CN204939602U - The shielding refrigerating unit of magnetron sputtering plating line - Google Patents
The shielding refrigerating unit of magnetron sputtering plating line Download PDFInfo
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- CN204939602U CN204939602U CN201520592599.2U CN201520592599U CN204939602U CN 204939602 U CN204939602 U CN 204939602U CN 201520592599 U CN201520592599 U CN 201520592599U CN 204939602 U CN204939602 U CN 204939602U
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- cooling tube
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- copper braid
- underframe
- shielding slab
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Abstract
Provide a kind of shielding refrigerating unit of magnetron sputtering plating line, comprise shielding slab, copper braid, cooling tube, underframe and web plate, underframe is coupled together by screw by web plate, cooling tube is bolted to underframe, and cooling tube is fixed with copper braid, and shielding slab is arranged on cooling tube by screw, copper braid is closely pressed between shielding slab and cooling tube, thus, copper braid makes shielding slab and cooling tube fit tightly, thus increases heat transfer area.According to the shielding refrigerating unit of magnetron sputtering plating line of the present utility model, shielding slab adsorbs a large amount of heats, conducts to cooling tube by copper braid, is beneficial to heat radiation during plated film.Meanwhile, shielding slab also can adsorb a large amount of cathode sputtering things, prevents sputtering thing from diffusing to whole coating chamber, pollutes film coating environment, ensure that the quality of plated film, effectively can stop that cathode sputtering thing is adsorbed onto the surface of cooling tube, affects its radiating effect simultaneously.
Description
Technical field
The utility model relates to a kind of shielding refrigerating unit of magnetron sputtering plating line, belongs to big area magnetron sputtering membrane production equipment.
Background technology
For continuous vacuum magnetron sputtering plating glass production line, in coating process, cathode sputtering can produce certain sputtering thing and heat, and these sputtering thing long term accumulation not only can affect the conduction of heat in vacuum chamber, but also the film coating environment that can affect in plated film chamber, thus certain impact is produced on coating quality, so can wish that when plated film the sputtering thing by negative electrode produces is cleared up in time, also wish that the heat that negative electrode produces conducts as early as possible simultaneously.
Utility model content
The cleaning problem of the sputtering thing that negative electrode produces and the conducting problem of negative electrode generation heat when the utility model is intended to solve plated film.
In order to reach above-mentioned purpose, provide a kind of shielding refrigerating unit of magnetron sputtering plating line, comprise shielding slab, copper braid, cooling tube, underframe, and web plate, described underframe is coupled together by screw by described web plate, described cooling tube is bolted to described underframe, described cooling tube is fixed with described copper braid, described shielding slab is arranged on described cooling tube by screw, described copper braid is closely pressed between described shielding slab and described cooling tube, thus, described copper braid makes described shielding slab and described cooling tube fit tightly, thus increase heat transfer area.
In some embodiments, described underframe is linked together by screw by described web plate, ensures that these device both sides are in same level to increase the stability of its support thus.
In some embodiments, described cooling tube is bolted on the upper surface of described underframe.
In some embodiments, described copper braid is fixed on the upper surface of described cooling tube, effectively increases heat transfer area thus.
In some embodiments, described shielding slab is set to active adsorption cathode sputtering thing, and isolated cathode sputtering thing is adsorbed on the surface of described cooling tube simultaneously.
According to the shielding refrigerating unit of magnetron sputtering plating line of the present utility model, shielding slab adsorbs a large amount of heats, conducts to cooling tube by copper braid, is beneficial to heat radiation during plated film.Meanwhile, shielding slab also can adsorb a large amount of cathode sputtering things, prevents sputtering thing from diffusing to whole coating chamber, pollutes film coating environment, ensure that the quality of plated film, effectively can stop that cathode sputtering thing is adsorbed onto the surface of cooling tube, affects its radiating effect simultaneously.
Below in conjunction with accompanying drawing, the description of the utility model purport is described by example, with clear other aspects of the present utility model and advantage.
Accompanying drawing explanation
By reference to the accompanying drawings, by detailed description hereafter, above-mentioned and other feature and advantage of the present utility model more clearly can be understood, wherein:
Fig. 1 is the structural representation of the shielding refrigerating unit of magnetron sputtering plating line according to the utility model embodiment.
Embodiment
See the accompanying drawing of the utility model specific embodiment, hereafter in more detail the utility model will be described.But the utility model can realize in many different forms, and should not be construed as by the restriction in the embodiment of this proposition.On the contrary, it is abundant and complete open in order to reach for proposing these embodiments, and makes those skilled in the art understand scope of the present utility model completely.
Description describes the shielding refrigerating unit according to the magnetron sputtering plating line of the utility model embodiment in detail.
As shown in the figure, according to the shielding refrigerating unit of the magnetron sputtering plating line of the utility model embodiment, comprise shielding slab 1, copper braid 2, cooling tube 3, underframe 4, web plate 5.Underframe 4 is coupled together by screw by web plate 5, cooling tube 3 is bolted on underframe 4 upper surface, fix one deck copper braid 2 at the upper surface of cooling tube 3, shielding slab 1 is arranged on cooling tube 3 by screw, and copper braid 2 is closely pressed between shielding slab 1 and cooling tube 3.It is characterized in that: copper braid 2 can effectively make shielding slab 1 and cooling tube 3 fit tightly, increase heat transfer area, reach better cooling performance;
Underframe 4 is linked together by screw by web plate 5, ensures that these device both sides are in same level, and can increase its stability supported.Cooling tube 3 is bolted on underframe 4 upper surface.
Copper braid 2 is fixed on the upper surface of cooling tube 3, effectively can increase heat transfer area.Shielding slab 1 is arranged on cooling tube 3 by screw, is closely pressed in by copper braid 2 between shielding slab 1 and cooling tube 3, and shielding slab 1 can effectively adsorb cathode sputtering thing, also can completely cut off the surface that cathode sputtering thing is adsorbed on cooling tube 3 simultaneously, affect its thermolysis.
Underframe 4 is coupled together by screw by web plate 5, increase the stability of total, cooling tube 3 is bolted on underframe 4 upper surface, ensure that it is in same level, one deck copper braid 2 is fixed at the upper surface of cooling tube 3, shielding slab 1 is arranged on cooling tube 3 by screw, and copper braid 2 is closely pressed between shielding slab 1 and cooling tube 3.
Web plate 5 is connected to its lower surface by screw by underframe 4, cooling tube 3 is bolted on underframe 4 upper surface, fix one deck copper braid 2 at the upper surface of cooling tube 3, shielding slab 1 is arranged on cooling tube 3 by screw, is closely pressed between shielding slab 1 and cooling tube 3 by copper braid 2.Underframe 4 can ensure the stability of this device with the connection of web plate 5, and make its both sides be in same level, be beneficial to the laminating of shielding slab 1 and copper braid 2, simultaneously the fitting tightly of copper braid 2 and shielding slab 1 and cooling tube 3, effectively can increase heat transfer area, reach better cooling performance.
According to the shielding refrigerating unit of magnetron sputtering plating line of the present utility model, shielding slab adsorbs a large amount of heats, conducts to cooling tube by copper braid, is beneficial to heat radiation during plated film.Meanwhile, shielding slab also can adsorb a large amount of cathode sputtering things, prevents sputtering thing from diffusing to whole coating chamber, pollutes film coating environment, ensure that the quality of plated film, effectively can stop that cathode sputtering thing is adsorbed onto the surface of cooling tube, affects its radiating effect simultaneously.
More than describe preferred embodiment of the present utility model in detail.Should be appreciated that those of ordinary skill in the art just can make many modifications and variations according to design of the present utility model without the need to creative work.All technician in the art according to design of the present utility model on the basis of existing technology by the available technical scheme of logical analysis, reasoning, or a limited experiment, all should by the determined protection domain of claims.
Claims (5)
1. the shielding refrigerating unit of a magnetron sputtering plating line, it is characterized in that, comprise shielding slab, copper braid, cooling tube, underframe, and web plate, described underframe is coupled together by screw by described web plate, described cooling tube is bolted to described underframe, described cooling tube is fixed with described copper braid, described shielding slab is arranged on described cooling tube by screw, described copper braid is closely pressed between described shielding slab and described cooling tube, thus, described copper braid makes described shielding slab and described cooling tube fit tightly, thus increase heat transfer area.
2. shielding refrigerating unit according to claim 1, is characterized in that, described underframe is linked together by screw by described web plate, ensures that these device both sides are in same level to increase the stability of its support thus.
3. shielding refrigerating unit according to claim 2, is characterized in that, described cooling tube is bolted on the upper surface of described underframe.
4. shielding refrigerating unit according to claim 3, is characterized in that, described copper braid is fixed on the upper surface of described cooling tube, effectively increases heat transfer area thus.
5. shielding refrigerating unit according to claim 4, is characterized in that, described shielding slab is set to active adsorption cathode sputtering thing, and isolated cathode sputtering thing is adsorbed on the surface of described cooling tube simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520592599.2U CN204939602U (en) | 2015-08-07 | 2015-08-07 | The shielding refrigerating unit of magnetron sputtering plating line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520592599.2U CN204939602U (en) | 2015-08-07 | 2015-08-07 | The shielding refrigerating unit of magnetron sputtering plating line |
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| CN204939602U true CN204939602U (en) | 2016-01-06 |
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| CN201520592599.2U Active CN204939602U (en) | 2015-08-07 | 2015-08-07 | The shielding refrigerating unit of magnetron sputtering plating line |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063564A (en) * | 2015-08-07 | 2015-11-18 | 中国建材国际工程集团有限公司 | Shielding cooling system of magnetron sputtering coating line |
| CN110344018A (en) * | 2018-04-08 | 2019-10-18 | 北京七星华创集成电路装备有限公司 | A kind of more cathode continuous coating chambers |
| CN110670042A (en) * | 2019-12-09 | 2020-01-10 | 上海陛通半导体能源科技股份有限公司 | Physical vapor deposition apparatus for thick film deposition |
-
2015
- 2015-08-07 CN CN201520592599.2U patent/CN204939602U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105063564A (en) * | 2015-08-07 | 2015-11-18 | 中国建材国际工程集团有限公司 | Shielding cooling system of magnetron sputtering coating line |
| CN110344018A (en) * | 2018-04-08 | 2019-10-18 | 北京七星华创集成电路装备有限公司 | A kind of more cathode continuous coating chambers |
| CN110344018B (en) * | 2018-04-08 | 2020-09-08 | 北京七星华创集成电路装备有限公司 | Multi-cathode continuous coating chamber |
| CN110670042A (en) * | 2019-12-09 | 2020-01-10 | 上海陛通半导体能源科技股份有限公司 | Physical vapor deposition apparatus for thick film deposition |
| CN110670042B (en) * | 2019-12-09 | 2020-04-03 | 上海陛通半导体能源科技股份有限公司 | Physical vapor deposition apparatus for thick film deposition |
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