Background technology
In recent years, fast development along with mobile communication technology, the terminal equipments such as mobile phone are designed to be more and more thinner, compressed for taking up room again and again of the antenna of communicating by letter in terminal, how in limited space, to improve antenna performance, will antenna performance and user's communication quality be played to vital effect.
Current antenna assemblies technique mainly contains following three kinds:
(1) with LDS(Laser Direct Structuring, laser direct forming) form, by antenna assemblies on the antenna holder of the terminal inners such as mobile phone or any position of housing.Although this assembling mode can make full use of antenna space, the cost of LDS antenna is generally than common FPC(Flexible Printed Circuit, flexible printed circuit board) antenna is high 5~10 times, and debugging and draw a design all extremely inconvenient.
(2), with the form of stainless steel substrates, be assembled on the antenna holder of interior of mobile phone.Though stainless steel substrates is with low cost, hardness is too large, cannot cut easily, and can not make full use of some trickle antenna spaces when manually debugging.
(3), with the form of FPC, be assembled on the antenna holder of interior of mobile phone or drain pan outer surface.This is the most widely used mode of current antenna for mobile phone industry.Due to easy to assembly, FPC is normally attached to antenna holder outer surface or drain pan outer surface after mobile phone each several part structure has been shaped, and this mode is being limited to aspect raising antenna performance very much.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Please also refer to Fig. 1 and Fig. 2, be the STRUCTURE DECOMPOSITION schematic diagram of a kind of embodiment of the utility model embodiment terminal, terminal comprises main circuit board 1, antenna connector 2, support 3, antenna 4 and back cover 5.
Terminal also comprises fore shell (not shown), and fore shell coordinates with back cover 5 shell that forms terminal, and fore shell is for parts such as fixed terminal screens.
On main circuit board 1, be provided with antenna headroom district (not shown), main circuit board 1 is connected with antenna 4 by antenna connector 2.In the present embodiment, main circuit board is printing board PCB.Wherein, in the whole vertical solid space in antenna headroom district without any other metal structure or device, because the existence of metal structure or device may affect the radiance of antenna 4.The volume in antenna headroom district is the product of the headroom area on PCB surface and the distance of PCB and antenna 4, and the volume in antenna headroom district is larger, and the radiance of antenna 4 is better.
Antenna connector 2 is metal thimble, and metal thimble one end connects main circuit board, and the other end connects the distributing point of antenna 4.The style of metal thimble and length can be selected according to the specific design of mobile phone and structure, at this, do not add to set forth.
Support 3 is arranged between main circuit board 1 and back cover 5, and support is nonmetallic materials, and it is as the indispensable part of terminal, and inner side is for devices such as fixing loudspeaker, and loudspeaker space is around used as sound chamber.On support 3, be provided with through hole, antenna connector 2 links together main circuit board 1 and antenna 4 through through hole.In the present embodiment, through hole comprises the first through hole 31 and the second through hole 32, and metal thimble comprises that the first thimble 21 and the second thimble 22, the first thimbles 21 are connected with the antenna 4 on back cover 5 with the second through hole 32 through the first through hole 31 respectively with the second thimble 22.
Antenna 4 is arranged on back cover 5, and antenna 4 is arranged at the district's projection of antenna headroom in the region of back cover 5.In the present embodiment, antenna 4 is flexible printed circuit board FPC antenna or laser direct forming LDS antenna.Board substrate is the part of antenna 4, and FPC antenna is usingd copper foil of circuit board as antenna radiator.Antenna is a kind of converter, and it is transformed into the guided wave of transmission above-the-line promotion the electromagnetic wave of propagating in unbounded medium (normally free space), or carries out contrary conversion.Antenna is used for launching or reception electromagnetic wave in wireless device.The engineering systems such as radio communication, broadcast, TV, radar, navigation, electronic countermeasures, remote sensing or radio astronomy, every electromagnetic wave that utilizes carrys out transmission of information, all relies on antenna to carry out work.In addition,, aspect electromagnetic wave transmission energy, the energy emission of non-signal also needs antenna.General antenna all has invertibity, with common antenna, both can be used as transmitting antenna, also can be used as reception antenna.The same antenna is identical as the fundamental characteristics parameter of transmitting or reception.
Further, back cover 5 comprises inner surface and the outer surface being oppositely arranged, antenna 4 is arranged on inner surface, further, antenna 4 can be fixed on the inner surface of back cover 5 by immobilization materials such as adhesive stickers, and selecting good permanent adhesive, suitable barbola work is the important guarantee of these antenna 4 quality.The inner surface of back cover 5 is greater than support 3 with respect to the height of PCB with respect to the height of PCB, because support 3 is arranged between main circuit board 1 and back cover 5, and between support 3 and back cover 5, there is the wide gap of general 0.3mm-0.5mm, therefore antenna 4 is arranged on inner surface, can further increase the volume in wire antenna headroom district, thereby improve the radiance of antenna 4.In addition, the relative support 3 of back cover 5 may have larger space for antenna 4, and the cabling area that increases antenna 4 with this, makes the design of antenna 4 and cabling have more flexibility.
Adopt the utility model embodiment, by antenna being arranged to the district's projection of antenna headroom in the region of terminal back cover, the relative distance of antenna and main circuit board is increased, and then the volume in increase antenna headroom district, on the basis of moulding of interior of mobile phone, antenna performance and the capable of being wired area that has increased antenna have further been improved.
One of ordinary skill in the art will appreciate that all or part of flow process realizing in above-described embodiment method, to come the hardware that instruction is relevant to complete by computer program, described program can be stored in computer read/write memory medium, this program, when carrying out, can comprise as the flow process of the embodiment of above-mentioned each side method.Wherein, described storage medium can be magnetic disc, CD, read-only store-memory body (Read-Only Memory, ROM) or random store-memory body (Random Access Memory, RAM) etc.
Step in embodiment of the present invention method can be carried out according to actual needs order and adjusted, merges and delete.
Module in embodiment of the present invention device or unit can merge according to actual needs, divide and delete.
Module described in the embodiment of the present invention or unit, can pass through universal integrated circuit, CPU(Central Processing Unit for example, central processing unit), or by ASIC(Application Specific Integrated Circuit, application-specific integrated circuit (ASIC)) realize.
Above disclosed is only the utility model preferred embodiment, certainly can not limit with this interest field of the utility model, and the equivalent variations of therefore doing according to the utility model claim, still belongs to the scope that the utility model is contained.