CN203457341U - Electromagnetic heating device and heat radiation assembly thereof - Google Patents
Electromagnetic heating device and heat radiation assembly thereof Download PDFInfo
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- CN203457341U CN203457341U CN201320540052.9U CN201320540052U CN203457341U CN 203457341 U CN203457341 U CN 203457341U CN 201320540052 U CN201320540052 U CN 201320540052U CN 203457341 U CN203457341 U CN 203457341U
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- electromagnetic heating
- rectifier bridge
- heat pipe
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Abstract
The utility model discloses an electromagnetic heating device and a heat radiation assembly thereof. The heat radiation assembly comprises an insulated gate bipolar transistor (IGBT), a rectifier bridge, and a thermotube, wherein the IGBT is connected with the rectifier bridge; and the hot end of the thermotube is in contact with the IGBT and the rectifier bridge respectively. The heat radiation assembly for the electromagnetic heating device uses the thermotube to perform heat radiation on the IGBT and the rectifier bridge and the heat is transmitted from the hot end of the cold end by using continuous phase changes of the working medium inside the thermotude, and thus the heat of the IGBT and the rectifier bridge is conducted out via the thermotube, thereby fulfilling the purpose of cooling.
Description
Technical field
The utility model relates to household electrical appliance technical field, particularly, and particularly a kind of radiating subassembly for electromagnetic heating device and electromagnetic heating device.
Background technology
Insulated gate bipolar transistor (IGBT) and rectifier bridge are the core components of electromagnetic heating device, rectifier bridge be by behind commercial power rectification for IGBT, IGBT is by turning on and off fast the pan self-heating making, and produces the object that heat reaches culinary art.Electric current by rectifier bridge in utensil heating process is larger, is about several peaces to tens peaces not etc., and this causes the caloric value of rectifier bridge self very large; The frequency that IGBT opens shutoff is in the course of the work about 20KHz-30KHz, and in the process turning on and off, IGBT also can produce larger heat.In order not cause radiator accumulation of heat around, prior art is sidelong and is put fan at one of radiator, and artificial introducing Air Flow is taken away heat sink radiates heat out, thereby reduces the temperature of IGBT and rectifier bridge, guarantees its normal operation.But this mode of dispelling the heat by fan has following shortcoming: in fan work process, can produce larger noise, affect consumer's living environment; This mode is inner by extraneous Cryogenic air inhalation apparatus, by the Cryogenic air spreader surface of flowing through, absorbs the heat that IGBT and rectifier bridge produce, and discharges utensil after becoming hot-air again.In the process of air amount, can bring the extraneous impurity such as dust and steam into utensil inside, cause impurity to be accumulated on circuit board, cause the decline of product reliability; This mode need to be opened the air inlet differing in size on the supporting seat of product, makes the insect of small volume easily pierce interiors of products, causes product irregular working, and causes consumer's dislike; This side has reduced product casing intensity, under external impacts, may cause the damage of shell; The useful life of the fan of this mode is limited, and after it damages, electromagnetic heating device cannot be used, and after must changing, electromagnetic heating device could continue to use.
Utility model content
The utility model is intended to solve at least to a certain extent one of above-mentioned technical problem of the prior art.For this reason, an object of the present utility model is to propose a kind ofly have simple in structurely, and noiselessness produces, the good radiating subassembly of radiating effect.An object more of the present utility model is to propose a kind of electromagnetic heating device with above-mentioned radiating subassembly.
According to an aspect of the present utility model, a kind of radiating subassembly for electromagnetic heating device is proposed, comprising: insulated gate bipolar transistor and rectifier bridge, described insulated gate bipolar transistor is connected with described rectifier bridge; And heat pipe, the hot junction of described heat pipe contacts respectively with described rectifier bridge with described insulated gate bipolar transistor.
According to the radiating subassembly for electromagnetic heating device of embodiment of the present utility model, adopt heat pipe to dispel the heat to insulated gate bipolar transistor and rectifier bridge, utilize the continuous phase transformation of inside heat pipe working medium, heat is passed to cold junction from hot junction, thus, the heat of insulated gate bipolar transistor and rectifier bridge can be derived by heat pipe, reach the object of cooling.And, in the process of whole heat transmission, can not produce any noise, do not need air to carry out heat loss through convection yet, the housing that assembles the electromagnetic heating device of this radiating subassembly can be configured to airtight structure, do not need to arrange air inlet, can avoid dust, steam and insect etc. to enter electromagnetic heating device inside, improve the reliability of producing magnetic heating appliances.Meanwhile, due to the restriction of heat pipe without useful life, radiating subassembly is difficult for breaking down, and like this, the life-span of electromagnetic heating device will not be subject to the restriction of radiating subassembly.And this radiating mode is not wanted power drives, can reduce to a certain extent the power consumption of product.
In addition, according to the electromagnetic heating device of the utility model above-described embodiment, can also there is following additional technical characterictic:
According to an embodiment of the present utility model, the hot junction of described heat pipe is directly connected with described rectifier bridge with described insulated gate bipolar transistor respectively.
According to an embodiment of the present utility model, electromagnetic heating device further comprises fin, and described fin is connected respectively with rectifier bridge with described insulated gate bipolar transistor, and described fin is connected with the hot junction of described heat pipe.
According to an embodiment of the present utility model, between the hot junction of described heat pipe and the cold junction of described heat pipe, be provided with insulation division.
According to an embodiment of the present utility model, described insulated gate bipolar transistor and described rectifier bridge interval are arranged, and described rectifier bridge is between described heat pipe and described insulated gate bipolar transistor.
According on the other hand of the present utility model, a kind of electromagnetic heating device is provided, comprise housing, housing, is formed with closed chamber in described housing; And above-mentioned radiating subassembly, described radiating subassembly is located in described closed chamber, and the cold junction of the described heat pipe of described radiating subassembly contacts with described housing.
According to the electromagnetic heating device of embodiment of the present utility model, its radiating subassembly adopts heat pipe to dispel the heat to insulated gate bipolar transistor and rectifier bridge, utilize the continuous phase transformation of inside heat pipe working medium, heat is passed to cold junction from hot junction, thus, the heat of insulated gate bipolar transistor and rectifier bridge can be derived by heat pipe, reach the object of cooling, and, in the process of whole heat transmission, can not produce any noise, do not need air to carry out heat loss through convection yet, the housing that assembles the electromagnetic heating device of this radiating subassembly can be configured to airtight structure, do not need to arrange air inlet, can avoid dust, steam and insect etc. enter electromagnetic heating device inside, improve the reliability of electromagnetic heating device.Meanwhile, due to the restriction of heat pipe without useful life, radiating subassembly is difficult for breaking down, and like this, the life-span of electromagnetic heating device will not be subject to the restriction of radiating subassembly.And this radiating mode is not wanted power drives, can reduce to a certain extent the power consumption of product.
According to an embodiment of the present utility model, described housing is metal shell.
According to an embodiment of the present utility model, described electromagnetic heating device is electromagnetic oven.
Accompanying drawing explanation
Fig. 1 is according to the structural representation of the electromagnetic heating device of an embodiment of the present utility model;
Fig. 2 is according to the structural representation of the electromagnetic heating device of another embodiment of the present utility model.
Reference numeral:
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of indications such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the present utility model, the implication of " a plurality of " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or be integral; Can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term in the utility model.
In the utility model, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but contact by the other feature between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic under Second Characteristic and tiltedly, or only represent that First Characteristic level height is less than Second Characteristic.
As shown in Figure 1 and Figure 2, the radiating subassembly for electromagnetic heating device according to embodiment of the present utility model, comprising: insulated gate bipolar transistor 20, rectifier bridge 30 and heat pipe 40.
Particularly, insulated gate bipolar transistor (IGBT) 20 can be connected with rectifier bridge 30, rectifier bridge 30 can by behind commercial power rectification for insulated gate bipolar transistor 20.The hot junction 41 of heat pipe 40 contacts respectively with rectifier bridge 30 with insulated gate bipolar transistor 20, to the heat of edge grid bipolar transistor 20 and rectifier bridge 30 is delivered to the cold junction 42 of heat pipe 40 by the hot junction 41 of heat pipe 40, edge grid bipolar transistor 20 and rectifier bridge 30 heats are derived from the cold junction 42 of heat pipe 40.
According to the radiating subassembly for electromagnetic heating device of embodiment of the present utility model, adopt 40 pairs of insulated gate bipolar transistors 20 of heat pipe and rectifier bridge 30 to dispel the heat, utilize the continuous phase transformation of heat pipe 40 internal working medium, heat 41 is passed to cold junction 42 from hot junction, thus, the heat of insulated gate bipolar transistor 20 and rectifier bridge 30 can be derived by heat pipe 40, reach the object of cooling, and, in the process of whole heat transmission, can not produce any noise, do not need air to carry out heat loss through convection yet, the housing 10 that assembles the electromagnetic heating device of this radiating subassembly can be configured to airtight structure, do not need to arrange air inlet, can avoid dust, steam and insect etc. enter electromagnetic heating device inside, improve the reliability of electromagnetic heating device.Meanwhile, due to the restriction of heat pipe 40 without useful life, radiating subassembly is difficult for breaking down, and like this, the life-span of electromagnetic heating device will not be subject to the restriction of radiating subassembly.And this radiating mode is not wanted power drives, can reduce to a certain extent the power consumption of product.
As shown in Figure 1, according to an embodiment of the present utility model, the hot junction 41 of heat pipe 40 can directly be connected with rectifier bridge 30 with insulated gate bipolar transistor 20 respectively.Thus, at radiating subassembly, be located at the housing 10 of electromagnetic heating device when interior, can directly insulated gate bipolar transistor 20 be directly passed to the housing 10 being connected with the cold junction 42 of heat pipe 40 by heat pipe with rectifier bridge 30, to dispel the heat by housing 10.Be understandable that, in order to improve radiating effect, according to an embodiment of the present utility model, housing 10 can be metal shell.Thus, the radiating efficiency of housing 10 can be improved, that is, insulated gate bipolar transistor 20 and rectifier bridge 30 radiating effects can be improved accordingly.It should be noted that, according to one embodiment of present invention, electromagnetic heating device can be electromagnetic oven.
As shown in Figure 2, according to an embodiment of the present utility model, electromagnetic heating device may further include fin 50, and fin 50 can be connected respectively with rectifier bridge 30 with insulated gate bipolar transistor 20, and fin 50 is connected with the hot junction 41 of heat pipe 40.Thus, by being set, radiator 50 can increase the contact area in insulated gate bipolar transistor 20 and rectifier bridge 30 minutes and the hot junction of heat pipe 40, improve radiating efficiency, so that insulated gate bipolar transistor 20 and the rectifier bridge heat of 30 minutes can pass to heat pipe 40 by fin 50 rapidly, and pass to housing 10 by heat pipe 40, so that insulated gate bipolar transistor 20 and the rectifier bridge heat of 30 minutes can be derived as soon as possible.
As shown in Figure 1, according to an embodiment of the present utility model, between the hot junction 41 of heat pipe 40 and the cold junction 42 of heat pipe 40, be provided with insulation division 60.Thus, can improve the operating efficiency of heat pipe.According to an embodiment of the present utility model, insulated gate bipolar transistor 20 and rectifier bridge 30 can be arranged at interval, and rectifier bridge 30 is between the cold junction 41 and insulated gate bipolar transistor 20 of heat pipe 40.
As shown in Figure 1 and Figure 2, the electromagnetic heating device according to embodiment of the present utility model, comprising: housing 10 and according to the radiating subassembly of above-described embodiment of the present utility model.
Particularly, housing 10 is interior can be formed with closed chamber 101.Radiating subassembly can be located in closed chamber 101, and the cold junction 42 of the heat pipe 40 of radiating subassembly contacts with housing 10, by heat pipe 40, the heat of insulated gate bipolar transistor 20 and rectifier bridge 30 is passed to housing 10, and dispels the heat by housing 10.
According to the electromagnetic heating device of embodiment of the present utility model, its radiating subassembly adopts 40 pairs of insulated gate bipolar transistors 20 of heat pipe and rectifier bridge 30 to dispel the heat, utilize the continuous phase transformation of heat pipe 40 internal working medium, heat 41 is passed to cold junction 42 from hot junction, thus, the heat of insulated gate bipolar transistor 20 and rectifier bridge 30 can be derived by heat pipe 40, reach the object of cooling, and, in the process of whole heat transmission, can not produce any noise, do not need air to carry out heat loss through convection yet, the housing 10 that assembles the electromagnetic heating device of this radiating subassembly can be configured to airtight structure, do not need to arrange air inlet, can avoid dust, steam and insect etc. enter electromagnetic heating device inside, improve the reliability of electromagnetic heating device.Meanwhile, due to the restriction of heat pipe 40 without useful life, radiating subassembly is difficult for breaking down, and like this, the life-span of electromagnetic heating device will not be subject to the restriction of radiating subassembly.And this radiating mode is not wanted power drives, can reduce to a certain extent the power consumption of product.
Describe with reference to the accompanying drawings according to the course of work of the electromagnetic heating device of embodiment of the present utility model below.
As shown in Figure 1, be that the radiator of heat pipe 40 and insulated gate bipolar transistor 20, rectifier bridge 30 self is contacted, the heat of its generation is passed to the cold junction 42 of heat pipe 40.The cold junction 42 of heat pipe 40 and housing 10 good contacts of electromagnetic heating device, the housing 10 by electromagnetic heating device around in space, directly plays the object of insulated gate bipolar transistor 20, rectifier bridge 30 heat radiations by the dissipation of heat passing over.
The course of work is as follows: the heat that when electromagnetic heating device starts to heat, insulated gate bipolar transistor 20, rectifier bridge 30 produce is first passed to the hot junction 41 of heat pipe 40, make the refrigerant of 41 inside, hot junction of heat pipe 40 become gaseous state from liquid state, by this process, the heat of sending out insulated gate bipolar transistor 20 and rectifier bridge 30 generations is passed to the refrigerant of heat pipe 40, has reduced the temperature of insulated gate bipolar transistor 20 and rectifier bridge 30.
The cold junction 42 that the refrigerant of heat pipe 40 inside becomes the backward heat pipe 40 of gaseous state moves, due to the housing 10 of electromagnetic heating device in normal temperature and with cold junction 42 close contacts, the refrigerant of gaseous state becomes again liquid state after arriving cold junction 42, while releases heat, these heats are very fast conducts to housing 10, and is distributed in ambient air by housing 10.
At cold junction 42, become liquid refrigerant and by the capillary of heat pipe 40 tube walls, be back to again the hot junction 41 of heat pipe 40, complete once circulation.
Thus, the heat that the insulated gate bipolar transistor 20 of housing 10 inside of electromagnetic heating device and rectifier bridge 30 produce is just distributed in surrounding environment by heat pipe 40, housing 10, the temperature that has reduced insulated gate bipolar transistor 20 and rectifier bridge 30, has guaranteed product normal operation.
As shown in Figure 2, be installation of heat radiator 50 on insulated gate bipolar transistor 20 and rectifier bridge 30 first, and then heat pipe 40 be arranged on to radiator 50 surfaces or embed radiator inner, the heat on radiator 50 is passed to the cold junction 42 of heat pipe 40.The cold junction 42 of heat pipe 40 and the shell good contact of product, the housing 10 by electromagnetic heating device, by the dissipation of heat passing over space around, indirectly plays the object to insulated gate bipolar transistor 20 and rectifier bridge 30 heat radiations.
The course of work is as follows: the heat that when product starts to heat, insulated gate bipolar transistor 20 and rectifier bridge 30 produce is first passed on radiator 50, on radiator 50, be distributed with a fairly large number of fin, very soon the heat of insulated gate bipolar transistor 20 and rectifier bridge 30 generations is accumulated, the while very fast hot junction that is passed to heat pipe 40 41 of these heats of accumulating, make the refrigerant of 41 inside, hot junction of heat pipe 40 become gaseous state from liquid state, heat heater members being produced by this process is passed to the refrigerant of heat pipe 40, reduced the temperature of insulated gate bipolar transistor 20 and rectifier bridge 30.
The cold junction 42 that the refrigerant of heat pipe 40 inside becomes the backward heat pipe 40 of gaseous state moves, due to the housing 10 of electromagnetic heating device in normal temperature and with cold junction 42 close contacts, the refrigerant of gaseous state becomes again liquid state after arriving cold junction 42, while releases heat, these heats are very fast conducts to housing 10, and is distributed in ambient air by housing 10.
At cold junction 42, become liquid refrigerant and by the capillary of heat pipe 40 tube walls, be back to again the hot junction 41 of heat pipe 40, complete once circulation.
The passage that the insulated gate bipolar transistor 20 of electromagnetic heating device inside and the heat of rectifier bridge 30 just consist of radiator 50, heat pipe 40, housing 10 is like this distributed to the outside of electromagnetic heating device, the temperature that has reduced insulated gate bipolar transistor 20 and rectifier bridge 30, has guaranteed electromagnetic heating device normal operation.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, to the schematic statement of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can be with suitable mode combinations in any one or more embodiment or example.In addition, those skilled in the art can engage the different embodiment that describe in this specification or example and combine.
Although illustrated and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment in scope of the present utility model, modification, replacement and modification.
Claims (8)
1. for a radiating subassembly for electromagnetic heating device, it is characterized in that, comprising:
Insulated gate bipolar transistor and rectifier bridge, described insulated gate bipolar transistor is connected with described rectifier bridge; And
Heat pipe, the hot junction of described heat pipe contacts respectively with described rectifier bridge with described insulated gate bipolar transistor.
2. the radiating subassembly for electromagnetic heating device according to claim 1, is characterized in that, the hot junction of described heat pipe is directly connected with described rectifier bridge with described insulated gate bipolar transistor respectively.
3. the radiating subassembly for electromagnetic heating device according to claim 1, it is characterized in that, further comprise fin, described fin is connected respectively with rectifier bridge with described insulated gate bipolar transistor, and described fin is connected with the hot junction of described heat pipe.
4. the radiating subassembly for electromagnetic heating device according to claim 1, is characterized in that, between the hot junction of described heat pipe and the cold junction of described heat pipe, is provided with insulation division.
5. the radiating subassembly for electromagnetic heating device according to claim 1, it is characterized in that, described insulated gate bipolar transistor and described rectifier bridge interval are arranged, and described rectifier bridge is between the cold junction and described insulated gate bipolar transistor of described heat pipe.
6. an electromagnetic heating device, is characterized in that, comprising:
Housing, is formed with closed chamber in described housing; And
According to the radiating subassembly described in any one in claim 1-5, described radiating subassembly is located in described closed chamber, and the cold junction of the described heat pipe of described radiating subassembly contacts with described housing.
7. electromagnetic heating device according to claim 6, is characterized in that, described housing is metal shell.
8. electromagnetic heating device according to claim 6, is characterized in that, described electromagnetic heating device is electromagnetic oven, electric cooker or electric pressure cooker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320540052.9U CN203457341U (en) | 2013-08-30 | 2013-08-30 | Electromagnetic heating device and heat radiation assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320540052.9U CN203457341U (en) | 2013-08-30 | 2013-08-30 | Electromagnetic heating device and heat radiation assembly thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203457341U true CN203457341U (en) | 2014-02-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320540052.9U Expired - Fee Related CN203457341U (en) | 2013-08-30 | 2013-08-30 | Electromagnetic heating device and heat radiation assembly thereof |
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| Country | Link |
|---|---|
| CN (1) | CN203457341U (en) |
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2013
- 2013-08-30 CN CN201320540052.9U patent/CN203457341U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20200830 |