CN203276218U - Touch panel - Google Patents
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- CN203276218U CN203276218U CN 201320253988 CN201320253988U CN203276218U CN 203276218 U CN203276218 U CN 203276218U CN 201320253988 CN201320253988 CN 201320253988 CN 201320253988 U CN201320253988 U CN 201320253988U CN 203276218 U CN203276218 U CN 203276218U
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Abstract
A touch panel comprises a protection panel and a substrate, wherein the protection panel comprises a glass substrate; the glass substrate comprises a first area, and a second area arranged around the first area; a first conducting layer is formed in the first area of the glass substrate; the first conducting layer comprises a plurality of first conductive electrodes which are arranged at intervals and are mutually insulated; the substrate is fitted to the protection panel; second conducting layers are formed on one side, corresponding to the first area of the glass substrate, of the substrate; the first conducting layer, the substrate and the second conducting layers are positioned on the same side of the glass substrate; each second conducting layer comprises a plurality of second conductive electrodes which are arranged at intervals and are mutually insulated; the first conducting layer is directly formed on the surface of the glass substrate, and the substrate with the second conducting layers is fitted to the glass substrate in a counterpoint manner, so that a manufacturing process is simplified, production cost of the touch panel is reduced, and the touch panel is further thined.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of contact panel.
Background technology
Contact panel is the inductive arrangement that can receive the input signals such as touch.Contact panel has given information interaction brand-new looks, is extremely attractive brand-new information interaction equipment.The development of contact panel technology has caused the common concern of domestic and international information medium circle, has become the Chaoyang new high-tech industry that the photoelectricity industry is a dark horse.
At present, contact panel need adopt two groups of conductive materials for the touch location that detects the user, and usually these two groups of conductive materials are formed separately on different base materials, again these two base material contrapositions are stitched together, then fit with glass substrate, increase attaching process, caused the contact panel production cost high.
The utility model content
Based on this, being necessary provides a kind of contact panel that reduces costs for the high problem of contact panel production cost.
A kind of contact panel comprises:
The protection panel, comprise glass substrate, described glass substrate comprises first area and the second area that arranges around described first area, described first area is formed with the first conductive layer, described the first conductive layer comprises the first conductive electrode that a plurality of intervals arrange, described a plurality of the first conductive electrode mutually insulateds;
Base material; fit in described protection panel; one side of the corresponding described glass substrate of described base material first area is formed with the second conductive layer; and described the first conductive layer, described base material and described the second conductive layer all are positioned at described glass substrate homonymy; described the second conductive layer comprises the second conductive electrode that a plurality of intervals arrange, described a plurality of the second conductive electrode mutually insulateds.
In embodiment, described the first conductive electrode comprises the transparent conductive patterns that is formed at described glass substrate first area by graphical etching therein.
Therein in embodiment, one side of the corresponding described glass substrate of described base material first area is provided with the groove of reservation shape, described the second conductive electrode is contained in described groove and forms the second conductive layer, and described the second conductive electrode comprises the conductive grid that is formed by some metallic conduction stitchings.
In embodiment, comprise the optical clear glue-line therein, described optical clear glue-line is between described glass substrate and described base material.
Therein in embodiment, comprise the first lead-in wire and the second lead-in wire, described the first lead-in wire is arranged at the second area of described glass substrate, and be positioned at the homonymy of described glass substrate with described the first conductive layer, described the first lead-in wire one end is connected with described the first conductive electrode, and the other end forms the first pin; Described the second lead-in wire is arranged at a side of the corresponding described glass substrate second area of described base material, described the second lead-in wire and described the second conductive layer all are positioned at the homonymy of described base material, one end of described the second lead-in wire is connected with described the second conductive electrode, and the other end forms the second pin.
In embodiment, described the second conductive layer is formed at described base material away from a side of described protection panel therein, and described base material offers short slot, and described short slot is over against described the second pin.
In embodiment, described the second conductive layer is formed at described base material near a side of described protection panel therein.
In embodiment, described protection panel comprises protective seam therein, and at least part of described the first conductive layer is coated on described protective seam.
Therein in embodiment; the protection panel comprises photoresistance assembly and ink lay; described photoresistance assembly is attached to described glass substrate one side and is positioned at described second area; described ink lay is coated described glass substrate one side, and described ink lay and described photoresistance assembly all are positioned at described glass substrate homonymy.
In embodiment, described nesa coating is indium tin metal oxide coating therein.
Therein in embodiment, the material of described metallic conduction stitching is a kind of in gold, silver, copper, aluminium, zinc, vermeil or alloy at least both.
Above-mentioned contact panel forms the first conductive layer in a side of glass substrate, forms the second conductive layer in a side of base material, then the contraposition applying is formed with the base material of the second conductive layer in glass substrate.So, the first conductive layer directly is formed at glass baseplate surface, then will be formed with base material and the glass substrate contraposition applying of the second conductive layer, has simplified the making flow process, has reduced the production cost of contact panel, has also reduced the thickness of contact panel.
Description of drawings
Fig. 1 be in an embodiment contact panel structural representation;
Fig. 2 is the structural representation of the protection panel of contact panel shown in Figure 1;
Fig. 3 is the structural representation of contact panel in another embodiment;
Fig. 4 is the structural representation of contact panel in another embodiment;
Fig. 5 is the schematic flow sheet of contact panel manufacture method.
Embodiment
For the ease of understanding the utility model, the below is described more fully contact panel and manufacture method with reference to relevant drawings.Provided the first-selected embodiment of contact panel and manufacture method in accompanying drawing.But contact panel and manufacture method can realize in many different forms, are not limited to embodiment described herein.On the contrary, provide the purpose of these embodiment be make the disclosure of contact panel and manufacture method more comprehensively thorough.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present utility model understand usually identical.The term that uses in the instructions of contact panel and manufacture method herein is not intended to be restriction the utility model just in order to describe the purpose of specific embodiment.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
As depicted in figs. 1 and 2, a kind of contact panel, comprise protection panel 110, protection panel 110 comprises glass substrate 112, glass substrate 112 comprises first area and the second area that arranges around the first area, the first area of glass substrate 112 is formed with the first conductive electrode that the first conductive layer 120, the first conductive layers 120 comprise that a plurality of intervals arrange, described a plurality of the first conductive electrode mutually insulateds; Base material 130 fits in protection panel 110; one side of the corresponding glass substrate of base material 130 112 first areas is formed with the second conductive layer 140; and the first conductive layer 120, base material 130 and the second conductive layer 140 all are positioned at glass substrate 112 homonymies; the second conductive layer 140 comprises the second conductive electrode that a plurality of intervals arrange, described a plurality of the second conductive electrode mutually insulateds.
Wherein, each first conductive electrode of the first conductive layer 120 is electrically connected to the sensing of contact panel peripheral hardware detecting processing module, the second conductive electrode of the second conductive layer 140 is electrically connected to the pumping signal module of contact panel peripheral hardware, form mutual capacitance between the first conductive electrode and the second conductive electrode, common the first conductive electrode is induction electrode, and the second conductive electrode is drive electrode.When described contact panel surface generation touch action, the mutual capacitance value of touching central area can change, touch action is converted to electric signal, just can obtain the coordinate data of touch action center through the processing to capacitance domain transformation data, the electronic installation that can process related data just can be judged the touch action correspondence according to the coordinate data of touch action center and fit in accurate location on display screen at contact panel, thereby described display screen is completed corresponding corresponding function or input operation.
Wherein, base material 130 is transparent, can be by polyethylene terephthalate (Polyethylene terephthalate, PET), polycarbonate (Polycarbonate, PC) or the material such as polymethylmethacrylate (polymethylmethacrylate, PMMA) make.
Above-mentioned contact panel, the first conductive layer 120 is formed at the first area of glass substrate 112, the second conductive layer 140 is in a side that forms the corresponding glass substrate of base material 130 112 first areas, then the contraposition applying is formed with the base material 130 of the second conductive layer 140 in glass substrate 112.So, the first conductive layer 120 directly is formed at glass substrate 112 surfaces, the base material 130 that will be formed with again the second conductive layer 140 is fitted with glass substrate 112 contrapositions, simplified the making flow process, improve the production efficiency of contact panel, reduce the production cost of contact panel, also reduced the thickness of contact panel.Meanwhile, the first conductive layer 120 and the second conductive layer 140 lay respectively at different aspects, can avoid because of the first conductive layer 120 with the second too near phase mutual interference of conductive layer 140 distance and other module work causes adverse effect to contact panel.
See also Fig. 2, in embodiment, the first conductive electrode comprises the transparent conductive patterns that is formed at glass substrate 112 first areas by graphical etching therein.By the method for magnetron sputtering plating, form nesa coating in the first area of glass substrate 112, then with nesa coating by graphically being etched into transparent conductive patterns, obtain directly being formed at the first conductive layer 120 of glass substrate 112 first areas.So, because utilize glass substrate 112 to have stronger coating performance, and directly being plated, the first conductive layer 120 is located at glass substrate 112, when guaranteeing the first conductive layer 120 and glass substrate 112 bond strengths, also omit tackifier, simplify and make flow process, reduce production costs, the contact panel yield is controlled good, can also be guaranteed that contact panel has lower sheet resistance, higher transmittance and less thickness etc. simultaneously.
In the present embodiment, glass substrate 112 can be selected unorganic glass substrate 112, as calcium soda-lime glass or sillico aluminate glass, and the glass crossed for intensive treatment of this glass substrate 112, be called for short tempered glass.Wherein tempered glass comprise have anti-dazzle, sclerosis, the functional layer of anti-reflection or atomizing functions.Wherein, have the functional layer of anti-dazzle or atomizing functions, formed by the applying coating with anti-dazzle or atomizing functions, coating comprises metal oxide particle; Functional layer with sclerosis function is formed or is directly hardened by chemistry or physical method by the high-molecular coating coating with sclerosis function; Functional layer with anti-reflection function is titania coating, magnesium fluoride coating or calcium fluoride coating.Because the coating performance of unorganic glass substrate 112 is higher, form the first conductive layer 120 thereby can plate better nesa coating.Certainly can also be glass substrate 112 for the high material of other coating performances.In order to guarantee the light transmission of contact panel, the thickness of glass substrate 112 can rationally be set to 0.55mm～0.7mm, and the thickness of base material 130 can rationally be set to 45 μ m～75 μ m.
In embodiment, the material of transparent conductive patterns can be selected indium tin metal oxide coating therein.Because while indium tin metal oxide has good electric conductivity and light transmission, and the adhesion effect of indium tin metal oxide and glass is better, thereby has reduced the processing difficulty, is conducive to improve the yield of contact panel.
In other embodiments, the material of transparent conductive patterns can also be indium zinc oxide (Indium Zinc Oxide, IZO), in the materials such as zinc oxide aluminum (Aluminum Zinc Oxide, AZO) or poly-ethylenedioxy thiophene (PEDOT), metallic conduction grid (as silver-colored conductive grid), conducting polymer, CNT any one.
See also Fig. 1, therein in embodiment, one side of the corresponding glass substrate of base material 130 112 first areas is provided with the groove of reservation shape, and the second conductive electrode is contained in groove and forms the conductive grid that the second conductive layer 140, the second conductive layers 140 comprise that some metallic conduction stitchings form.A side in the corresponding glass substrate of base material 130 112 first areas forms groove by impression, so can be by the impression formboard impression of reservation shape, and obtain the figure that needs, recharge conductive material to groove, by solidifying to form the second conductive layer 140 with a plurality of second conductive electrodes.So, the second conductive electrode is contained in groove forms the second conductive layer 140, can save a large amount of conductive materials, and processing technology is ripe, thereby reduced production cost, also reduced the thickness of contact panel.
In other embodiments, as shown in Figure 3, the second conductive layer 140 also can directly graphically be etched in a surface of the corresponding glass substrate of base material 130 112 first areas.
Therein in embodiment, the material that forms the metallic conduction stitching of the second conductive layer 140 is a kind of in gold, silver, copper, aluminium, zinc, vermeil or alloy at least both, these materials are good conductivity on the one hand, meet the requirement of the second conductive layer 140 electric conductivities, cost is low on the other hand, can reduce the production cost of contact panel.
See also Fig. 1, in embodiment, comprise optical clear glue-line 150 therein, this optical clear glue-line 150 is between glass substrate 112 and base material 130.Before the base material 130 that will be provided with the second conductive layer 140 fits in glass substrate 112, add optical clear glue-line 150 between glass substrate 112 and base material 130, the further bond strength of reinforced glass substrate 112 and base material 130 has improved the yields of contact panel when reducing costs.Wherein, the material of optical clear glue-line 150 can be for OCA glue, UV glue, hot-setting adhesive or dried glue etc. certainly, to guarantee the light transmission of contact panel.
See also Fig. 1 and Fig. 2, therein in embodiment, also comprise first lead-in wire the 160 and second lead-in wire 170, the first lead-in wire 160 is arranged at the second area of glass substrate 112, and be positioned at the homonymy of glass substrate 112 with the first conductive layer 120, the first lead-in wire 160 1 ends are connected with the first conductive electrode, and the other end forms the first pin; The second lead-in wire 170 is arranged at a side of corresponding glass substrate 112 second areas of base material 130, and second lead-in wire the 170 and second conductive layer 140 all is positioned at the homonymy of base material 130, and an end of the second lead-in wire 170 is connected with the second conductive electrode, and the other end forms the second pin.The first lead-in wire 160 is used for the circuit board 180(Flexible Printed Circuit of the first conductive layer 120 with contact panel, FPC) be electrically connected to, the second lead-in wire 170 is used for the second metal conducting layer is electrically connected to the FPC of contact panel, thereby makes FPC sense operation on contact panel.Wherein, the first pin and the second pin are a section of lead terminal, are used for being electrically connected to FPC.
In the present embodiment, circuit board 180 is provided with touch control device 190, the first conductive layer 120 and the second conductive layer 140 all can be electrically connected to touch control device 190 by circuit board 180, and touch control device 190 is processed the touch signal that detects by the first conductive layer 120 and the second conductive layer 140.Touch control device 190 is arranged at circuit board 180, thereby detected touch signal can be passed to the touch control device 190 that is arranged at circuit board 180, so that 190 pairs of detected touch signals of touch control device are processed.
See also Fig. 1, in embodiment, the second conductive layer 140 is formed at base material 130 away from a side of protection panel 110 therein, and base material 130 offers short slot, and short slot is over against the second pin.Base material 130 1 surfaces are fitted in protection panel 110; another surface relative with this surface forms the second conductive layer 140; offer short slot at base material 130 over against the second pin place; so that the second pin exposed; facilitate FPC with when the first pin is electrically connected to; be electrically connected to the second pin by short slot, simplify manufacturing procedure, improve yield.
See also Fig. 4, in another embodiment, the second conductive layer 140 is formed at base material 130 near a side of protection panel 110.In production run, can first FPC be bound to the side that base material 130 is provided with the second pin, so that FPC is electrically connected to the second pin, then FPC followed base material 130 fit with protection panel 110 in the lump, to be electrically connected to the first pin.A side that base material 130 is formed with the second conductive layer 140 is fitted with protection panel 110; FPC is between protection panel 110 and base material 130; thereby the second pin can directly be electrically connected to FPC; need not to cross base material 130; and the second conductive layer 140 is between protection panel 110 and base material 130; be conducive to strengthen the protection to the second conductive layer 140, good reliability.
See also Fig. 2, in embodiment, protection panel 110 comprises protective seam 114 therein, and at least part of the first conductive layer 120 is coated on protective seam 114.The first conductive layer 120 is formed at glass substrate 112, the layer of other effect also need be set at glass substrate 112, can have the gap unavoidably between layers, cause air to contact with the first conductive layer 120 and oxidized.Therefore protective seam 114 is set, with at least part of protective seam 114 that is coated on of the first conductive layer 120, be conducive to reduce the probability that the first conductive layer 120 contacts with air, so that the first conductive layer 120 is not oxidized, improve the yield of contact panel.Wherein, in the present embodiment; protective seam 114 is set in the side of the first conductive layer 120 away from glass substrate 112; the glass substrate 112 of selecting is silicate glass; and the material of protective seam 114 is selected silicate usually; it is good near a side and the sealing between glass substrate 112 of glass substrate 112 in glass substrate 112, the first conductive layers 120 that the first conductive layer 120 is established in plating, gets final product therefore only need in the side away from glass substrate 112, protective seam 114 to be set.In other embodiments; if the material of the glass substrate of selecting 112 is not silicate series; also can between glass substrate 112 and the first conductive layer 120, protective seam 114 be set; namely the first conductive layer 120 is coated on protective seam 114 fully; because of the material of protective seam 114 belong to glass substrate 112 materials in a kind of, therefore this protective seam 114 can't affect the adhesion effect that glass substrate 112 is located in the first conductive layer 120 platings.
See also Fig. 2; therein in embodiment; protection panel 110 comprises photoresistance assembly 116 and ink lay 118; this photoresistance assembly 116 is attached to glass substrate 112 1 sides and is positioned at described second area; ink lay 118 is coated on glass substrate 112 1 sides, and ink lay 118 all is positioned at glass substrate 112 homonymies with photoresistance assembly 116.A side at the substrate second area is attached with photoresistance assembly 116, can make the corresponding photoresist of second area coating form the light low transmission regional, thereby make the frame that visually forms respective electronic device.Apparently, can be formed on any color frame of contact panel according to coating material selection color, be the black photoresistance as photoresist, corresponding dark border etc.This touch screen can be used the electronic installation of the touch-control input types such as mobile phone, panel computer, all-in-one computing machine, Terminal Server.Simultaneously, the homonymy that is provided with photoresistance assembly 116 at glass substrate 112 is coated with ink lay 118 by the mode of serigraphy, can form corresponding button sign, the correlating markings such as LED beacon light will as requested on protection panel 110.This ink lay 118 can be attached to glass substrate 112 by adhesion promoting layer 119, to strengthen the bond strength of ink lay 118 and glass substrate 112, is conducive to improve the yield of contact panel.
In the present embodiment, ink lay 118 is positioned at photoresistance assembly 116 away from a side of glass substrate 112, photoresistance assembly 116 is between glass substrate 112 and the first lead-in wire 160, thereby photoresistance assembly 116 can block the first lead-in wire 160, to guarantee the shown appearance no significant difference of second area, the consistance of the appearance of second area.The material of photoresistance assembly 116 can be selected from opaque photoresist, resin or printing ink.In other embodiments, ink lay 118 also can be between glass substrate 112 and light ancestral assembly 116.
As shown in Figure 5, a kind of manufacture method of contact panel comprises the following steps:
Step S110 provides a protection panel 110, comprises glass substrate 112, and described glass substrate 112 comprises first area and the second area that arranges around described first area.
Step S120 forms the first conductive layer 120 in glass substrate 112 first areas, and the first conductive layer 120 comprises the first conductive electrode that a plurality of intervals arrange, a plurality of the first conductive electrode mutually insulateds.
Step S140, one base material 130 is provided, form the second conductive layer 140 in a side of the corresponding described glass substrate of described base material 130 112 first areas, described the second conductive layer 140 comprises the second conductive electrode that a plurality of isolation arrange, described a plurality of the second conductive electrode mutually insulateds.
Step S160, the base material 130 that the contraposition applying is formed with described the second conductive layer 140 is in described glass substrate 112, and described the first conductive layer 120, described base material 130 and described the second conductive layer 140 all are positioned at described glass substrate 112 homonymies.
Wherein, each first conductive electrode of the first conductive layer 120 is electrically connected to the sensing of contact panel peripheral hardware detecting processing module, the second conductive electrode of the second conductive layer 140 is electrically connected to the pumping signal module of contact panel peripheral hardware, form mutual capacitance between the first conductive electrode and the second conductive electrode, common the first conductive electrode is induction electrode, and the second conductive electrode is drive electrode.When described contact panel surface generation touch action, the mutual capacitance value of touching central area can change, touch action is converted to electric signal, just can obtain the coordinate data of touch action center through the processing to capacitance domain transformation data, the electronic installation that can process related data just can be judged the touch action correspondence according to the coordinate data of touch action center and fit in accurate location on display screen at contact panel, thereby described display screen is completed corresponding corresponding function or input operation.
Wherein, base material 130 is transparent, can be by polyethylene terephthalate (Polyethylene terephthalate, PET), polycarbonate (Polycarbonate, PC) or the material such as polymethylmethacrylate (polymethylmethacrylate, PMMA) make.
Above-mentioned contact panel manufacture method, form the first conductive layer 120 in the first area of glass substrate 112, form the second conductive layer 140 in a side of the corresponding glass substrate of base material 130 112 first areas, then the contraposition applying is formed with the base material 130 of the second conductive layer 140 in glass substrate 112.So, the first conductive layer 120 directly is formed at glass substrate 112 surfaces, the base material 130 that will be formed with again the second conductive layer 140 is fitted with glass substrate 112 contrapositions, simplified the making flow process, improve the production efficiency of contact panel, reduce the production cost of contact panel, also reduced the thickness of contact panel.Meanwhile, the first conductive layer 120 and the second conductive layer 140 lay respectively at different aspects, can avoid because of the first conductive layer 120 with the second too near phase mutual interference of conductive layer 140 distance and other module work causes adverse effect to contact panel.
See also Fig. 2, therein in embodiment, step S120 forms the first conductive layer 120 and specifically comprises in described glass substrate 112 first areas: plated film forms nesa coating in the first area of described glass substrate 112 by magnetron sputtering; Exposure imaging carries out exposure imaging to described nesa coating, makes nesa coating form a plurality of the first conductive electrodes; Described the first conductive electrode electrically conducting transparent membrane portions is in addition removed in etching, forms the first conductive layer 120 with a plurality of first conductive electrodes, described a plurality of the first conductive electrode mutually insulateds.
In the first area of glass substrate 112 by the method for magnetron sputtering plating, form nesa coating, again with the nesa coating exposure imaging, make transparent conducting film figure form a plurality of the first conductive electrodes, by etching, remove described the first conductive electrode electrically conducting transparent membrane portions in addition, form the first conductive layer 120 with a plurality of first conductive electrodes, described a plurality of the first conductive electrode mutually insulated, these a plurality of first conductive electrodes form transparent conductive patterns.The first conductive layer 120 directly is formed at glass substrate 112 first areas, so, because utilize glass substrate 112 to have stronger coating performance, and directly being plated, the first conductive layer 120 is located at glass substrate 112, when guaranteeing the first conductive layer 120 and glass substrate 112 bond strengths, also omit tackifier, simplify and make flow process, reduce production costs, the contact panel yield is controlled good, can also be guaranteed that contact panel has lower sheet resistance, higher transmittance and less thickness etc. simultaneously.
In the present embodiment, glass substrate 112 can be selected unorganic glass substrate 112, as calcium soda-lime glass or sillico aluminate glass, and the glass crossed for intensive treatment of this glass substrate 112, be called for short tempered glass.Wherein tempered glass comprise have anti-dazzle, sclerosis, the functional layer of anti-reflection or atomizing functions.Wherein, have the functional layer of anti-dazzle or atomizing functions, formed by the applying coating with anti-dazzle or atomizing functions, coating comprises metal oxide particle; Functional layer with sclerosis function is formed or is directly hardened by chemistry or physical method by the high-molecular coating coating with sclerosis function; Functional layer with anti-reflection function is titania coating, magnesium fluoride coating or calcium fluoride coating.Because the coating performance of unorganic glass substrate 112 is higher, form the first conductive layer 120 thereby can plate better nesa coating.Certainly can also be glass substrate 112 for the high material of other coating performances.In order to guarantee the light transmission of contact panel, the thickness of glass substrate 112 can rationally be set to 0.55mm～0.7mm, and the thickness of base material 130 can rationally be set to 45 μ m～75 μ m.
In embodiment, nesa coating can be selected indium tin metal oxide coating therein.Because while indium tin metal oxide has good electric conductivity and light transmission, and the adhesion effect of indium tin metal oxide and glass is better, thereby has reduced the processing difficulty, is conducive to improve the yield of contact panel.
In other embodiments, the material of nesa coating can also comprise indium zinc oxide (Indium Zinc Oxide, IZO), in the materials such as zinc oxide aluminum (Aluminum Zinc Oxide, AZO) or poly-ethylenedioxy thiophene (PEDOT), metallic conduction grid (as silver-colored conductive grid), conducting polymer, CNT any one.
See also Fig. 1, therein in embodiment, step S140 forms the side of the second conductive layer 140 in the corresponding described glass substrate of described base material 130 112 first areas and specifically comprises: embossed grooves, at the groove of a side pressure seal reservation shape of the corresponding described glass substrate of described base material 130 112 first areas; Form the second conductive layer 140, filled conductive material and curing in described groove, the second conductive layer 140 that has a plurality of the secondth conductive electrodes with formation, described the second conductive electrode comprises the conductive grid that is formed by some metallic conduction stitchings, described conductive grid is contained in described groove, described a plurality of the second conductive electrode mutually insulateds.
Form groove in the side in the corresponding glass substrate of base material 130 112 first areas by impression, so can be by the impression formboard impression of reservation shape, and obtain the figure that needs, recharge conductive material to groove, by solidifying to form the second conductive layer 140 with a plurality of second conductive electrodes.So, the second conductive electrode is contained in groove forms the second conductive layer 140, can save a large amount of conductive materials, and the processing technology of impression is ripe, thereby reduced production cost, also reduced the thickness of contact panel.
In other embodiments, as shown in Figure 3, the second conductive layer 140 also can directly graphically be etched in a surface of the corresponding glass substrate of base material 130 112 first areas.
Therein in embodiment, a kind of for in gold, silver, copper, aluminium, zinc, vermeil or alloy at least both of the material of metallic conduction stitching that forms the second conductive layer 140, these materials are good conductivity on the one hand, meet the requirement of the second conductive layer 140 electric conductivities, cost is low on the other hand, can reduce the production cost of contact panel.
See also 1, Fig. 2 and Fig. 5, therein in embodiment, step S110 also comprises after the step of one protection panel 110 is provided:
Step S130, form the first lead-in wire 160 in described glass substrate 112 second areas, described the first lead-in wire 160 all is positioned at described glass substrate 112 homonymies with described the first conductive layer 120, and described the first lead-in wire 160 1 ends are connected with described the first conductive layer 120, and the other end forms the first pin.
Step S150, form the second lead-in wire 170 in a side of corresponding described glass substrate 112 second areas of described base material 130, described the second lead-in wire 170 all is positioned at described base material 130 homonymies with described the second conductive layer 140, described the second lead-in wire 170 1 ends are connected with described the second conductive layer 140, and the other end forms the second pin.
So, form the first lead-in wire 160 in the second area of glass substrate 112, and be positioned at the homonymy of glass substrate 112 with the first conductive layer 120, the first lead-in wire 160 1 ends are connected with the first conductive electrode, other end formation the first pin; Form the second lead-in wire 170 in a side of corresponding glass substrate 112 second areas of base material 130, second lead-in wire the 170 and second conductive layer 140 all is positioned at the homonymy of base material 130, and an end of the second lead-in wire 170 is connected with the second conductive electrode, and the other end forms the second pin.The first lead-in wire 160 is used for the circuit board 180(Flexible Printed Circuit of the first conductive layer 120 with contact panel, FPC) be electrically connected to, the second lead-in wire 170 is used for the second metal conducting layer is electrically connected to the FPC of contact panel, thereby makes FPC sense operation on contact panel.Wherein, the first pin and the second pin are a section of lead terminal, are used for being electrically connected to FPC.
In the present embodiment, circuit board 180 is provided with touch control device 190, the first conductive layer 120 and the second conductive layer 140 all can be electrically connected to touch control device 190 by circuit board 180, and touch control device 190 is processed the touch signal that detects by the first conductive layer 120 and the second conductive layer 140.Touch control device 190 is arranged at circuit board 180, thereby detected touch signal can be passed to the touch control device 190 that is arranged at circuit board 180, so that 190 pairs of detected touch signals of touch control device are processed.
See also Fig. 1, therein in embodiment, the described contraposition of the step S160 base material 130 that is formed with described the second conductive layer 140 of fitting comprises in described glass substrate 112: contraposition fit described base material 130 away from a side of described the second conductive layer 140 in described glass substrate 112, offer short slot in described base material 130, described short slot is over against described the second pin.
In embodiment, the second conductive layer 140 is formed at base material 130 away from a side of protection panel 110 therein, and base material 130 offers short slot, and short slot is over against the second pin.Base material 130 1 surfaces are fitted in protection panel 110; another surface relative with this surface forms the second conductive layer 140; offer short slot at base material 130 over against the second pin place; so that the second pin exposed; facilitate FPC with when the first pin is electrically connected to; be electrically connected to the second pin by short slot, simplify manufacturing procedure, improve yield.
See also Fig. 4, therein in embodiment, the described contraposition of the step S160 base material 130 that is formed with described the second conductive layer 140 of fitting comprises in described glass substrate 112: the contraposition described base material 130 of fitting is formed with a side of described the second conductive layer 140 in described glass substrate 112.
The second conductive layer 140 is formed at base material 130 near a side of protection panel 110.In production run, can first FPC be bound to the side that base material 130 is provided with the second pin, so that FPC is electrically connected to the second pin, then FPC followed base material 130 fit with protection panel 110 in the lump, to be electrically connected to the first pin.A side that base material 130 is formed with the second conductive layer 140 is fitted with protection panel 110; FPC is between protection panel 110 and base material 130; thereby the second pin can directly be electrically connected to FPC; need not to cross base material 130; and the second conductive layer 140 is between protection panel 110 and base material 130; be conducive to strengthen the protection to the second conductive layer 140, good reliability.
See also Fig. 1, in embodiment, comprise optical clear glue-line 150 therein, this optical clear glue-line 150 is between glass substrate 112 and base material 130.Before the base material 130 that will be provided with the second conductive layer 140 fits in glass substrate 112, add optical clear glue-line 150 between glass substrate 112 and base material 130, the further bond strength of reinforced glass substrate 112 and base material 130 has improved the yields of contact panel when reducing costs.Wherein, the material of optical clear glue-line 150 can be for OCA glue, UV glue, hot-setting adhesive or dried glue etc. certainly, to guarantee the light transmission of contact panel.
See also Fig. 2, in embodiment, protection panel 110 comprises protective seam 114 therein, and at least part of the first conductive layer 120 is coated on protective seam 114.The first conductive layer 120 is formed at glass substrate 112, the layer of other effect also need be set at glass substrate 112, can have the gap unavoidably between layers, cause air to contact with the first conductive layer 120 and oxidized.Therefore protective seam 114 is set, with at least part of protective seam 114 that is coated on of the first conductive layer 120, be conducive to reduce the probability that the first conductive layer 120 contacts with air, so that the first conductive layer 120 is not oxidized, improve the yield of contact panel.Wherein, in the present embodiment; protective seam 114 is set in the side of the first conductive layer 120 away from glass substrate 112; the glass substrate 112 of selecting is silicate glass; and the material of protective seam 114 is selected silicate usually; it is good near a side and the sealing between glass substrate 112 of glass substrate 112 in glass substrate 112, the first conductive layers 120 that the first conductive layer 120 is established in plating, gets final product therefore only need in the side away from glass substrate 112, protective seam 114 to be set.In other embodiments; if the material of the glass substrate of selecting 112 is not silicate series; also can between glass substrate 112 and the first conductive layer 120, protective seam 114 be set; namely the first conductive layer 120 is coated on protective seam 114 fully; because of the material of protective seam 114 belong to glass substrate 112 materials in a kind of, therefore this protective seam 114 can't affect the adhesion effect that glass substrate 112 is located in the first conductive layer 120 platings.
See also Fig. 2; therein in embodiment; protection panel 110 comprises photoresistance assembly 116 and ink lay 118; this photoresistance assembly 116 is attached to glass substrate 112 1 sides and is positioned at described second area; ink lay 118 is coated on glass substrate 112 1 sides, and ink lay 118 all is positioned at glass substrate 112 homonymies with photoresistance assembly 116.A side at the substrate second area is attached with photoresistance assembly 116, can make the corresponding photoresist of second area coating form the light low transmission regional, thereby make the frame that visually forms respective electronic device.Apparently, can be formed on any color frame of contact panel according to coating material selection color, be the black photoresistance as photoresist, corresponding dark border etc.This touch screen can be used the electronic installation of the touch-control input types such as mobile phone, panel computer, all-in-one computing machine, Terminal Server.Simultaneously, the homonymy that is provided with photoresistance assembly 116 at glass substrate 112 is coated with ink lay 118 by the mode of serigraphy, can form corresponding button sign, the correlating markings such as LED beacon light will as requested on protection panel 110.This ink lay 118 can be attached to glass substrate 112 by adhesion promoting layer 119, to strengthen the bond strength of ink lay 118 and glass substrate 112, is conducive to improve the yield of contact panel.
In the present embodiment, ink lay 118 is positioned at photoresistance assembly 116 away from a side of glass substrate 112, photoresistance assembly 116 is between glass substrate 112 and the first lead-in wire 160, thereby photoresistance assembly 116 can block the first lead-in wire 160, to guarantee the shown appearance no significant difference of second area, the consistance of the appearance of second area.The material of photoresistance assembly 116 can be selected from opaque photoresist, resin or printing ink.In other embodiments, ink lay 118 also can be between glass substrate 112 and light ancestral assembly 116.
The above embodiment has only expressed several embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be as the criterion with claims.
Claims (11)
1. a contact panel, is characterized in that, comprising:
The protection panel, comprise glass substrate, described glass substrate comprises first area and the second area that arranges around described first area, described first area is formed with the first conductive layer, described the first conductive layer comprises the first conductive electrode that a plurality of intervals arrange, described a plurality of the first conductive electrode mutually insulateds;
Base material; fit in described protection panel; one side of the corresponding described glass substrate of described base material first area is formed with the second conductive layer; and described the first conductive layer, described base material and described the second conductive layer all are positioned at described glass substrate homonymy; described the second conductive layer comprises the second conductive electrode that a plurality of intervals arrange, described a plurality of the second conductive electrode mutually insulateds.
2. contact panel according to claim 1, is characterized in that, described the first conductive electrode comprises the transparent conductive patterns that is formed at described glass substrate first area by graphical etching.
3. contact panel according to claim 2, it is characterized in that, one side of the corresponding described glass substrate of described base material first area is provided with the groove of reservation shape, described the second conductive electrode is contained in described groove and forms the second conductive layer, and described the second conductive electrode comprises the conductive grid that is formed by some metallic conduction stitchings.
4. contact panel according to claim 1, is characterized in that, comprises the optical clear glue-line, and described optical clear glue-line is between described glass substrate and described base material.
5. contact panel according to claim 1, it is characterized in that, comprise the first lead-in wire and the second lead-in wire, described the first lead-in wire is arranged at the second area of described glass substrate, and be positioned at the homonymy of described glass substrate with described the first conductive layer, described the first lead-in wire one end is connected with described the first conductive electrode, and the other end forms the first pin; Described the second lead-in wire is arranged at a side of the corresponding described glass substrate second area of described base material, described the second lead-in wire and described the second conductive layer all are positioned at the homonymy of described base material, one end of described the second lead-in wire is connected with described the second conductive electrode, and the other end forms the second pin.
6. contact panel according to claim 5, is characterized in that, described the second conductive layer is formed at described base material away from a side of described protection panel, and described base material offers short slot, and described short slot is over against described the second pin.
7. contact panel according to claim 5, is characterized in that, described the second conductive layer is formed at described base material near a side of described protection panel.
8. contact panel according to claim 1, is characterized in that, described protection panel comprises protective seam, and at least part of described the first conductive layer is coated on described protective seam.
9. contact panel according to claim 1; it is characterized in that; the protection panel comprises photoresistance assembly and ink lay; described photoresistance assembly is attached to described glass substrate one side and is positioned at described second area; described ink lay is coated described glass substrate one side, and described ink lay and described photoresistance assembly all are positioned at described glass substrate homonymy.
10. the described contact panel of according to claim 1 to 9 any one, is characterized in that, described nesa coating is indium tin metal oxide coating.
11. contact panel according to claim 10 is characterized in that, the material of described metallic conduction stitching is a kind of in gold, silver, copper, aluminium, zinc, vermeil or alloy at least both.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320253988 CN203276218U (en) | 2013-05-10 | 2013-05-10 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320253988 CN203276218U (en) | 2013-05-10 | 2013-05-10 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN203276218U true CN203276218U (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320253988 Expired - Fee Related CN203276218U (en) | 2013-05-10 | 2013-05-10 | Touch panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257748A (en) * | 2013-05-10 | 2013-08-21 | 苏州欧菲光科技有限公司 | Touch panel and manufacturing method thereof |
| CN111908801A (en) * | 2020-07-23 | 2020-11-10 | 泉州市鑫晟电子科技有限公司 | Manufacturing process of gradual change glass panel and gradual change glass panel |
-
2013
- 2013-05-10 CN CN 201320253988 patent/CN203276218U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257748A (en) * | 2013-05-10 | 2013-08-21 | 苏州欧菲光科技有限公司 | Touch panel and manufacturing method thereof |
| CN103257748B (en) * | 2013-05-10 | 2016-12-28 | 苏州欧菲光科技有限公司 | Contact panel and manufacture method |
| CN111908801A (en) * | 2020-07-23 | 2020-11-10 | 泉州市鑫晟电子科技有限公司 | Manufacturing process of gradual change glass panel and gradual change glass panel |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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