CN203522865U - Camera module - Google Patents
Camera module Download PDFInfo
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- CN203522865U CN203522865U CN201320372961.6U CN201320372961U CN203522865U CN 203522865 U CN203522865 U CN 203522865U CN 201320372961 U CN201320372961 U CN 201320372961U CN 203522865 U CN203522865 U CN 203522865U
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- openend
- image sensor
- sensor substrate
- camera module
- imaging len
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Abstract
The utility model provides a camera module that can be subjected to reflow soldering. The camera module is characterized in that the camera module comprises a microscope base, an image sensor substrate, an imaging lens unit, a plurality of conductive connecting pieces, silicon-penetrating through holes and a lens barrel, and gaps between the imaging lens unit and the internal surface of the lens barrel are filled with glue in order to fix the lens barrel on the imaging lens unit.
Description
Technical field
The utility model relates to optical element, relates in particular to a kind of camera module.
Background technology
Now, can reflow camera module growing in industrial demand.Assembling process that can reflow camera module is also very simple and convenient.Yet existing camera module is in equipment process, and its microscope base, lens barrel and lens are easy to separation.
Particularly, the side sectional view of the camera module of prior art as shown in Figure 1.Camera module 100 comprises: lens barrel 102, microscope base 104, image sensor substrate 114, imaging len unit 112, a plurality of conducting connecting part 116, wear the viscose 118 that silicon through hole 128 is worn silicon through hole 128 and connected for fixing each parts.
Wherein, microscope base 104 is hollow cylinders, and microscope base 104 is provided with the first relative openend 106 and the second openend 108.The aperture area of the first openend 106 is less than the aperture area of the second openend 108.
Imaging len unit 112 be placed in image sensor substrate 114 with the opposing side of the first openend 106.Imaging len unit 112 has sensing area 122 and around the non-sensing area 124 of sensing area 122.Viscose 118 is filled in the non-sensing area 124 of imaging len unit 112 and the gap between image sensor substrate 114 imaging len unit 122 is fixed on to the opposing side of image sensor substrate 114 and the first openend 106.Wherein, imaging len unit 112 comprises a plurality of lens, at least has two different focal lengths in a plurality of lens.
A plurality of conducting connecting parts 116 are placed in the side that image sensor substrate 114 connects the first openend 106, and are surrounded 106 by the first openend, in a plurality of conducting connecting parts 116, have at least one to comprise grounding connection part.A plurality of conducting connecting parts 116 comprise a plurality of weldering bags.
Wearing silicon through hole 128 extends through image sensor substrate 114 and is coupled to by correspondence from the upper side of image sensor substrate 114 the grounding connection part that is placed in described image sensor substrate 114 downsides.
In a preference, camera module 100 also comprises a printed circuit board (PCB) (not shown).Printed circuit board (PCB) is fixed on the opposing one side in image sensor substrate 114 and imaging len unit 112 by a plurality of conducting connecting parts 116.
Utility model content
The utility model provide a kind of can reflow camera module, it is characterized in that, comprising: microscope base, described microscope base is hollow cylinder, described microscope base is provided with the first relative openend and the second openend, and the aperture area of described the first openend is less than the aperture area of described the second openend; Image sensor substrate, is placed in a side that is provided with described the first openend in described microscope base, and viscose fills up gap between described image sensor substrate and the inner surface of described microscope base so that described image sensor substrate is fixed in described microscope base; Imaging len unit, be placed in a side different with described the first openend of described image sensor substrate, described imaging len unit has sensing area and around the non-sensing area of described sensing area, and viscose is filled in the non-sensing area of described imaging len unit and the gap between described image sensor substrate described imaging len unit is fixed on to the different side of described image sensor substrate and described the first openend; A plurality of conducting connecting parts, are placed in described image sensor substrate and connect described the first openend one side and surrounded by described the first openend, in a plurality of described conducting connecting parts, have at least one to comprise grounding connection part; Wear silicon through hole, described in wear silicon through hole and extend through described image sensor substrate and be coupled to by correspondence from a side of described image sensor substrate the described grounding connection part that is placed in described image sensor substrate opposite side; And lens barrel, described lens barrel is hollow cylinder and is provided with the 3rd openend and the 4th openend, the aperture area of described the 3rd openend is greater than the aperture area of described the 4th openend, described the 3rd openend is connected in described the second openend, and viscose fills up gap between described imaging len unit and the inner surface of described lens barrel so that described lens barrel is fixed on described imaging len unit.
Preferably, described viscose is a kind of in following material: epoxy glue; Anaerobic adhesive; Or polyurethane adhesive.
Preferably, described viscose is curing by warming, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
Preferably, described image sensor substrate comprises a plurality of imaging pixels.
Preferably, described imaging len unit comprises a plurality of lens, and described a plurality of lens at least have two different focal lengths.
Preferably, described a plurality of lens are coated with filter with the one side that described image sensor substrate is connected.
Preferably, described a plurality of conducting connecting part comprises a plurality of weldering bags.
Preferably, described a plurality of weldering bag is for ball grid array (BGA) reflow process.
Preferably, the maximum temperature of described ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Preferably, also comprise a printed circuit board (PCB), described printed circuit board (PCB) is fixed on the different one side of described image sensor substrate and described imaging len unit by described a plurality of conducting connecting parts.
The utility model utilizes camera module when assembling, and the position that is coated with viscose between image sensor substrate and microscope base, image sensor substrate and imaging len unit, imaging len unit and lens barrel makes the more firm yield with increase camera module of being connected of each inter-module of camera module.
Accompanying drawing explanation
By describe its example embodiment in detail with reference to accompanying drawing, above-mentioned and further feature of the present utility model and advantage will become more obvious.
Fig. 1 illustrates in prior art, the side sectional view of camera module;
The side sectional view of the camera module that Fig. 2 the utility model provides.
Embodiment
Referring now to accompanying drawing, example embodiment is more fully described.Yet example embodiment can be implemented in a variety of forms, and should not be understood to be limited to execution mode set forth herein; On the contrary, provide these execution modes to make the utility model by comprehensive and complete, and the design of example embodiment is conveyed to those skilled in the art all sidedly.In the drawings, for clear, exaggerated the thickness of region and layer.Identical in the drawings Reference numeral represents same or similar structure, thereby will omit their detailed description.
The side sectional view of the camera module that Fig. 2 the utility model provides.Camera module 100 comprises: lens barrel 102, microscope base 104, image sensor substrate 114, imaging len unit 112, a plurality of conducting connecting part 116, the viscose 120 of wearing silicon through hole 128 and connecting for fixing each parts.
Wherein, microscope base 104 is hollow cylinders, and microscope base 104 is provided with the first relative openend 106 and the second openend 108.The aperture area of the first openend 106 is less than the aperture area of the second openend 108.
Imaging len unit 112 be placed in image sensor substrate 114 with the opposing side of the first openend 106.Imaging len unit 112 has sensing area 122 and around the non-sensing area 124 of sensing area 122.Viscose 120 is filled in the non-sensing area 124 of imaging len unit 112 and the gap between image sensor substrate 114 imaging len unit 122 is fixed on to the opposing side of image sensor substrate 114 and the first openend 106.Wherein, imaging len unit 112 comprises a plurality of lens, at least has two different focal lengths in a plurality of lens.Preferably, the one side plating that a plurality of lens are connected with 114 image sensor substrate also has filter.
A plurality of conducting connecting parts 116 are placed in the side that image sensor substrate 114 connects the first openend 106, and are surrounded 106 by the first openend, in a plurality of conducting connecting parts 116, have at least one to comprise grounding connection part.A plurality of conducting connecting parts 116 comprise a plurality of weldering bags.A plurality of weldering bags are for ball grid array (BGA) reflow process.Wherein, the maximum temperature of ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Wearing silicon through hole 128 extends through image sensor substrate 114 and is coupled to by correspondence from the upper side of image sensor substrate 114 the grounding connection part that is placed in described image sensor substrate 114 downsides.
Wherein, viscose 120 is a kind of in following material: epoxy glue; Anaerobic adhesive; Or polyurethane adhesive.。A kind of solidify of viscose 120 in the following way: warm curing, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
In a preference, camera module 100 also comprises a printed circuit board (PCB) (not shown).Printed circuit board (PCB) is fixed on the opposing one side in image sensor substrate 114 and imaging len unit 112 by a plurality of conducting connecting parts 116.
Below illustrate particularly and described illustrative embodiments of the present utility model.Should be appreciated that, the utility model is not limited to disclosed execution mode, and on the contrary, the utility model intention contains various modifications and the equivalent arrangements in the spirit and scope that are included in claims.
Claims (7)
1. can a reflow camera module, it is characterized in that, comprising:
Microscope base, described microscope base is hollow cylinder, and described microscope base is provided with the first relative openend and the second openend, and the aperture area of described the first openend is less than the aperture area of described the second openend;
Image sensor substrate, is placed in a side that is provided with described the first openend in described microscope base, and viscose fills up gap between described image sensor substrate and the inner surface of described microscope base so that described image sensor substrate is fixed in described microscope base;
Imaging len unit, be placed in a side different with described the first openend of described image sensor substrate, described imaging len unit has sensing area and around the non-sensing area of described sensing area, and viscose is filled in the non-sensing area of described imaging len unit and the gap between described image sensor substrate described imaging len unit is fixed on to the different side of described image sensor substrate and described the first openend;
A plurality of conducting connecting parts, are placed in described image sensor substrate and connect described the first openend one side and surrounded by described the first openend, in a plurality of described conducting connecting parts, have at least one to comprise grounding connection part;
Wear silicon through hole, described in wear silicon through hole and extend through described image sensor substrate and be coupled to by correspondence from a side of described image sensor substrate the described grounding connection part that is placed in described image sensor substrate opposite side; And
Lens barrel, described lens barrel is hollow cylinder and is provided with the 3rd openend and the 4th openend, the aperture area of described the 3rd openend is greater than the aperture area of described the 4th openend, described the 3rd openend is connected in described the second openend, and viscose fills up gap between described imaging len unit and the inner surface of described lens barrel so that described lens barrel is fixed on described imaging len unit.
2. camera module according to claim 1, is characterized in that, described viscose is a kind of in following material:
Epoxy glue;
Anaerobic adhesive; Or
Polyurethane adhesive.
3. camera module according to claim 1, is characterized in that, described image sensor substrate comprises a plurality of imaging pixels.
4. camera module according to claim 1, is characterized in that, described imaging len unit comprises a plurality of lens, and described a plurality of lens at least have two different focal lengths.
5. camera module according to claim 4, is characterized in that, described a plurality of lens are coated with filter with the one side that described image sensor substrate is connected.
6. camera module according to claim 1, is characterized in that, described a plurality of conducting connecting parts comprise a plurality of weldering bags.
7. camera module according to claim 1, is characterized in that, also comprises a printed circuit board (PCB), and described printed circuit board (PCB) is fixed on the different one side of described image sensor substrate and described imaging len unit by described a plurality of conducting connecting parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320372961.6U CN203522865U (en) | 2013-06-26 | 2013-06-26 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320372961.6U CN203522865U (en) | 2013-06-26 | 2013-06-26 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203522865U true CN203522865U (en) | 2014-04-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320372961.6U Expired - Lifetime CN203522865U (en) | 2013-06-26 | 2013-06-26 | Camera module |
Country Status (1)
| Country | Link |
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| CN (1) | CN203522865U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253133A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Camera module group and manufacturing method thereof |
| CN107167893A (en) * | 2016-03-08 | 2017-09-15 | 光宝电子(广州)有限公司 | Image focusing structure |
| WO2022057044A1 (en) * | 2020-09-16 | 2022-03-24 | 诚瑞光学(深圳)有限公司 | Lens module and imaging system |
-
2013
- 2013-06-26 CN CN201320372961.6U patent/CN203522865U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104253133A (en) * | 2013-06-26 | 2014-12-31 | 深圳赛意法微电子有限公司 | Camera module group and manufacturing method thereof |
| CN104253133B (en) * | 2013-06-26 | 2017-07-28 | 深圳赛意法微电子有限公司 | Camera module and preparation method thereof |
| CN107167893A (en) * | 2016-03-08 | 2017-09-15 | 光宝电子(广州)有限公司 | Image focusing structure |
| CN107167893B (en) * | 2016-03-08 | 2019-10-18 | 光宝电子(广州)有限公司 | Image focusing structure |
| WO2022057044A1 (en) * | 2020-09-16 | 2022-03-24 | 诚瑞光学(深圳)有限公司 | Lens module and imaging system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |