CN203339142U - FCQFN packaging part filled with bottom filling material - Google Patents

FCQFN packaging part filled with bottom filling material Download PDF

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Publication number
CN203339142U
CN203339142U CN201320393209XU CN201320393209U CN203339142U CN 203339142 U CN203339142 U CN 203339142U CN 201320393209X U CN201320393209X U CN 201320393209XU CN 201320393209 U CN201320393209 U CN 201320393209U CN 203339142 U CN203339142 U CN 203339142U
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projection
chip
pin projection
bosses
interior pin
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Expired - Lifetime
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CN201320393209XU
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Inventor
徐召明
谌世广
钟环清
朱文辉
王虎
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Huatian Technology Xian Co Ltd
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Huatian Technology Xian Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The utility model discloses an FCQFN packaging part filled with bottom filling material. The FCQFN packaging part filled with the bottom filling material is mainly composed of a bare copper frame, front-face copper grooves, blocking bosses, an inner pin bosses, inner pin NiPdAu material, the bottom filling material, chips, Sn-Ag bumps, outer pin bosses, plastic sealing material and solder balls. The bare cooper frame includes the blocking bosses, the inner pin bosses and the outer pin bosses. The front-face copper grooves are disposed between the blocking bosses and the inner pin bosses. The inner pin bosses are coated with the inner pin NiPdAu material and are connected with the Sn-Ag bumps on the chips through the inner pin NiPdAu material. The bottom filling material surrounds the inner pin bosses, the Sn-Ag bumps of the chips and the lower surfaces of the chips. The outer pin bosses are disposed on the back faces of the inner pin bosses. The tin balls are disposed on the outer pin bosses. The bare copper frame is provided with the back-face copper grooves arranged on two sides of the outer pin bosses and filled with the plastic sealing material. The chips, the Sn-Ag bumps, the inner pin NiPdAu material, the inner pin bosses, the outer pin bosses and the tin balls constitute a power source and a signal channel. According to the utility model, a technological process is simplified and production efficiency is improved.

Description

The FCQFN packaging part that filler of a kind of end is filled
Technical field
The utility model relates to electronic information Element of automatic control manufacturing technology field, the FCQFN packaging part that specifically filler of a kind of end is filled.
Background technology
Flip Chip is a kind of chip interconnects technology, is again a kind of desirable die bonding technology.Before 30 years, IBM Corporation has researched and developed and has used this technology.But until in recent years,, Flip-Chip became the packing forms often adopted in high-end device and high-density packages field.Today, the range of application of Flip-Chip encapsulation technology is increasingly extensive, and packing forms is variation more, to the also raising thereupon of requirement of Flip-Chip encapsulation technology.Simultaneously, Flip-Chip has also proposed a series of new severe challenges to the producer, and the reliable support of encapsulation, assembling and test is provided for the technology of this complexity.One-level sealing technique in the past is all that the active area of chip is faced up, and bonding back to substrate and after pasting, as Bonding and carrier band sound (TAB) automatically.Flip-Chip faces substrate by the chip active area, realizes the interconnection of chip and substrate by the solder system silver salient point that is arrayed on chip.Silicon chip directly is installed to PCB in the back-off mode and draws I/O from silicon chip to surrounding, and interconnected length shortens greatly, has reduced the RC delay, has effectively improved electrical property.Obviously, this chip interconnects mode can provide higher I/O density.The upside-down mounting occupied area is almost consistent with die size.In all surface mounting technique, flip-chip can reach minimum, the thinnest encapsulation.
But, in traditional handicraft, chip tin silver salient point can subside in reflux course in fusing, between two chip tin silver salient points, because connecting, tin causes short circuit.
The utility model content
The problem existed with regard to above-mentioned prior art; the FCQFN packaging part that the utility model provides filler of a kind of end to fill; chip tin silver salient point and frame pin projection after end filler is filled are not easy to occur bridge joint in reflux course, and chip tin silver salient point is had to certain support and protective effect.Easily overflow scope in view of end filler in injecting glue and solidification process, erode away on bare copper frame and stop projection for this reason, end filler is controlled within limits.
The FCQFN packaging part that filler of a kind of end is filled, mainly by bare copper frame, front copper groove, stop that projection, interior pin projection, interior pin NiPdAu, end filler, chip, tin silver salient point, outer pin projection, plastic packaging material and tin ball form.Described bare copper frame comprises and stops projection, interior pin projection and outer pin projection, stop between projection and interior pin projection it is front copper groove, be coated with interior pin NiPdAu on interior pin projection, and bonding by the silver of the tin on interior pin NiPdAu and chip salient point, filler of the described end has surrounded the tin silver salient point of interior pin projection, chip and the lower surface of chip, the described interior pin projection back side is outer pin projection, on outer pin projection, the tin ball is arranged, bare copper frame has back side copper groove, back side copper groove is pin projection both sides outside, and plastic packaging material is filled in the copper groove of the back side.Chip, tin silver salient point, interior pin NiPdAu, interior pin projection, outer pin projection and tin ball have formed power supply and signalling channel.
The internal pin projection of end filler, chip and Xi Yin salient point have played protection and supporting role.The external pin projection of plastic packaging material has played the slip-off preventing effect, has improved product reliability.Interior pin projection and outer pin projection are to form the part of signalling channel by the method for exposure, development and corrosion.The tin ball is to form by the printing of tin cream steel mesh, Reflow Soldering on the outer pin projection after corrosion.
The technical process of the manufacture craft of the FCQFN packaging part that filler of a kind of end is filled:
The wafer attenuate wafer Dicing
Figure 456970DEST_PATH_IMAGE001
naked framework coating printing ink
Figure 382200DEST_PATH_IMAGE001
exposure imaging
Figure 668825DEST_PATH_IMAGE002
bare copper frame half corrosion
Figure 730322DEST_PATH_IMAGE001
interior pin nickel plating porpezite
Figure 14673DEST_PATH_IMAGE001
glue is filled at the end core in upside-down mounting
Figure 517515DEST_PATH_IMAGE001
reflux, solidify the framework thinning back side
Figure 951088DEST_PATH_IMAGE001
pin corrosion is separated
Figure 913228DEST_PATH_IMAGE004
framework back side pad pasting
Figure 479338DEST_PATH_IMAGE001
the secondary plastic packaging paste solder printing is planted ball
Figure 203898DEST_PATH_IMAGE001
separation of products packing
Figure 23135DEST_PATH_IMAGE001
delivery.
The silver salient point Reflow Soldering of chip tin and end filler are solidificated in reflow soldering and once complete, and have simplified technological process, have improved again production efficiency.The method, at the bare copper frame flip-chip-on, is then filled with special end filler, and the first Reflow Soldering of chip tin silver salient point, solidify after end filler, without cleaning residual flux, can effectively avoid cavity.The relatively traditional plastic packaging material of filler of the described end is short curing time, has shortened life cycle of the product, has greatly improved production efficiency.And the water absorption rate of the relative plastic packaging material of end filler is lower, matched coefficients of thermal expansion is good, can offset thermal stress and the mechanical stress of chip tin silver salient point and frame pin projection.
After the corrosion of frame outer pin projection separates, adopt the secondary plastic package process, plastic packaging material is filled to back side copper groove.Evidence, the cementability of plastic packaging material and copper is better than green paint, can effectively protect pin, and reliability gets a promotion.
The method is on the basis of multi-turn FCQFN encapsulation technology, gropes voluntarily the test tackling key problem, breaks through its technological difficulties, and this encapsulation technology realizes the pad array layout, greatly increases the I/O number.It combines the advantage of reverse installation process and etching process, utilizes bare copper frame as carries chips and the main material that is connected signal path, makes joint efficiency higher, has shortened electric current and signal transmission distance, has improved electrical property and product reliability.In addition, this method has numerous advantages such as miniaturization, high reliability, low cost, can meet the requirement of high density, high-performance, the encapsulation of multi-functional and high I/O number.
The accompanying drawing explanation
Fig. 1 bare copper frame profile;
Fig. 2 bare copper frame applies the photosensitive-ink profile;
Fig. 3 bare copper frame exposure imaging profile;
Profile after half corrosion of Fig. 4 bare copper frame;
Pin nickel plating porpezite profile in Fig. 5;
Fill in the glue profile at the bottom of Fig. 6;
Core profile in Fig. 7 upside-down mounting;
Profile after Fig. 8 refluxes and solidifies;
The naked framework thinning back side of Fig. 9 profile;
Figure 10 pin corrosion is separated profile;
Figure 11 bare copper frame back side pad pasting profile;
Figure 12 secondary plastic packaging profile;
Figure 13 paste solder printing is planted the ball profile;
Figure 14 separation of products profile.
In figure, 1 is bare copper frame, and 2 is printing ink, 3 is front copper groove, and 4 for stopping projection, and 5 is interior pin projection, 6 is interior pin NiPdAu, and 7 is end filler, and 8 is chip, 9 is tin silver salient point, the 10 copper layers that are corrosion thinning, and 11 is outer pin projection, 12 is back side copper groove, and 13 is glued membrane, and 14 is plastic packaging material, 15 is the tin ball, and 16 is Cutting Road.
Embodiment
Below in conjunction with accompanying drawing, the utility model is done and is described in further detail.
As shown in figure 14, the FCQFN packaging part that filler of a kind of end is filled, mainly by bare copper frame 1, front copper groove 3, stop that projection 4, interior pin projection 5, interior pin NiPdAu 6, end filler 7, chip 8, tin silver salient point 9, outer pin projection 11, plastic packaging material 14 and tin ball 15 form.Described bare copper frame 1 comprises and stops projection 4, interior pin projection 5 and outer pin projection 11, stop between projection 4 and interior pin projection 5 it is front copper groove 3, be coated with interior pin NiPdAu 6 on interior pin projection 5, and bonding with the tin silver salient point 9 on chip 8 by interior pin NiPdAu 6, filler of the described end 7 has surrounded interior pin projection 5, the tin silver salient point 9 of chip 8 and the lower surface of chip 8, described interior pin projection 5 back sides are outer pin projection 11, on outer pin projection 11, tin ball 15 is arranged, bare copper frame 1 has back side copper groove 12, back side copper groove 12 is pin projection 11 both sides outside, plastic packaging material 14 is filled in back side copper groove 12.Chip 8, tin silver salient point 9, interior pin NiPdAu 6, interior pin projection 5, outer pin projection 11 and tin ball 15 have formed power supply and signalling channel.
In 7 pairs of end fillers, pin projection 5, chip 8 and Xi Yin salient point 9 have played protection and supporting role.The external pin projection 11 of plastic packaging material 14 has played the slip-off preventing effect, has improved product reliability.Interior pin projection 5 is to form the part of signalling channel by the method for exposure, development and corrosion with outer pin projection 11.Tin ball 15 is to form by the printing of tin cream steel mesh, Reflow Soldering on the outer pin projection 11 after corrosion.
The technical process of the manufacture craft of the FCQFN packaging part that filler of a kind of end is filled:
The wafer attenuate
Figure 913731DEST_PATH_IMAGE001
wafer Dicing
Figure 710785DEST_PATH_IMAGE001
naked framework coating printing ink exposure imaging
Figure 555430DEST_PATH_IMAGE002
bare copper frame half corrosion
Figure 628429DEST_PATH_IMAGE001
interior pin nickel plating porpezite
Figure 596385DEST_PATH_IMAGE001
glue is filled at the end
Figure 754834DEST_PATH_IMAGE003
core in upside-down mounting
Figure 466438DEST_PATH_IMAGE001
reflux, solidify
Figure 331625DEST_PATH_IMAGE001
the framework thinning back side
Figure 532800DEST_PATH_IMAGE001
pin corrosion is separated
Figure 116228DEST_PATH_IMAGE004
framework back side pad pasting
Figure 428260DEST_PATH_IMAGE001
the secondary plastic packaging paste solder printing is planted ball
Figure 785609DEST_PATH_IMAGE001
separation of products
Figure 856334DEST_PATH_IMAGE001
packing
Figure 972057DEST_PATH_IMAGE001
delivery.
As shown in Fig. 1 to Figure 14, the manufacture craft of the FCQFN packaging part that filler of a kind of end is filled, it carries out according to following steps:
The first step, wafer attenuate: the wafer attenuate is first roughly ground rear fine grinding, and from the clean wafer reduced thickness to final thickness, fine grinding speed: 10 μ m/s-20 μ m/s adopt and prevent fragment technique.In order to make the attenuate glued membrane firmly adsorb wafer frontside, prevent from revealing vacuum, require bondline thickness can reach the height of chip tin silver salient point 9.
The highly chip tin silver salient point 9 of 0.15 ㎜ of take is example explanation wafer attenuate.Wafer thickness 736 μ m, final thickness thinning is 500 μ m.Embodiment: the attenuate glued membrane that is 0.15 ㎜ by bondline thickness is bonded in wafer frontside by automatic placement machine, and then first fine grinding is roughly ground again, and making the wafer final thickness is 350 μ m.Last glued membrane is under the irradiation of UV ultraviolet light, and the glue-line cohesiveness can reduce gradually, causes glued membrane to be taken off.
Second step, Wafer Dicing: the above wafer of 150 μ m is with common scribing process, but thickness is used double-pole scribing machine and technique thereof at the following wafer of 150 μ m.
The 3rd step, bare copper frame coating printing ink: in the photosensitive-ink 2 of bare copper frame 1 surface screen-printed one deck 20 μ m, then with baking oven, printing ink 2 is dried, temperature and time is 75 ℃/15min, removes the moisture in printing ink.Thin layer ink coats bare copper frame surface section figure as shown in Figure 2.
The 4th step, printing ink exposure, development: will have the photomask blank (exposed film) of figure to utilize a kind of ultraviolet light perspective, the figure optics video picture of needs is arrived to bare copper frame 1 bottom, under effect by liquid medicine sodium carbonate, after the printing ink of unexposed portion 2 is dissolved and rinsing, stay the part of sensitization.2, printing ink is stayed on the plate face, protects the not etched liquid medicine of following copper face to dissolve.Figure after the printing ink exposure imaging is as shown in 3.
The 5th step, bare copper frame half corrosion: unexposed copper on bare copper frame 1 being etched away, form and stop projection 4, interior pin projection 5, is front copper groove 3 between the two.As shown in Figure 4.
The 6th step, interior pin nickel plating porpezite: in order to make chip 8 tin silver salient points 9, with frame inner pin projection 5, effectively form intermetallic compound, and prevent 5 oxidations of frame inner pin projection, need to be in frame inner pin projection 5 surface chemical plating one decks pin NiPdAu 6, ratio is nickel: 0.5 μ m min, palladium: 0.02 μ m min, gold: 0.003 μ m min, as shown in Figure 5.
Glue is filled at the 7th step, the end: 7 of the end fillers of certain mass are watered to whole interior pin projection 5 zones, stop that projection 4 is blocked in interior pin projection 5 zones by end filler 7, prevents that end filler 7 is excessive.The glue that end filler 7 is comprised of silica dioxide granule, epoxy resin and associated additives, be applied to chip 8 and fill above with the space of framework, and hot, mechanical protection is provided, and the protection of environment also is provided.The filling of silica dioxide granule has reduced the CTE of end filler 7, once end filler 7 be cured, will be looped around welding knot around, and play a supportive role, so it can absorb stress and the tension force of welding knot.Therefore, the thermal cycle life of welding knot is greatly improved, or even bottom is not filled out 10 times that rush reliability.The tin silver salient point 9 that end filler 7 also must meet on chip 8 is not cured in reflow process, to prevent tin silver salient point 9 weld failure.Glue is filled in as shown in Figure 6 in the end.
Core in the 8th step, upside-down mounting: 180 ° of chip 8 upsets accurately are attached on bare copper frame 1, tin silver salient point 9 on chip 8 and interior pin projection 5 combinations on corresponding bare copper frame 1, stop that projection 4 by 7 controls of end filler within limits, prevent that it is excessive, affect the space that end filler 7 is filled between chip 1 and bare copper frame 1.Profile in upside-down mounting after core as shown in Figure 7.
The 9th step, backflow, curing: at first, the tin of chip 8 silver salient point 9 overlaps and contacts with the center line of the interior pin projection 5 of bare copper frame 1; Secondly, the temperature of each warm area of reflow soldering rationally is set, maximum temperature is 255 ± 5 ℃, and return time is 50 ~ 70 seconds, and tin silver salient point 9 first effectively forms welding knot, i.e. intermetallic compound with interior pin projection 5; Simultaneously, the 7 Heated Flow enhancings of end filler, fill the space between chip 8 and bare copper frame 1 fully, and end filler 7 rises to 3/4ths places of chip 8, and 8 four angles of chip are wrapped fully; Along with the reflow soldering temperature continues to increase, filler 7 mobility in the end weaken gradually, and cross-linking reaction occurs internal structure gradually, both solidify; When the reflow soldering temperature rises to 265 ± 5 ℃, end filler 7 is fully curing, has protected packaging part; On the interior pin projection 5 of bare copper frame 1, without the brush scaling powder, the tin silver salient point 9 on chip 8 does not have welding assisted agent residuals with the interior pin projection 5 of bare copper frame 1 after reflow soldering, and end filler 7 is heated and can avoids empty generation while filling.After refluxing, solidifying, product profile is as shown in 8.
The tenth step, naked framework thinning back side: bare copper frame 1(copper frame thickness is decided to be to 0.127 ㎜) back side corrodes by chemical medicinal liquid (being mainly liquor ferri trichloridi), copper layer 10 thickness of corrosion thinning are 20 μ m ~ 30 μ m, the one, remove the oxide on naked copper surface, the 2nd, be convenient to the control with the post-etching precision.Bare copper frame after attenuate as shown in Figure 9.
The 11 step, pin corrosion are separated: will have the photomask blank (exposed film) of figure to utilize a kind of ultraviolet light perspective, the figure optics video picture of needs is arrived to bare copper frame 1 bottom, under effect by liquid medicine sodium carbonate, after the printing ink of unexposed portion 2 is dissolved and rinsing, stay the part of sensitization; Unexposed copper etching on bare copper frame 1 is disconnected, then with sodium hydroxide solution, the green paint of sensitization part is cleaned up, pin corrosion forms outer pin projection 11, back side copper groove 12 after separating.As shown in section Figure 10.
The 12 step, bare copper frame back side pad pasting: after corrosion, bare copper frame 1 back side a layer thickness is about the glued membrane 13 of 100 μ m.Profile as shown in figure 11.
The 13 step, secondary plastic packaging: fill back side copper groove 12 with plastic packaging material 14, then take glued membrane 13 off, by the copper surface exposure of outer pin projection 11 out.Profile as shown in figure 12.
The 14 step, paste solder printing are planted ball: on the naked copper surface of pin projection 11, steel mesh prints the tin cream of 0.12 ㎜ thickness outside, then at the temperature of 255 ℃, refluxes, and forms diameter 0.25 ㎜, the tin ball 15 of height 0.20 ㎜.Profile as shown in figure 13.
The 15 step, product cutting: with diamond blade, Cutting Road between product 16 is cut off, make separation of products.Profile as shown in figure 14.
The 16 step, packing are equal to conventional method.

Claims (1)

1. the FCQFN packaging part that filler is filled at the bottom of a kind is characterized in that: mainly by bare copper frame (1), front copper groove (3), stop that projection (4), interior pin projection (5), interior pin NiPdAu (6), end filler (7), chip (8), tin silver salient point (9), outer pin projection (11), plastic packaging material (14) and tin ball (15) form, described bare copper frame (1) comprises and stops projection (4), interior pin projection (5) and outer pin projection (11), stop between projection (4) and interior pin projection (5) it is front copper groove (3), be coated with interior pin NiPdAu (6) on interior pin projection (5), and bonding with the tin silver salient point (9) on chip (8) by interior pin NiPdAu (6), filler of the described end (7) has surrounded interior pin projection (5), the tin silver salient point (9) of chip (8) and the lower surface of chip (8), described interior pin projection (5) back side is outer pin projection (11), tin ball (15) is arranged on outer pin projection (11), bare copper frame (1) has back side copper groove (12), back side copper groove (12) is pin projection (11) both sides outside, plastic packaging material (14) is filled in back side copper groove (12), chip (8), tin silver salient point (9), interior pin NiPdAu (6), interior pin projection (5), outer pin projection (11) and tin ball (15) have formed power supply and signalling channel.
CN201320393209XU 2013-07-03 2013-07-03 FCQFN packaging part filled with bottom filling material Expired - Lifetime CN203339142U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400812A (en) * 2013-07-03 2013-11-20 华天科技（西安）有限公司 FCQFN packaging part filled by underfill material and production process thereof
CN109623071A (en) * 2017-10-06 2019-04-16 肖特股份有限公司 Matrix and its manufacturing method and purposes with soldering grounding pin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400812A (en) * 2013-07-03 2013-11-20 华天科技（西安）有限公司 FCQFN packaging part filled by underfill material and production process thereof
CN109623071A (en) * 2017-10-06 2019-04-16 肖特股份有限公司 Matrix and its manufacturing method and purposes with soldering grounding pin
US11205610B2 (en) 2017-10-06 2021-12-21 Schott Ag Base body with soldered-on ground pin, method for its production and uses thereof

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Granted publication date: 20131211