CN104253133A - Camera module group and manufacturing method thereof - Google Patents
Camera module group and manufacturing method thereof Download PDFInfo
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- CN104253133A CN104253133A CN201310260368.7A CN201310260368A CN104253133A CN 104253133 A CN104253133 A CN 104253133A CN 201310260368 A CN201310260368 A CN 201310260368A CN 104253133 A CN104253133 A CN 104253133A
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- image sensor
- sensor substrate
- openend
- viscose
- imaging len
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Abstract
The invention provides a camera module group of a reflow soldering property and a manufacturing method thereof. The camera module group of the reflow soldering property comprises a lens seat, an image sensor substrate, an imaging lens unit, a plurality of conductive connecting elements, a through silicon through via hole, and a lens cone. The gap between the imaging lens unit and the inner surface of the lens cone is filled with viscose, so that the lens cone is fixed at the imaging lens unit.
Description
Technical field
The present invention relates to optical element, particularly relate to a kind of camera module and preparation method thereof.
Background technology
Now, can reflow camera module demand industrially growing.Can the assembling process of reflow camera module also very simple and convenient.But existing camera module is in equipment process, its microscope base, lens barrel and lens are easy to be separated.
Particularly, the side sectional view of the camera module of prior art as shown in Figure 1.Camera module 100 comprises: lens barrel 102, microscope base 104, image sensor substrate 114, imaging len unit 112, multiple conducting connecting part 116, wear the viscose 118 that silicon through hole 128 wears silicon through hole 128 and connect for fixing each parts.
Wherein, microscope base 104 is hollow cylinders, and microscope base 104 is provided with the first relative openend 106 and the second openend 108.The aperture area of the first openend 106 is less than the aperture area of the second openend 108.
Image sensor substrate 114 is placed in microscope base 104 side being provided with the first openend 106.Viscose 118 fills up gap between image sensor substrate 114 downside and the side being provided with the first openend 106 of microscope base 104 image sensor substrate 114 to be fixed in the first openend 106 of microscope base 104.Wherein, image sensor substrate 114 comprises multiple imaging pixel.
Imaging len unit 112 is placed in the side opposing with the first openend 106 of image sensor substrate 114.Imaging len unit 112 has sensing area 122 and the non-sensing area 124 around sensing area 122.Viscose 118 is filled in gap between the non-sensing area 124 of imaging len unit 112 and image sensor substrate 114 imaging len unit 122 to be fixed on image sensor substrate 114 and the opposing side of the first openend 106.Wherein, imaging len unit 112 comprises multiple lens, at least has two different focal lengths in multiple lens.
Multiple conducting connecting part 116 is placed in the side that image sensor substrate 114 connects the first openend 106, and is surrounded 106 by the first openend, has at least one to comprise ground connections in multiple conducting connecting part 116.Multiple conducting connecting part 116 comprises multiple weldering bag.
Wear silicon through hole 128 extend through image sensor substrate 114 and be coupled to the ground connections being placed in described image sensor substrate 114 downside from the upper side of image sensor substrate 114 by correspondence.
Lens barrel 102 is hollow cylinder and is provided with the 3rd openend 110 and the 4th openend 126.The aperture area of the 3rd openend 110 is greater than the aperture area of the 4th openend 126.3rd openend 110 is connected in the second openend 108 of microscope base 104.Viscose 118 fills up gap between imaging len unit 112 and the inner surface being provided with the side of the 4th openend 126 of lens barrel 102 to be fixed on imaging len unit 112 by lens barrel 102.
In a preference, camera module 100 also comprises a printed circuit board (PCB) (not shown).Printed circuit board (PCB) is fixed on image sensor substrate 114 one side opposing with imaging len unit 112 by multiple conducting connecting part 116.
Summary of the invention
The invention provides one can reflow camera module, it is characterized in that, comprising: microscope base, described microscope base is hollow cylinder, described microscope base is provided with the first relative openend and the second openend, and the aperture area of described first openend is less than the aperture area of described second openend; Image sensor substrate, is placed in described microscope base the side being provided with described first openend, and the gap between the inner surface that viscose fills up described image sensor substrate and described microscope base is to be fixed in described microscope base by described image sensor substrate; Imaging len unit, be placed in the side different with described first openend of described image sensor substrate, described imaging len unit has sensing area and the non-sensing area around described sensing area, and viscose is filled in gap between the non-sensing area of described imaging len unit and described image sensor substrate described imaging len unit to be fixed on described image sensor substrate and the different side of described first openend; Multiple conducting connecting part, is placed in described image sensor substrate and connects described first openend side and surrounded by described first openend, have at least one to comprise ground connections in multiple described conducting connecting part; Wear silicon through hole, described in wear silicon through hole and extend through described image sensor substrate and be coupled to the described ground connections being placed in described image sensor substrate opposite side from the side of described image sensor substrate by correspondence; And lens barrel, described lens barrel is hollow cylinder and is provided with the 3rd openend and the 4th openend, the aperture area of described 3rd openend is greater than the aperture area of described 4th openend, described 3rd openend is connected in described second openend, and viscose fills up gap between described imaging len unit and the inner surface of described lens barrel to be fixed on described imaging len unit by described lens barrel.
Preferably, described viscose is the one in following material: epoxy glue; Anaerobic adhesive; Or polyurethane adhesive.
Preferably, described viscose by warming solidification, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
Preferably, described image sensor substrate comprises multiple imaging pixel.
Preferably, described imaging len unit comprises multiple lens, and described multiple lens at least have two different focal lengths.
Preferably, the one side that described multiple lens are connected with described image sensor substrate is coated with filter.
Preferably, described multiple conducting connecting part comprises multiple weldering bag.
Preferably, described multiple weldering bag is used for ball grid array (BGA) reflow process.
Preferably, the maximum temperature of described ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Preferably, also comprise a printed circuit board (PCB), described printed circuit board (PCB) is fixed on described image sensor substrate and the different one side of described imaging len unit by described multiple conducting connecting part.
According to another aspect of the invention, also provide a kind of can the manufacture method of reflow camera module, it is characterized in that, comprising: form multiple conducting connecting part in a side of an image sensor substrate, in multiple described conducting connecting part, have at least one to comprise ground connections; Formed extend through described image sensor substrate and be coupled to the described ground connections being placed in described image sensor substrate opposite side by correspondence from the side of described image sensor substrate wear silicon through hole; Viscose is coated with at the periphery of the side opposing with described conducting connecting part of described image sensor substrate with a point glue equipment; One imaging len unit is fixed on the side that described imageing sensor is coated with viscose, described imaging len unit has sensing area and the non-sensing area around described sensing area, and described viscose fills up the gap between the non-sensing area of described imaging len unit and described image sensor substrate; With described point glue equipment at the viscose of described image sensor substrate coating around the formation closed loop shape of described image sensor substrate, with the periphery coating viscose that be formed with a side of described multiple conducting connecting part of described point glue equipment in described image sensor substrate; The side described image sensor substrate being formed with described multiple conducting connecting part is fixed in the microscope base that a shape is hollow cylinder, viscose fills up the gap between the inner surface of described image sensor substrate and described microscope base, wherein, described microscope base is provided with the first relative openend and the second openend, the aperture area of described first openend is less than the aperture area of described second openend, and described image sensor substrate is fixed in described first openend; With described point glue equipment in the coating of described imaging len unit around the viscose of the formation closed loop shape of described imaging len unit, be coated with viscose with described point glue equipment at the periphery of a side opposing with described image sensor substrate of described imaging len unit; A side opposing with described image sensor substrate of described imaging len unit is fixed in the lens barrel that a shape is hollow cylinder, viscose fills up the gap between described imaging len unit and the inner surface of described lens barrel, described lens barrel is provided with the 3rd openend and the 4th openend, the aperture area of described 3rd openend is greater than the aperture area of described 4th openend, and described 3rd openend is connected to described second openend; Solidification viscose.
Preferably, described viscose is the one in following material: epoxy glue; Anaerobic adhesive; Or polyurethane adhesive.
Preferably, described viscose by warming solidification, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
Preferably, described image sensor substrate comprises multiple imaging pixel.
Preferably, described imaging len unit comprises multiple lens, and described multiple lens at least have two different focal lengths.
Preferably, the one side that described multiple lens are connected with described image sensor substrate is coated with filter.
Preferably, described multiple conducting connecting part comprises multiple weldering bag.
Preferably, described multiple weldering bag is used for ball grid array (BGA) reflow process.
Preferably, the maximum temperature of described ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Preferably, also comprise and provide a printed circuit board (PCB), described printed circuit board (PCB) is fixed on described image sensor substrate and the opposing one side of described imaging len unit by described multiple conducting connecting part.
When the present invention utilizes camera module to assemble, make the connection of each inter-module of camera module more firm in the yield increasing camera module in image sensor substrate and microscope base, image sensor substrate and imaging len unit, the position that is coated with viscose between imaging len unit and lens barrel.
Accompanying drawing explanation
Describe its example embodiment in detail by referring to accompanying drawing, above-mentioned and further feature of the present invention and advantage will become more obvious.
Fig. 1 illustrates in prior art, the side sectional view of camera module;
The side sectional view of Fig. 2 camera module provided by the invention; And
The flow chart of the manufacture method of Fig. 3 camera module provided by the invention.
Embodiment
More fully example embodiment is described referring now to accompanying drawing.But example embodiment can be implemented in a variety of forms, and should not be understood to be limited to execution mode set forth herein; On the contrary, these execution modes are provided to make the present invention comprehensively with complete, and the design of example embodiment will be conveyed to those skilled in the art all sidedly.In the drawings, in order to clear, exaggerate the thickness of region and layer.Reference numeral identical in the drawings represents same or similar structure, thus will omit their detailed description.
The side sectional view of Fig. 2 camera module provided by the invention.Camera module 100 comprises: lens barrel 102, microscope base 104, image sensor substrate 114, imaging len unit 112, multiple conducting connecting part 116, the viscose 120 worn silicon through hole 128 and connect for fixing each parts.
Wherein, microscope base 104 is hollow cylinders, and microscope base 104 is provided with the first relative openend 106 and the second openend 108.The aperture area of the first openend 106 is less than the aperture area of the second openend 108.
Image sensor substrate 114 is placed in microscope base 104 side being provided with the first openend 106.Viscose 120 fills up the gap between image sensor substrate 114 downside and the side being provided with the first openend 106 of microscope base 104, viscose 120 also fills up the gap between the medial surface of image sensor substrate 114 and microscope base 104, image sensor substrate 114 to be fixed in the first openend 106 of microscope base 104.Wherein, image sensor substrate 114 comprises multiple imaging pixel.
Imaging len unit 112 is placed in the side opposing with the first openend 106 of image sensor substrate 114.Imaging len unit 112 has sensing area 122 and the non-sensing area 124 around sensing area 122.Viscose 120 is filled in gap between the non-sensing area 124 of imaging len unit 112 and image sensor substrate 114 imaging len unit 122 to be fixed on image sensor substrate 114 and the opposing side of the first openend 106.Wherein, imaging len unit 112 comprises multiple lens, at least has two different focal lengths in multiple lens.Preferably, the one side that multiple lens are connected with 114 image sensor substrate plates filter in addition.
Multiple conducting connecting part 116 is placed in the side that image sensor substrate 114 connects the first openend 106, and is surrounded 106 by the first openend, has at least one to comprise ground connections in multiple conducting connecting part 116.Multiple conducting connecting part 116 comprises multiple weldering bag.Multiple weldering bag is used for ball grid array (BGA) reflow process.Wherein, the maximum temperature of ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Wear silicon through hole 128 extend through image sensor substrate 114 and be coupled to the ground connections being placed in described image sensor substrate 114 downside from the upper side of image sensor substrate 114 by correspondence.
Lens barrel 102 is hollow cylinder and is provided with the 3rd openend 110 and the 4th openend 126.The aperture area of the 3rd openend 110 is greater than the aperture area of the 4th openend 126.3rd openend 110 is connected in the second openend 108 of microscope base 104.Viscose 120 fills up the gap between imaging len unit 112 and the inner surface being provided with the side of the 4th openend 126 of lens barrel 102, viscose 120 also fills up the gap between imaging len unit 112 and camera lens 102 medial surface, to be fixed on imaging len unit 112 by lens barrel 102.Wherein, described viscose fills up the gap in imaging len unit 112 between the most segregative one deck and camera lens 102 medial surface, to be fixed on imaging len unit 112 by lens barrel 102.
Wherein, viscose 120 is the one in following material: epoxy glue; Anaerobic adhesive; Or polyurethane adhesive.。Viscose 120 by warming solidification, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
In a preference, camera module 100 also comprises a printed circuit board (PCB) (not shown).Printed circuit board (PCB) is fixed on image sensor substrate 114 one side opposing with imaging len unit 112 by multiple conducting connecting part 116.
The flow chart of the manufacture method of Fig. 3 camera module provided by the invention.Particularly, 9 steps are originally illustrated.
Step S1: form multiple conducting connecting part in a side of an image sensor substrate.Wherein, in, image sensor substrate 114 comprises multiple imaging pixel.One is had at least to comprise ground connections in multiple conducting connecting part.Multiple conducting connecting part comprises multiple weldering bag.Multiple weldering bag is used for ball grid array (BGA) reflow process.Wherein, the maximum temperature of ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
Step S2: formed extend through image sensor substrate and be coupled to the ground connections being placed in image sensor substrate opposite side by correspondence from the side of image sensor substrate wear silicon through hole.
Step S3: be coated with viscose at the periphery of the side opposing with described conducting connecting part of described image sensor substrate with a point glue equipment.
Step S4: an imaging len unit is fixed on the side that imageing sensor is coated with viscose.Imaging len unit comprises sensing area and the non-sensing area around sensing area.Viscose fills up the gap between the non-sensing area of imaging len unit and image sensor substrate.Wherein, imaging len unit comprises multiple lens, at least has two different focal lengths in multiple lens.Preferably, the one side that multiple lens are connected with 114 image sensor substrate plates filter in addition.
Step S5: with point glue equipment at the viscose of image sensor substrate coating around the formation closed loop shape of image sensor substrate.And be coated with viscose with point glue equipment at the periphery being formed with a side of multiple conducting connecting part of image sensor substrate.
Step S6: side image sensor substrate being formed with multiple conducting connecting part is fixed in the microscope base that a shape is hollow cylinder.Wherein, microscope base is provided with the first relative openend and the second openend.The aperture area of the first openend is less than the aperture area of the second openend, and image sensor substrate is fixed in the first openend.Viscose fills up the gap between the medial surface of described image sensor substrate and described microscope base.Viscose also fills up described image sensor substrate and is formed with gap between inner surface that a side of multiple conducting connecting part and microscope base be provided with the side of the first openend.
Step S7: the viscose encompassing the formation closed loop shape of picture lens unit with point glue equipment in the coating of imaging len unit.And be coated with viscose with point glue equipment at the periphery of a side opposing with image sensor substrate of imaging len unit.
Step S8 a: side opposing with image sensor substrate of imaging len unit is fixed in the lens barrel that a shape is hollow cylinder.Lens barrel is provided with the 3rd openend and the 4th openend.3rd openend is less than the 4th openend.3rd openend is connected in the second openend.Viscose fills up the gap between imaging len unit and the medial surface of lens barrel.Gap between that viscose also fills up imaging len unit and that image sensor substrate is an opposing side and the inner surface being provided with the side of the 4th openend of lens barrel.
Step S9: solidification viscose is to complete the encapsulation of camera module.
In a change case, make camera module and also comprise, a printed circuit board (PCB) (not shown) is provided.Printed circuit board (PCB) is fixed on image sensor substrate 114 one side opposing with imaging len unit 112 by multiple conducting connecting part 116.
Below illustrative embodiments of the present invention is illustrate and described particularly.Should be appreciated that, the invention is not restricted to disclosed execution mode, on the contrary, the invention is intended to contain and be included in various amendment in the spirit and scope of claims and equivalent arrangements.
Claims (20)
1. can a reflow camera module, it is characterized in that, comprising:
Microscope base, described microscope base is hollow cylinder, and described microscope base is provided with the first relative openend and the second openend, and the aperture area of described first openend is less than the aperture area of described second openend;
Image sensor substrate, is placed in described microscope base the side being provided with described first openend, and the gap between the inner surface that viscose fills up described image sensor substrate and described microscope base is to be fixed in described microscope base by described image sensor substrate;
Imaging len unit, be placed in the side different with described first openend of described image sensor substrate, described imaging len unit has sensing area and the non-sensing area around described sensing area, and viscose is filled in gap between the non-sensing area of described imaging len unit and described image sensor substrate described imaging len unit to be fixed on described image sensor substrate and the different side of described first openend;
Multiple conducting connecting part, is placed in described image sensor substrate and connects described first openend side and surrounded by described first openend, have at least one to comprise ground connections in multiple described conducting connecting part;
Wear silicon through hole, described in wear silicon through hole and extend through described image sensor substrate and be coupled to the described ground connections being placed in described image sensor substrate opposite side from the side of described image sensor substrate by correspondence; And
Lens barrel, described lens barrel is hollow cylinder and is provided with the 3rd openend and the 4th openend, the aperture area of described 3rd openend is greater than the aperture area of described 4th openend, described 3rd openend is connected in described second openend, and viscose fills up gap between described imaging len unit and the inner surface of described lens barrel to be fixed on described imaging len unit by described lens barrel.
2. camera module according to claim 1, is characterized in that, described viscose is the one in following material:
Epoxy glue;
Anaerobic adhesive; Or
Polyurethane adhesive.
3. camera module according to claim 1, is characterized in that, described viscose by warming solidification, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
4. camera module according to claim 1, is characterized in that, described image sensor substrate comprises multiple imaging pixel.
5. camera module according to claim 1, is characterized in that, described imaging len unit comprises multiple lens, and described multiple lens at least have two different focal lengths.
6. camera module according to claim 5, is characterized in that, the one side that described multiple lens are connected with described image sensor substrate is coated with filter.
7. camera module according to claim 1, is characterized in that, described multiple conducting connecting part comprises multiple weldering bag.
8. camera module according to claim 7, is characterized in that, described multiple weldering bag is used for ball grid array (BGA) reflow process.
9. camera module according to claim 8, is characterized in that, the maximum temperature of described ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
10. camera module according to claim 1, is characterized in that, also comprises a printed circuit board (PCB), and described printed circuit board (PCB) is fixed on described image sensor substrate and the different one side of described imaging len unit by described multiple conducting connecting part.
11. 1 kinds can the manufacture method of reflow camera module, it is characterized in that, comprising:
Form multiple conducting connecting part in a side of an image sensor substrate, in multiple described conducting connecting part, have at least one to comprise ground connections;
Formed extend through described image sensor substrate and be coupled to the described ground connections being placed in described image sensor substrate opposite side by correspondence from the side of described image sensor substrate wear silicon through hole;
Viscose is coated with at the periphery of the side opposing with described conducting connecting part of described image sensor substrate with a point glue equipment;
One imaging len unit is fixed on the side that described imageing sensor is coated with viscose, described imaging len unit has sensing area and the non-sensing area around described sensing area, and described viscose fills up the gap between the non-sensing area of described imaging len unit and described image sensor substrate;
With described point glue equipment at the viscose of described image sensor substrate coating around the formation closed loop shape of described image sensor substrate, with the periphery coating viscose that be formed with a side of described multiple conducting connecting part of described point glue equipment in described image sensor substrate;
The side described image sensor substrate being formed with described multiple conducting connecting part is fixed in the microscope base that a shape is hollow cylinder, viscose fills up the gap between the inner surface of described image sensor substrate and described microscope base, wherein, described microscope base is provided with the first relative openend and the second openend, the aperture area of described first openend is less than the aperture area of described second openend, and described image sensor substrate is fixed in described first openend;
With described point glue equipment in the coating of described imaging len unit around the viscose of the formation closed loop shape of described imaging len unit, be coated with viscose with described point glue equipment at the periphery of a side opposing with described image sensor substrate of described imaging len unit;
A side opposing with described image sensor substrate of described imaging len unit is fixed in the lens barrel that a shape is hollow cylinder, viscose fills up the gap between described imaging len unit and the inner surface of described lens barrel, described lens barrel is provided with the 3rd openend and the 4th openend, the aperture area of described 3rd openend is greater than the aperture area of described 4th openend, and described 3rd openend is connected to described second openend;
Solidification viscose.
12. manufacture methods according to claim 11, is characterized in that, described viscose is the one in following material:
Epoxy glue;
Anaerobic adhesive; Or
Polyurethane adhesive.
13. manufacture methods according to claim 11, is characterized in that, described viscose by warming solidification, described in the temperature warmed be 80 degrees Celsius to 150 degrees Celsius.
14. manufacture methods according to claim 11, is characterized in that, described image sensor substrate comprises multiple imaging pixel.
15. manufacture methods according to claim 11, is characterized in that, described imaging len unit comprises multiple lens, and described multiple lens at least have two different focal lengths.
16. manufacture methods according to claim 15, is characterized in that, the one side that described multiple lens are connected with described image sensor substrate is coated with filter.
17. manufacture methods according to claim 11, is characterized in that, described multiple conducting connecting part comprises multiple weldering bag.
18. manufacture methods according to claim 17, is characterized in that, described multiple weldering bag is used for ball grid array (BGA) reflow process.
19. manufacture methods according to claim 18, is characterized in that, the maximum temperature of described ball grid array (BGA) reflow process welding is 240 degrees Celsius to 255 degrees Celsius.
20. manufacture methods according to claim 11, is characterized in that, also comprise and provide a printed circuit board (PCB), and described printed circuit board (PCB) is fixed on described image sensor substrate and the opposing one side of described imaging len unit by described multiple conducting connecting part.
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| CN201310260368.7A CN104253133B (en) | 2013-06-26 | 2013-06-26 | Camera module and preparation method thereof |
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| CN201310260368.7A CN104253133B (en) | 2013-06-26 | 2013-06-26 | Camera module and preparation method thereof |
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| CN104253133B CN104253133B (en) | 2017-07-28 |
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Cited By (1)
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