CN203559117U - Multi-target sputtering chamber for magnetic control sputtering machine - Google Patents
Multi-target sputtering chamber for magnetic control sputtering machine Download PDFInfo
- Publication number
- CN203559117U CN203559117U CN201320616358.8U CN201320616358U CN203559117U CN 203559117 U CN203559117 U CN 203559117U CN 201320616358 U CN201320616358 U CN 201320616358U CN 203559117 U CN203559117 U CN 203559117U
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- target
- upper cover
- cover plate
- magnetic control
- sputtering chamber
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Abstract
The utility model discloses a multi-target sputtering chamber for a magnetic control sputtering machine. The sputtering chamber comprises an upper cover plate, a cathode, target materials and a carrier transferring device, wherein the target materials are fixedly connected with the upper cover plate through the cathode; the carrier transferring device is arranged under the upper cover plate; a plurality of target materials are arranged on the upper cover plate; an L-shaped baffle structure is arranged between every adjacent two target materials on the upper plate. The multi-target sputtering chamber for the magnetic control sputtering machine is simple in structure, and the L-shaped baffle structure is arranged between every adjacent two target materials on the upper plate, so that the target materials at other point positions can be effectively prevented from being polluted by pollution sources; the pollution degree of the target materials is controlled effectively; the using cost of the target materials is saved; meanwhile, the production efficiency is improved.
Description
Technical field
The utility model relates to a kind of structure field of many target position magnetic control sputtering plating machine, when relating in particular to a kind of production and only needing single material technique, prevents from polluteing the sputtering chamber structure of other target material surfaces during sputtering target sputter.
Background technology
When many target position of plane magnetic control sputtering plating machine is produced at the target of a kind of material for single, the electricity slurry producing can directly pollute other targets.For example: three target position that sputtering chamber is equipped with are respectively A, B, C 3 points, when production technique only need be by a certain material, sputter target position only open A point or other certain a bit, when enabling the work of A point target position, continual B point or the C point of splashing to of material molecules meeting of sputter, cause material on B and C point target position polluted and cannot normally use, to such an extent as to B and C point target position need to remove through long electric shock the pollution substance of target material surface before use, can again produce, thereby reduced production efficiency, increased the repeated work bringing when target is changed and cleaned.
utility model content
For the problem of above-mentioned existence, the utility model object is to provide a kind of many target position sputtering chamber of magnetic control sputtering plating machine simple in structure.
In order to achieve the above object, the technical solution adopted in the utility model is as follows: a kind of many target position sputtering chamber of magnetic control sputtering plating machine, and described sputtering chamber comprises upper cover plate, negative electrode, target and carrier transfer device; Described target is fixedly connected on upper cover plate by negative electrode, described carrier transfer device be arranged on upper cover plate under, described upper cover plate is provided with a plurality of targets, the upper cover plate between adjacent target is provided with L-type baffle arrangement; The long handle end of described L-type baffle plate has the target practice separated by spaces between each target is come, simultaneously by being connected and fixed between short handle end and upper cover plate, and good connecting effect.
As a kind of improvement of the present utility model, described L-type baffle plate is fixed on upper cover plate by retaining screw, and described retaining screw is that internal diameter is the allen screw of 6mm.
As a kind of improvement of the present utility model, described L-type baffle plate comprises long handle end and short handle end, the top of described long handle end is provided with arc convex structure, by arc convex structure, improved the pretective acreage of baffle plate, further guarantee the isolation effect between each target, can facilitate cleaning and the maintenance of L-type baffle plate simultaneously.
The utility model has the advantage of: the utility model is simple in structure, by the L-type protective baffle plate structure being provided with between adjacent target, can effectively intercept the target that source of pollution corrode other some positions, make its pollution level obtain effective control, save the use cost of target, improved production efficiency simultaneously.
Accompanying drawing explanation
Fig. 1 is the utility model structure diagram;
Wherein, 1 upper cover plate; 2,, 4,5 negative electrodes; 6,8,10 targets; 7,9 L-type baffle plates; 11 carrier transfer devices; 12,13 hexagonal standing bolts.
Embodiment
Below in conjunction with accompanying drawing explanation and embodiment, the utility model is described in further detail.
embodiment 1:as shown in Figure 1, a kind of many target position sputtering chamber of magnetic control sputtering plating machine, described sputtering chamber comprises upper cover plate 1, negative electrode 2,4,5; Target 6,8,10 and carrier transfer device 11; Described target 6,8,10 is fixedly connected on upper cover plate 1 by negative electrode 2,4,5 respectively, described carrier transfer device 11 be arranged on upper cover plate 1 under, described upper cover plate 1 is provided with a plurality of targets 6,8,10, upper cover plate 1 between adjacent target 6 and 8 is provided with L-type baffle plate 7, upper cover plate 1 between adjacent target 8 and 10 is provided with L-type baffle plate 9, the long handle end of described L-type baffle plate has the target practice separated by spaces between each target is come, simultaneously by being connected and fixed between short handle end and upper cover plate 1, good connecting effect.
embodiment 2:as shown in Figure 1, described L-type baffle plate 7 and 9 is fixed on upper cover plate 1 by retaining screw 12 and 13 respectively, and described retaining screw 12 and 13 is internal diameter be 6mm allen screw, stable connection, easy disassembly and cleaning.
embodiment 3:as shown in Figure 1, described L-type baffle plate 7 and 9 comprises long handle end and short handle end, and the top of described long handle end is provided with arc convex structure; By arc convex structure, improve the pretective acreage of baffle plate, further guaranteed the isolation effect between each target, can facilitate cleaning and the maintenance of L-type baffle plate simultaneously.
embodiment 4:as shown in Figure 1, principle of work of the present utility model:
When target 6 is when work is practiced shooting; the target molecule sputtering can be intercepted and hold by L-type baffle plate 7; between protection to target 8 surfaces not contaminated; equally when target 8 work; L-type baffle plate 7 and L-type baffle plate 9 intercept respectively opens the surface that electricity slurry pollutes target 6 and 10; effectively reduce the operating time of the pre-target practice while producing, refer to the time of cleaning target material surface, work-ing life and the production efficiency of target are all improved.
It should be noted that, above-mentioned is only preferred embodiment of the present utility model, is not used for limiting protection domain of the present utility model, and the equivalents of having done on the basis of above-described embodiment all belongs to protection domain of the present utility model.
Claims (3)
1. many target position sputtering chamber of magnetic control sputtering plating machine, described sputtering chamber comprises upper cover plate, negative electrode, target and carrier transfer device; Described target is fixedly connected on upper cover plate by negative electrode, described carrier transfer device be arranged on upper cover plate under, it is characterized in that, described upper cover plate is provided with a plurality of targets, the upper cover plate between adjacent target is provided with L-type baffle arrangement.
2. many target position sputtering chamber of a kind of magnetic control sputtering plating machine according to claim 1, is characterized in that, described L-type baffle arrangement is fixed on upper cover plate by retaining screw, and described retaining screw is that internal diameter is the allen screw of 6mm.
3. many target position sputtering chamber of a kind of magnetic control sputtering plating machine according to claim 1, is characterized in that, described L-type baffle plate comprises long handle end and short handle end, and the top of described long handle end is provided with arc convex structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320616358.8U CN203559117U (en) | 2013-10-08 | 2013-10-08 | Multi-target sputtering chamber for magnetic control sputtering machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320616358.8U CN203559117U (en) | 2013-10-08 | 2013-10-08 | Multi-target sputtering chamber for magnetic control sputtering machine |
Publications (1)
Publication Number | Publication Date |
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CN203559117U true CN203559117U (en) | 2014-04-23 |
Family
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Family Applications (1)
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CN201320616358.8U Expired - Fee Related CN203559117U (en) | 2013-10-08 | 2013-10-08 | Multi-target sputtering chamber for magnetic control sputtering machine |
Country Status (1)
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CN (1) | CN203559117U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106435498A (en) * | 2016-09-26 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Magnetron sputtering target baffle plate mechanism |
CN110760807A (en) * | 2019-12-03 | 2020-02-07 | 松山湖材料实验室 | Ceramic plate vacuum sputtering coating device and coating method thereof |
-
2013
- 2013-10-08 CN CN201320616358.8U patent/CN203559117U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106435498A (en) * | 2016-09-26 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Magnetron sputtering target baffle plate mechanism |
CN106435498B (en) * | 2016-09-26 | 2019-01-29 | 中国电子科技集团公司第四十八研究所 | A kind of magnetic controlled sputtering target baffle mechanism |
CN110760807A (en) * | 2019-12-03 | 2020-02-07 | 松山湖材料实验室 | Ceramic plate vacuum sputtering coating device and coating method thereof |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 Termination date: 20141008 |
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EXPY | Termination of patent right or utility model |