CN203376678U - A built-in water cooling heat sink for a notebook computer - Google Patents
A built-in water cooling heat sink for a notebook computer Download PDFInfo
- Publication number
- CN203376678U CN203376678U CN201320231740.7U CN201320231740U CN203376678U CN 203376678 U CN203376678 U CN 203376678U CN 201320231740 U CN201320231740 U CN 201320231740U CN 203376678 U CN203376678 U CN 203376678U
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- Prior art keywords
- heat
- water
- radiator
- built
- notebook computer
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Abstract
The utility model discloses a built-in water cooling heat sink for a notebook computer. The built-in water cooling heat sink comprises a radiator, a cooling fan, a minitype water pump, plastic tubes and heat conduction bases. The radiator comprises a copper tube and radiating fins arranged on the periphery of the copper tube closely. The heat conduction bases are made of pure copper, are hollow inside, are provided with liquid inlets and outlets, are fixed on a mainboard through screws, and are tightly attached to a video card and a processor. The radiator, the heat conduction bases and the minitype water pump are connected by the plastic tubes in series to form a loop which is filled with purified water. The water pump drives the water in the loop to flow circularly and heat of the video card and the processor are taken to the radiator through the heat conduction bases and are dissipated to the external air through the cooling fan. The built-in water cooling heat sink is simple in structure and is capable of improving the heat dissipation efficiency of a notebook computer and reducing the internal temperature of the computer.
Description
Technical field
The utility model relates to a kind of notebook computer accessory, relates in particular to a kind of new radiator.
Background technology
At present, the portability that notebook computer is good with it has become one of indispensable digital product of student and office clan, can be used for office, and people's free life has greatly been enriched in online and audio-visual amusement etc.Notebook computer has higher integrated level compared to desktop computer, and the pressure that therefore dispels the heat is also higher than desktop computer.Traditional notebook computer generally adopts heat pipe---and the heating radiator of fan form, radiating efficiency is low, easily causes each electronic component excess Temperature in notebook computer, causes and crashes, the generation of the phenomenons such as blue screen.Not only affect operating experience, more greatly reduced the serviceable life of notebook computer.
As can be seen here, prior art awaits further improving and development.
Summary of the invention
The utility model provides a kind of new radiator in order to solve above-mentioned defect of the prior art, and existing notebook radiator has been carried out to scientific and reasonable improvement, to improve the radiating efficiency of heating radiator.
In order to solve the problems of the technologies described above, the utility model scheme comprises:
The built-in water-filled radiator of notebook, by cold type, radiator fan, plastic pipe, the video card heat-conducting base, the processor heat-conducting base, micro pump forms.Water has higher specific heat capacity than other liquid, and uniform temp can store more heat, and asepsis environment-protecting, simple and easy to get.Heat-conducting base is hollow design, adopts fine copper to make, and has guaranteed that the heat that video card and processor produce can pass on heat-conducting base rapidly.With plastic pipe, by cold type, video card and processor heat-conducting base and micro pump series connection are a loop, and water pump orders about current and circulates in pipeline, and heat is constantly brought to the cold type place.Cold type is also made by fine copper, the heat in water can be passed to rapidly in each radiating fin in cold type, by radiator fan by the dissipation of heat in radiating fin in extraneous air.It is simple in structure for the utility model, has high radiating efficiency, can significantly reduce the internal temperature of notebook computer.
The accompanying drawing explanation
Fig. 1 is the vertical view of water-filled radiator in the utility model;
Fig. 2 is the left view of cold type in the utility model;
Fig. 3 is the sectional view of heat-conducting base in the utility model.
In figure, 1 cold type, 2 plastic pipes, 3 video card heat-conducting bases, 4 pipe interfaces, 5 processor heat-conducting bases, 6 fixing threaded holes, 7 micro pumps, 8 radiator fans, 9 radiating fins, 10 copper pipes.
Embodiment
The utility model provides a kind of notebook computer built-in water-filled radiator, clearer, clear and definite in order to make the purpose of this utility model, technical scheme and advantage, below in conjunction with accompanying drawing and embodiment, the utility model is further described.
The utility model provides notebook computer built-in water-filled radiator, flowing by current in pipeline, take away the heat that video card and processor produce, and by dissipation of heat in the notebook computer extraneous air, improve radiating efficiency, reduced the temperature of computer inside.As Fig. 1, Fig. 2, shown in Fig. 3, it comprises that cold type (1) is connected with video card heat-conducting base (3) by plastic pipe (2), video card heat-conducting base (3) is connected with processor heat-conducting base (5) by plastic pipe (2), processor heat-conducting base (5) is connected with micro pump (7) by plastic pipe (2), and micro pump (7) is connected with cold type (1) by plastic pipe (2), and radiator fan (8) is close to cold type (1) right side.Cold type (1) mainly is comprised of radiating fin (9) and copper pipe (10), and radiating fin (9) is the fine copper sheet that thickness is a millimeter, with the fixed intervals close-packed arrays at copper pipe (10) on every side, and closely is connected with it.Video card heat-conducting base (3) and processor heat-conducting base (5) are equally by the fine copper manufacture, for inner hollow designs, and leave water inlet and water delivering orifice, structure is similar between the two, the heat-conducting base size can be changed according to notebook computer manufacturer's specific requirement, use screw that heat-conducting base is fixed on main board for notebook computer by screw (6), make together with heat-conducting base below and processor or video card fit tightly, the good thermal conductivity by copper, the heat that processor and video card produce can pass on heat-conducting base rapidly.Using plastic pipe (2) is a loop by cold type (1), video card heat-conducting base (3), processor heat-conducting base (5) and micro pump (7) series connection, fill with pure water in loop, cause main plate short for preventing that pipeline from revealing, must locate to carry out encapsulation process at plastic pipe (2) and the pipe interface (4) of each parts.Radiator fan (8) and micro pump (7) all can adopt mainboard 3pin interface to be powered, and the air outlet of radiator fan (8) must be close to cold type (1).When water-filled radiator is worked, the water circulation that micro pump (7) orders about in pipeline flows, current are taken away the heat of video card and processor generation by heat-conducting base, when current pass through cold type (1), it is upper that heat in water passes to rapidly radiating fin (9) by copper pipe (10), by radiator fan (8) by the dissipation of heat on radiating fin (9) in the notebook extraneous air.
Claims (4)
1. the built-in water-filled radiator of notebook, it comprises that cold type (1) is connected with video card heat-conducting base (3) by plastic pipe (2), video card heat-conducting base (3) is connected with processor heat-conducting base (5) by plastic pipe (2), processor heat-conducting base (5) is connected with micro pump (7) by plastic pipe (2), micro pump (7) is connected with cold type (1) by plastic pipe (2), and radiator fan (8) is close to cold type (1) right side.
2. water-filled radiator according to claim 1 is characterized in that: using plastic pipe (2) is a pipeline loop by each parts series connection.
3. water-filled radiator according to claim 1 is characterized in that: use the water that the circulates heat transfer medium as heating radiator.
4. water-filled radiator according to claim 1 is characterized in that: the water circulation of using micro pump (7) to order about in pipeline loop flows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320231740.7U CN203376678U (en) | 2013-05-02 | 2013-05-02 | A built-in water cooling heat sink for a notebook computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320231740.7U CN203376678U (en) | 2013-05-02 | 2013-05-02 | A built-in water cooling heat sink for a notebook computer |
Publications (1)
Publication Number | Publication Date |
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CN203376678U true CN203376678U (en) | 2014-01-01 |
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Family Applications (1)
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CN201320231740.7U Expired - Fee Related CN203376678U (en) | 2013-05-02 | 2013-05-02 | A built-in water cooling heat sink for a notebook computer |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103885557A (en) * | 2014-04-15 | 2014-06-25 | 吴江市赛纳电子科技有限公司 | Self-cooling-type computer case |
CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
CN108419424A (en) * | 2018-05-16 | 2018-08-17 | 江琴兰 | A kind of heat dissipation equipment for sensor |
CN109862757A (en) * | 2019-03-14 | 2019-06-07 | 京东方科技集团股份有限公司 | Transfer tube, radiating subassembly and flat panel detector |
CN111488045A (en) * | 2020-04-14 | 2020-08-04 | 殷莉 | Computer cooling assembly working in large range |
-
2013
- 2013-05-02 CN CN201320231740.7U patent/CN203376678U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103885557A (en) * | 2014-04-15 | 2014-06-25 | 吴江市赛纳电子科技有限公司 | Self-cooling-type computer case |
CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
CN108419424A (en) * | 2018-05-16 | 2018-08-17 | 江琴兰 | A kind of heat dissipation equipment for sensor |
CN109862757A (en) * | 2019-03-14 | 2019-06-07 | 京东方科技集团股份有限公司 | Transfer tube, radiating subassembly and flat panel detector |
CN111488045A (en) * | 2020-04-14 | 2020-08-04 | 殷莉 | Computer cooling assembly working in large range |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140101 Termination date: 20140502 |