CN203509349U - Laser dotting device - Google Patents
Laser dotting device Download PDFInfo
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- CN203509349U CN203509349U CN201320600010.XU CN201320600010U CN203509349U CN 203509349 U CN203509349 U CN 203509349U CN 201320600010 U CN201320600010 U CN 201320600010U CN 203509349 U CN203509349 U CN 203509349U
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- beam splitter
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- dotting device
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Abstract
The utility model provides a laser dotting device which comprises a laser device, a beam splitter and a focus lens. The beam splitter is arranged between the laser device and the focus lens on the light path of the laser device, and the focus lens is arranged between the beam splitter and a processed workpiece on the light path of the laser device. The beam splitter and the focus lens are arranged between the laser device and the processed workpiece on the light path of the laser device, a laser beam emitted by the laser device enters the beam splitter, the laser beam is divided into two or more laser beams by the beam splitter, thus under the effect of the focus lens, the two or more laser beams are focused on the processed workpiece to achieve simultaneous working of the multiple laser beams, the processed workpiece is made to be heated to form micro-pits, and the micro-pits of a certain number can form a groove. Thus, designed pictures can be directly processed on the processed workpiece, the process is simple, the processed workpiece can not be deformed easily, and the efficiency and the rate of finished products are improved.
Description
Technical field
The utility model relates to a kind of laser dotting device, relates in particular to a kind of laser dotting device for processing graphic pattern on LGP.
Background technology
At present, on LGP, the method for processing graphic pattern mainly contains typography method.First according to optics, to obtain a film, then this film be transferred on a screen template, LGP be put into screen template below.Ink special is imprinted on the film and is scraped, thereby see through the film, on LGP, form half-tone, and then toast with baking oven.The complex procedures of this technique, and baking easily make light conducting board from deformation, caused the reduction of efficiency and yield rate.And, the poisonous not environmental protection of ink.
Summary of the invention
It is a kind of by the device of laser processing graphic pattern on LGP that the purpose of this utility model is to provide.
For addressing the above problem, a kind of laser dotting device in the utility model one embodiment, comprising:
Laser instrument, beam splitter and focus lamp, described beam splitter is arranged between described laser instrument and described focus lamp in the light path of described laser instrument, and described focus lamp is arranged between described beam splitter and processing work in the light path of described laser instrument.
As further improvement of the utility model, described laser dotting device also comprises one first motion platform and one second motion platform, described laser instrument, described beam splitter and described focus lamp are arranged on described the first motion platform, described processing work is arranged on described the second motion platform, and described the first motion platform and described the second motion platform can be movable relatively.
As further improvement of the utility model,
Described the first motion platform drives described laser instrument, described beam splitter and described focus lamp to move in the horizontal direction;
Described the second motion platform drives described processing work to move at vertical direction.
As further improvement of the utility model, described beam splitter is arranged at rotationally between described laser instrument and described focus lamp in described light path.
As further improvement of the utility model, described laser dotting device also comprises a speculum, and described speculum is arranged between described laser instrument and described beam splitter in described light path.
As further improvement of the utility model, described laser dotting device also comprises a beam expanding lens, and described beam expanding lens is arranged between described laser instrument and described beam splitter in described light path.
As further improvement of the utility model, described laser dotting device also comprises a speculum, and described speculum is arranged between described beam expanding lens and described beam splitter in described light path.
As further improvement of the utility model, the angle of described speculum and horizontal plane is 45 degree.
As further improvement of the utility model, described laser dotting device also comprises one first motion platform and one second motion platform, described speculum, described beam splitter and described focus lamp are arranged on described the first motion platform, described processing work is arranged on described the second motion platform, and described the first motion platform and described the second motion platform can be movable relatively.
As further improvement of the utility model, described beam splitter is arranged at rotationally between described laser instrument and described focus lamp in described light path.
As further improvement of the utility model, described laser dotting device also comprises an optical gate, and described optical gate is arranged between described laser instrument and described beam splitter in described light path.
As further improvement of the utility model, described laser dotting device also comprises an optical gate, and described optical gate is arranged between described laser instrument and described beam expanding lens in described light path.
As further improvement of the utility model, described focus lamp is plano-convex focus lamp.
Compared to prior art, the technical solution of the utility model can make the figure designing directly just process on LGP, and technique is simple, and fabrication cycle is short.
Accompanying drawing explanation
The principle schematic of the laser dotting device that Fig. 1 provides for the utility model the first embodiment;
The principle schematic of the laser dotting device that Fig. 2 provides for the utility model the second embodiment;
The principle schematic of the laser dotting device that Fig. 3 provides for the utility model the 3rd embodiment;
The principle schematic of the laser dotting device that Fig. 4 provides for the utility model the 4th embodiment;
The principle schematic of the laser dotting device that Fig. 5 provides for the utility model the 5th embodiment;
The principle schematic of the laser dotting device that Fig. 6 provides for the utility model the 6th embodiment;
The principle schematic of the laser dotting device that Fig. 7 provides for the utility model the 7th embodiment;
The principle schematic of the laser dotting device that Fig. 8 A ~ Fig. 8 G provides for the utility model the 8th embodiment;
The hot spot schematic diagram of the laser dotting device that Fig. 9 provides for the utility model the first embodiment on processing work.
The specific embodiment
Below with reference to the specific embodiment shown in the drawings, the utility model is described in detail.But these embodiments do not limit the utility model, the conversion in the structure that those of ordinary skill in the art makes according to these embodiments, method or function is all included in protection domain of the present utility model.
The principle schematic of the laser dotting device that Fig. 1 provides for the utility model the first embodiment, as shown in Figure 1.Laser dotting device comprises laser instrument 10, beam splitter 20 and focus lamp 30, described beam splitter 10 is arranged between described laser instrument 10 and described focus lamp 30 in the light path of described laser instrument 10, and described focus lamp 30 is arranged between described beam splitter 20 and processing work 40 in the light path of described laser instrument 10.Preferably, described laser instrument 10 is CO2 laser instrument.The light beam sending from described CO2 laser instrument is CO2 laser beam.
Particularly, described beam splitter 20 can utilize diffraction effect, and single laser beam is divided into two or more laser beams.
Alternatively, in one of the present embodiment possible implementation, described beam splitter 20 is arranged at rotationally between described laser instrument 10 and described focus lamp 30 in described light path.Described beam splitter 20 can be around its longitudinal axis d that rotates a certain angle, so, the center of hot spot that the hot spot of laser dotting device on processing work be take before rotation is the center of circle, rotating photo with angle d, the spacing on the width of groove of hot spot is changed, as shown in Figure 9.By the method, the spacing of the micro-hole being formed by hot spot on can controlled working workpiece on the width of groove, can access less distance between centers of tracks.
Particularly, described focus lamp 30 can be convex lens, for example, and planoconvex spotlight etc.
In general, described processing work 40 is LGP, is a part for backlight.For example, the casting plate of acrylic material or stripper plate, can be for the light source industry of large format flat-panel monitor industry, lamp box advertisement and Uniform Illumination industry etc.
Alternatively, in one of the present embodiment possible implementation, it is the pulse laser of 10640 nanometers (nm) that laser instrument 10 specifically can adopt wavelength, and acrylic material has good absorptivity to the laser of this wavelength, like this, can produce the groove that quality is higher and be beneficial to leaded light.The power of laser instrument 10 is 100 watts (W), can effectively guarantee the speed of processing.The spot size of laser can pass through to regulate, to meet the requirement of the present embodiment, for example, 0.3 millimeter of diameter (mm), degree of depth 0.05mm.
Alternatively, in one of the present embodiment possible implementation, specifically can, by adjusting the focal length of described focus lamp 30, on described processing work 40, produce size and the energy of the hot spot satisfying the demands, thereby offer groove on described processing work 40.
In the present embodiment, by in the light path of laser instrument, be arranged at beam splitter and focus lamp between this laser instrument and processing work, the laser beam that laser instrument sends enters beam splitter, by beam splitter, a laser beam is divided into two or more laser beams, and then under the effect of focus lamp, two or more laser beam focusings are on processing work, to form the operation simultaneously of a plurality of laser beams, make processing work be subject to the micro-hole of thermosetting, micro-hole of some can form groove, like this, can make the figure designing directly just process on processing work, operation is simple, and be not easy to make processing work distortion, thereby efficiency and yield rate have been improved.
In addition, adopt the technical solution of the utility model, without using the toxic materials such as ink, be more conducive to environmental protection.
The principle schematic of the laser dotting device that Fig. 2 provides for the utility model the second embodiment, as shown in Figure 2.On the laser dotting device basic providing at embodiment corresponding to Fig. 1, this laser dotting device can further include one first motion platform 51 and one second motion platform 52, and described laser instrument 10, described beam splitter 20 and described focus lamp 30 are arranged on described the first motion platform 51; Described processing work 40 is arranged at described the second motion platform 52.Described the first motion platform 51 can be movable relatively with described the second motion platform 52.
Particularly, second motion platform 52 at described the first motion platform 51 and processing work 40 places specifically can, in conjunction with motion, move with respect to processing work 40 to realize described laser instrument 10, described beam splitter 20 and described focus lamp 30.Like this, easy to process, control simply, can further raise the efficiency.
For example, described the first motion platform 51 can drive the x motion in the horizontal direction of described laser instrument 10, described beam splitter 20 and described focus lamp 30, and correspondingly, second motion platform 52 at processing work 40 places drives processing work 40 to move at vertical direction y.Particularly, described the first motion platform 51 specifically can comprise x direction delivery unit, for example, and the motor of x direction slide rail and control x direction slide rail; Second motion platform 52 at described processing work 40 places specifically can comprise substrate and y direction delivery unit, for example, and the motor of y direction slide rail and control y direction slide rail.Wherein, described substrate can be resistant to elevated temperatures aluminum base plate.
Or, again for example, described the first motion platform 51 can drive described laser instrument 10, described beam splitter 20 and described focus lamp 30 in vertical direction y motion, and correspondingly, second motion platform 52 at processing work 40 places drives processing work 40 x motion in the horizontal direction.Particularly, described the first motion platform 51 specifically can comprise y direction delivery unit, for example, and the motor of y direction slide rail and control y direction slide rail; Second motion platform 52 at described processing work 40 places specifically can comprise substrate and x direction delivery unit, for example, and the motor of x direction slide rail and control x direction slide rail.Wherein, described substrate can be resistant to elevated temperatures aluminum base plate.
Or, again for example, described the first motion platform 51 can drive described laser instrument 10, described beam splitter 20 and described focus lamp 30 x and vertical direction y motion in the horizontal direction, and second motion platform 52 at processing work 40 places also can drive processing work 40 x and vertical direction y motion in the horizontal direction.Particularly, described the first motion platform 51 specifically can comprise x direction delivery unit, for example, and the motor of x direction slide rail and control x direction slide rail, and can further include y direction delivery unit, for example, the motor of y direction slide rail and control y direction slide rail; Second motion platform 52 at described processing work 40 places specifically can comprise substrate and x direction delivery unit, for example, the motor of x direction slide rail and control x direction slide rail, and can further include y direction delivery unit, for example, the motor of y direction slide rail and control y direction slide rail.Wherein, described substrate can be resistant to elevated temperatures aluminum base plate.
Here the horizontal direction x of indication and vertical direction y are with respect to the horizontal plane.
Preferably, the movement velocity maximum of x can reach 4 meter per seconds (m/s) in the horizontal direction, in the movement velocity maximum of vertical direction y, can be reached for 50 mm/second (mm/s).Because the movement velocity maximum of x in the horizontal direction can reach 4m/s, can meet the requirement of large format, for example, 1100mm * 1800mm.
Be understandable that, the motion of horizontal direction x and vertical direction y has sequencing.For example, if the length direction of groove is set to horizontal direction x, so, the upper motion of x first in the horizontal direction after a line completion of processing, then is moved on vertical direction y.Or, more for example, if the width of groove is set to horizontal direction x, so, can first on vertical direction y, move, after a line completion of processing, the upper motion of x in the horizontal direction.
Alternatively, described the second motion platform 52 can also further not move, described the first motion platform 51 can drive described laser instrument 10, described beam splitter 20 and described focus lamp 30 x and vertical direction y motion in the horizontal direction, to realize described laser instrument 10, described beam splitter 20 and described focus lamp 30, with respect to processing work 40, moves.
Particularly, described the first motion platform 51 specifically can comprise x direction delivery unit, for example, and the motor of x direction slide rail and control x direction slide rail; Can further include y direction delivery unit, for example, the motor of y direction slide rail and control y direction slide rail.
Alternatively, described the first motion platform 51 can also further not move, by second motion platform 52 at processing work 40 places drive processing works 40 in the horizontal direction x and vertical direction y move, equally also can realize described laser instrument 10, described beam splitter 20 and described focus lamp 30 and move with respect to processing work 40.
Particularly, second motion platform 52 at described processing work 40 places specifically can comprise substrate and x direction delivery unit, for example, and the motor of x direction slide rail and control x direction slide rail; Can further include y direction delivery unit, for example, the motor of y direction slide rail and control y direction slide rail.Wherein, described substrate can be resistant to elevated temperatures aluminum base plate.
Preferably, the movement velocity maximum of x can reach 4 meter per seconds (m/s) in the horizontal direction, in the movement velocity maximum of vertical direction y, can be reached for 50 mm/second (mm/s).Because the movement velocity maximum of x in the horizontal direction can reach 4m/s, can meet the requirement of large format, for example, 1100mm * 1800mm.
Be understandable that, the motion of horizontal direction x and vertical direction y has sequencing.For example, if the length direction of groove is set to horizontal direction x, so, the upper motion of x first in the horizontal direction after a line completion of processing, then is moved on vertical direction y.Or, more for example, if the width of groove is set to horizontal direction x, so, can first on vertical direction y, move, after a line completion of processing, the upper motion of x in the horizontal direction.
Alternatively, 20 of described beam splitters can be connected on described the first motion platform 51 rotationally.The detailed description of described beam splitter 20 can, referring to the related content in embodiment corresponding to Fig. 1, repeat no more herein.
In the present embodiment, x and/or vertical direction y move in the horizontal direction by the first motion platform, to drive laser instrument, beam splitter and focus lamp, and second motion platform at processing work place drives processing work in vertical direction y and/or horizontal direction x motion, can on processing work, form the groove that many different densities distribute, the length of groove is 200 microns of (μ m) ~ 400 μ m, width is 100 μ m ~ 200 μ m, and the degree of depth is 40 μ m ~ 100 μ m.
Generally, for stable output, need to laser instrument 10 is fixing.Like this, comparatively speaking, the transmission direction of laser beam is also fixed.But for the demand constantly changing, can take some mode, change as required the transmission direction of laser beam, make the transmission of laser beam become a dynamic transmission.Conventionally speculum is set up in the measure of taking exactly in light path.The principle schematic of the laser dotting device that Fig. 3 provides for the utility model the 3rd embodiment, as shown in Figure 3.On the laser dotting device basic providing at embodiment corresponding to Fig. 1, this laser dotting device can further include a speculum 60, and described speculum 60 is arranged between described laser instrument 10 and described beam splitter 20 in described light path.
Preferably, described speculum 60 can be set to 45 degree with the angle of horizontal plane, to guarantee light path vertical reflection.
In the present embodiment, by the light path of laser instrument, be arranged at the speculum between laser instrument and beam splitter, can change the transmission direction of laser beam, thereby realized the dynamic transmission of laser beam.
The principle schematic of the laser dotting device that Fig. 4 provides for the utility model the 4th embodiment, as shown in Figure 4.On the laser dotting device basic providing at embodiment corresponding to Fig. 3, this laser dotting device can further include one first motion platform 53 and one second motion platform 54, and described speculum 60, described beam splitter 20 and described focus lamp 30 are arranged on described the first motion platform 53; Described processing work 40 is arranged on described the second motion platform 54.Described the first motion platform 53 can be movable relatively with described the second motion platform 54.The detailed description of this first motion platform 53 can be referring to the related content of the first motion platform 51 in embodiment corresponding to Fig. 2, the detailed description of the second motion platform 54 can, referring to the related content of the second motion platform 52 in embodiment corresponding to Fig. 2, repeat no more herein.Like this, because the position of laser instrument is motionless, described speculum 60, described beam splitter 20 and 30 motions of described focus lamp, therefore, realized the flight light path of laser instrument 10.
Alternatively, 20 of described beam splitters can be connected on described the first motion platform 53 rotationally.The detailed description of described beam splitter 20 can, referring to the related content in embodiment corresponding to Fig. 1, repeat no more herein.
The principle schematic of the laser dotting device that Fig. 5 provides for the utility model the 5th embodiment, as shown in Figure 5.On the laser dotting device basic providing at embodiment corresponding to Fig. 1, this laser dotting device can further include a beam expanding lens 70, and described beam expanding lens 40 is arranged between described laser instrument 10 and described beam splitter 20 in described light path.
In the present embodiment, by in the light path of laser instrument, be arranged at the beam expanding lens between laser instrument and beam splitter, with amplifying laser light beam, thereby reduced the angle of divergence of laser beam, and then can further reduce the spot diameter of the focusing focal position of described focus lamp 30.
Generally, for stable output, need to laser instrument 10 is fixing.Like this, comparatively speaking, the transmission direction of laser beam is also fixed.But for the demand constantly changing, can take some mode, change as required the transmission direction of laser beam, make the transmission of laser beam become a dynamic transmission.Conventionally speculum is set up in the measure of taking exactly in light path.The principle schematic of the laser dotting device that Fig. 6 provides for the utility model the 6th embodiment, as shown in Figure 6.On the laser dotting device basic providing at embodiment corresponding to Fig. 3, this laser dotting device can further include a speculum 80, and described speculum 80 is arranged between described beam expanding lens 70 and described beam splitter 20 in described light path.
Preferably, described speculum 80 can be set to 45 degree with the angle of horizontal plane, to guarantee light path vertical reflection.
In the present embodiment, by the light path of laser instrument, be arranged at the speculum between laser instrument and beam splitter, can change the transmission direction of laser beam, thereby realized the dynamic transmission of laser beam.
The principle schematic of the laser dotting device that Fig. 7 provides for the utility model the 7th embodiment, as shown in Figure 7.On the laser dotting device basic providing at embodiment corresponding to Fig. 6, this laser dotting device can further include one first motion platform 55 and one second motion platform 56, and described speculum 80, described beam splitter 20 and described focus lamp 30 are arranged on described the first motion platform 55; Described processing work 40 is arranged on described the second motion platform 56.Described the first motion platform 55 can be movable relatively with described the second motion platform 56.The detailed description of this first motion platform 55 can be referring to the related content of the first motion platform 51 in embodiment corresponding to Fig. 2, the detailed description of the second motion platform 56 can, referring to the related content of the second motion platform 52 in embodiment corresponding to Fig. 2, repeat no more herein.Like this, because the position of laser instrument is motionless, described speculum 80, described beam splitter 20 and 30 motions of described focus lamp, therefore, realized the flight light path of laser instrument 10.
Alternatively, 20 of described beam splitters can be connected on described the first motion platform 55 rotationally.The detailed description of described beam splitter 20 can, referring to the related content in embodiment corresponding to Fig. 1, repeat no more herein.
The principle schematic of the laser dotting device that Fig. 8 A ~ Fig. 8 G provides for the utility model the 8th embodiment, as shown in Fig. 8 A ~ Fig. 8 G.On the arbitrary laser dotting device basic providing at embodiment corresponding to Fig. 1 ~ Fig. 7, this laser dotting device can further include an optical gate 90, and described optical gate 90 is arranged between described laser instrument 10 and described beam splitter 20 in described light path.Like this, by optical gate, can control the speed-sensitive switch of laser beam, can make a call to 2000 ~ 4000 micro-holes each second, form in time the micro-hole of string.
In the present embodiment, by the light path of laser instrument, be arranged at the optical gate between laser instrument and beam splitter, to control the speed-sensitive switch of laser beam, thereby further improved efficiency.
In above-described embodiment of the present utility model, be understandable that, laser dotting device can further include control appliance (not shown), second motion platform at described control appliance and described laser instrument 10 and the first motion platform and/or processing work place is electrically connected, and this control appliance is coordinated to control by computer system.
In sum, the utility model utilizes the high density energy of laser, makes material surface fusing, also vaporization, and the melt that irradiates center evenly overflows to surrounding.Join computer control the first motion platform to, the figure designing is directly just processed on material, feature, technique is simple: only figure need to be imported to computer, by controlling the degree of depth and the size of software control site, just can directly process on product, the cycle of manufacturing is short, if design the unreasonable working process parameter that can change plan immediately or change equipment, manufacture immediately another sample, until satisfied, get final product success, reach and go out qualified sample half an hour for general 1～2 time.
Especially the utility model has adopted beam splitter and focus lamp, can on processing work surface, form a plurality of laser spots simultaneously, has more effectively improved working (machining) efficiency.
Be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should make description as a whole, technical scheme in each embodiment also can, through appropriately combined, form other embodiments that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility embodiment of the present utility model; they are not in order to limit protection domain of the present utility model, all disengaging within equivalent embodiment that the utility model skill spirit does or change all should be included in protection domain of the present utility model.
Claims (13)
1. a laser dotting device, it is characterized in that, described laser dotting device, comprise: laser instrument, beam splitter and focus lamp, described beam splitter is arranged between described laser instrument and described focus lamp in the light path of described laser instrument, and described focus lamp is arranged between described beam splitter and processing work in the light path of described laser instrument.
2. laser dotting device according to claim 1, it is characterized in that, described laser dotting device also comprises one first motion platform and one second motion platform, described laser instrument, described beam splitter and described focus lamp are arranged on described the first motion platform, described processing work is arranged on described the second motion platform, and described the first motion platform and described the second motion platform can be movable relatively.
3. laser dotting device according to claim 2, is characterized in that,
Described the first motion platform drives described laser instrument, described beam splitter and described focus lamp to move in the horizontal direction;
Described the second motion platform drives described processing work to move at vertical direction.
4. according to the laser dotting device described in claim 2 or 3, it is characterized in that, described beam splitter is arranged at rotationally between described laser instrument and described focus lamp in described light path.
5. laser dotting device according to claim 1, is characterized in that, described laser dotting device also comprises a speculum, and described speculum is arranged between described laser instrument and described beam splitter in described light path.
6. laser dotting device according to claim 1, is characterized in that, described laser dotting device also comprises a beam expanding lens, and described beam expanding lens is arranged between described laser instrument and described beam splitter in described light path.
7. laser dotting device according to claim 6, is characterized in that, described laser dotting device also comprises a speculum, and described speculum is arranged between described beam expanding lens and described beam splitter in described light path.
8. according to the laser dotting device described in claim 5 or 7, it is characterized in that, the angle of described speculum and horizontal plane is 45 degree.
9. according to the laser dotting device described in claim 5 or 7, it is characterized in that, described laser dotting device also comprises one first motion platform and one second motion platform, described speculum, described beam splitter and described focus lamp are arranged on described the first motion platform, described processing work is arranged on described the second motion platform, and described the first motion platform and described the second motion platform can be movable relatively.
10. laser dotting device according to claim 9, is characterized in that, described beam splitter is arranged at rotationally between described laser instrument and described focus lamp in described light path.
11. laser dotting devices according to claim 1, is characterized in that, described laser dotting device also comprises an optical gate, and described optical gate is arranged between described laser instrument and described beam splitter in described light path.
12. laser dotting devices according to claim 6, is characterized in that, described laser dotting device also comprises an optical gate, and described optical gate is arranged between described laser instrument and described beam expanding lens in described light path.
13. laser dotting devices according to claim 1, is characterized in that, described focus lamp is plano-convex focus lamp.
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| CN201320600010.XU CN203509349U (en) | 2013-09-27 | 2013-09-27 | Laser dotting device |
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| CN201320600010.XU CN203509349U (en) | 2013-09-27 | 2013-09-27 | Laser dotting device |
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| CN203509349U true CN203509349U (en) | 2014-04-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103495805A (en) * | 2013-09-27 | 2014-01-08 | 苏州德龙激光股份有限公司 | Laser point printing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103495805A (en) * | 2013-09-27 | 2014-01-08 | 苏州德龙激光股份有限公司 | Laser point printing device |
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Granted publication date: 20140402 Termination date: 20160927 |