CN203509805U - Eccentric rotary sander - Google Patents
Eccentric rotary sander Download PDFInfo
- Publication number
- CN203509805U CN203509805U CN201320633527.9U CN201320633527U CN203509805U CN 203509805 U CN203509805 U CN 203509805U CN 201320633527 U CN201320633527 U CN 201320633527U CN 203509805 U CN203509805 U CN 203509805U
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- China
- Prior art keywords
- eccentric rotary
- sander
- driving mechanism
- buffer layer
- mill
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Abstract
The utility model discloses an eccentric rotary sander which comprises a sander body and a sanding disk. The sander body comprises a driving mechanism and an eccentric rotary mechanism in transmission connection with the driving mechanism, the sanding disk is in transmission connection with the eccentric rotating mechanism to eccentrically rotate around a rotating shaft of the driving mechanism under the driving of the driving mechanism, the sanding disk comprises a top plate, a bottom plate and a flexible buffering layer, the bottom plate is used for enabling a device to be sanded to be bonded, the flexible buffering layer is arranged between the top plate and the bottom plate, the cross section of the sanding disk is round, and the thickness of the sanding disc is larger than 1.5cm. The eccentric rotary sander is high in sanding accuracy and long in service life.
Description
Technical field
The application relates to mechanical grinding polishing technology field, relates in particular to a kind of eccentric rotary sander.
Background technology
Sander is widely used in the every field such as product manufacture, processing, maintenance, maintenance, and wherein, eccentric rotary sander is mainly used in the surface that polishing grinding area is larger, as cabinet table surface polishing, and stone material polishing and surface treatment etc.The mill thinner thickness of existing eccentric rotary sander, base plate adopts hard material to make, and the precision of not only polishing is lower, and easily to being polished object, causes damage, and self also very short in service life.
Summary of the invention
The application's technical problem to be solved is, a kind of eccentric rotary sander is provided, and polishing precision is high, long service life.
In order to solve the problems of the technologies described above, the application has proposed a kind of eccentric rotary sander, comprises sander main body and mill; Described sander main body comprises driving mechanism and the eccentric rotary mechanism being in transmission connection with driving mechanism; Described mill be connected with eccentric rotary mechanism driving with under the drive of driving mechanism around the rotating shaft eccentric rotation of driving mechanism, it comprise top board, in order to the base plate of bonding polishing utensil and be arranged at top board and base plate between supple buffer layer; The cross section of described mill is circular, and thickness is greater than 1.5CM.
Further, described supple buffer layer adopts flexible colloidal materials, flexible foam or sponge to make.
Further, described flexible buffer layer thickness is 2.0CM ~ 4.0CM.
Further, described base plate is set to hard fabric, and it is that VELCRO hooks face with the one side that polishing utensil fits.
Further, described top board is nested in the top of described supple buffer layer.
Further, described eccentric rotary mechanism is provided with the screw that central shaft deviates from driving mechanism rotating shaft, and the top board top of described mill is coaxially arranged with the double-screw bolt suitable with described screw.
The application's beneficial effect is: the mill structure that is more than or equal to 1.5CM and has supple buffer layer by thickness is set, utilize deformability and reset capability that supple buffer layer is stronger, effectively strengthen polishing utensil and be polished the buffering between object, avoid in bruting process object surface and the damage that himself causes, polishing precision is high, long service life.
Accompanying drawing explanation
Fig. 1 is the front view of the application's mill.
Fig. 2 is the structural representation of the application's eccentric rotary sander.
The specific embodiment
It should be noted that, in the situation that not conflicting, embodiment and the feature in embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the application are described in further detail.
As shown in Fig. 1 ~ Fig. 2, the application provides a kind of sander, comprises sander main body 10 and mill 20.
In the application, the cross section of described mill 20 arranges rounded, and thickness is greater than 1.5CM, and it comprises top board 21, base plate 22, and supple buffer layer 23.
Described sander main body 10 comprises driving mechanism and the eccentric rotary mechanism being in transmission connection with described driving mechanism, described mill 20 be connected with described eccentric rotary mechanism driving with under the drive of described driving mechanism around the rotating shaft eccentric rotation of described driving mechanism.Described eccentric rotary mechanism is provided with the screw that central shaft deviates from described driving mechanism rotating shaft, and deviating from an end face of described supple buffer layer 23 of described top board 21 is provided with the double-screw bolt 211 suitable with described screw.
Described supple buffer layer 23 is arranged between described top board 21 and base plate 22, adopts the flexible material with stronger deformability and reset capability to make, as flexible colloidal materials, flexible foam or sponge etc.
In the application, described top board 21 is nested in the top of described supple buffer layer 23, and the end face of the end face of described top board 21 and described supple buffer layer 23 maintains an equal level.
As the polishing such as polished silicon wafer, sand paper utensil, in the application, described base plate 22 is set to have the fabric construction of certain degree of hardness to described base plate 22 in order to bonding, and it deviates from the VELCRO being provided with in order to bonding polishing utensil in the one side of described supple buffer layer 23 and hooks face.
When reality is implemented, can polish the as required concrete structure of object of the thickness of the described mill 20 in the application is set, and the scope that preferably arranges is 2.0CM ~ 4.0CM.
During use, the selected mill 20 that is applicable to thickness is in transmission connection in sander main body 20, and the utensil of polishing is accordingly bonded on described base plate 22.Owing to being provided with described supple buffer layer 23, strengthen polishing utensil and be polished the buffering between object, effectively strengthening polishing effect, improving polishing fineness, and avoid causing damage to being polished the surface of object, greatly improve the service life of mill 20 and polishing utensil.
Above content is the further description of the application being done in conjunction with concrete embodiment, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.
Claims (6)
1. an eccentric rotary sander, is characterized in that, comprises sander main body and mill; Described sander main body comprises driving mechanism and the eccentric rotary mechanism being in transmission connection with driving mechanism; Described mill be connected with eccentric rotary mechanism driving with under the drive of driving mechanism around the rotating shaft eccentric rotation of driving mechanism, it comprise top board, in order to the base plate of bonding polishing utensil and be arranged at top board and base plate between supple buffer layer; The cross section of described mill is circular, and thickness is greater than 1.5CM.
2. eccentric rotary sander as claimed in claim 1, is characterized in that, described supple buffer layer adopts flexible colloidal materials, flexible foam or sponge to make.
3. eccentric rotary sander as claimed in claim 1, is characterized in that, described flexible buffer layer thickness is 2.0CM ~ 4.0CM.
4. eccentric rotary sander as claimed in claim 1, is characterized in that, described base plate is set to hard fabric, and it is that VELCRO hooks face with the one side that polishing utensil fits.
5. eccentric rotary sander as claimed in claim 1, is characterized in that, described top board is nested in the top of described supple buffer layer.
6. eccentric rotary sander as claimed in claim 1, is characterized in that, described eccentric rotary mechanism is provided with the screw that central shaft deviates from driving mechanism rotating shaft, and the top board top of described mill is coaxially arranged with the double-screw bolt suitable with described screw.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320633527.9U CN203509805U (en) | 2013-10-14 | 2013-10-14 | Eccentric rotary sander |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320633527.9U CN203509805U (en) | 2013-10-14 | 2013-10-14 | Eccentric rotary sander |
Publications (1)
Publication Number | Publication Date |
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CN203509805U true CN203509805U (en) | 2014-04-02 |
Family
ID=50368787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201320633527.9U Expired - Fee Related CN203509805U (en) | 2013-10-14 | 2013-10-14 | Eccentric rotary sander |
Country Status (1)
Country | Link |
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CN (1) | CN203509805U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103978352A (en) * | 2014-05-14 | 2014-08-13 | 戴素琳 | Die polishing process |
-
2013
- 2013-10-14 CN CN201320633527.9U patent/CN203509805U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103978352A (en) * | 2014-05-14 | 2014-08-13 | 戴素琳 | Die polishing process |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140402 Termination date: 20201014 |
|
CF01 | Termination of patent right due to non-payment of annual fee |