CN203401566U - Capacitor ceramic-powder die assembly - Google Patents
Capacitor ceramic-powder die assembly Download PDFInfo
- Publication number
- CN203401566U CN203401566U CN201320493839.4U CN201320493839U CN203401566U CN 203401566 U CN203401566 U CN 203401566U CN 201320493839 U CN201320493839 U CN 201320493839U CN 203401566 U CN203401566 U CN 203401566U
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- CN
- China
- Prior art keywords
- powder die
- blocks
- guiding
- guide
- feeding module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a capacitor ceramic-powder die assembly which is provided with a base. Two parallel guiding blocks are arranged on the base, a feeding module is arranged between the guiding blocks, a driving arm is arranged at the tail end of the feeding module, a material guiding bin is arranged above the feeding module and fixedly arranged above the guiding blocks, and a material storage hopper is arranged at the top of the material guiding bin. Stopping blocks are fixedly arranged on the guiding blocks through bolts. The head portions of the guiding blocks are provided with positioning blocks. The capacitor ceramic-powder die assembly can achieve pressing and feeding of ceramic capacitor materials, the production efficiency is improved, and the production cost is reduced.
Description
Technical field
The utility model relates to capacitor area, relates in particular to a kind of capacitance ceramic powder die arrangement.
Background technology
The capacitor electronic devices and components that are all absolutely necessary in a lot of electronic products, it serves as smothing filtering, power supply and decoupling, the bypass of AC signal, the AC coupled of AC-DC Circuit etc. of rectifier in electronic equipment.
Electric capacity generally consists of electrode and medium block, and existing capacitor dielectric piece is used the most extensive with ceramic dielectric block.In order to make ceramic block up to specification, be all generally to make by mould.But, after general mold die completes, be all that production efficiency is lower by artificial feeding.
Summary of the invention
Technical problem to be solved in the utility model is that a kind of capacitance ceramic powder die arrangement that can realize the feeding of automation binder is provided.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions: a kind of capacitance ceramic powder die arrangement, there is base, on described base, be provided with two guide pads that are parallel to each other, between guide pad, be provided with feeding module, the end of described feeding module is provided with actuating arm, and top is provided with guide cabin, this guide cabin is fixedly installed on guide pad top, and its top is provided with storage bin hopper.
Preferably, described actuating arm top is provided with block, and this block is bolted settings on guide pad.
Preferably, the head of described guide pad is provided with locating piece.
Compared with prior art, usefulness of the present utility model is: this capacitance ceramic powder die arrangement structure can realize compacting and the feeding of ceramic capacitance material, enhances productivity, and has reduced production cost.
accompanying drawing explanation:
Below in conjunction with accompanying drawing, the utility model is further illustrated.
Fig. 1 is the utility model capacitance ceramic powder die arrangement structural representation.
In figure: 1, base; 2, guide pad; 3, actuating arm; 4, guide cabin; 5, storage bin hopper; 6, feeding template; 7, locating piece; 8, block.
the specific embodiment:
Below in conjunction with the drawings and the specific embodiments, the utility model is described in detail:
A kind of capacitance ceramic powder die arrangement shown in Fig. 1, there is base 1, on described base 1, be provided with two guide pads that are parallel to each other 2, the head of described guide pad 2 is provided with locating piece 7, between guide pad 2, be provided with feeding module 6, the end of described feeding module 6 is provided with actuating arm 3, and top is provided with guide cabin 4, this guide cabin 4 is fixedly installed on guide pad 2 tops, and its top is provided with storage bin hopper 5; Described actuating arm 3 tops are provided with block 8, and this block 8 is bolted settings on guide pad 2.
Its specific works mode is as follows, and ceramic powder is contained in storage bin hopper 5, by guide cabin 4, enters in feeding template 6, is pressed, and drives feeding template 6 that the ceramic block of moulding is sent afterwards by actuating arm 3, continues processing.
This capacitance ceramic powder die arrangement structure can realize compacting and the feeding of ceramic capacitance material, enhances productivity, and has reduced production cost.
It is emphasized that: be only preferred embodiment of the present utility model above, not the utility model is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present utility model is done above embodiment, all still belong in the scope of technical solutions of the utility model.
Claims (3)
1. a capacitance ceramic powder die arrangement, it is characterized in that: there is base (1), on described base (1), be provided with two guide pads that are parallel to each other (2), between guide pad (2), be provided with feeding module (6), the end of described feeding module (6) is provided with actuating arm (3), top is provided with guide cabin (4), and this guide cabin (4) is fixedly installed on guide pad (2) top, and its top is provided with storage bin hopper (5).
2. capacitance ceramic powder die arrangement according to claim 1, is characterized in that: described actuating arm (3) top is provided with block (8), and this block (8) is bolted settings on guide pad (2).
3. capacitance ceramic powder die arrangement according to claim 1 and 2, is characterized in that: the head of described guide pad (2) is provided with locating piece (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320493839.4U CN203401566U (en) | 2013-08-14 | 2013-08-14 | Capacitor ceramic-powder die assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320493839.4U CN203401566U (en) | 2013-08-14 | 2013-08-14 | Capacitor ceramic-powder die assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203401566U true CN203401566U (en) | 2014-01-22 |
Family
ID=49937511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320493839.4U Expired - Fee Related CN203401566U (en) | 2013-08-14 | 2013-08-14 | Capacitor ceramic-powder die assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203401566U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103434007A (en) * | 2013-08-14 | 2013-12-11 | 吴江佳艺电子科技有限公司 | Capacitance ceramic powder die assembly |
-
2013
- 2013-08-14 CN CN201320493839.4U patent/CN203401566U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103434007A (en) * | 2013-08-14 | 2013-12-11 | 吴江佳艺电子科技有限公司 | Capacitance ceramic powder die assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20140814 |
|
| EXPY | Termination of patent right or utility model |