CN203831217U - Grinding machine and grinding disc thereof - Google Patents
Grinding machine and grinding disc thereof Download PDFInfo
- Publication number
- CN203831217U CN203831217U CN201320633487.8U CN201320633487U CN203831217U CN 203831217 U CN203831217 U CN 203831217U CN 201320633487 U CN201320633487 U CN 201320633487U CN 203831217 U CN203831217 U CN 203831217U
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- CN
- China
- Prior art keywords
- mill
- grinding
- sander
- main body
- buffer layer
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- Expired - Fee Related
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a grinding machine and a grinding disc thereof. The cross section of the grinding disc is rectangular, the thickness of the grinding disc is larger than 1.5 CM, and the grinding disc comprises a top plate used for being fixedly connected to a grinding machine body, a bottom plate used for bonding a grinding tool and a flexible buffer layer arranged between the top plate and the bottom plate. The grinding machine and the grinding disc thereof can achieve grinding of edges, right angles, circular beads and other positions with special structures of articles, grinding precision is high, and service life is long.
Description
Technical field
The application relates to mechanical grinding polishing technology field, relates in particular to a kind of sander and mill thereof.
Background technology
Sander is widely used in the every field such as product manufacture, processing, maintenance, maintenance.The mill thinner thickness of existing sander, be to guarantee safety and the quality of polishing operation, and the base plate of mill adopts hard material to make, and such mill structure precision of not only polishing is lower, and service life is not long.Because the fine degree of existing product outward appearance requires more and more highlyer, particularly, for the polishing at the special construction positions such as the seamed edge of object, right angle, fillet, cannot well complete.
Summary of the invention
The application's technical problem to be solved is, a kind of mill is provided, and is suitable for object seamed edge, right angle, the isostructural meticulous polishing of fillet, and long service life.
The further technical problem to be solved of the application is, a kind of sander is provided, and can realize the meticulous polishing of the special construction such as seamed edge, right angle, fillet of object, and long service life.
In order to solve the problems of the technologies described above, the application has proposed a kind of mill, the cross section of described mill is rectangle, and thickness is greater than 1.5CM, comprise being fixedly attached to sander main body top board, in order to the base plate of bonding polishing utensil and be arranged at top board and base plate between supple buffer layer.
Further, described supple buffer layer adopts flexible colloidal materials, flexible foam or sponge to make.
Further, described mill thickness is 2.0CM ~ 4.0CM.
Further, described base plate is set to hard fabric, and it is that VELCRO hooks face with the one side that polishing utensil fits.
Further, described top board is nested in the top of described supple buffer layer.
Correspondingly, the application also provides a kind of sander, comprises sander main body and is fixedly connected on the mill in sander main body, and described mill is mill as above.
Further, described sander main body is preset with installing hole on the installation position of mill, and described top board offers in order to the screw with sander main body bolt corresponding to installing hole.
The application's beneficial effect is: the mill structure that is more than or equal to 1.5CM and has supple buffer layer by thickness is set, utilize deformability and reset capability that supple buffer layer is stronger, effectively strengthen polishing utensil and the laminating degree that is polished object surface, the polishing of realization to special construction positions such as the seamed edge of object, right angle, fillets, and polishing fineness is good, precision is high; Meanwhile, due to supple buffer layer being set, effectively strengthen polishing utensil and be polished the buffering between object, when further strengthening polishing effect, improving the service life of mill and polishing utensil.
Accompanying drawing explanation
Fig. 1 is the front view of the application's mill.
Fig. 2 is the top view of the application's mill.
Fig. 3 is the structural representation of the application's sander.
The specific embodiment
It should be noted that, in the situation that not conflicting, embodiment and the feature in embodiment in the application can mutually combine, and below in conjunction with the drawings and specific embodiments, the application are described in further detail.
As shown in Fig. 1 ~ Fig. 3, the application provides a kind of mill 10, and the sander of applying this mill 10.
Please refer to Fig. 3, described sander comprises sander main body 20 and mill 10, and described mill 10 is fixedly installed on the corresponding installation position of described sander main body 20.
As shown in Figure 1 and Figure 2, the cross section of described mill 10 arranges rectangular, and thickness is greater than 1.5CM, and it comprises top board 11, base plate 12, and supple buffer layer 13.
Described supple buffer layer 13 is arranged between described top board 11 and base plate 12, adopts the flexible material with stronger deformability and reset capability to make, as flexible colloidal materials, flexible foam or sponge etc.
Described top board 11 is in order to be fixedly attached to described mill 10 on the mill installation position of described sander main body 20, described sander main body 20 is preset with installing hole on mill installation position, on the top board 11 of described mill 10, corresponding to described installing hole, offers in order to the screw 111 with described sander main body 20 bolts.
In the application, described top board 11 is nested in the top of described supple buffer layer 13, and the end face of the end face of described top board 11 and described supple buffer layer 13 maintains an equal level.
As the polishing such as polished silicon wafer, sand paper utensil, in the application, described base plate 12 is set to have the fabric construction of certain degree of hardness to described base plate 12 in order to bonding, and it deviates from the VELCRO being provided with in order to bonding polishing utensil in the one side of described supple buffer layer 13 and hooks face.
When reality is implemented, can polish the as required concrete structure of object of the thickness of the described mill 10 in the application is set, and the scope that can arrange is 2.0CM ~ 4.0CM.
During use, the selected mill 10 that is applicable to thickness is fixedly installed in sander main body 20, and the utensil of polishing is accordingly bonded on described base plate 12.Owing to being provided with described supple buffer layer 13, when polished in the positions such as the seamed edge of object, right angle or fillet, described supple buffer layer 13 is under the interaction force of described sander main body 20 and object, compressive deformation also drives polishing utensil to be wrapped in the position to be polished of object simultaneously, thereby realize the meticulous polishing at this position, after having polished, described supple buffer layer 13 drives polishing utensil to reset.Meanwhile, due to supple buffer layer being set, the utensil and be polished the buffering between object of can effectively strengthening polishing, when further strengthening polishing effect, improves the service life of mill and polishing utensil greatly.
Above content is the further description of the application being done in conjunction with concrete embodiment, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.
Claims (7)
1. a mill, is characterized in that, the cross section of described mill is rectangle, and thickness is greater than 1.5CM, comprise being fixedly attached to sander main body top board, in order to the base plate of bonding polishing utensil and be arranged at top board and base plate between supple buffer layer.
2. mill as claimed in claim 1, is characterized in that, described supple buffer layer adopts flexible colloidal materials, flexible foam or sponge to make.
3. mill as claimed in claim 1, is characterized in that, described mill thickness is 2.0CM ~ 4.0CM.
4. mill as claimed in claim 1, is characterized in that, described base plate is set to hard fabric, and it is that VELCRO hooks face with the one side that polishing utensil fits.
5. mill as claimed in claim 1, is characterized in that, described top board is nested in the top of described supple buffer layer.
6. a sander, comprises sander main body and is fixedly connected on the mill in sander main body, it is characterized in that, described mill is the mill as described in any one in claim 1 to 5.
7. sander as claimed in claim 6, is characterized in that, described sander main body is preset with installing hole on the installation position of mill, and described top board offers in order to the screw with sander main body bolt corresponding to installing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633487.8U CN203831217U (en) | 2013-10-14 | 2013-10-14 | Grinding machine and grinding disc thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633487.8U CN203831217U (en) | 2013-10-14 | 2013-10-14 | Grinding machine and grinding disc thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203831217U true CN203831217U (en) | 2014-09-17 |
Family
ID=51509105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320633487.8U Expired - Fee Related CN203831217U (en) | 2013-10-14 | 2013-10-14 | Grinding machine and grinding disc thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203831217U (en) |
-
2013
- 2013-10-14 CN CN201320633487.8U patent/CN203831217U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140917 Termination date: 20161014 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |