CN203465964U - Conductive film, touch-control sensing element, touch-control electronic device - Google Patents
Conductive film, touch-control sensing element, touch-control electronic device Download PDFInfo
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- CN203465964U CN203465964U CN201320602115.9U CN201320602115U CN203465964U CN 203465964 U CN203465964 U CN 203465964U CN 201320602115 U CN201320602115 U CN 201320602115U CN 203465964 U CN203465964 U CN 203465964U
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Abstract
The utility model provides a conductive film, a touch-control sensing element and a touch-control electronic device. The conductive film comprises a substrate and a conductive layer arranged on the substrate; the conductive layer comprises a transparent conductive pattern located in the middle of the substrate and lead wires located at the edge of the substrate; the lead wires are electrically connected with the transparent conductive pattern; the substrate comprises one top plate portion and at least one side plate portion; each side plate portion extends along one edge of the top plate portion towards the direction deviating from the top plate portion; and the lead wires are arranged on the side plate portions. As the lead wires are arranged on the side plate portions and the side plate portions deviate from the top plate portion, the projection area of the side plate portions on the top plate portion, that is, the lead wire area, is small in size, the size of the lightproof area is greatly reduced, the whole transparent panel can almost form a total light-coming sensing area, and miniaturization and full screen of the touch-control electronic device are facilitated.
Description
Technical field
The utility model relates to touch-control sensing technology, relates in particular to a kind of conducting film, touch sensing element and screen touch electronic device.
Background technology
Touch sensing element is the inductive arrangement that can receive the input signals such as touch.Touch sensing element has given information interaction brand-new looks, is extremely attractive brand-new information interaction equipment.The development of touch-control sensing technology has caused the common concern of domestic and international information medium circle, has become the Chaoyang new high-tech industry that photoelectricity industry is a dark horse.
At present, touch sensing element has been widely used in various electronic installations, and as electronic installations such as camera, mobile phone, MP4, it is mainly to carry out figure touch control operation in conjunction with display screen.
Existing touch sensing element comprises face glass and fits in the conducting film on face glass, this conducting film comprises a substrate and is located at this on-chip conductive layer, conductive layer comprises the transparent conductive patterns that is positioned at substrate middle part and the lead-in wire that is positioned at substrate edge, lead-in wire electrically conducts with conductive pattern, for transmission of electric signals, the formation induction zone, region at conductive pattern place on substrate, induction zone is transmission region, over against display screen.Go between on the substrate region at place forms lead district, for attractive in appearance, lead district is equipped with black out ink to cover lead-in wire, therefore, lead district is light tight region, when conducting film fits in face glass, the equal integral plaster of induction zone and lead district closes on face glass, lead district forms wider light tight district on face glass, has taken the transmission region of face glass, is unfavorable for miniaturization and the screen enlarging of screen touch electronic device.
Utility model content
The utility model provides a kind of conducting film, touch sensing element and screen touch electronic device, for overcoming defect of the prior art, greatly reduces the area in light tight region, is conducive to screen touch electronic device to miniaturization and full frameization development.
The utility model provides a kind of conducting film, comprise a substrate and be located at this on-chip conductive layer, described conductive layer comprises the transparent conductive patterns that is positioned at substrate middle part and the lead-in wire that is positioned at described substrate edge, described lead-in wire and transparent conductive patterns are electrically connected, described substrate comprises a top plate portion and at least one side plate, described side plate all extends to a side that deviates from this top plate portion along a side of described top plate portion, described transparent conductive patterns is located on described top plate portion, and described lead-in wire is arranged on described side plate.
As the embodiment of above-mentioned conducting film, described substrate comprises two side plates, and described two side plates extend to the homonymy that deviates from this top plate portion along the edge of described top plate portion, and described substrate takes the shape of the letter U.
As the preferred embodiment of above-mentioned conducting film, described side plate arranges with described top plate portion is vertical.
In above-described embodiment, described side plate and described top plate portion are one-body molded.
In above-described embodiment, described transparent conductive patterns and described lead-in wire are all located at the outer surface of described substrate, or are all located at the inner surface of described substrate.
In above-described embodiment, described transparent conductive patterns is formed by a plurality of spaced conductive units, and described in each, conductive unit forms by conducting metal grid, and the end of each conductive unit is all electrically connected described lead-in wire.
The utility model also provides a kind of touch sensing element, comprise transparent panel and fit at least one conducting film on this transparent panel, described conducting film is above-mentioned conducting film, the one side that deviates from the side plate of described conducting film on the top plate portion of described conducting film is binding face, described binding face and the laminating of described transparent panel.
Preferred embodiment as above-mentioned touch sensing element, described transparent conductive patterns is located on the binding face of described substrate, described lead-in wire is all located at the side plate of described substrate on the face of described transparent conductive patterns, and described transparent conductive patterns is located between described transparent panel and described binding face.
As another preferred embodiment of above-mentioned touch sensing element, described conducting film comprises at least two conductive layers, between adjacent described conductive layer, insulate, and the conductive unit setting intersected with each other in adjacent described conductive layer.
The utility model also provides a kind of screen touch electronic device, comprise casing and be fastened on the touch sensing element on described casing, in described casing, be provided with display module, driver module with described display module electric connection, touch-control driver module, flexible PCB, described sensing element is above-mentioned touch sensing element, the described casing groove shape that takes the shape of the letter U, the transparent panel of described sensing element is fastened on the openend of described casing and is jointly enclosed to form an accommodation space with casing, described conducting film, driver module, touch-control driver module, flexible PCB is all placed in described accommodation space, described display module is fitted in the top plate portion of conducting film in described sensing element and deviates from the one side of described transparent panel, described flexible PCB is electrically connected conducting film lead-in wire and touch-control driver module in described sensing element.
The conducting film that the utility model provides, touch sensing element and screen touch electronic device, because lead-in wire is arranged on side plate, and side plate deviates from top plate portion, the view field of side plate on top plate portion is that lead district area is less like this, greatly reduced the area in light tight region, whole transparent panel almost all can form the induction zone of printing opacity, is conducive to miniaturization and full frameization of screen touch electronic device.
Accompanying drawing explanation
The schematic perspective view of the conducting film that Fig. 1 provides for the utility model embodiment mono-;
The schematic perspective view of a kind of conducting film that Fig. 2 provides for the utility model embodiment bis-;
The schematic perspective view of the another kind of conducting film that Fig. 3 provides for the utility model embodiment bis-;
The cutaway view of the sensing element that Fig. 4 provides for the utility model embodiment tri-;
Fig. 5 is the enlarged diagram one of I in Fig. 4;
Fig. 6 is the enlarged diagram two of I in Fig. 4;
The cutaway view of the screen touch electronic device that Fig. 7 provides for the utility model embodiment tetra-;
Fig. 8 is a kind of execution mode of embodiment tri-;
Fig. 9 is the another kind of execution mode of embodiment tri-.
Embodiment
Embodiment mono-
As shown in Figure 1, the utility model embodiment provides a kind of conducting film, comprise a substrate 11 and be located at the conductive layer 12 on this substrate 11, conductive layer 12 comprises the transparent conductive patterns 12a that is positioned at substrate middle part and the lead-in wire 12b that is positioned at substrate edge, lead-in wire 12b and transparent conductive patterns are electrically connected, substrate 11 comprises a top plate portion 11a and at least one side plate 11b, side plate 11b extends to a side that deviates from this Roof board 11a along a side of top plate portion 11a, and lead-in wire 12b is arranged on side plate side plate 11b.Top plate portion 11a and suitable with the shape of the face glass of top plate portion 11a laminating, if the binding face of face glass is plane, top plate portion 11a is plane tabular, if if the binding face of face glass is curved surface, to be curved surface tabular for top plate portion 11a.
Kink 11b in the present embodiment is one, and is plane, certainly also can be curved surface shape, and can arrange and take on a different shape as required, at this, does not limit.Here deviate from top plate portion 11a and refer to the direction away from this top plate portion 11a place face, side plate 11b all extends and refers to that side plate 11b is all positioned at the same side of top plate portion 11a to a side that deviates from this top plate portion 11a along a side of top plate portion 11a, the bearing of trend of side plate 11b is not identical, suppose that side plate 11b is all plane, top plate portion 11a horizontal positioned, side plate 11b is all along the both sides of the edge of top plate portion 11a to downward-extension, or side plate 11b all extends upward along the both sides of the edge of top plate portion 11a, side plate 11b can be identical with the angle between top plate portion 11a, also can be different.
The conducting film that the utility model provides, due to lead-in wire, 12b is arranged on side plate 11b, and side plate 11b deviates from top plate portion 11a, the view field of side plate 11b on top plate portion 11a is that lead district area is less like this, greatly reduced the area in light tight region, whole transparent panel almost all can form the induction zone of printing opacity, is conducive to miniaturization and full frameization of screen touch electronic device.
As the preferred embodiment of above-described embodiment one, side plate 11b arranges with top plate portion 11a is vertical.When side plate 11b is vertical with top plate portion 11a, the view field area of side plate on top plate portion is minimum, and the final lead district forming is minimum, induction zone can be maximized, and, when the thickness of substrate can accomplish that when enough thin, lead-in wire 12b is longitudinally stacked and placed on the surface of side plate 11b, lead district is a line just finally, need to not apply black out ink with covering lead-in wire in lead district, simplified the manufacturing process of conducting film, saved black out ink, can reduce costs.
Embodiment bis-
As shown in Figure 2 and Figure 3, on the basis of embodiment mono-, substrate 11 comprises two side plate 11b, and two side plate 11b extend to the same direction that deviates from this top plate portion 11a along the edge of top plate portion 11a, and substrate 11 takes the shape of the letter U.In the present embodiment, top plate portion 11a is rectangular, and two side plate 11b are relatively located at top plate portion 11a both sides and form U-shaped.Provide two kinds of concrete forms below:
As shown in Figure 2, conductive layer 12 is located at the inner surface of substrate 11 to a kind of form, and the inner surface here refers to the inwall of the storage tank of substrate 11 formation that take the shape of the letter U, and transparent conductive patterns is located at the inner surface of substrate 11, and lead-in wire 12b is located at the inner surface of both sides board 11b.
As shown in Figure 3, conductive layer 12 is located at substrate outer surface to another kind of form, and the outer surface here refers to the outer wall of the storage tank of substrate 11 formation that take the shape of the letter U, and conductive pattern 12a is located at the outer surface of substrate 11, and lead-in wire 12b is located at the outer surface of both sides board 11b.
In above-described embodiment, side plate 11b is connected with top plate portion 11a one.Can adopt injection moulding one-shot forming, or diaphragm hot pressing bending.
Embodiment tri-
As Figure 4-Figure 6, the utility model embodiment also provides a kind of touch sensing element, comprise transparent panel 2 and fit in the conducting film 1 on this transparent panel 2, the conducting film that conducting film 1 is above-mentioned any embodiment, top plate portion 11a one side upper and that side plate 11b deviates from is binding face 10, binding face 10 and transparent panel 2 laminatings.
As shown in Figure 8, in above-described embodiment, transparent conductive patterns 12a is formed by a plurality of spaced conductive units 20, and each conductive unit 20 forms by conducting metal grid, and the end of each conductive unit is all electrically connected lead-in wire.
Transparent conductive patterns is located on the binding face 10 of substrate, and the side plate 11b that lead-in wire 12b is all located at substrate is on the face of transparent conductive patterns 12a, and transparent conductive patterns 12a is located between transparent panel 2 and binding face 10.
Transparent conductive patterns on the induction zone of conducting film is the metal grill of visually-clear, and metal material has preferably flexible, and therefore, the overbending direction of conducting film has good selectivity.
The induction zone of conducting film is formed at conducting film towards a side of transparent panel, and conducting metal grid, towards transparent panel 2, does not need additionally conducting metal grid to be arranged to protective layer, as shown in Figure 6.
A kind of distortion as embodiment tri-, the two-layer conducting film 1 of fitting on transparent panel as shown in Fig. 4, Fig. 8, the conducting film that conducting film 1 is above-mentioned any embodiment, top plate portion 11a one side upper and that side plate 11b deviates from is binding face 10, binding face 10 and transparent panel 2 laminatings; Between two conducting films, by substrate 11, insulate, form conductive unit 20 setting intersected with each other of transparent conductive patterns 12a in adjacent two conducting films.As the another kind distortion of embodiment tri-, as shown in Fig. 4, Fig. 9, conducting film 1 comprises at least two conductive layers 12, between adjacent conductive layer 12, by insulating barrier 3, insulate, and conductive unit 20 setting intersected with each other in adjacent conductive layer 12.
In two conductive layers, conducting metal grid forms double-deck induction structure.As the preferred implementation of the present embodiment, the conductive unit that forms the transparent conductive patterns in each conductive layer is parallel to each other, the conductive unit of the bright conductive pattern intersection that is perpendicular to one another in two conductive layers.The double-deck induction structure sensitivity that above-mentioned conducting metal grid forms is higher, and compact conformation, can produce the sensing element that volume is less.
This conducting metal grid consists of cross one another conductive thread, and the wire diameter of conductive thread is less than 5um, and the light transmittance of conductive grid is greater than 90%, and the wire diameter of conductive thread is preferably 2um, and the light transmittance of conducting metal grid is preferably 93%.
Conducting metal grid and lead-in wire 12b are that conductive layer 12 can be fixed on substrate surface 11, and referring to Fig. 5, first at substrate surface plating conductive metal film, then photoresist exposure, development, etching form; Or adopt the coating of nanometer acupuncture needle ink and substrate surface, dry compacting, then photoresist exposure, development, etching form.The lead-in wire formation technique of 12b is identical with the formation technique of conducting metal grid.
In the structure shown in Fig. 5, conductive layer 12 can also because ITO is the not material of tension of resistance to compression, be located at conducting film inner side for tin indium oxide (ITO) layer, can prevent the be full of cracks of ITO transparent conductive patterns.
Conducting metal grid and lead-in wire are that conductive layer 12 also can be embedded on substrate 11, specifically can be referring to Fig. 6, first on substrate 11 surfaces, establish impression glue-line 13, then on this impression glue-line 13, form latticed groove, finally filled conductive metal material in latticed groove finally forms conducting metal grid after metallic conduction material cured.The lead-in wire formation technique of 12b is identical with the formation technique of conducting metal grid, and in other embodiments, lead-in wire 12b also can adopt silk-screen printing technique to be formed at the end of conducting metal grid.
As the preferred embodiment of above-mentioned touch sensing element, between transparent panel 2 and binding face 10, there is substratum transparent 3.Substratum transparent is in order to increase the stability of sensing element.
The material of transparent panel can be a kind of in the optically transparent materials such as glass, polymethyl methacrylate (PMMA), Merlon (PC), polyvinyl chloride (PVC), PETG (PET).This flexible parent metal is a kind of in the optically transparent materials such as polymethyl methacrylate (PMMA), Merlon (PC), polyvinyl chloride (PVC), PETG (PET).
The touch sensing element that the utility model provides, the lead district of conducting film does not need to fit on transparent panel, but extend downwardly into the inside of electronic installation, do not take the printing opacity viewing area on transparent panel, also need not additionally in lead district, form black out ink, not only be conducive to the miniaturization of electronic installation, screen enlarging, can also reduce production costs.
Embodiment tetra-
As shown in Figure 7, on the basis of above-described embodiment, the utility model embodiment also provides a kind of screen touch electronic device, comprise casing 4 and be fastened on the sensing element 30 on casing 1, in casing 4, be provided with display module 5, driver module 6 with display module 5 electric connections, touch-control driver module 7, flexible PCB 8, sensing element is the touch sensing element of above-mentioned any embodiment, the casing 4 groove shape that takes the shape of the letter U, the transparent panel 2 of sensing element is fastened on the openend of casing 4 and is jointly enclosed to form an accommodation space with casing 4, conducting film 1, driver module 5, touch-control driver module 6, flexible PCB 7 is all placed in accommodation space, display module 5 is fitted in the top plate portion 11a of conducting film in sensing element and deviates from the one side of transparent panel 2, flexible PCB 8 is electrically connected lead-in wire 12b and the touch-control driver module 7 of conducting film in sensing element.
The screen touch electronic device that the utility model provides, due to lead-in wire, 12b is arranged on side plate 11b, and side plate 11b deviates from top plate portion 11a, the view field of side plate 11b on top plate portion 11a is that lead district area is less like this, greatly reduced the area in light tight region, whole transparent panel almost all can form the induction zone of printing opacity, is conducive to screen touch electronic device to miniaturization and full frameization development.
As the specific embodiment of above-mentioned screen touch electronic device, driver module 6 and touch-control driver module 7 are all located at casing 4 bottoms, compact conformation.Between flexible PCB 8 and touch-control driver module 7, be connected with connector 9, strengthen electrical connection properties.
Finally it should be noted that: each embodiment, only in order to the technical solution of the utility model to be described, is not intended to limit above; Although the utility model is had been described in detail with reference to aforementioned each embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or some or all of technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a conducting film, comprise a substrate and be located at this on-chip conductive layer, described conductive layer comprises transparent conductive patterns and the lead-in wire being electrically connected with described transparent conductive patterns, it is characterized in that, described substrate comprises a top plate portion and at least one side plate, described side plate extends to a side that deviates from this top plate portion along a side of described top plate portion, and described transparent conductive patterns is located on described top plate portion, and described lead-in wire is arranged on described side plate.
2. conducting film according to claim 1, is characterized in that, described substrate comprises two side plates, and along the edge of described top plate portion, the homonymy to this top plate portion extends described two side plates, and described substrate takes the shape of the letter U.
3. conducting film according to claim 1 and 2, is characterized in that, described side plate arranges with described top plate portion is vertical.
4. conducting film according to claim 1, is characterized in that, described side plate and described top plate portion are one-body molded.
5. conducting film according to claim 1, is characterized in that, described transparent conductive patterns and described lead-in wire are all located at the outer surface of described substrate, or is all located at the inner surface of described substrate.
6. conducting film according to claim 1, is characterized in that, described transparent conductive patterns is formed by a plurality of spaced conductive units, and described in each, conductive unit forms by conducting metal grid, and the end of each conductive unit is all electrically connected described lead-in wire.
7. a touch sensing element, comprise transparent panel and fit at least one conducting film on this transparent panel, it is characterized in that, described conducting film is the arbitrary described conducting film of the claims 1-6, the one side that deviates from the side plate of described conducting film on the top plate portion of described conducting film is binding face, described binding face and the laminating of described transparent panel.
8. touch sensing element according to claim 7, it is characterized in that, described transparent conductive patterns is located on the binding face of described substrate, described lead-in wire is all located at the side plate of described substrate on the face of described transparent conductive patterns, and described transparent conductive patterns is located between described transparent panel and described binding face.
9. according to the touch sensing element described in claim 7 or 8, it is characterized in that, described conducting film comprises at least two conductive layers, between adjacent described conductive layer, insulate, and the conductive unit setting intersected with each other in adjacent described conductive layer.
10. a screen touch electronic device, comprise casing and be fastened on the touch sensing element on described casing, in described casing, be provided with display module, driver module with described display module electric connection, touch-control driver module, flexible PCB, it is characterized in that, described sensing element is the arbitrary described touch sensing element of the claims 7-9, the described casing groove shape that takes the shape of the letter U, the transparent panel of described sensing element is fastened on the openend of described casing and is jointly enclosed to form an accommodation space with casing, described conducting film, driver module, touch-control driver module, flexible PCB is all placed in described accommodation space, described display module is fitted in the top plate portion of conducting film in described sensing element and deviates from the one side of described transparent panel, described flexible PCB is electrically connected lead-in wire and the touch-control driver module of conducting film in described sensing element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320602115.9U CN203465964U (en) | 2013-09-27 | 2013-09-27 | Conductive film, touch-control sensing element, touch-control electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320602115.9U CN203465964U (en) | 2013-09-27 | 2013-09-27 | Conductive film, touch-control sensing element, touch-control electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN203465964U true CN203465964U (en) | 2014-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320602115.9U Expired - Fee Related CN203465964U (en) | 2013-09-27 | 2013-09-27 | Conductive film, touch-control sensing element, touch-control electronic device |
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| CN (1) | CN203465964U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500601A (en) * | 2013-09-27 | 2014-01-08 | 南昌欧菲光科技有限公司 | Conducting film, touch sensing element and touch electronic device |
| CN109101137A (en) * | 2018-08-21 | 2018-12-28 | 业成科技（成都）有限公司 | Special-shaped touch screen and preparation method thereof |
-
2013
- 2013-09-27 CN CN201320602115.9U patent/CN203465964U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500601A (en) * | 2013-09-27 | 2014-01-08 | 南昌欧菲光科技有限公司 | Conducting film, touch sensing element and touch electronic device |
| CN103500601B (en) * | 2013-09-27 | 2016-04-27 | 南昌欧菲光科技有限公司 | Conducting film, touch sensing element and screen touch electronic device |
| CN109101137A (en) * | 2018-08-21 | 2018-12-28 | 业成科技（成都）有限公司 | Special-shaped touch screen and preparation method thereof |
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Granted publication date: 20140305 Termination date: 20180927 |