CN203367279U - LED line light source - Google Patents
LED line light source Download PDFInfo
- Publication number
- CN203367279U CN203367279U CN2013204786635U CN201320478663U CN203367279U CN 203367279 U CN203367279 U CN 203367279U CN 2013204786635 U CN2013204786635 U CN 2013204786635U CN 201320478663 U CN201320478663 U CN 201320478663U CN 203367279 U CN203367279 U CN 203367279U
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- Prior art keywords
- reflecting plate
- light source
- heat sink
- electrode
- led
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Provided is an LED line light source. According to one aspect of the utility model, the LED line light source includes a packaging frame formed by a heat sink, an electrode, and a reflective plate, an LED chip, a lead connecting the LED chip to the electrode, and a light-transmission filler for protection. The packaging frame is a long-strip part formed through the integration of the heat sink, the electrode, and the reflective plate, wherein the heat sink and the electrode are made of metal materials, and the reflective plate is made of insulating materials. In addition, the reflective plate is composed of an upper reflective plate and a lower reflective plate, a plurality of recesses are arranged in the lower reflective plate and are linearly arranged, and the upper reflective plate encircles the plurality of recesses of the lower reflective plate and is arranged above the lower reflective plate. The electrode and the heat sink are arranged on different planes. By adopting such an integrated packaging structure, the LED line light source is good in the structural strength of the product and is suitable for mass production.
Description
Technical field
The utility model relates to a kind of luminous semiconductor device, particularly a kind of LED lines light source.
Background technology
LED lines light source light source low as a kind of energy consumption, long service life is widely used in various places.Figure 1A and Figure 1B are respectively vertical view and the front view shown according to the LED lines light source of prior art.The encapsulating structure of this LED lines light source comprises aluminium sheet 100, insulating barrier 110, copper foil electrode 120, Copper Foil is heat sink 130, reflecting plate 140, LED chip 150, wire 160 and translucent resin 170.Aluminium sheet 100, insulating barrier 110, copper foil electrode 120 and Copper Foil are heat sink 130 forms aluminium bases, and this aluminium base has formed again the support of LED lines light sources with reflecting plate 140.LED chip 150 cements on the Copper Foil heat sink 130 on support successively, and the positive and negative electrode of its LED chip 150 is connected with the copper foil electrode 120 on support by wire 160.Be equipped with reflecting plate 140 around LED chip 150, finally with translucent resin 170, LED chip 150 and wire 160 sealing got up again.The shortcoming of this encapsulating structure is that LED chip 150 peripheries only have a larger reflecting plate 140, and catoptrical efficiency is not high.In addition, insulating barrier 110 is not good Heat Conduction Material, so the heat that LED chip 150 sends can not well outwards be conducted.This packaged type is not preferably for LED lines light source.
The utility model content
The purpose of this utility model is the deficiency existed in order to overcome above-mentioned LED lines illuminating source packaging structure, has proposed a kind of excellent heat radiation performance, LED lines light source that luminous efficiency is high.
According to an aspect of the present utility model, a kind of LED lines light source at least comprises packaging frame, LED chip, and many wires of connection LED chip, and the light transmission filler of protection LED chip and wire or light transmission protection lens cover.Wherein, packaging frame is by heat sink, electrode and the integrally formed elongated member of reflecting plate.Preferably, heat sink and electrode is made by metal material, and reflecting plate is made by insulating material.Preferably, reflecting plate is made by the injection molded mode, makes electrode, heat sink and reflecting plate be injection molded into simultaneously and is integrated, and jointly forms packaging frame.
According to another aspect of the present utility model, reflecting plate comprises reflecting plate and lower reflecting plate, and described lower reflecting plate forms a plurality of recesses, and recess is linear array, and one or more LED chips are installed in each recess.In described upper reflecting plate is looped around a plurality of recesses of lower reflecting plate, in the top of lower reflecting plate.Recess has four inclined sides and a bottom surface, bottom surface consists of heat sink at least in part, concrete, in LED lines light source, the heat sink bottom that is positioned at reflecting plate, heat sink upper surface exposes in reflecting plate, and LED chip cements in heat sink upper surface, heat sink lower surface below reflecting plate to exposing outside.
According to another aspect of the present utility model, electrode is positioned at heat sink periphery, and electrode and heat sink laying respectively at least two planes of staggering each other.
According to another aspect of the present utility model, electrode comprises the internal electrode that is positioned at packaging frame and is positioned at the outer outer electrode of packaging frame, being exposed in reflecting plate partially of internal electrode.
The utility model has adopted integrally formed encapsulating structure, and the structural strength of product is good, and is applicable to the large batch of manufacturing.
In different levels, therefore, can fully separate electrical path and heat dissipation channel due to the heat sink and electrode according in LED lines light source of the present utility model, heat sinkly can directly receive external radiator, thereby can reach good radiating effect.
In addition, the light that the lower reflecting plate in LED lines light source of the present utility model can make LED chip send is able to upwards and outside ejaculation, and improves luminous efficiency; Upper reflecting plate and the light transmission filler of filling in it from the discontinuous light of basis that sends of each recess of reflecting plate penetrate again after mixing within it, and obtain the line source of surperficial continuous luminous.
The utility model example is stated in the full mode in parallel of each wafer/chip, by changing the design of electrode connection, also can be made into full series connection, or the encapsulating structure of string series-parallel connection.This is entirely in interest field of the present utility model.
The accompanying drawing explanation
Figure 1A and Figure 1B are respectively vertical view and the front view that shows LED lines light source of the prior art.
Fig. 2 A, 2B and 2C are respectively vertical view, front view and the end view according to the LED lines light source of the first embodiment of the present utility model.
Fig. 3 is the exploded view shown according to the LED lines light source of the first embodiment of the present utility model.
Fig. 4 is the stereogram according to the LED lines light source of the second embodiment of the present utility model.
Fig. 5 shows the metallic plate for the manufacture of the LED lines light source according to the utility model embodiment.
Fig. 6 shows the schematic diagram of manufacture according to first step of the LED lines light source of the utility model embodiment.
Fig. 7 shows the schematic diagram of manufacture according to the second step of the LED lines light source of the utility model embodiment.
Fig. 8 shows the schematic diagram of manufacture according to the 3rd step of the LED lines light source of the utility model embodiment.
Fig. 9 shows the schematic diagram of manufacture according to the 4th step of the LED lines light source of the utility model embodiment.
Figure 10 shows the schematic diagram of manufacture according to the five steps of the LED lines light source of the utility model embodiment.
Embodiment
Below in conjunction with specific embodiments and the drawings, the utility model is described in further detail; set forth in the following description more details so that fully understand the utility model; but the utility model obviously can be implemented with the multiple alternate manner that is different from this description; those skilled in the art can be in the situation that do similar popularization, deduction without prejudice to the utility model intension according to practical situations, therefore should be with the content constraints of this specific embodiment protection range of the present utility model.
Fig. 2 A, 2B and 2C are respectively vertical view, front view and the end view according to the LED lines light source of the first embodiment of the present utility model.Fig. 3 is the exploded view shown according to the LED lines light source of the first embodiment of the present utility model.LED lines light source is elongated on the whole; this LED lines light source comprises the reflecting plate 230 made by insulating material, is positioned at heat sink 220 of reflecting plate 230 bottoms; and a plurality of electrodes 210 of heat sink 220 peripheries, the wire 270 that cements in the LED chip 260 on reflecting plate 230 bottoms heat sink 220 and connect LED chip 260 and internal electrode 211; In addition, light transmission filler 280 is filled in the upper shrinkage pool of reflecting plate 230, covers on LED chip 260 and wire 270, forms the transparent surface of light source.
As shown in Figure 3, LED lines light source comprises positive and negative two electrodes 210.Each electrode 210 forms by being positioned at the internal electrode 211 within packaging frame and the outer electrode 212 be positioned at outside packaging frame.Internal electrode 211 is long strip type and is provided with integratedly outer electrode 212 in the end of internal electrode 211.Preferably, the outer electrode 212 of two electrodes 210 is arranged on two relative ends.Shown in Fig. 3 heat sink 220 forms strip, two electrodes 210 are positioned at heat sink 220 the outside, but electrode 210 lays respectively on two planes of staggering each other with heat sink 220, this can be clear that from Fig. 2 C, heat sink 220 are positioned at the bottom of whole packaging frame 200, the part of its upper surface is exposed in reflecting plate 230, its lower surface exposes from the bottom of reflecting plate 230, and two electrodes 210 are positioned at whole packaging frame 200 medium position highly, wherein outer electrode 212 stretches out from the sidepiece of reflecting plate 230.The height and position of two electrodes 210 can be the same or different.Being exposed to partially in reflecting plate 230 of internal electrode 211, for being electrically connected to the positive and negative electrode of LED chip 260.As shown in Figure 3, comprise upper reflecting plate 250 and lower reflecting plate 240 according to reflecting plate 230 of the present utility model.Be formed with a plurality of recesses in lower reflecting plate 240, these recesses are linear array.Upper reflecting plate 250 is positioned at the top of reflecting plate 230 around whole packaging frame 200, and more specifically, upper reflecting plate 250 is the top in lower reflecting plate 240 around a plurality of recesses.Outwards penetrate on the ambient light alignment that lower reflecting plate 240 structures can make LED chip 260 surroundings send, improve luminous efficiency; And the light transmission filler of upper reflecting plate 250 interior fillings make from the discontinuous light of script that sends of reflecting plate 240 each recesses effectively mix within it and obtain the line source of continuous luminous.The recess of 10 lower reflecting plates 240 shown in Fig. 3, but quantity is not conditional, but can be set according to the length of LED lines light source.Each recess in lower reflecting plate 240 has four inclined sides and ，Qi bottom surface, a bottom surface forms by heat sink 220 at least in part, and heat sink 220 the area exposed should be enough for LED chip 260 die bonds.In addition, the fluorescer (fluorescent glue, fluorescent material) that can play reflex can be coated on side and bottom surface.
The mode that LED chip 260 contacts by face cements on heat sink 220 upper surface, and the positive and negative electrode of LED chip 260 is connected on the upper surface of internal electrode 211 by wire 270, thereby can separate electrical path and heat dissipation channel fully, make better heat-radiation effect.
As shown in Figure 2 A, be provided with a LED chip 260 in each recess of reflecting plate 230, the light that all send LED chip 260 four sides of each recess and bottom surface plays reflex, thereby luminous efficiency is high; Perhaps, it is also feasible a plurality of LED chips 260 being set in each recess.
Be filled with light transmission filler 280 such as the transparent material of resin etc. in the recess of reflecting plate 230 to form the transparent surface of LED lines light source, thus sealing protect the element in the packaging frame 200 such as LED chip 260.Upper reflecting plate 250 and the light transmission filler 280 of filling in it can from the discontinuous light of basis that sends of reflecting plate 240 each recesses fully mix the line source that obtains surperficial continuous luminous.When this LED chip 260 is that blue light and light transmission filler 280 is during for fluorescent glue, because the fluorescent glue of each recesses in lower reflecting plate 240 is connected as a single entity with the fluorescent glue that is positioned at upper reflecting plate 250, during its horizontal positioned, fluorescent glue (before solidifying) flows under gravity, the amount of the fluorescent glue that makes each blue-light LED chip 260 cover is identical, thereby has guaranteed that the white light that this LED lines light source sends does not have aberration.
Fig. 4 is the stereogram according to the LED lines light source of the second embodiment of the present utility model.With the first embodiment difference, be, the LED lines light source shown in Fig. 4 has the optical lens 290 of arcwall face, and in other words, light transmission filler 280 has formed with the arcwall face transparent surface, like this, can adjust lighting angle, further improves luminosity.
Each LED chip 260 in each illustrated LED lines light source is complete in parallel, if necessary, can be configured to the LED lines light source of LED chip 260 for full series connection or string series-parallel connection by quantity and the connected mode that changes electrode 210.For example, positive and negative electrode in LED lines light source is configured to discrete electrode section, these electrode sections similarly also are formed in reflecting plate 230 by integrated injection molding, and partly from reflecting plate 230, expose, be formed for connecting the join domain of LED chip electrode, by such positive and negative electrode, can make the full series connection of LED chip or string series-parallel connection ground be encapsulated.
Below, in conjunction with Fig. 5-Figure 10, the manufacture method of LED lines light source of the present utility model is described.
At first the metallic plate 300 for the manufacture of the LED lines light source according to the utility model embodiment as shown in Figure 5 is provided.As shown in Figure 6, according to method of the present utility model, comprise punch steps, in this step, form heat sink 220 and electrode 210 by punching press on metallic plate 300, each is heat sink 220 is connected with the frame 310 of metallic plate 300 respectively with electrode 210.The support chip 320 that becomes little tab-like in frame 310 inner electrodes 211 or the heat sink 220 side blow swagings of metallic plate 300, for after after the injection molding process of step, heat sink 220 work to support packaging frame 200 while separating with frame 310 with electrode 210.300 upper punches of metallic plate shown in Fig. 6 are pressed with four groups heat sink 220 and corresponding electrode 210, but heat sink 220 and electrode 210 of other quantity are all also feasible.In punch steps, electrode 210 and heat sink 220 punching presses are formed at least two planes of staggering each other, as, electrode 210 is on same level with frame 310, and heat sink 220 are stamped into the below of electrode 210 and frame 310.By means of the metal elongation property, heat sink 220 will keep being connected with frame 310.
Then, form the reflecting plate that includes a plurality of reflecting plates 230 230 aggregates as shown in Figure 7 by injection moulding.As above mentioned, preferably reflecting plate 230 is formed to reflecting plate 250 and lower reflecting plate 240 in this step, lower reflecting plate 240 forms a plurality of recesses, and recess is linear array, and upper reflecting plate 250 is formed on the top of lower reflecting plate 240 around a plurality of recesses.When injection moulding, support chip 320 is encased in reflecting plate 230, in order in step, packaging frame 200 is being played a supportive role afterwards.
Next step, as shown in Figure 8, carry out by punching press heat sink 220 separating steps that separate with the frame 310 of metallic plate 300 with electrode 210.In this step, heat sink 220, electrode 210 separates with the frame 310 of metallic plate 300, and forms outer electrode 212 at the outside, the two ends of packaging frame 200 simultaneously.Packaging frame 200 is connected with frame 310 by support chip 320.
Fig. 9 shows the chip installation steps, and in this step, LED chip 260 is arranged on heat sink 220 in packaging frame 200, by wire 270, LED chip 260 and internal electrode 211 is electrically connected.Preferably, one or more LED chips 260 are installed in each recess.As Figure 10, carry out a sealing step afterwards, light transmission filler 280 is inserted to packaging frame 200 in the sealing step to form the transparent surface of lines light source.Transparent surface can form plane or arcwall face.Finally, by support chip 320 is deviate from from reflecting plate 230, just each LED lines light source can be separated.
Although the utility model with preferred embodiment openly as above, it is not for limiting the utility model, and any those skilled in the art, within not breaking away from spirit and scope of the present utility model, can make possible change and modification.Therefore, every content that does not break away from technical solutions of the utility model, any modification of above embodiment being done according to technical spirit of the present utility model.
Claims (11)
1. a LED lines light source comprises:
Packaging frame, that described packaging frame comprises is heat sink, electrode and reflecting plate,
Be arranged on the LED chip on heat sink in packaging frame,
The wire that connects LED chip and electrode, and
The light transmission filler of protection LED chip and wire,
It is characterized in that, described packaging frame is by described heat sink, described electrode and the integrally formed elongated member of described reflecting plate.
2. LED lines light source as claimed in claim 1, is characterized in that, described reflecting plate comprises reflecting plate and lower reflecting plate, and described lower reflecting plate forms a plurality of recesses, and described recess is linear array, and one or more LED chips are installed in each recess.
3. LED lines light source as claimed in claim 2, is characterized in that, described upper reflecting plate is around the top of described a plurality of recesses in described lower reflecting plate.
4. LED lines light source as claimed in claim 2, is characterized in that, described recess has four inclined sides and a bottom surface, and described bottom surface heat sinkly consists of described at least in part.
5. LED lines light source as claimed in claim 2 or claim 3, is characterized in that, described light transmission filler is filled in the recess and upper reflecting plate of described lower reflecting plate, forms the transparent surface of described LED lines light source.
6. LED lines light source as claimed in claim 1, it is characterized in that, the described heat sink bottom that is positioned at described reflecting plate, described heat sink upper surface exposes in described reflecting plate, described LED chip cements in described heat sink upper surface, described heat sink lower surface below described reflecting plate to exposing outside.
7. LED lines light source as claimed in claim 1, is characterized in that, described electrode is positioned at described heat sink periphery, and described electrode and described heat sink laying respectively at least two planes of staggering each other.
8. LED lines light source as described as claim 1 or 7, is characterized in that, described electrode comprises the internal electrode outer electrode outer with being positioned at packaging frame that is positioned at packaging frame, and described internal electrode partly is exposed in reflecting plate.
9. LED lines light source as claimed in claim 8, is characterized in that, described transparent surface to outer surface, be plane or arcwall face.
10. LED lines light source as claimed in claim 1, is characterized in that, described reflecting plate is by injection moulding and described electrode and heat sink forming as one.
11. LED lines light source as claimed in claim 1, is characterized in that, described heat sink and described electrode is made by metal material, and described reflecting plate is made by insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204786635U CN203367279U (en) | 2013-08-06 | 2013-08-06 | LED line light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204786635U CN203367279U (en) | 2013-08-06 | 2013-08-06 | LED line light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203367279U true CN203367279U (en) | 2013-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013204786635U Expired - Fee Related CN203367279U (en) | 2013-08-06 | 2013-08-06 | LED line light source |
Country Status (1)
| Country | Link |
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| CN (1) | CN203367279U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347604A (en) * | 2013-08-06 | 2015-02-11 | 杭州友旺科技有限公司 | LED (Light Emitting Diode) line light source and manufacturing method thereof |
-
2013
- 2013-08-06 CN CN2013204786635U patent/CN203367279U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347604A (en) * | 2013-08-06 | 2015-02-11 | 杭州友旺科技有限公司 | LED (Light Emitting Diode) line light source and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20190806 |