CN203456436U - Wearing type semiconductor packaging structure - Google Patents
Wearing type semiconductor packaging structure Download PDFInfo
- Publication number
- CN203456436U CN203456436U CN201320515193.5U CN201320515193U CN203456436U CN 203456436 U CN203456436 U CN 203456436U CN 201320515193 U CN201320515193 U CN 201320515193U CN 203456436 U CN203456436 U CN 203456436U
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- CN
- China
- Prior art keywords
- epoxy resin
- wearing type
- semiconductor device
- resin layer
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a wearing type semiconductor packaging structure which comprises the following components: a packaged semiconductor device, an elastomer rubber layer and an epoxy resin layer. The elastomer rubber covers the packaged semiconductor device. The epoxy resin layer covers the elastomer rubber layer. The wearing type semiconductor packaging structure is advantageous in that: the elastomer rubber layer is arranged between the packaged semiconductor device and the epoxy resin layer; a good vibrating function can be performed; and the requirement for wearing type mobile equipment is satisfied.
Description
Technical field
The utility model relates to semiconductor packaging field, relates to or rather a kind of Wearable semiconductor package.
Background technology
Along with the rise of Wearable mobile device, people need the application of re-examine traditional handicraft aspect Wearable mobile device.Aspect semiconductor packaging, existing technology adopts the epoxy resin of hard to encapsulate conventionally, and this easily causes packed semiconductor to receive mechanical damage for the application of the Wearable mobile device of the frequent withstand shock of needs.
As can be seen here, above-mentioned existing semiconductor package is urgently improved.
Summary of the invention
Technical problem underlying to be solved in the utility model is, overcomes the defect that existing semiconductor package exists, and a kind of Wearable semiconductor package is provided.
The utility model solves its technical problem underlying and realizes by the following technical solutions.A kind of Wearable semiconductor package according to the utility model proposes, comprises packed semiconductor device, elastomer plastic layer and epoxy resin layer, and elastomer plastic layer covers packed semiconductor device, and epoxy resin layer covers elastomer plastic layer.
The beneficial effects of the utility model are, adopt elastomer plastic layer between packed semiconductor device and epoxy resin layer, can play good cushioning effect, meet the demand of Wearable mobile device.
Accompanying drawing explanation
Fig. 1 is cross section structure schematic diagram of the present utility model.
Description of reference numerals: 1, packed semiconductor device; 2, elastomer plastic layer; 3, epoxy resin layer.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, its embodiment, structure, feature and effect thereof to according to the utility model proposes, be described in detail as follows.
Refer to shown in Fig. 1, a kind of Wearable semiconductor package of the present utility model, comprise packed semiconductor device 1, elastomer plastic layer 2 and epoxy resin layer 3, elastomer plastic layer 2 covers packed semiconductor device 1, and epoxy resin layer 3 covers elastomer plastic layer 2.
The above, it is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of technical solutions of the utility model.
Claims (1)
1. a Wearable semiconductor package, it is characterized in that: described Wearable semiconductor package comprises packed semiconductor device, elastomer plastic layer and epoxy resin layer, described elastomer plastic layer covers packed semiconductor device, and described epoxy resin layer covers elastomer plastic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320515193.5U CN203456436U (en) | 2013-08-22 | 2013-08-22 | Wearing type semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320515193.5U CN203456436U (en) | 2013-08-22 | 2013-08-22 | Wearing type semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203456436U true CN203456436U (en) | 2014-02-26 |
Family
ID=50136294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320515193.5U Expired - Fee Related CN203456436U (en) | 2013-08-22 | 2013-08-22 | Wearing type semiconductor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203456436U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766836A (en) * | 2015-04-15 | 2015-07-08 | 江苏晟芯微电子有限公司 | Elastically shock-resistant semiconductor package structure |
-
2013
- 2013-08-22 CN CN201320515193.5U patent/CN203456436U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104766836A (en) * | 2015-04-15 | 2015-07-08 | 江苏晟芯微电子有限公司 | Elastically shock-resistant semiconductor package structure |
| CN104766836B (en) * | 2015-04-15 | 2017-10-27 | 苏州聚达晟芯微电子有限公司 | A kind of semiconductor package of elastic anti-seismic |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. Assignor: JIANGXI CHUANGCHENG SEMICONDUCTOR CO., LTD. Contract record no.: 2015360000016 Denomination of utility model: Wearing type semiconductor packaging structure Granted publication date: 20140226 License type: Exclusive License Record date: 20150225 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160513 Address after: 343000 Jinggangshan export processing zone, Jiangxi, No. Torch Road, No. 192 Patentee after: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. Address before: 343000 Jinggangshan export processing zone, Ji'an, Jiangxi (Jiangxi, Ji'an) Patentee before: JIANGXI CHUANGCHENG SEMICONDUCTOR CO., LTD. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20180912 Address after: 343000 No. 192 Torch Road, Jinggangshan economic and Technological Development Zone, Ji'an, Jiangxi Patentee after: Jiangxi creation Microelectronics Co., Ltd. Address before: 343000 No. 192 Torch Road, Jinggangshan export processing zone, Ji'an, Jiangxi Patentee before: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20190822 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |