CN203480462U - Touch control panel - Google Patents
Touch control panel Download PDFInfo
- Publication number
- CN203480462U CN203480462U CN201320530064.3U CN201320530064U CN203480462U CN 203480462 U CN203480462 U CN 203480462U CN 201320530064 U CN201320530064 U CN 201320530064U CN 203480462 U CN203480462 U CN 203480462U
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- substrate
- block
- glue
- contact panel
- line
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Abstract
The utility model discloses a touch control panel, comprising a substrate, a cover plate, a touch control element layer, and a glue layer. The substrate comprises a central region and a peripheral region surrounding the central region. The cover plate is arranged on the substrate. The touch control element layer is arranged in the central region of the substrate and located between the substrate and the cover plate. The glue layer is arranged between the substrate and the cover plate and comprises a first cured region block and multiple discontinuous second cured region blocks located in the peripheral region. The first cured region block of the glue layer covers the touch control element layer, while the second cured region blocks surround the touch control element layer. The curing rate of each second cured region block is greater than that of the first cured region block.
Description
Technical field
The utility model relates to a kind of panel, and particularly relates to a kind of contact panel.
Background technology
The cover plate of general contact panel is mostly by glue with the laminating of the substrate of configuration touch control component layer, and wherein glue had certain mobility before uncured.Therefore,, when carrying out pressure debubble manufacture craft, while allowing glue flow toward the surrounding of substrate, glue cannot effectively rest on the surrounding of substrate and present the phenomenon of the glue that overflows.Now, be positioned at the obvious meeting of glue thickness of substrate center higher than the glue thickness that is positioned at substrate periphery, therefore after follow-up curing glue, can make the thickness of formed glue-line present central thickness and the inconsistent phenomenon of peripheral thickness.In addition, because the bondline thickness of substrate periphery is obviously thinner than the bondline thickness of substrate center, so four jiaos of substrates easily have the phenomenon of peeling off, and then affect the structural reliability of contact panel.
Utility model content
The purpose of this utility model is to provide a kind of contact panel, and it can effectively control the thickness of glue-line integral body, to avoid the periphery of substrate and the phenomenon that cover plate is peeled off.
For reaching above-mentioned purpose, contact panel of the present utility model, it comprises substrate, cover plate, touch control component layer and glue-line.Substrate has central area and is positioned at central area surrounding zone around.Cover plate is disposed at the top of substrate.Touch control component layer is disposed at the central area of substrate, and between substrate and cover plate.Glue-line is disposed between substrate and cover plate, and has the first a plurality of discontinuous second curing block that solidifies block and be positioned at surrounding zone.First of glue-line solidifies block and covers touch control component layer, and second solidifies block around touch control component layer.Each second curing degree that solidifies block is greater than the curing degree of the first curing block.
In an embodiment of the present utility model, the first curing degree that solidifies block of above-mentioned glue-line is less than 95%, and each second curing degree that solidifies block of glue-line is more than or equal to 95%.
In an embodiment of the present utility model, the distance between a side of each the second orthogonal projection of curing block on substrate of above-mentioned glue-line and a side of adjacent substrate is between 0 to 2 centimetre.
In an embodiment of the present utility model, the frontal projected area of each the second curing block on substrate of above-mentioned glue-line is between 3 square centimeters to 330 square centimeters.
In an embodiment of the present utility model, the orthogonal projection profile of each the second curing block on substrate of above-mentioned glue-line comprises rectangle or L shaped.
In an embodiment of the present utility model, thickness and each the second difference of solidifying the thickness of block that first of above-mentioned glue-line solidifies block are less than or equal to 100 microns.
In an embodiment of the present utility model, above-mentioned each second solidifies the size of block and the coefficient of viscosity of glue-line is inversely proportional to.
In an embodiment of the present utility model, the second above-mentioned curing block has identical or different size.
In an embodiment of the present utility model, the size of above-mentioned cover plate is greater than the size of substrate, and the orthogonal projection of glue-line on substrate is overlapped in substrate completely.
In an embodiment of the present utility model, the size of above-mentioned contact panel is between 18 inch to 26 inch.
The utility model has the advantages that, based on above-mentioned, because each second curing degree that solidifies block of glue-line of the present utility model is greater than first, solidify the curing degree of block, so between the periphery of substrate and cover plate, can avoid occurring the phenomenon peeled off.Therefore contact panel of the present utility model can have preferably structural reliability.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Figure 1A is the elevational schematic view of a kind of contact panel of the embodiment that creates of the utility model;
Figure 1B is the diagrammatic cross-section of the contact panel of Figure 1A;
Fig. 2 is the elevational schematic view of a kind of contact panel of another embodiment of creating of the utility model;
Fig. 3 is the elevational schematic view of a kind of contact panel of another embodiment of creating of the utility model;
Fig. 4 is the elevational schematic view of a kind of contact panel of another embodiment of creating of the utility model.
Symbol description
100a, 100b, 100c, 100d: contact panel
110: substrate
111: side
112: central area
114: surrounding zone
120: cover plate
130: touch control component layer
140a, 140b, 140c, 140d: glue-line
142a, 142b, 142c, 142d: first solidifies block
144a, 144b, 146b, 144c, 144d: second solidifies block
145a, 145c: side
C: corner
D: distance
Embodiment
Figure 1A illustrates the elevational schematic view of a kind of contact panel of an embodiment who creates into the utility model.Figure 1B illustrates the diagrammatic cross-section into the contact panel of Figure 1A.Please also refer to Figure 1A and Figure 1B, in the present embodiment, contact panel 100a comprises substrate 110, cover plate 120, touch control component layer 130 and glue-line 140a.Substrate 110 has central area 112 and is positioned at central area 112 surrounding zone 114 around.Cover plate 120 is disposed at the top of substrate 110, and the size of cover plate 110 is greater than the size of substrate 120.Touch control component layer 130 is disposed at the central area 112 of substrate 110, and between substrate 110 and cover plate 120.Glue-line 140a is disposed between substrate 110 and cover plate 120, and has the first curing block 142a that is positioned at central area 112 and surrounding zone 114 and a plurality of discontinuous second curing block 144a that is positioned at surrounding zone 114.First of glue-line 140a solidifies block 142a and at least covers touch control component layer 130, and second solidifies block 144a around touch control component layer 130.Each second curing degree that solidifies block 144a is greater than the curing degree of the first curing block 142a.
Specifically, the better suggestion of size of the contact panel 100a of the present embodiment is between 18 inch to 26 inch, even more than 26 inch, i.e. and general so-called large scale.Substrate 110 is all for example glass substrate with cover plate 120, and cover plate 120, as shown in Figure 1A and Figure 1B, touch control component layer 130 can be capacitive touch control element layer, electric resistance touch-control element layer, electromagnetic touch-control element layer or other suitable touch control component layers, in this, is not limited.Glue-line 140a can divide into first because of curing degree and solidify block 142a and the second curing block 144a.Preferably, the first curing degree that solidifies block 142a of glue-line 140a is less than 95%, and each second curing degree that solidifies block 144a of glue-line 140a is more than or equal to 95%.In this enforcement, the orthogonal projection of glue-line 140a on substrate 110 is overlapped in substrate 110 completely, and this means, the frontal projected area of glue-line 140a on substrate 110 is identical with the area of substrate 110, but not as limit.
Further, refer again to Figure 1A and Figure 1B, the distance between the side 145a of the second orthogonal projection of curing block 144a on substrate 110 of glue-line 140a and the side 111 of adjacent substrate 110 is 0 centimetre.That is to say, second solidifies four sides 111 that block 144a is in fact the neat substrate 110 of subsides in this arranges.In the present embodiment, second solidifies block 144a has identical size, but not as limit.The frontal projected area of each the second curing block 144a on substrate 110 of glue-line 140a, for example between 3 square centimeters to 330 square centimeters, and the orthogonal projection profile of each the second curing block 144a on substrate 110 of glue-line 140a is embodied as rectangle or square, but not as limit.Particularly, first of glue-line 140a the thickness and each second difference of solidifying the thickness of block 144a of solidifying block 142a is less than or equal to 100 microns.Should be noted that, that at this, defines first solidifies block 142a and is embodied as glue-line 140a and deducts discontinuous second and solidify remaining block after block 144a, therefore first solidifies block 142a except covering touch control component layer 130, and it also has the part surrounding zone 114 of covered substrate 110.
In manufacture craft, after touch control component layer 130 is disposed on substrate 110, can between cover plate 120 and substrate 110, carry out glue laminating manufacture craft.Wherein, the step of glue laminating manufacture craft, first, is filled in glue between cover plate 120 and substrate 110.Then, the photomask with a plurality of openings is arranged on cover plate 120, and opening part is carried out to first stage UV solidifies, with precuring part glue.It should be noted that the position that the opening of photomask solidifies block 144a corresponding to follow-up formation second.Afterwards, carry out pressure debubble manufacture craft, allow the glue of central area 112 114 flow and the bubble in glue is discharged toward surrounding zone.Therefore now, owing to being positioned at the part glue precuring of surrounding zone 114, it can be considered barrier wall structure, and the glue of precuring can be because of the surrounding zone 114 that is stranded in substrate 110 that stops of barrier wall structure for this reason.Finally, then the glue of the glue of not precuring and precuring is carried out to subordinate phase UV solidify, to solidify glue completely, form glue-line 140a.Herein, formed glue-line 140a can measure its curing degree by Fourier infrared spectrograph Nicolet380, and divide into curing degree larger second solidify the first curing block 142a that block 144a is less with curing degree.
It should be noted that, the thickness of glue-line 140a is that manufacture craft parameter in pressure debubble manufacture craft and the coefficient of viscosity of glue-line 140a are controlled, that is to say, when manufacture craft parameter (as the size of centrifugal force) difference, and the coefficient of viscosity of glue-line 140a more hour, and formed glue-line 140a's is thinner.Based on this principle, if under the control of manufacture craft parameter, the coefficient of viscosity of glue-line 140a more hour, more easily flows out the surrounding zone 114 of substrate 110, and therefore required second to solidify block 144a larger; Otherwise, when the coefficient of viscosity of glue-line 140a is larger, be more easily stranded in the central area 112 of substrate 110, therefore required second to solidify block 144a less.This means, the second curing size of block 144a and the coefficient of viscosity of glue-line 140a are inversely proportional to.Thus, the thickness that first of glue-line 140a solidifies block 142a can roughly be consistent with each second thickness that solidifies block 144a, and the difference of thickness is less than or equal to 100 microns.
Because the second curing degree that solidifies block 144a of the glue-line 140a of the present embodiment is greater than the first curing degree that solidifies block 142a, and thickness is roughly unanimously, so between the surrounding zone 114 of substrate 110 and cover plate 120, can avoid occurring the phenomenon peeled off.Therefore the contact panel 100a of the present embodiment can have preferably structural reliability.
At this, should be noted that, following embodiment continues to use element numbers and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate element, and has omitted the explanation of constructed content.Explanation about clipped can be with reference to previous embodiment, and it is no longer repeated for following embodiment.
Fig. 2 illustrates the elevational schematic view into a kind of contact panel of another embodiment of this novel creation.Please refer to Fig. 2, the contact panel 100b of the present embodiment is similar to the contact panel 100a of Figure 1A, and only the two Main Differences part is: the glue-line 140b of the contact panel 100b of the present embodiment has second of different size and solidifies block 144b, 146b.Specifically, the coefficient of viscosity of the glue-line 140b of the present embodiment is less than the coefficient of viscosity of the glue-line 140a of previous embodiment, and therefore, the in the situation that of manufacture craft parameter size, its second required curing block 144b, 146b is larger.Thus, first of glue-line 140b the thickness that solidifies block 142b can roughly be consistent with the second thickness that solidifies block 144b, 146b.
Fig. 3 illustrates the elevational schematic view into a kind of contact panel of another embodiment of this novel creation.Please refer to Fig. 3, the contact panel 100c of the present embodiment is similar to the contact panel 100a of Figure 1A, only the two Main Differences part is: the distance B between the side 145c of the second orthogonal projection of curing block 144c on substrate 110 of the glue-line 140c of the contact panel 100c of the present embodiment and the side 111 of adjacent substrate 110 is between 0 to 2 centimetre, as shown in Figure 3, distance B is embodied as and is greater than 0 and be less than or equal to 2 centimetres.So, solidify the side 111 that block 144c does not need to trim substrate 110 due to second, there is higher error tolerances, in manufacture craft, can control than being easier to, and easily manufacture.
Fig. 4 illustrates the elevational schematic view into a kind of contact panel of another embodiment of this novel creation.Please refer to Fig. 4, the contact panel 100d of the present embodiment is similar to the contact panel 100a of Figure 1A, and only the two Main Differences part is: second of the glue-line 140d of the contact panel 100d of the present embodiment solidifies the orthogonal projection profile of block 144d on substrate 110 and specializes L shaped.Specifically, the second curing block 144d is embodied as side 111 configurations that are positioned at four corner C of substrate 110 and trim substrate 110.So, owing to thering is second of higher curing degree, solidify block 144d, be just positioned at four corner C of substrate 110, therefore avoiding, in four jiaos of phenomenons of peeling off, having excellent effect.In the embodiment not illustrating at other, the orthogonal projection profile of the second curing block on substrate can be also hollow, or tool frame glue jaggy type, in this, do not limited.
In sum, the curing degree that solidifies block due to second of glue-line of the present utility model is greater than first and solidifies the curing degree of block, so between the surrounding zone of substrate and cover plate, can avoid occurring the phenomenon peeled off.Therefore contact panel of the present utility model can have preferably structural reliability.
Claims (10)
1. a contact panel, is characterized in that, this contact panel comprises:
Substrate, has central area and is positioned at this central area surrounding zone around;
Cover plate, is disposed at the top of this substrate;
Touch control component layer, is disposed at this central area of this substrate, and between this substrate and this cover plate; And
Glue-line, be disposed between this substrate and this cover plate, and have first and solidify block and a plurality of discontinuous second curing block that is positioned at this surrounding zone, this first curing block covers this touch control component layer, those second solidify blocks around this touch control component layer, and respectively this second curing degree that solidifies block is greater than this first curing degree that solidifies block.
2. contact panel as claimed in claim 1, is characterized in that, the curing degree that this of this glue-line first solidifies block is less than 95%, and respectively this second curing degree that solidifies block of this glue-line is more than or equal to 95%.
3. contact panel as claimed in claim 1, is characterized in that, the distance between a side of respectively this orthogonal projection of the second curing block on this substrate of this glue-line and a side of this adjacent substrate is between 0 to 2 centimetre.
4. contact panel as claimed in claim 3, is characterized in that, the frontal projected area of respectively this second curing block on this substrate of this glue-line is between 3 square centimeters to 330 square centimeters.
5. contact panel as claimed in claim 3, is characterized in that, the orthogonal projection profile of respectively this second curing block on this substrate of this glue-line comprises rectangle or L shaped.
6. contact panel as claimed in claim 1, is characterized in that, the thickness of this of this glue-line the first curing block and respectively this second difference of solidifying the thickness of block are less than or equal to 100 microns.
7. contact panel as claimed in claim 1, is characterized in that, respectively this second curing size of block and the coefficient of viscosity of this glue-line are inversely proportional to.
8. contact panel as claimed in claim 1, is characterized in that, those second curing blocks have identical or different size.
9. contact panel as claimed in claim 1, is characterized in that, the size of this cover plate is greater than the size of this substrate, and the orthogonal projection of this glue-line on this substrate is overlapped in this substrate completely.
10. contact panel as claimed in claim 1, is characterized in that, the size of this contact panel is between 18 inch to 26 inch.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320530064.3U CN203480462U (en) | 2013-08-28 | 2013-08-28 | Touch control panel |
| TW102216926U TWM472891U (en) | 2013-08-28 | 2013-09-09 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320530064.3U CN203480462U (en) | 2013-08-28 | 2013-08-28 | Touch control panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203480462U true CN203480462U (en) | 2014-03-12 |
Family
ID=50228757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320530064.3U Expired - Fee Related CN203480462U (en) | 2013-08-28 | 2013-08-28 | Touch control panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203480462U (en) |
| TW (1) | TWM472891U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104965612A (en) * | 2014-03-31 | 2015-10-07 | 深圳市比亚迪电子部品件有限公司 | Touch screen module and preparation method therefor |
| CN108460317A (en) * | 2017-02-22 | 2018-08-28 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method |
| CN112817484A (en) * | 2021-02-02 | 2021-05-18 | 业成科技（成都）有限公司 | Touch module and manufacturing method thereof and terminal |
-
2013
- 2013-08-28 CN CN201320530064.3U patent/CN203480462U/en not_active Expired - Fee Related
- 2013-09-09 TW TW102216926U patent/TWM472891U/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104965612A (en) * | 2014-03-31 | 2015-10-07 | 深圳市比亚迪电子部品件有限公司 | Touch screen module and preparation method therefor |
| CN104965612B (en) * | 2014-03-31 | 2018-11-20 | 深圳市比亚迪电子部品件有限公司 | A kind of touch screen mould group and preparation method thereof |
| CN108460317A (en) * | 2017-02-22 | 2018-08-28 | 致伸科技股份有限公司 | Fingerprint identification module and its manufacturing method |
| CN112817484A (en) * | 2021-02-02 | 2021-05-18 | 业成科技（成都）有限公司 | Touch module and manufacturing method thereof and terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM472891U (en) | 2014-02-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 |