CN103434007A - Capacitance ceramic powder die assembly - Google Patents
Capacitance ceramic powder die assembly Download PDFInfo
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- CN103434007A CN103434007A CN2013103519627A CN201310351962A CN103434007A CN 103434007 A CN103434007 A CN 103434007A CN 2013103519627 A CN2013103519627 A CN 2013103519627A CN 201310351962 A CN201310351962 A CN 201310351962A CN 103434007 A CN103434007 A CN 103434007A
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- Prior art keywords
- ceramic powder
- capacitance
- feeding
- guiding
- block
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Abstract
The invention discloses a capacitance ceramic powder die assembly, which is provided with a base, wherein the base is provided with two parallel guiding blocks, a feeding die block is arranged between the guiding blocks, the tail end of the feeding die block is provided with a driving arm, a guiding cabin is arranged above the feeding die block and is fixedly arranged on the guiding blocks, the top of the guiding cabin is provided with a storage hopper, a check block is fixedly arranged on the guiding blocks through bolts, and the head parts of the guiding blocks are provided with positioning blocks. Due to the adoption of the structure, pressing and feeding of ceramic capacitance materials are realized, so that the production efficiency is improved, and the production cost is lowered.
Description
Technical field
The present invention relates to capacitor area, relate in particular to a kind of capacitance ceramic powder die arrangement.
Background technology
The capacitor electronic devices and components that all are absolutely necessary in a lot of electronic products, it serves as smothing filtering, power supply and the decoupling of rectifier, the bypass of AC signal, the AC coupled of AC-DC Circuit etc. in electronic equipment.
Electric capacity generally consists of electrode and medium block, and existing capacitor dielectric piece is used the most extensive with ceramic dielectric block.In order to make ceramic block up to specification, be all generally to make by mould.But, after general mold die completes, be all that production efficiency is lower by artificial feeding.
Summary of the invention
Technical problem to be solved by this invention is that a kind of capacitance ceramic powder die arrangement that can realize the feeding of automation binder is provided.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of capacitance ceramic powder die arrangement, there is base, be provided with two guide pads that are parallel to each other on described base, be provided with feeding module between guide pad, the end of described feeding module is provided with actuating arm, and top is provided with the guide cabin, this guide cabin is fixedly installed on the guide pad top, and its top is provided with storage bin hopper.
Preferably, described actuating arm top is provided with block, and this block is bolted settings on guide pad.
Preferably, the head of described guide pad is provided with locating piece.
Compared with prior art, usefulness of the present invention is: this capacitance ceramic powder die arrangement structure can realize compacting and the feeding of ceramic capacitance material, enhances productivity, and has reduced production cost.
the accompanying drawing explanation:
Below in conjunction with accompanying drawing, the present invention is further described.
Fig. 1 is a kind of capacitance ceramic powder of the present invention die arrangement structural representation.
In figure: 1, base; 2, guide pad; 3, actuating arm; 4, guide cabin; 5, storage bin hopper; 6, feeding template; 7, locating piece; 8, block.
the specific embodiment:
Below in conjunction with the drawings and the specific embodiments, describe the present invention:
A kind of capacitance ceramic powder die arrangement shown in Fig. 1, there is base 1, be provided with two guide pads that are parallel to each other 2 on described base 1, the head of described guide pad 2 is provided with locating piece 7, be provided with feeding module 6 between guide pad 2, the end of described feeding module 6 is provided with actuating arm 3, and top is provided with guide cabin 4, this guide cabin 4 is fixedly installed on guide pad 2 tops, and its top is provided with storage bin hopper 5; Described actuating arm 3 tops are provided with block 8, and this block 8 is bolted settings on guide pad 2.
Its specific works mode is as follows, and ceramic powder is contained in storage bin hopper 5, by guide cabin 4, enters in feeding template 6, is pressed, and by actuating arm 3, drives feeding template 6 that the ceramic block of moulding is sent afterwards, continues processing.
This capacitance ceramic powder die arrangement structure can realize compacting and the feeding of ceramic capacitance material, enhances productivity, and has reduced production cost.
It is emphasized that: above is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, any simple modification, equivalent variations and modification that every foundation technical spirit of the present invention is done above embodiment, all still belong in the scope of technical solution of the present invention.
Claims (3)
1. a capacitance ceramic powder die arrangement, it is characterized in that: there is base (1), be provided with two guide pads that are parallel to each other (2) on described base (1), be provided with feeding module (6) between guide pad (2), the end of described feeding module (6) is provided with actuating arm (3), top is provided with guide cabin (4), and this guide cabin (4) is fixedly installed on guide pad (2) top, and its top is provided with storage bin hopper (5).
2. capacitance ceramic powder die arrangement according to claim 1 is characterized in that: described actuating arm (3) top is provided with block (8), and this block (8) is bolted settings on guide pad (2).
3. capacitance ceramic powder die arrangement according to claim 1 and 2, it is characterized in that: the head of described guide pad (2) is provided with locating piece (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103519627A CN103434007A (en) | 2013-08-14 | 2013-08-14 | Capacitance ceramic powder die assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103519627A CN103434007A (en) | 2013-08-14 | 2013-08-14 | Capacitance ceramic powder die assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103434007A true CN103434007A (en) | 2013-12-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103519627A Pending CN103434007A (en) | 2013-08-14 | 2013-08-14 | Capacitance ceramic powder die assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103434007A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10296710A (en) * | 1997-04-28 | 1998-11-10 | Takahama Kogyo Kk | Method for forming ceramic product and forming line system thereof |
| CN101092207A (en) * | 2006-06-23 | 2007-12-26 | 鸿富锦精密工业（深圳）有限公司 | Upright feeding apparatus |
| CN101770873A (en) * | 2010-03-05 | 2010-07-07 | 梁惠新 | Explosion proof aluminous shell stamping forming die of capacitor |
| CN102642242A (en) * | 2012-05-17 | 2012-08-22 | 黎永健 | Intelligent powder distribution system in ceramic tile production |
| CN102815571A (en) * | 2012-09-03 | 2012-12-12 | 四川大学 | Automatic aluminum foil cutting and feeding device |
| CN102814728A (en) * | 2012-08-24 | 2012-12-12 | 深圳市翔通光电技术有限公司 | Inner bore lapping machine for ceramic bushing used for optical fiber ceramic inserted core metal assembly |
| CN202816684U (en) * | 2011-07-04 | 2013-03-20 | 东莞市和田工业自动化设备有限公司 | Capacitor core wrap feeding apparatus |
| CN203077440U (en) * | 2013-02-04 | 2013-07-24 | 刘岳兴 | Ceramic blank conveying device |
| CN203401566U (en) * | 2013-08-14 | 2014-01-22 | 吴江佳艺电子科技有限公司 | Capacitor ceramic-powder die assembly |
-
2013
- 2013-08-14 CN CN2013103519627A patent/CN103434007A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10296710A (en) * | 1997-04-28 | 1998-11-10 | Takahama Kogyo Kk | Method for forming ceramic product and forming line system thereof |
| CN101092207A (en) * | 2006-06-23 | 2007-12-26 | 鸿富锦精密工业（深圳）有限公司 | Upright feeding apparatus |
| CN101770873A (en) * | 2010-03-05 | 2010-07-07 | 梁惠新 | Explosion proof aluminous shell stamping forming die of capacitor |
| CN202816684U (en) * | 2011-07-04 | 2013-03-20 | 东莞市和田工业自动化设备有限公司 | Capacitor core wrap feeding apparatus |
| CN102642242A (en) * | 2012-05-17 | 2012-08-22 | 黎永健 | Intelligent powder distribution system in ceramic tile production |
| CN102814728A (en) * | 2012-08-24 | 2012-12-12 | 深圳市翔通光电技术有限公司 | Inner bore lapping machine for ceramic bushing used for optical fiber ceramic inserted core metal assembly |
| CN102815571A (en) * | 2012-09-03 | 2012-12-12 | 四川大学 | Automatic aluminum foil cutting and feeding device |
| CN203077440U (en) * | 2013-02-04 | 2013-07-24 | 刘岳兴 | Ceramic blank conveying device |
| CN203401566U (en) * | 2013-08-14 | 2014-01-22 | 吴江佳艺电子科技有限公司 | Capacitor ceramic-powder die assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131211 |