CN203465010U - Infrared image and wavefront dual-mode integrated imaging detection chip - Google Patents

Infrared image and wavefront dual-mode integrated imaging detection chip Download PDF

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Publication number
CN203465010U
CN203465010U CN201320571481.2U CN201320571481U CN203465010U CN 203465010 U CN203465010 U CN 203465010U CN 201320571481 U CN201320571481 U CN 201320571481U CN 203465010 U CN203465010 U CN 203465010U
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infrared
battle array
ceramic package
face battle
infrared detector
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CN201320571481.2U
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张新宇
佟庆
康胜武
罗俊
桑红石
谢长生
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Huazhong University of Science and Technology
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Huazhong University of Science and Technology
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Abstract

The utility model discloses an infrared image and wavefront dual-mode integrated imaging detection chip. The infrared image and wavefront dual-mode integrated imaging detection chip comprises a ceramic housing, a metal supporting and cooling plate, a driving control and fluoroscopic image preprocessing module, an area array uncooled infrared detector, and an area array infrared refractive micro lens. The driving control and fluoroscopic image preprocessing module, the area array uncooled infrared detector and the area array infrared refractive micro lens are coaxially and successively in the ceramic housing. The rear portion of the ceramic housing is arranged on the top portion of the metal supporting and cooling plate. The driving control and fluoroscopic image preprocessing module is arranged on the connection portion between the rear portion of the ceramic housing and the metal supporting and cooling plate. The area array uncooled infrared detector is arranged on the top portion of the driving control and fluoroscopic image preprocessing module. The area array infrared refractive micro lens is arranged on the top portion of the area array uncooled infrared detector, and the light incidence surface of the area array infrared refractive micro lens is exposed through holes in the facial portion of the ceramic housing. The area array infrared refractive micro lens comprises M*N unit micro lenses. The infrared image and wavefront dual-mode integrated imaging detection chip of the utility model has the advantage of compact structure, can be easily compatible or coupled with a conventional infrared optical system, and the advantage of good target and environmental adaptability.

Description

The double-mode integrated imaging detection chip of a kind of infrared image and wavefront
Technical field
The utility model belongs to infrared imaging detection technical field, more specifically, relates to the double-mode integrated imaging detection chip of a kind of infrared image and wavefront.
Background technology
Generally speaking, the light wave of nature and the outgoing of artificial light sources institute, has formed the interdependent background electromagnetism good fortune of target and has penetrated environment.The atmospheric flow field aspect such as density, temperature, pressure and component of being everlasting produces unsettled or nonequilibrium variation.The specific physical chemical behavior of gas molecule is as ionisation effect etc., the unstability of its dielectric properties of boosting randomly changing even again, the light refractive index in flow field is presented when complicated and become or space-variant feature, thereby the transmission in atmosphere produces the different interference of degree and even suppresses to target light wave.Show as with the closely-related outgoing beam of feature of interest feature it and can flow and in time-space domain, present complicated disperse, gathering or fluctuation, and the typical situations such as random change of corresponding wavefront form.The non-human act such as mankind's activity and sleet, also often orders about transmission light wave and produces similar variation, and finally by picture element being reduced in the implanted electronic target image of imaging detection.In other words, the evolution before light wave, the hydridization that distorts even etc., also directly reflected that light field can flow form and deviate from its this attribute of intrinsic transmission situation.Therefore, the electronic target image that is subject to energy flow point cloth to drive and retrain, with the change of the appearance structure in transmitting procedure before object wave, exists cause and effect or recursion associated.By analyzing and the closely-related wavefront of image information, even if do not change the performance index of photovoltaic array, also can, in the presence or guiding of wavefront information, imaging detection usefulness be enhanced.At present, one of developing direction of infrared imaging detection technology is exactly based on wavefront, to regulate and control the energy flow point cloth of wave beam, thereby makes imaging detection possess target and adaptive capacity to environment, realizes the bimodulus infrared imaging detection of wavefront and image correlation connection.
Up to now, developed multiple by measuring even modulation wavefront, to object beam, it can flow the extrinsic change that form introduces in delivering path and revises, thereby promotes picture element and imaging detection usefulness and improve anti-interference and technical method adaptive capacity to environment.The approach that mainly realizes comprises: (one) is based on Shack-Hartmann(SH) little/microminiaturized Wavefront detecting of effect; (2) based on wavefront measurement, obtain the key physical index that is closely related with target image as point spread function, and promote for picture element; (3) in wavefront passage, carry out even modulation of wavefront measurement, thereby strengthen the imaging detection ability in energy flow measurement passage; (4) integrate or splicing wavefront with can flow (image) equipment, based on wavefront with can flow such mating of bimodulus measurement and be coupled to improve imaging detection usefulness.
The SH Wavefront detecting framework with little/microminiaturized feature as above, only can carry out the wavefront measurement under single-mode at present.Other has the technological approaches that bimodulus feature had both comprised wavefront and these two physical element of image, and all needing to configure must complete independently wavefront and two kind equipments or the two class frameworks that can flow morphometry.The problems such as equipment configuration is numerous and diverse thereby bring, and volume is large, and cost is high, and the measurement of wavefront and image, coupling, balance and FEEDBACK CONTROL are complicated, and response or modulation speed are low, and target and environmental suitability are poor.Therefore, find simple and direct, efficient and dexterous technical measures, obtain high picture element image in before high-acruracy survey infrared waves, become the Focal point and difficult point problem that the advanced infrared imaging detection technology of development faces, in the urgent need to new breakthrough.
Utility model content
Above defect or Improvement requirement for prior art, the utility model provides a kind of infrared image and the double-mode integrated imaging detection chip of wavefront, its object is to realize integrated the obtaining of wavefront and this two sets of data of image, and have that measuring accuracy is high, target and good environmental adaptability, volume and quality are little, low in energy consumption, the feature that is easily coupled with other optical/optoelectronic/physical construction.
For achieving the above object, according to an aspect of the present utility model, provide a kind of infrared image and wavefront double-mode integrated imaging detection chip, comprise: ceramic package, metallic support and heat sink, drive control and pretreatment module, face battle array non-refrigerated infrared detector, and face battle array infrarefraction lenticule, drive control and pretreatment module, face battle array non-refrigerated infrared detector, and the coaxial order of face battle array infrarefraction lenticule is arranged in ceramic package, ceramic package rear portion is arranged at metallic support and heat sink top, drive control and be arranged at ceramic package rear portion and metallic support and heat sink junction with pretreatment module, face battle array non-refrigerated infrared detector is arranged at and drives control and pretreatment module top, face battle array infrarefraction lenticule is arranged at face battle array non-refrigerated infrared detector top, and out exposed by its light entrance face of ceramic package face perforate, face battle array infrarefraction lenticule comprises M * N unit microlens, wherein M and N are positive integer, face battle array non-refrigerated infrared detector is divided into M * N sub-area array infrared detector, the quantity of this sub-area array infrared detector is identical with lenticular quantity in face battle array infrarefraction lenticule, every sub-area array infrared detector comprises P * Q photosensitive unit, wherein P and Q are positive integer, face battle array infrarefraction lenticule is for receiving the infrared waves from target, and by the discrete specific photosensitive unit that converges to different sub-area array infrared detectors in face battle array non-refrigerated infrared detector of this infrared waves, driving control and Infrared images pre-processing module is used to face battle array non-refrigerated infrared detector that driving and adjustment signal are provided, photosensitive unit is electric signal for infrared light being carried out to opto-electronic conversion under the effect at driving and adjustment signal, and this electric signal is sent to and drives control and Infrared images pre-processing module, drive control and Infrared images pre-processing module also for electric signal is carried out to pre-service, with synthetic image and wave front data, and by this image and wave front data output.
What preferably, drive that control and Infrared images pre-processing module carry out to electric signal pre-service employing that image generates object is asymmetric correction method.
What preferably, drive that control and Infrared images pre-processing module carry out to electric signal pre-service employing that wavefront generates object is sub-plane wave front inclination angle and focal spot position correspondent method.
Preferably, the side of ceramic package is provided with drives control signal output port, for exporting, drive control and Infrared images pre-processing module offers driving and the adjustment signal of face battle array non-refrigerated infrared detector, the side of ceramic package is provided with drives control signal output port, for exporting to drive, control driving and the adjustment signal that offers face battle array non-refrigerated infrared detector with pretreatment module, the side of ceramic package is provided with the first pilot lamp, this lamp is connected for showing that driving control is in normal operating conditions with pretreatment module, the side of ceramic package is provided with detector and drives control signal input port, driving and adjustment signal for input face battle array non-refrigerated infrared detector, the side of ceramic package is provided with the second pilot lamp, this lamp is connected for display surface battle array non-refrigerated infrared detector and is in normal operating conditions, the side of ceramic package is provided with the 3rd pilot lamp, this lamp is connected for display surface battle array infrarefraction lenticule and is in normal operating conditions.
Preferably, the bottom surface of ceramic package is provided with the input of infrared electro response signal and infrared image and wave front data output port, photoelectric response signal for output face battle array non-refrigerated infrared detector, the bottom surface of ceramic package is provided with the 4th pilot lamp, for display surface battle array non-refrigerated infrared detector, be in normal signal output state, the bottom surface of ceramic package is provided with infrared electro response signal output port, for the photoelectric output signal of face battle array non-refrigerated infrared detector is introduced and is driven control and pretreatment module, the bottom surface of ceramic package is provided with the 4th pilot lamp, for showing that driving control is in normal data input state with pretreatment module, the bottom surface of ceramic package is provided with the input of infrared electro response signal and infrared image and wave front data output port, for the photoelectric response signal input of face battle array non-refrigerated infrared detector is driven to control and pretreatment module, and sequential infrared image and wave front data are exported with pretreatment module from driving control.
Preferably, the side of ceramic package is provided with power port, and for accessing power lead to be connected with external power source, the side of ceramic package is provided with the 5th pilot lamp, for display power supply, connects.
In general, the above technical scheme of conceiving by the utility model compared with prior art, can obtain following beneficial effect:
1, the image of target and wavefront single-chip integrative detection, owing to passing through the larger area array infrared detector of coupling surface battle array REFRACTIVE LIQUID crystal micro-lens and array, the signal of focusing, opto-electronic conversion, synthetic image and the wave front data of the sub-plane wave front of realization based on discrete distribution is processed, so the utlity model has infrared light sensitive array integrative detection infrared target image based on monolithic functionalization and the advantage of wavefront;
2, measuring accuracy is high, because the utility model adopts face battle array refractive micro lenses and face battle array non-refrigerated infrared detector, they all have high array scale mixed integrated and have high structural stability, so the utlity model has the advantage that measuring accuracy is high;
3, target adaptability is good, because the utility model carries out quick detection based on single photosensor chip to the emerging wavefront of target and view data, has both been applicable to stable state, gradual or fixed target, is applicable to again the advantage of motion and variation targets.
4, good environmental adaptability, because the utility model has adopted the non-refrigerated infrared detector based on thermal effect, and has the fixedly refractive micro lenses of pattern, measures spectral coverage wide, is operated in room temperature environment, so the utlity model has the advantage of good environmental adaptability.
5, easy to use, because having adopted integrated battle array infrarefraction lenticule, face battle array non-refrigerated infrared detector and driven, the utility model controls the architectural framework such with pretreatment module, so the utlity model has, patch conveniently, easily mate the advantage of coupling with infrared optical system, other electronics and mechanical hook-up.
Accompanying drawing explanation
Fig. 1 is the structural representation of infrared image of the present utility model and the double-mode integrated imaging detection chip of wavefront.
Fig. 2 is the principle schematic of infrared image of the present utility model and the double-mode integrated imaging detection chip of wavefront.
In institute's drawings attached, identical Reference numeral is used for representing identical element or structure, wherein:
1-drives control signal output port, 2-the first pilot lamp, and 3-drives control and pretreatment module, 4-detector drives control signal input port, 5-the second pilot lamp, 6-face battle array non-refrigerated infrared detector, 7-face battle array infrarefraction lenticule, 8-the 3rd pilot lamp, 9-infrared electro response signal output port, 10-the 4th pilot lamp, the response signal input of 11-infrared electro and infrared image and wave front data output port, 12-power port, 13-ceramic package, 14-metallic support and heat sink, 15-the 5th pilot lamp.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.In addition,, in each embodiment of described the utility model, involved technical characterictic just can not combine mutually as long as do not form each other conflict.
As shown in Figure 1, the double-mode integrated imaging detection chip of the utility model infrared image and wavefront comprises: ceramic package 13, metallic support and heat sink 14, drive control and pretreatment module 3, face battle array non-refrigerated infrared detector 6 and face battle array infrarefraction lenticule 7.
Driving control is arranged in ceramic package 13 with the coaxial order of pretreatment module 3, face battle array non-refrigerated infrared detector 6 and face battle array infrarefraction lenticule 7.
Ceramic package 13 rear portions are arranged at metallic support and heat sink 14 tops.
Drive control and be arranged at ceramic package 13 rear portions and metallic support and heat sink 14 junctions with pretreatment module 3.
Face battle array non-refrigerated infrared detector 6 is arranged at and drives control and pretreatment module 3 tops.
Face battle array infrarefraction lenticule 7 is arranged at face battle array non-refrigerated infrared detector 6 tops, and by the facial perforate (not shown) of ceramic package 13, its light entrance face is out exposed.
Face battle array infrarefraction lenticule 7 comprises M * N unit microlens, and wherein M and N are positive integer.
Face battle array non-refrigerated infrared detector 6 is divided into M * N sub-area array infrared detector, and the quantity of this sub-area array infrared detector is identical with lenticular quantity in face battle array infrarefraction lenticule 7.Every sub-area array infrared detector comprises P * Q photosensitive unit, and wherein P and Q are positive integer.
Face battle array infrarefraction lenticule 7 is for receiving the infrared waves from target, and by the discrete specific photosensitive unit that converges to different sub-area array infrared detectors in face battle array non-refrigerated infrared detector 6 of this infrared waves.
Driving control and Infrared images pre-processing module 3 is used to face battle array non-refrigerated infrared detector 6 that driving and adjustment signal are provided.
Photosensitive unit is electric signal for infrared light being carried out to opto-electronic conversion under the effect at driving and adjustment signal, and this electric signal is sent to and drives control and Infrared images pre-processing module 3.
Drive control and Infrared images pre-processing module 3 also for electric signal is carried out to pre-service, with synthetic image and wave front data, and by this image and wave front data output.Particularly, what electric signal was carried out to pre-service that image generates object adopts is asymmetric correction method, and what electric signal was carried out to pre-service that wavefront generates object adopts is sub-plane wave front inclination angle and focal spot position correspondent method.
The side of ceramic package 13 is provided with drives control signal output port 1, for exporting, drives control and Infrared images pre-processing module 3 offers driving and the adjustment signal of face battle array non-refrigerated infrared detector 6.
The side of ceramic package 13 is provided with drives control signal output port 1, for exporting to drive, controls driving and the adjustment signal that offers face battle array non-refrigerated infrared detector 6 with pretreatment module 3.
The side of ceramic package 13 is provided with the first pilot lamp 2, and this lamp is connected for showing that driving control is in normal operating conditions with pretreatment module 3.
The side of ceramic package 13 is provided with detector and drives control signal input port 4, for driving and the adjustment signal of input face battle array non-refrigerated infrared detector 6.
The side of ceramic package 13 is provided with the second pilot lamp 5, and this lamp is connected for display surface battle array non-refrigerated infrared detector 6 and is in normal operating conditions.
The side of ceramic package 13 is provided with the 3rd pilot lamp 8, and this lamp is connected for display surface battle array infrarefraction lenticule 7 and is in normal operating conditions.
The bottom surface of ceramic package 13 is provided with the input of infrared electro response signal and infrared image and wave front data output port 9, for the photoelectric response signal of output face battle array non-refrigerated infrared detector 6.
The bottom surface of ceramic package 13 is provided with the 4th pilot lamp 8, for display surface battle array non-refrigerated infrared detector 6, is in normal signal output state.
The bottom surface of ceramic package 13 is provided with infrared electro response signal output port 9, for by the photoelectric output signal of face battle array non-refrigerated infrared detector 6, introduces and drives control and pretreatment module 3.
The bottom surface of ceramic package 13 is provided with the 4th pilot lamp 10, for showing that driving control is in normal data input state with pretreatment module 3.
The bottom surface of ceramic package 13 is provided with the input of infrared electro response signal and infrared image and wave front data output port 11, be used for the photoelectric response signal of face battle array non-refrigerated infrared detector 6, control and pretreatment module 3 are driven in input, and sequential infrared image and wave front data are controlled and pretreatment module 3 outputs from driving;
The side of ceramic package 13 is provided with power port 12, for accessing power lead to be connected with external power source.
The side of ceramic package 13 is provided with the 5th pilot lamp 15, for display power supply, connects.
Below with reference to Fig. 2, principle of work of the present utility model is described:
As shown in the figure, it is integrated that face battle array non refrigerating infrared imaging detector and array scale are mixed compared with the lowered infrarefraction microlens array of infrared device, forms infrared image and the double-mode integrated imaging detection framework of wavefront in chip.The array mode of lenticule and infrared eye is: under the array scale setting or spatial resolution pattern; every unit refractive micro lenses respectively with multiunit detector, as 2 * 2 yuan, 4 * 4 yuan, 8 * 8 yuan, even the larger sub-detector array of array is corresponding.For unit refractive micro lenses, infrared incident wavefront is formed after by microlens array discretize, the sub-plane wave front that inclination angle is different, by unit microlens directional focusing that it covered in the specific photosensitive unit of the sub-planar array detector corresponding with this yuan of lenticule.Focal beam spot converts photoelectric response signal to by the infrared photosensitive unit that is placed in this place.Arrayed optical by polynary refractive micro lenses converges effect, forms correspondingly with target outgoing light wave, and the focal spot distributional pattern that energy state is different, is shown in shown in lower right subgraph.
The photoelectric response signal of the infrared photosensitive unit in sub-planar array detector, first forms electronic target view data output through driving after control and pretreatment module are processed; In addition, geometric center based on sub-area array infrared detector (reference mark), take the sub-plane wave front of normal incidence to converge its photoelectric response signal of focal spot be benchmark, by resolving the degrees of offset of the photoelectric response signal of sub-its focal beam spot of plane wave front of inclination that departs from reference data, obtain the front inclination angle of the sub-plane wave front of normal incidence relatively of sub-plane inclined wave.Through angular dimensions balance and registration, be finally inversed by incident wavefront data output again.Under above-mentioned optical/optoelectronic Detecting System, because every unit infrarefraction lenticule will project its surperficial incident wave beam, converge in the specific photosensitive unit with the sub-planar array detector of its coupling, the imaging resolution of target is determined by the lenticular array scale of adopted infrarefraction.Measuring accuracy and the variable degree of infrared its wavefront of wave beam of target institute outgoing, the scale of sub-planar array detector and the physical dimension of infrared photosensitive unit that by every unit infrarefraction lenticule, are coupled determine.Generally speaking, the array scale of sub-area array infrared detector is larger, and the physical dimension of infrared photosensitive unit is less, and the measuring accuracy of wavefront is higher, and the mobility scale of measurable wavefront is larger.In other words, from chip output mouth, will export two sets of data, the first is through the formed electronic target view data of conventional infrared electro response signal treatment scheme (by focal spot Distribution evolution), and it two is the wave front datas that resolve the infrared electro response signal institute inverting formation under certain architectures.
For target a little less than energy, can be placed in both focal plane places of primary mirror of primary optical system by mixing integrated infrared imaging detection chip, see shown in upper right subgraph.For strong good fortune, penetrate target, can directly use the wavefront and the image that mix integrated infrared dual mode imaging detection chip target acquisition, see shown in bottom left subgraph.
Below briefly introduce operating process of the present utility model:
During operation, first with parallel signal line, connect drive control signal output port 1, detector drives control signal input port 4; With parallel data line, connect infrared electro response signal output port 9, and the input of infrared electro response signal and infrared image and wave front data output port 11; Power lead is connected on power port 12.Then by parallel communication line (access interface 1 simultaneously), send into electric power starting instruction, chip starts self check, now the first pilot lamp 2, the second pilot lamp 5, the 3rd pilot lamp 8, the 4th pilot lamp 10, the 5th pilot lamp 12 hook switch flash.Self check is by rear the 3rd pilot lamp 8, and the 4th pilot lamp 10 extinguishes, and chip enters duty.By parallel communication line, send into after work order, chip starts to carry out photoelectric response signal measurement.Photoelectric response signal is by infrared electro response signal output port 9 and the input of infrared electro response signal and infrared image and wave front data output port 11, send into and drive control and pretreatment module 3, now the 4th pilot lamp 8 and the 5th pilot lamp 10 hook switch flash again.Through driving infrared image and the wave front data after control and pretreatment module 3 are processed, by the input of infrared electro response signal and infrared image and 11 outputs of wave front data output port.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.

Claims (6)

1. the double-mode integrated imaging detection chip of infrared image and wavefront, comprising: ceramic package, metallic support and heat sink, drives control and pretreatment module, face battle array non-refrigerated infrared detector and face battle array infrarefraction lenticule, it is characterized in that,
Driving control is arranged in ceramic package with the coaxial order of pretreatment module, face battle array non-refrigerated infrared detector and face battle array infrarefraction lenticule;
Ceramic package rear portion is arranged at metallic support and heat sink top;
Drive control and be arranged at ceramic package rear portion and metallic support and heat sink junction with pretreatment module;
Face battle array non-refrigerated infrared detector is arranged at and drives control and pretreatment module top;
Face battle array infrarefraction lenticule is arranged at face battle array non-refrigerated infrared detector top, and out exposed by its light entrance face of ceramic package face perforate;
Face battle array infrarefraction lenticule comprises M * N unit microlens, and wherein M and N are positive integer;
Face battle array non-refrigerated infrared detector is divided into M * N sub-area array infrared detector, and the quantity of this sub-area array infrared detector is identical with lenticular quantity in face battle array infrarefraction lenticule;
Every sub-area array infrared detector comprises P * Q photosensitive unit, and wherein P and Q are positive integer;
Face battle array infrarefraction lenticule is for receiving the infrared waves from target, and by the discrete specific photosensitive unit that converges to different sub-area array infrared detectors in face battle array non-refrigerated infrared detector of this infrared waves;
Driving control and Infrared images pre-processing module is used to face battle array non-refrigerated infrared detector that driving and adjustment signal are provided;
Photosensitive unit is electric signal for infrared light being carried out to opto-electronic conversion under the effect at driving and adjustment signal, and this electric signal is sent to and drives control and Infrared images pre-processing module;
Drive control and Infrared images pre-processing module also for electric signal is carried out to pre-service, with synthetic image and wave front data, and by this image and wave front data output.
2. the double-mode integrated imaging detection chip of infrared image according to claim 1 and wavefront, is characterized in that, what drive that control and Infrared images pre-processing module carry out to electric signal pre-service employing that image generates object is asymmetric correction method.
3. the double-mode integrated imaging detection chip of infrared image according to claim 1 and wavefront, it is characterized in that, what drive that control and Infrared images pre-processing module carry out to electric signal pre-service employing that wavefront generates object is sub-plane wave front inclination angle and focal spot position correspondent method.
4. the double-mode integrated imaging detection chip of infrared image according to claim 1 and wavefront, is characterized in that,
The side of ceramic package is provided with drives control signal output port, for exporting, drives control and Infrared images pre-processing module offers driving and the adjustment signal of face battle array non-refrigerated infrared detector;
The side of ceramic package is provided with drives control signal output port, for exporting to drive, controls driving and the adjustment signal that offers face battle array non-refrigerated infrared detector with pretreatment module;
The side of ceramic package is provided with the first pilot lamp, and this lamp is connected for showing that driving control is in normal operating conditions with pretreatment module;
The side of ceramic package is provided with detector and drives control signal input port, for driving and the adjustment signal of input face battle array non-refrigerated infrared detector;
The side of ceramic package is provided with the second pilot lamp, and this lamp is connected for display surface battle array non-refrigerated infrared detector and is in normal operating conditions;
The side of ceramic package is provided with the 3rd pilot lamp, and this lamp is connected for display surface battle array infrarefraction lenticule and is in normal operating conditions.
5. the double-mode integrated imaging detection chip of infrared image according to claim 1 and wavefront, is characterized in that,
The bottom surface of ceramic package is provided with the input of infrared electro response signal and infrared image and wave front data output port, for the photoelectric response signal of output face battle array non-refrigerated infrared detector;
The bottom surface of ceramic package is provided with the 4th pilot lamp, for display surface battle array non-refrigerated infrared detector, is in normal signal output state;
The bottom surface of ceramic package is provided with infrared electro response signal output port, for the photoelectric output signal of face battle array non-refrigerated infrared detector is introduced and driven control and pretreatment module;
The bottom surface of ceramic package is provided with the 4th pilot lamp, for showing that driving control is in normal data input state with pretreatment module;
The bottom surface of ceramic package is provided with the input of infrared electro response signal and infrared image and wave front data output port, for the photoelectric response signal input of face battle array non-refrigerated infrared detector is driven to control and pretreatment module, and sequential infrared image and wave front data are controlled and pretreatment module output from driving.
6. the double-mode integrated imaging detection chip of infrared image according to claim 1 and wavefront, is characterized in that,
The side of ceramic package is provided with power port, for accessing power lead to be connected with external power source;
The side of ceramic package is provided with the 5th pilot lamp, for display power supply, connects.
CN201320571481.2U 2013-09-13 2013-09-13 Infrared image and wavefront dual-mode integrated imaging detection chip Expired - Lifetime CN203465010U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512668A (en) * 2013-09-13 2014-01-15 华中科技大学 Infrared image and wave front dual mode integrated imaging detection chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512668A (en) * 2013-09-13 2014-01-15 华中科技大学 Infrared image and wave front dual mode integrated imaging detection chip
CN103512668B (en) * 2013-09-13 2016-01-13 华中科技大学 A kind of infrared image and the double-mode integrated imaging detection chip of wavefront

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