CN203386805U - Wafer fixing glue pressurizing device - Google Patents
Wafer fixing glue pressurizing device Download PDFInfo
- Publication number
- CN203386805U CN203386805U CN201320240495.6U CN201320240495U CN203386805U CN 203386805 U CN203386805 U CN 203386805U CN 201320240495 U CN201320240495 U CN 201320240495U CN 203386805 U CN203386805 U CN 203386805U
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- crystal
- mobile platform
- bonding adhesive
- led
- pressurizing block
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Abstract
A wafer fixing glue pressurizing device is used to press a wafer fixing glue after an LED wafer is fixed, and comprises a fixed work platform on which an LED support on which the LED wafer is fixed is fixed; a mobile platform which is located above the fixed work platform and can be moved up and down; a mobile control part used for controlling the mobile platform to move; and a pressurizing block arranged on the mobile platform and driven by the mobile platform to move and press on the LED wafer on the LED support. The pressurizing device of the utility model presses the LED wafer, so that the thickness of the wafer fixing glue is thinned under the pressure action of the pressurizing device. Moreover, the wafer fixing glue is heated, and the pressurizing device is removed until the wafer fixing glue is cured and formed, thereby reducing the thermal resistance of the lamp beads of an LED, and improving the reliability of the LED.
Description
Technical field
The utility model belongs to Light-Emitting Diode encapsulation technology field, relates in particular to a kind of at LED(Light-Emitting Diode, hereinafter to be referred as LED) make the device of crystal-bonding adhesive thickness attenuation after the wafer die bond by the mode of pressurization.
Background technology
Heat problem in the LED encapsulation technology becomes the common problem of industry at present, the heat that each enterprise all is devoted to how to allow the LED wafer produce can be guided in air effectively and quickly, to improve the reliability of LED lamp pearl, and reduce thermal resistance, be the key technology that solves this difficult problem.
Reducing the thermal resistance of LED lamp pearl whole system need to set about from each link.As everyone knows, the link of LED lamp pearl thermal resistance maximum is crystal-bonding adhesive, particularly adopt the middle low power LED of insulating cement material die bond, its thermal resistance is far longer than the thermal resistance that other links produce, and therefore reduces the crystal-bonding adhesive thermal resistance for improving one of the most effective means of LED lamp pearl reliability.The method that reduces at present the crystal-bonding adhesive thermal resistance mainly contains following two kinds of approach: by selecting the higher crystal-bonding adhesive material of conductive coefficient; Perhaps reduce the heat conduction approach of crystal-bonding adhesive, for example reduce the thickness of crystal-bonding adhesive.
In order to realize reducing the purpose of crystal-bonding adhesive thermal resistance, utility model people has proposed a kind of mode of passing through pressurization, can make the thickness reduction of crystal-bonding adhesive, thereby reduce crystal-bonding adhesive heat conduction approach, to reach the purpose that reduces thermal resistance.
The utility model content
The purpose of this utility model is to provide a kind of crystal-bonding adhesive pressue device, can make the thickness of crystal-bonding adhesive reduce, and is intended to solve the problem that how to reduce LED system thermal resistance of current existence.
To achieve these goals, the utility model is taked following technical solution:
The crystal-bonding adhesive pressue device, suppressed for the crystal-bonding adhesive to after the LED die bond, comprising: the steady job platform, and the LED support of die bond is fixed on described steady job platform; Mobile platform, described mobile platform is positioned at described steady job platform top and can moves up and down; Mobile control unit, move for controlling described mobile platform; Pressurizing block, described pressurizing block is arranged on described mobile platform and by described mobile platform and drives mobile being pressed on the LED wafer on LED support.
Further, be provided with several spaced apart putting holes on described mobile platform, described putting hole is corresponding with the position of LED wafer; Described pressurizing block is positioned in described putting hole and bottom passes described putting hole, and described pressurizing block can move up and down along described putting hole axis.
Further, the vertical section shape of described pressurizing block is in T shape.
Further, be provided with the height guide vane end stop on described mobile platform bottom surface, described height guide vane end stop and the machine-shaping of mobile platform one or described height guide vane end stop and mobile platform are split-type structural.
Further, described steady job platform and described mobile platform are metallic plate.
Further, described heater is to be built in the heating tube in the steady job platform or is baking box.
The utility model first is fixed in the LED wafer on LED support by crystal-bonding adhesive, then LED support is fixed on the steady job platform, pressurizing block by pressue device is implemented compacting to the LED wafer, so that crystal-bonding adhesive thickness attenuation, after in pressurizing block, the LED wafer being started the compacting action, crystal-bonding adhesive heating until the crystal-bonding adhesive solidifying and setting, then is removed to pressue device.Just can reduce crystal-bonding adhesive thickness thus, and then reduce the heat conduction approach to reach the effect that reduces thermal resistance, remove pressurizing block and can continue to be packaged into LED lamp pearl, the reliability of gained lamp pearl is able to effective raising.
The accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will do simple introduction to needing the accompanying drawing used in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The structural representation that Fig. 1 is the utility model embodiment 1 pressue device;
The flow chart of Fig. 2 for adopting the utility model to be pressurizeed to crystal-bonding adhesive;
The structural representation of the LED support that Fig. 3 is the utility model embodiment 1;
Fig. 4 is the schematic diagram of 1 pair of crystal-bonding adhesive of the utility model embodiment while being suppressed;
Fig. 5 is the schematic diagram that 1 pair of crystal-bonding adhesive of the utility model embodiment is heated;
Fig. 6 a is the schematic diagram before crystal-bonding adhesive is not suppressed;
Fig. 6 b is the schematic diagram after the crystal-bonding adhesive compacting;
The structural representation of the LED support that Fig. 7 is the utility model embodiment 2;
The structural representation that Fig. 8 is the utility model embodiment 2 pressue devices;
Fig. 9 is the schematic diagrames of 2 pairs of crystal-bonding adhesives of the utility model embodiment while being suppressed;
Figure 10 is the schematic diagram that 2 pairs of crystal-bonding adhesives of the utility model embodiment are heated.
Embodiment
The LED die bond, also referred to as Die Bond or load, is by the appointed area of crystal-bonding adhesive (being generally conducting resinl or insulating cement for LED) the LED wafer bonding at LED support, forms heat passage or electric pathway, for the routing of postorder connects the operation that condition is provided.Just as described in the background section, one of link of LED lamp pearl thermal resistance maximum is from crystal-bonding adhesive, and reducing the crystal-bonding adhesive thermal resistance can, by reducing crystal-bonding adhesive heat conduction approach, reduce crystal-bonding adhesive thickness and realize.
In order to realize aforementioned purpose, utility model people has designed a kind of pressue device that crystal-bonding adhesive is suppressed, and by this pressue device, crystal-bonding adhesive is carried out to pressurized operation, makes the thickness attenuation of crystal-bonding adhesive.During pressurization, at first by crystal-bonding adhesive, the LED wafer is fixed on LED support, complete die bond, then by pressue device, the LED wafer is implemented to the compacting action, make crystal-bonding adhesive thickness attenuation under the pressure-acting of pressue device, and crystal-bonding adhesive is heated, until remove again pressue device after the crystal-bonding adhesive solidifying and setting, then carry out the processing of next process and be packaged into LED lamp pearl.The utility model can make the attenuation of crystal-bonding adhesive thickness, thereby reduces the thermal resistance of the lamp pearl of LED, reaches the purpose of the reliability that improves LED.
It is more than the application's core concept, below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme of the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making under the creative work prerequisite the every other embodiment obtained, and all belong to the scope of the utility model protection.
A lot of details have been set forth in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here and implement, those skilled in the art can be in the situation that do similar popularization without prejudice to the utility model intension, so the utility model is not subject to the restriction of following public specific embodiment.
Secondly, the utility model is described in detail in conjunction with schematic diagram, when the utility model embodiment is described in detail in detail; for ease of explanation; the accompanying drawing that means device architecture can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of the utility model protection at this.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment clearly.
The present embodiment be take a kind of LED support with the bowl cup structure and the utility model is described as example.As shown in Figure 1, the pressue device of the present embodiment comprises steady job platform 1, mobile platform 2, pressurizing block 3 and mobile control unit (not shown).Steady job platform 1 is for placing LED support, and mobile platform 2 is positioned at the top of steady job platform 1, and mobile platform 2 can move under the control of mobile control unit.Steady job platform 1 and the mobile platform 2 of the present embodiment are metallic plate, be processed with a plurality of putting hole 2a on mobile platform 2, putting hole 2a is distributed on mobile platform 2, putting hole 2a can be latticed form or the linear array form is arranged, and the position of putting hole 2a is corresponding with the position of LED wafer on LED support.Place a pressurizing block 3 in each putting hole 2a, each independently pressurizing block 3 can suppress action to a LED wafer.Preferably, the vertical section shape of the pressurizing block 3 of the present embodiment is in T shape, and the bottom of pressurizing block 3 is through putting hole 2a, and the T shape head of pressurizing block 3 can play position-limiting action, pressurizing block 3 can not dropped out in putting hole 2a, and pressurizing block 3 can move up and down along putting hole 2a axis.Pressurizing block 3 is solid, can be made by materials such as metal, pottery, plastics, can also be combined by materials such as metal, pottery, plastics.The moving-member that mobile platform 2 moves for driving pressurizing block 3, the distance that mobile platform descends is decided by the thickness of the crystal-bonding adhesive of wanting to obtain.
With reference to Fig. 2, the flow chart of Fig. 2 for adopting the utility model to be pressurizeed to crystal-bonding adhesive specifically comprises the following steps:
As shown in Figure 3, the LED support 10 of the present embodiment, for the LED support of band bowl cup structure 10-1, is provided with positive electrode 10-2 and negative electrode 10-3 on LED support 10, between positive electrode 10-2 and negative electrode 10-3, by insulating tape 10-4, isolated.Have the die bond zone that sets firmly LED wafer 11 on LED support 10, LED wafer 11 is fixedly arranged on LED support 10 by crystal-bonding adhesive 12;
As shown in Figure 4, when LED support 10 is fixed on steady job platform 1, mobile platform 2 and pressurizing block 3 are positioned at the top of LED support 10, distance between mobile platform 2 bottom surfaces and bowl cup structure 10-1 end face is H1, the dropping distance that this segment distance is mobile platform 2, distance between pressurizing block 3 bottom surfaces and LED wafer 11 upper surfaces is H2, H1>H2, and the dropping distance of mobile platform 2 is greater than the distance of pressurizing block 3 to LED wafer 11 upper surfaces;
Mobile control unit is controlled mobile platform 2 and is moved down, pressurizing block 3 is followed and is moved down and be pressed on LED wafer 11, because the distance H 1 between mobile platform 2 bottom surfaces and bowl cup 10-1 end face is greater than the distance H 2 between pressurizing block 3 bottom surfaces and LED wafer 11 upper surfaces, mobile platform 2 is in the decline process, pressurizing block 3 can first touch the upper surface of LED wafer 11, along with mobile platform 2 continues to descend, pressurizing block 3 is separated with mobile platform 2, because pressurizing block 3 bottoms are dropped on LED wafer 11, pressurizing block 3 loses the support of mobile platform 2 simultaneously, continue to move down compacting LED wafer 11 under the Action of Gravity Field that pressurizing block 3 produces at own wt after being pressed on LED wafer 11, as shown in Figure 5, thereby make crystal-bonding adhesive 12 under the pressure-acting of pressurizing block 3 by ironed, under the suppression of pressurizing block 3, crystal-bonding adhesive 12 thickness can be 2～5 microns by 8～15 microns original attenuation, in order to guarantee the Horizontal consistency of LED support 10, mobile platform 2 continues to descend until mobile platform 2 contacts with the top of bowl cup structure 10-1, it is upper that the mobile platform 2 of metal material is positioned over bowl cup structure 10-1, can be ensuing heating good thermal contact conductance condition is provided,
In step 2,3 pairs of LED wafers of pressurizing block 11 are implemented compacting so that crystal-bonding adhesive 12 attenuation, for making crystal-bonding adhesive 12 maintain this thickness, need to heat and make its solidifying and setting it, stop moving down when mobile platform 2 drops to (when H1 is 0) mobile platform 2 while contacting with the top of bowl cup structure 10-1, now start heater crystal-bonding adhesive is heated to (that is just starting heating after pressurizing block 3 is pressed on the LED wafer); In pressurizing block 3 is utilized the process of himself gravity compacting LED wafer 11, crystal-bonding adhesive is heated, preferred heating-up temperature is 100～150 degrees centigrade, and be 2～5 minutes heating time.The present embodiment adopts heating tube to be heated crystal-bonding adhesive 12, heating tube 4 is built in steady job platform 1 (Fig. 5), steady job platform 1 is provided with temp control switch and time control switch (not shown), for controlling the operating state of heating tube 4, in addition, also can adopt baking box to be heated crystal-bonding adhesive.
Fig. 6 a is the die bond view before suppress to crystal-bonding adhesive 12, and Fig. 6 b is for suppressing the die bond view after also hot briquetting to crystal-bonding adhesive 12.Comparison diagram 6a, Fig. 6 b are known, and by above step, the thickness of crystal-bonding adhesive reduces, and because the crystal-bonding adhesive heat conduction approach that reduces of crystal-bonding adhesive thickness reduces thus, can reach the effect that reduces thermal resistance, effectively improve the functional reliability of lamp pearl.
As shown in Figure 7, the LED support of the present embodiment is not with a bowl cup structure, is provided with positive electrode 10-2 and negative electrode 10-3 on LED support 10, between positive electrode 10-2 and negative electrode 10-3, by insulating tape 10-4, is isolated.Have the die bond zone that sets firmly LED wafer 11 on LED support 10, LED wafer 11 is fixedly arranged on LED support 10 by crystal-bonding adhesive 12.
With reference to Fig. 8, be provided with height guide vane end stop 2b on mobile platform 2 bottom surfaces of the present embodiment pressue device, height guide vane end stop 2b and mobile platform 2 one machine-shapings, height guide vane end stop 2b also can adopt welding to wait other connected mode to be arranged at mobile platform 2 bottom surfaces.Be processed with a plurality of putting hole 2a on mobile platform 2, putting hole 2a is distributed on mobile platform 2, places a pressurizing block 3 in each putting hole 2a, and the vertical section shape of pressurizing block 3 is in T shape, the bottom of pressurizing block 3 is through putting hole 2a, and pressurizing block 3 can move up and down along putting hole 2a axis
As shown in Figure 9, when mobile platform 2 and pressurizing block 3 are positioned at the top of LED support 10, distance between height guide vane end stop 2b bottom surface and LED support 10 upper surfaces is H1 ', this segment distance is the distance that mobile platform 2 moves down, distance between pressurizing block 3 bottom surfaces and LED wafer 11 upper surfaces is H2, H1 '>H2, the dropping distance of mobile platform 2 is greater than the distance of pressurizing block 3 to the LED upper wafer surface;
Because the distance H 1 ' between height guide vane end stop 2b bottom surface and LED support 10 upper surfaces is greater than the distance H 2 between pressurizing block 3 bottom surfaces and LED wafer 11 upper surfaces, mobile platform 2 is in the decline process, before height guide vane end stop 2b contact LED support 10 (being before mobile platform 2 stops moving), pressurizing block 3 first touches the upper surface of LED wafer 11, pressurizing block 3 is pressed on LED wafer 11, along with mobile platform 2 continues to descend, pressurizing block 3 is separated with mobile platform 2, because pressurizing block 3 loses the support of mobile platform 2, continue to move down compacting LED wafer 11 under the Action of Gravity Field that can produce at own wt after pressurizing block 3 is pressed on LED wafer 11, make crystal-bonding adhesive 12 thickness attenuation under pressure, as shown in figure 10, mobile platform 2 continues to descend until height guide vane end stop 2b stops movement while contacting with the upper surface of LED support 10,
LED lamp pearl crystal-bonding adhesive thickness after by the utility model, crystal-bonding adhesive being pressurizeed significantly reduces, and thermal resistance can be effectively reduced, and with this, improves the functional reliability of LED lamp pearl.
In previous embodiment, pressurizing block touches after the LED wafer when LED wafer is carried out to pressing operation, is to utilize the gravity of pressurizing block self naturally to press down crystal-bonding adhesive, but also can adopts displacement control component to control the pressing action of pressurizing block.The mode of utilizing the pressurizing block self gravitation naturally to press down, on the one hand the whole stressed relatively balance of crystal-bonding adhesive, on the other hand, compare the movement that adopts displacement control component to operate pressurizing block, simple in structure, cost is low.Mobile platform is a kind of preferred form of moving-member, and it is as the carrier of pressurizing block, and for driving the movement of pressurizing block, this moving-member can also adopt other suitable structure.When pressurizing block is not while adopting self gravitation to be suppressed crystal-bonding adhesive, can be after pressurizing block is pressed on the LED wafer and under moving-member drives further start heating during compacting downwards, heating-up temperature and heating time can need to adjust accordingly according to difference.
Above embodiment is only in order to illustrate that the technical solution of the utility model is not intended to limit, although with reference to above-described embodiment, the utility model is had been described in detail, those of ordinary skill in the field are to be understood that, still can modify or be equal to replacement embodiment of the present utility model, and do not break away from any modification of the utility model spirit and scope or be equal to replacement, it all should be encompassed in the scope of technical solutions of the utility model.
Claims (6)
1. the crystal-bonding adhesive pressue device, suppressed for the crystal-bonding adhesive to after the LED die bond, it is characterized in that, comprising:
The steady job platform, the LED support of die bond is fixed on described steady job platform;
Mobile platform, described mobile platform is positioned at described steady job platform top and can moves up and down;
Mobile control unit, move for controlling described mobile platform;
Pressurizing block, described pressurizing block is arranged on described mobile platform and by described mobile platform and drives mobile being pressed on the LED wafer on LED support.
2. crystal-bonding adhesive pressue device as claimed in claim 1, it is characterized in that: be provided with several spaced apart putting holes on described mobile platform, described putting hole is corresponding with the position of LED wafer;
Described pressurizing block is positioned in described putting hole and bottom passes described putting hole, and described pressurizing block can move up and down along described putting hole axis.
3. crystal-bonding adhesive pressue device as claimed in claim 2, it is characterized in that: the vertical section shape of described pressurizing block is in T shape.
4. crystal-bonding adhesive pressue device as claimed in claim 1 or 2, it is characterized in that: be provided with the height guide vane end stop on described mobile platform bottom surface, described height guide vane end stop and the machine-shaping of mobile platform one or described height guide vane end stop and mobile platform are split-type structural.
5. crystal-bonding adhesive pressue device as claimed in claim 1, it is characterized in that: described steady job platform and described mobile platform are metallic plate.
6. crystal-bonding adhesive pressue device as claimed in claim 1 is characterized in that: described heater is to be built in the heating tube in described steady job platform or is baking box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320240495.6U CN203386805U (en) | 2013-05-06 | 2013-05-06 | Wafer fixing glue pressurizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320240495.6U CN203386805U (en) | 2013-05-06 | 2013-05-06 | Wafer fixing glue pressurizing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386805U true CN203386805U (en) | 2014-01-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320240495.6U Expired - Fee Related CN203386805U (en) | 2013-05-06 | 2013-05-06 | Wafer fixing glue pressurizing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386805U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311405A (en) * | 2013-05-06 | 2013-09-18 | 芜湖锐拓电子有限公司 | Die attach adhesive pressing method and pressurizing device |
-
2013
- 2013-05-06 CN CN201320240495.6U patent/CN203386805U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311405A (en) * | 2013-05-06 | 2013-09-18 | 芜湖锐拓电子有限公司 | Die attach adhesive pressing method and pressurizing device |
| CN103311405B (en) * | 2013-05-06 | 2016-08-03 | 芜湖锐拓电子有限公司 | Crystal-bonding adhesive drawing method and pressue device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20160506 |