Utility model content
The application discloses a kind of touch-control with kink and shows module and have the electronic installation that described touch-control shows module, can improve the territory, effective display area that touch-control shows module.
Other characteristics of the present disclosure and advantage become the detailed description by below obviously, or the partly acquistion by practice of the present disclosure.
According to an aspect of the present disclosure, provide a kind of touch-control to show module, comprising: display module, has display surface; And touch-control sensing assembly, comprise matrix and be arranged at transparent conductive patterns and the lead-in wire on described matrix, described lead-in wire is electrically connected to described transparent conductive patterns, wherein said matrix comprises top board and the side plate extending from least one side one bending of described top board, described top board is arranged on the display surface of described display module, described side plate is positioned at the sidepiece of described display module, and described lead-in wire is arranged at described side plate at least in part.
For example, described matrix is transparent rigid matrix.
For example, described side plate extends to the same side one of described top board from the relative dual-side of described top board.
For example, described transparent conductive patterns is arranged on described top board and the described side plate of part on.
For example, described lead-in wire is arranged on described side plate and the described top board of part on.
For example, described transparent rigid matrix is glass basis or quartz substrate.
For example, touch-control shows that module also comprises the optical lens gelatin between described touch-control sensing assembly and the display surface of described display module.
For example, described transparent conductive patterns and described lead-in wire are arranged at the surface that deviates from described display module of described matrix.
For example, described transparent conductive patterns and described lead-in wire are arranged at the surface adjacent with described display module of described matrix.
For example, described transparent conductive patterns and described lead-in wire comprise: the first surperficial transparent conductive patterns that deviates from described display module and the first lead-in wire that are arranged at described matrix; Surperficial second transparent conductive patterns adjacent with described display module and the second lead-in wire that are arranged at described matrix, described the first lead-in wire is electrically connected to described the first transparent conductive patterns, and described the second lead-in wire is electrically connected to described the second transparent conductive patterns.
For example, described transparent conductive patterns is set directly on described matrix.
For example, described lead-in wire is set directly on described matrix.
For example, touch-control shows that module also comprises the hypothallus being arranged on described matrix, on the surface away from described matrix of described hypothallus, is provided with groove, and described transparent conductive patterns is placed in described groove.For example, described lead-in wire is placed in described groove.
For example, described transparent conductive patterns is conductive grid.
For example, the material of described transparent conductive patterns and/or described lead-in wire is metal, Graphene, carbon nano-tube, conducting metal oxide or conducting polymer.
According to another aspect of the present disclosure, provide a kind of touch-control to show module, comprising: display module, has display surface, and touch-control sensing assembly, comprise transparent flexible matrix and be arranged at transparent conductive patterns and the flexible leads on described transparent flexible matrix, described flexible leads is electrically connected to described transparent conductive patterns, wherein said transparent flexible matrix comprises top board and the side plate extending from least one side one bending of described top board, described top board is arranged on the display surface of described display module, described side plate is positioned at the sidepiece of described display module, described transparent conductive patterns is arranged on described top board, described flexible leads is arranged at described side plate and extends to described top board from described side plate.
For example, touch-control shows that module also can comprise the rigid support that is arranged at display module periphery, described rigid support comprises end face back up pad and the lateral bolster fagging that at least one side one of this end face back up pad bends certainly, the top board of described transparent flexible matrix fits in described end face back up pad, and the side plate of described transparent flexible matrix fits in described lateral bolster fagging.
For example, touch-control shows that module also comprises the rigid support being arranged between described touch-control sensing assembly and described display module.
For example, touch-control shows that module also comprises the optical lens gelatin between described touch-control sensing assembly and the display surface of described display module.
For example, described transparent conductive patterns and described flexible leads comprise: the first surperficial transparent conductive patterns and the first flexible leads that deviate from described display module that are arranged at described transparent flexible matrix; Be arranged at surperficial second transparent conductive patterns and second flexible leads adjacent with described display module of described transparent flexible matrix, described the first flexible leads is electrically connected to described the first transparent conductive patterns, and described the second flexible leads is electrically connected to described the second transparent conductive patterns.
For example, described transparent conductive patterns is set directly on described transparent flexible matrix.
For example, described flexible leads is set directly on described transparent flexible matrix.
For example, touch-control shows that module also comprises the hypothallus being arranged on described transparent flexible matrix, on the surface away from described transparent flexible matrix of described hypothallus, is provided with groove, and described transparent conductive patterns is placed in described groove.For example, described flexible leads is placed in described groove.
For example, described transparent conductive patterns is conductive grid.
For example, touch-control shows that module also comprises the second touch-control sensing assembly being arranged on described touch-control sensing assembly, described the second touch-control sensing assembly has with the corresponding structure of described touch-control sensing assembly and comprises the second transparent conductive patterns and the second flexible leads, thereby described the second transparent conductive patterns and described transparent conductive patterns space form induction structure.
For example, the material of described flexible leads is metal, Graphene, carbon nano-tube or conducting polymer composite.
For example, the material of described transparent conductive patterns is ITO or IZO.
According to another aspect of the present disclosure, a kind of electronic installation is provided, this electronic installation comprises that foregoing touch-control shows one of module.
According to technical scheme of the present disclosure, can improve the territory, effective display area that touch-control shows module, be conducive to electronic installation and realize narrow frame, meet miniaturization and the screen enlarging demand for development of electronic installation.
Embodiment
Referring now to accompanying drawing, embodiment is more fully described.Yet embodiment can be implemented in a variety of forms, and should not be understood to be limited to embodiment set forth herein; On the contrary, provide these embodiments to make the disclosure by comprehensive and complete, and the design of embodiment is conveyed to those skilled in the art all sidedly.In the drawings, for clear, exaggerated the thickness of region and layer.Identical in the drawings Reference numeral represents same or similar part, thereby can omit their detailed description.
In addition, described feature, structure or characteristic can be combined in one or more embodiment in any suitable manner.In the following description, thus provide many details to provide fully understanding embodiment of the present disclosure.Yet, one of skill in the art will appreciate that and can put into practice technical scheme of the present disclosure and there is no one or more in described specific detail, or can adopt other method, constituent element, material etc.In other cases, be not shown specifically or describe known configurations, material or operation to avoid fuzzy each side of the present disclosure.
The disclosure provides a kind of touch-control with kink to show module and have the electronic installation that described touch-control shows module, can improve the territory, effective display area of touch-control demonstration module, be conducive to electronic installation and realize narrow frame, meet miniaturization and the screen enlarging demand for development of electronic installation.
Describe according to embodiment of the present disclosure with reference to the accompanying drawings.
Fig. 1 schematically shows the side view that shows module 100 according to the touch-control of the disclosure the first embodiment.Fig. 2 illustrates the enlarged drawing of circle part in Fig. 1.Fig. 3 schematically shows the stereographic map that shows the touch-control sensing assembly 110 in module 100 according to the touch-control of the disclosure the first embodiment.
With reference to Fig. 1, according to the touch-control of the disclosure the first embodiment, show that module 100 comprises touch-control sensing assembly 110, display module 130 and flexible PCB 140.
Touch-control sensing assembly 110 comprises top main part 112 and lateral bending folding part 114, and extend from the 112 one bendings of top main part lateral bending folding part 114.For example, lateral bending folding part 114 can be perpendicular to top main part 112.Two lateral bending folding parts 114 of extending from the relative both sides of top main part 112 have been shown in Fig. 1, but the disclosure is not limited to this.For example, lateral bending folding part 114 also can be from a side, the even four sides extensions of three sides of top main part 112.
The upper surface that top main part 112 can be arranged on display module 130 by optical lens gelatin 120 is for example on display surface.But the disclosure is not limited to this, for example, top main part 112 also can fit on the display surface of display module 130 by other suitable modes.Lateral bending folding part 114 can be positioned at the sidepiece of display module 130.
With reference to Fig. 3, touch-control sensing assembly 110 comprises matrix 1103 and is arranged at transparent conductive patterns 1105 and the lead-in wire 1107 on matrix 1103.Lead-in wire 1107 is electrically connected to transparent conductive patterns 1105.Matrix 1103 comprises top board 112a and the side plate 114a extending from least one side one bending of top board 112a.Top board 112a is corresponding with top main part 112, can be arranged on the display surface of display module 130.Side plate 114a is corresponding with lateral bending folding part 114, can be positioned at the sidepiece of display module 130.
With Fig. 1 correspondingly, two side plate 114a that the same side one from the relative dual-side of top board 112a to top board is extended have been shown in Fig. 3, but the disclosure is not limited to this.For example, side plate 114a also can be from a side, the even four sides extensions of three sides of top board 112a.
As shown in Figure 3, lead-in wire 1107 is arranged on side plate 114a.Like this, the lead district at lead-in wire 1107 places does not take the display surface of display module 130.In addition, also need not additionally in lead district, form black out ink.Therefore, can improve the territory, effective display area that touch-control shows module, be conducive to electronic installation and realize narrow frame, meet miniaturization and the screen enlarging demand for development of electronic installation, can also reduce production costs.
Although Fig. 3 illustrates transparent conductive patterns 1105 and extends to side plate 114a from top board 112a, upper thereby lead-in wire 1107 is arranged on side plate 114a completely, the disclosure is not limited to this.For example, transparent conductive patterns 1105 can not extend to side plate, thereby lead-in wire 1107 can extend to that a top board 112a part is arranged on side plate 114a and another part is arranged on top board 112a from side plate 114a.
Fig. 2 there is shown according to the configuration of the touch-control sensing assembly 110 of embodiment in amplification.As shown in Figure 2, transparent conductive patterns 1105(correspondingly, and lead-in wire 1107) be arranged at the surface adjacent with display module 130 of matrix 1103.But the disclosure is not limited to this, for example, transparent conductive patterns 1105(correspondingly, and lead-in wire 1107) also can be arranged at the surface that deviates from display module 130 of matrix 1103.Transparent conductive patterns 1105 can be transparent conductive material coating, as metal oxide coating.Metal oxide can be ITO, IZO etc.Transparent conductive material coating is generally the not material of tension of resistance to compression, is located at inner side, can prevent conductive pattern be full of cracks.In addition, transparent conductive patterns 1105 can be also a kind of in the coat of metal, metallic coating, graphene layer, carbon nanotube layer or electroconductive polymer layer.
According to some embodiments, matrix 1103 can be a kind of in the optically transparent materials such as glass, quartz, polymethylmethacrylate (PMMA), polycarbonate (PC), Polyvinylchloride (PVC), polyethylene terephthalate (PET), but the disclosure is not limited to this.Matrix 1103 is mainly used in carrying transparent conductive patterns 1105 and lead-in wire 1107.
If matrix 1103 is flexible, bent, matrix 1103 is after touch-control sensing assembly 110 fits in the display surface of display module 130, bent and form the top board 112a on the display surface that is arranged on display module 130 and the side plate 114a that is positioned at the sidepiece of display module 130.Correspondingly, touch-control sensing assembly 110 forms top main part 112 and lateral bending folding part 114.At this moment, if transparent conductive patterns 1105 has better flexible material by wire mesh grid, the coat of metal, metallic coating, graphene layer, carbon nanotube layer or electroconductive polymer layer etc., form, transparent conductive patterns 1105 can extend to side plate 114a from top board 112a.Otherwise, if transparent conductive patterns 1105 is formed as ITO etc. by conducting metal oxide, consider the bending of conducting metal oxide, can make transparent conductive patterns 1105 be positioned at top board 112a upper, there is 1107, flexible lead-in wire and extend to top board 112a from side plate 114a.
If matrix 1103 is the transparent rigid materials such as glass, quartz, can, after forming transparent conductive patterns 1105 and lead-in wire 1107, adopt bending technique to make matrix 1103 bendings and form top board and side plate.
According to an embodiment, by depositing operation, directly on the surface of matrix 1103, form metal film, then by photoetching process and etch process, form conductive grid.For rigid matrix, can on the matrix 1103 of bending in advance, carry out described technique, thereby the less-restrictive to conductive material needn't consider the bending of conductive material.
The rigid matrix of bending can be realized by injection mo(u)lding or hot press forming technology.For example, injection molding process can comprise: the material of molten state is injected to mould cooling forming, and wherein the temperature of mould is higher than the glass transition temperature of material.Hot press forming technology can comprise: by heating, made material softening and the patrix temperature of mould and counterdie temperature are controlled in certain temperature range, more softening material is placed in to mould and under certain pressure, carries out moulding.
According to an embodiment, by coating process, directly at surface-coated nanometer acupuncture needle ink or other slurries that comprises conductive material (as carbon nano tube paste) of matrix 1103, then by drying the techniques such as compacting, photoetching, etching, form conductive grid.For rigid matrix, can on the matrix 1103 of bending in advance, carry out described technique, thereby the less-restrictive to conductive material needn't consider the bending of conductive material.
In addition, lead-in wire 1107 can form from transparent conductive patterns 1105 simultaneously or different time formation.According to an embodiment, can, after forming transparent conductive patterns 1105, by serigraphy or inkjet printing, form the lead-in wire 1107 being electrically connected to transparent conductive patterns 1105.
Fig. 4 schematically shows the side view that shows module 200 according to the touch-control of the disclosure the second embodiment.Fig. 5 illustrates the enlarged drawing of circle part in Fig. 4.Fig. 6 schematically shows the stereographic map that shows the touch-control sensing assembly 210 in module 200 according to the touch-control of the disclosure the second embodiment.
With reference to Fig. 4, according to the touch-control of the disclosure the second embodiment, show that module 200 comprises touch-control sensing assembly 210, display module 230 and flexible PCB 240.
Touch-control sensing assembly 210 comprises top main part 212 and lateral bending folding part 214, and extend from the 212 one bendings of top main part lateral bending folding part 214.For example, lateral bending folding part 214 can be perpendicular to top main part 212.Two lateral bending folding parts 214 of extending from the relative both sides of top main part 212 have been shown in Fig. 4, but the disclosure is not limited to this.For example, lateral bending folding part 214 also can be from a side, the even four sides extensions of three sides of top main part 212.
The upper surface that top main part 212 can be arranged on display module 230 by optical lens gelatin 220 is for example on display surface.But the disclosure is not limited to this, for example, top main part 212 also can fit on the display surface of display module 230 by other suitable modes.Lateral bending folding part 214 can be positioned at the sidepiece of display module 230.
With reference to Fig. 6, touch-control sensing assembly 210 comprises matrix 2103 and is arranged at transparent conductive patterns 2105 and the lead-in wire 2107 on matrix 2103.Lead-in wire 2107 is electrically connected to transparent conductive patterns 2105.Matrix 2103 comprises top board 212a and the side plate 214a extending from least one side one bending of top board 212a.Top board 212a is corresponding with top main part 212, can be arranged on the display surface of display module 230.Side plate 214a is corresponding with lateral bending folding part 214, can be positioned at the sidepiece of display module 230.
With Fig. 4 correspondingly, two side plate 214a that extend from the relative both sides of top board 212a have been shown in Fig. 6, but the disclosure is not limited to this.For example, side plate 214a also can be from a side, the even four sides extensions of three sides of top board 212a.
As shown in Figure 6, lead-in wire 2107 is arranged on side plate 214a.Like this, the lead district at lead-in wire 2107 places does not take the display surface of display module 230.In addition, also need not additionally in lead district, form black out ink.Therefore, can improve the territory, effective display area that touch-control shows module, be conducive to electronic installation and realize narrow frame, meet miniaturization and the screen enlarging demand for development of electronic installation, can also reduce production costs.
Although Fig. 6 illustrates transparent conductive patterns 2105 and extends to side plate 214a from top board 212a, upper thereby lead-in wire 2107 is arranged on side plate 214a completely, the disclosure is not limited to this.For example, transparent conductive patterns 2105 can not extend to side plate, thereby lead-in wire 2107 can extend to that a top board 212a part is arranged on side plate 214a and another part is arranged on top board 212a from side plate 214a.
Fig. 5 there is shown according to the configuration of the touch-control sensing assembly 210 of embodiment in amplification.As shown in Figure 5, transparent conductive patterns 2105(correspondingly, and lead-in wire 2107) be arranged at the surface that deviates from display module 230 of matrix 2103.But the disclosure is not limited to this, for example, transparent conductive patterns 2105(correspondingly, and lead-in wire 2107) also can be arranged at the surface adjacent with display module 230 of matrix 2103.
As shown in Figure 5, on matrix 2103, can be provided with the hypothallus 2109 as embossed layer.Hypothallus 2109 can be ultraviolet-curing resin, hot-setting adhesive, light binding or dry glue etc. certainly.Hypothallus 2109 away from being formed with groove 2111 by imprint process on the surface of matrix 2103.Groove 2111 can be for for example latticed.Transparent metal conductive pattern 2105 can be placed in described groove.Corresponding to latticed groove, transparent metal conductive pattern 2105 can be conductive grid.
According to an example embodiment, can use blade coating technology in groove 2111, to fill for example Nano Silver ink, then toast sintering under about 150 ℃ of conditions, make the silver-colored simple substance in Nano Silver ink sinter conduction fine rule into.Wherein, silver-colored ink solids 35%, solvent volatilizees in sintering.Because the shape of groove 2111 impresses in advance, become preset shape, therefore, after conductive grid forms, need not carry out again Patternized technique.The live width of conduction fine rule can be between 500nm~5um.The transmittance of conductive grid is greater than approximately 90%.According to an embodiment, the wire diameter of conduction fine rule is 2um, and the transmittance of conductive grid is 93%.Conductive material can be gold, silver, copper, aluminium, nickel, zinc or the alloy of the two at least wherein.Be appreciated that the material of preparing conductive grid is that applicable electric conductor can be realized corresponding function, for example, can adopt carbon nano-tube, Graphene, conducting polymer etc.
According to some embodiment, matrix 2103 can be made by flexible, transparent material, a kind of in optically transparent materials such as polymethylmethacrylate (PMMA), polycarbonate (PC), Polyvinylchloride (PVC), polyethylene terephthalate (PET), but the disclosure is not limited to this.Matrix 2103 is mainly used in carrying transparent conductive patterns 2105 and lead-in wire 2107.
If matrix 2103 is flexible, bent, matrix 2103 is after touch-control sensing assembly 210 fits in the display surface of display module 230, bent and form the top board 212a on the display surface that is arranged on display module 230 and the side plate 214a that is positioned at the sidepiece of display module 230.Correspondingly, touch-control sensing assembly 210 forms top main part 212 and lateral bending folding part 214.
If transparent conductive patterns 2105 is formed by bendable materials such as wire mesh grid, graphene layer grid, carbon nano-tube grid or conductive polymer sub-grids, transparent conductive patterns 2105 can extend to side plate 214a from top board 212a.
Otherwise, if transparent conductive patterns 2105 is formed as ITO etc. by conducting metal oxide, consider the bending of conducting metal oxide, can make transparent conductive patterns 2105 be positioned at top board 212a upper, there is 2107, flexible lead-in wire and extend to top board 212a from side plate 214a.
Matrix 2103 can be also the transparent rigid materials such as glass, quartz.At this moment, can prepare the rigid matrix 2103 of bending, hypothallus 2109 and groove wherein 2111 can form before or after bending rigid matrix 2103.Then, by blade coating, oven dry sintering process, form the conductive grid that comprises transparent conductive patterns 2105 and/or lead-in wire 2107.
In addition, according to an embodiment, lead-in wire 2107 can form with transparent conductive patterns 2105 simultaneously, also can after form transparent conductive patterns 2105, by serigraphy or inkjet printing, be formed with transparent conductive patterns 2105 and is electrically connected to.
If touch-control sensing assembly adopts flexible substrate to form, except aforementioned, make display surface that touch-control sensing assembly is set directly at display module, also can be first by touch-control sensing component joint on rigid support, then rigid support is arranged on display module.
Fig. 7 schematically shows the side view of the touch-control sensing assembly arranging according to the disclosure the 3rd embodiment.
As shown in Figure 7, touch-control sensing assembly 310 is arranged on rigid support 350.Rigid support 350 can be the transparent rigid materials such as glass or quartz.Touch-control sensing assembly 310 can be have flexible substrate according to the touch-control sensing assembly of the first or second embodiment.Rigid support 350 comprises end face back up pad 352 and the lateral bolster fagging 354 extending from least one side one bending of end face back up pad 352.The size of rigid support 350 and touch-control sensing assembly 310 and display module adapt.The top board of the transparent flexible matrix of touch-control sensing assembly 310 fits in end face back up pad 352, and the side plate of the transparent flexible matrix of touch-control sensing assembly 310 fits in lateral bolster fagging 354.
Adopt the extra rigid support 350 can be with serving extra advantage.For example, before showing module or electronic installation at assembling touch-control, touch-control sensing assembly can be arranged on rigid support 350, can improve packaging efficiency, simplified assembling process.In addition, adopt rigid support 350, can improve while assembling and the alignment precision of display module, be conducive to accurate rapid-assembling.
Although in the embodiment illustrating above, touch-control shows that module comprises a touch-control sensing assembly.But the disclosure is not limited to this.According to an embodiment, touch-control shows that module comprises that two according to the touch-control sensing assembly of aforementioned embodiments, a touch-control sensing assembly is arranged on another touch-control sensing assembly, thus and the transparent conductive patterns space of two touch-control sensing assemblies formation induction structure.
Participate in Fig. 8, according to the disclosure the 4th embodiment, touch-control sensing assembly 410 comprises lip-deep the first transparent conductive patterns 4105a and a first lead-in wire (not shown) that is arranged on matrix 4103 and another lip-deep second transparent conductive patterns 4105b and the second lead-in wire (not shown) that is arranged on matrix 4103.Set-up mode and the previously described mode of the first transparent conductive patterns 4105a and the first lead-in wire and the second transparent conductive patterns 4105b and the second lead-in wire are similar.Described the second transparent conductive patterns and the second lead-in wire can have and described transparent conductive patterns and the corresponding structure of lead-in wire.
As mentioned above, according to the touch-control of some embodiments of the disclosure, show module, at least one of have the following advantages:
Because lead-in wire is arranged on side plate, the lead district at the place that therefore goes between does not take the display surface of display module.In addition, also need not additionally in lead district, form black out ink.Therefore, can improve the territory, effective display area that touch-control shows module, be conducive to electronic installation and realize narrow frame, meet miniaturization and the screen enlarging demand for development of electronic installation, can also reduce production costs.
Owing to adopting rigid matrix, can form conductive pattern and lead-in wire at the matrix of bending in advance, reduced the restriction to conductive material.
Transparent conductive patterns is formed and is arranged on by conducting metal oxide on top board, and pliability lead-in wire extends to top board from side plate, has both made full use of the advantage of conducting metal oxide, realizes again the touch-control sensing assembly with reliable bending.
By adopting extra rigid support, can improve packaging efficiency, simplified assembling process.In addition, can improve while assembling and the alignment precision of display module, be conducive to accurate rapid-assembling.
Below illustrate particularly and described property embodiment of the present disclosure.Should be appreciated that, the disclosure is not limited to disclosed embodiment, and on the contrary, disclosure intention contains various modifications and the equivalent arrangements in the spirit and scope that are included in claims.