CN203523136U - CTP touch assembly - Google Patents
CTP touch assembly Download PDFInfo
- Publication number
- CN203523136U CN203523136U CN201320542794.5U CN201320542794U CN203523136U CN 203523136 U CN203523136 U CN 203523136U CN 201320542794 U CN201320542794 U CN 201320542794U CN 203523136 U CN203523136 U CN 203523136U
- Authority
- CN
- China
- Prior art keywords
- ctp
- plate
- touch assembly
- nickel dam
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a CTP touch assembly, comprising a back side covering layer (1), a copper metal layer (2), and a nickel layer (3) disposed in sequence. The CTP touch assembly is simple in structure, reasonable in design, and effectively improves service life of the CTP touch assembly, and cost is effectively saved.
Description
Technical field
The utility model relates to CTP and touches product, and particularly a kind of CTP touches assembly.
Background technology
At present in FPC manufacturing, the heavy nickel majority in FPC edge connector position is hard nickel, the crystal formation pattern of hard nickel is horizontal layered arrangement, be that nickle atom is piled up layer by layer along golden finger copper face direction, when copper face is bent by extraneous effect of stress, nickel dam inside can not be stretched and transverse deformation cannot occur causes nickel dam to be torn.Therefore a distinct disadvantage of hard nickel is exactly that intensity and elasticity are not enough, easily causes golden finger fracture when golden finger and connector do not match.
CTP touches product when early development, and easy fracture while occurring because of the lead-in wire bending of IC position, causes jitter, frequently occurs that electronic product is used unstable.Conventional FPC and components and parts welding procedure, often occur that element and FPC adhesion are bad.
Summary of the invention
The purpose of this utility model is to overcome the deficiency of prior art, provide a kind of CTP to touch assembly, comprise the back side cover layer (1) setting gradually, copper metal layer (2) and nickel dam (3), it is characterized in that, the middle part of the another side of described nickel dam (3) has IC plate (5), the both sides of this IC plate (5) have front cover layer (4), described IC plate (5) also has a via hole vertically passing (6), and this via hole (6) is for being connected to lead-in wire IC plate (5).
Described nickel dam (3) thickness is 2-4um.
The utility model is simple in structure, reasonable in design, has improved the pliability of FPC edge connector.Improve the signal stabilization of assembly, improve IC and FPC adhesion, and improved the useful life of this CTP touch assembly, effectively cost-saving.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
With reference to accompanying drawing, this CTP touches assembly, comprise the back side cover layer (1) setting gradually, copper metal layer (2) and nickel dam (3),, described nickel dam (3) another side middle part and IC plate (5) combine, the remainder of described nickel dam (3) another side has front cover layer (4) and is positioned at the both sides of IC plate (5), and described IC plate (5) also has a via hole (6), and this via hole (6) is for being connected to lead-in wire IC plate (5).Described nickel dam (3) thickness is 2-4um, with the tool bending of 1.0mm, does not rupture for 5 times.Described via hole (6) can also have a plurality of.
The nickel adopting is vertical nickel, the crystal formation pattern of this vertical nickel is longitudinal layered arrangement, be that nickle atom is along piling up layer by layer perpendicular to golden finger copper face direction, when copper face is bent by extraneous effect of stress, between nickel dam, be stretched transverse deformation can occur, therefore vertical nickel has better intensity and elasticity than hard nickel, can effectively avoid the problem of fracture.
The wire breaking that connects IC when FPC bends causes that jitter adopts via hole technology; the lead-in wire that connects IC position is transferred to the FPC back side; through via hole, lead-in wire is connected to IC; there is like this protection of back side coverlay to significantly improve lead-in wire bend resistance performance, improved the stability of signal.
Certainly; the above is only a kind of execution mode of the present utility model; should be understood that those skilled in the art; do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, within these improvements and modifications all belong to the protection range of the utility model claim.
Claims (2)
1. a CTP touches assembly, comprise the back side cover layer (1) setting gradually, copper metal layer (2) and nickel dam (3), it is characterized in that, the middle part of the another side of described nickel dam (3) has IC plate (5), the both sides of this IC plate (5) have front cover layer (4), and described IC plate (5) also has a via hole vertically passing (6), and this via hole (6) is for being connected to lead-in wire IC plate (5).
2. a kind of CTP according to claim 1 touches assembly, it is characterized in that: described nickel dam (3) thickness is 2-4um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542794.5U CN203523136U (en) | 2013-09-03 | 2013-09-03 | CTP touch assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320542794.5U CN203523136U (en) | 2013-09-03 | 2013-09-03 | CTP touch assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203523136U true CN203523136U (en) | 2014-04-02 |
Family
ID=50381999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320542794.5U Expired - Fee Related CN203523136U (en) | 2013-09-03 | 2013-09-03 | CTP touch assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203523136U (en) |
-
2013
- 2013-09-03 CN CN201320542794.5U patent/CN203523136U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20150903 |
|
| EXPY | Termination of patent right or utility model |