CN203299771U - Touch panel - Google Patents
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- CN203299771U CN203299771U CN2013200792764U CN201320079276U CN203299771U CN 203299771 U CN203299771 U CN 203299771U CN 2013200792764 U CN2013200792764 U CN 2013200792764U CN 201320079276 U CN201320079276 U CN 201320079276U CN 203299771 U CN203299771 U CN 203299771U
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Abstract
The utility model discloses a touch panel. The touch panel comprises a cover plate, a shielding layer, an attached pattern layer, a sensing electrode layer and a signal lead layer, wherein the cover plate is provided with a visible range and a frame area surrounding the visible range, and at least one connecting area is defined in the frame area. The shielding layer is arranged on the cover plate and located inside the frame area. The attached pattern layer is arranged on the shielding layer and is at least located inside the connecting area. The sensing electrode layer is arranged on the cover plate and extends to the shielding layer of the frame area from the visible region. The signal lead layer is arranged on the shielding layer and is located inside the frame area. The signal lead layer comprises a plurality of leads, one ends of the leads are electrically connected to the sensing electrode layer, and the other ends of the leads are converged to the attached pattern layer of the connecting layer. By means of the touch panel, the problem that the leads disengage from the shielding layer can be improved, and then the yield of the touch panel can be improved.
Description
Technical field
The utility model system is relevant for a kind of contact panel, particularly relevant for a kind of contact panel that increases lead-in wire adhesion.
Background technology
Along with the development of Information of Science and Technology, contactor control device become man-machine between one of the mode transmitted of information, common contactor control device comprises contact panel and two major parts of display panel.Wherein, the touch panel structure provided of individual layer is the trend of industry technical development.Individual layer touch panel structure provided has visible area and around the rim area of visible area, its agent structure includes cover plate, be formed on cover plate and be positioned at rim area shielding layer, be formed on cover plate and be positioned at the touch-control sensing assembly of visible area, and be formed at the lead-in wire that is electrically connected the touch-control sensing assembly on shielding layer.Cover series of strata in order to cover lead-in wire, avoid in follow-up use, visual problem goes between.The electric signal that lead-in wire system produces in order to transmit the touch-control sensing assembly, typically, an end of lead-in wire is electrically connected the touch-control sensing assembly, and the other end converges at least one bonding land.The other end that converges to the lead-in wire of bonding land passes through to engage flexible circuit board, and then the signal of touch-control sensing assembly is delivered in processor.In known contact panel method for making, due to the adhesion deficiency of lead-in wire on shielding layer, when engaging flexible circuit board, the effect of bond stress may cause signal lead to come off from shielding layer, and then can affect the yield of contact panel.
Therefore, be necessary to seek a kind of new contact panel, it can solve or improve above-mentioned problem.
The utility model content
The utility model system provides a kind of contact panel, comprising: a cover plate, and have a visible area and reach the rim area around this visible area, in this rim area, also define at least one bonding land; One shielding layer, be arranged on this cover plate, and be positioned at this rim area; One attached pattern layer, be arranged on this shielding layer, and be positioned at least this bonding land; One sensing electrode layer, be arranged on this cover plate, and extend on this shielding layer of this rim area from this visible area; One signal lead layer, be arranged on this shielding layer, and be positioned at this rim area, and this signal lead layer comprises the plural number lead-in wire, and respectively an end of this lead-in wire is electrically connected at this sensing electrode layer, and the other end converges on the attached pattern layer of this bonding land.
Adopt contact panel of the present utility model, by between shielding layer and lead-in wire, the attached pattern layer being set, can improve the problem that lead-in wire comes off from shielding layer, and then can improve the yield of contact panel.
The accompanying drawing explanation
Figure 1A to Fig. 1 E system shows the floor map of the touch panel structure provided manufacture method of the utility model embodiment;
Fig. 1 C-1, Fig. 1 C-2 and Fig. 1 C-3 system show the floor map of arranging the attached pattern layer of the mode of putting according to the difference of the utility model embodiment;
Fig. 2 A to Fig. 2 E system shows in Figure 1A to Fig. 1 E of the utility model embodiment along the diagrammatic cross-section of the touch panel structure provided manufacture method of I-I ' line;
Fig. 3 A to Fig. 3 E system shows the floor map of the touch panel structure provided manufacture method of another embodiment of the utility model;
Fig. 4 A to Fig. 4 E system shows in Fig. 3 A to Fig. 3 E of another embodiment of the utility model along the diagrammatic cross-section of the touch panel structure provided manufacture method of I-I ' line;
Fig. 5 A to Fig. 5 E system shows the floor map of the touch panel structure provided manufacture method of another embodiment of the utility model;
Fig. 5 C-1, Fig. 5 C-2 and Fig. 5 C-3 system show the floor map of arranging the attached pattern layer of the mode of putting according to the difference of another embodiment of the utility model;
Fig. 6 A to Fig. 6 E system shows in Fig. 5 A to Fig. 5 E figure of another embodiment of the utility model along the diagrammatic cross-section of the touch panel structure provided manufacture method of I-I ' line;
Fig. 7 A to Fig. 7 E system shows the floor map of the touch panel structure provided manufacture method of another embodiment of the utility model;
Fig. 8 A to Fig. 8 E system shows in Fig. 7 A to Fig. 7 E of another embodiment of the utility model along the diagrammatic cross-section of the touch panel structure provided manufacture method of I-I ' line.
Fig. 9 system shows the touch panel structure provided of another embodiment of the utility model;
[main element symbol description]
The 100-cover plate;
The 110-visible area;
The 120-rim area;
The 200-shielding layer;
240,240A, 240B, 240C, 240D-attached pattern layer;
260-signal lead layer;
The 260a-lead-in wire;
300-sensing electrode layer
310-the first electrode block;
The 320-connecting line;
330-the second electrode block;
The 340-insulation course;
The 340a-collets;
The 340b-hollow hole;
The 400-protective seam;
400a-protects piece;
The M-bonding land.
Embodiment
Contact panel and the manufacture method thereof of the utility model embodiment below are described.Yet, can understand easily embodiment provided by the utility model and only for explanation, with ad hoc approach, make and use the utility model, not in order to limit to scope of the present utility model.Moreover, in the graphic and description of the utility model embodiment, be to represent same or analogous parts with identical label.
Please refer to Fig. 1 E and Fig. 2 E, wherein Fig. 1 E shows the contact panel floor map according to the utility model embodiment, and Fig. 2 E shows in Fig. 1 E the contact panel diagrammatic cross-section along I-I ' line.In the present embodiment, contact panel comprises: a cover plate 100, have the rim area 120 that a visible area 110 reaches around visible area, and in rim area 120, define a bonding land M; One shielding layer 200, be arranged on the cover plate 100 of rim area 120; One attached pattern layer 240A, be arranged on the shielding layer 200 of bonding land M; One sensing electrode layer 300, be arranged on the cover plate 100 of visible area 110, and extend on the shielding layer 200 of rim area 120 from visible area 110; One signal lead layer 260, be arranged on shielding layer 200, and signal lead layer 260 comprises plural number lead-in wire 260a, and respectively the end of this lead-in wire 260a is electrically connected at sensing electrode layer 300, and the other end converges to bonding land M.
Wherein, cover plate 100 can be consisted of other transparent cover plate materials of commonly using such as glass material or PET.Cover plate 100 can select hard material maybe can disturb the material of formula.Cover plate 100 can be flat shape, curve form, or aforementioned combination.
In the present embodiment, as shown in Fig. 1 E, the part edge that attached pattern layer 240A carries over rim area 120 is formed on shielding layer 200.Attached pattern layer 240A can consist of insulating material, as polypropylene (Polypropylene), the inferior acid amides (Polyimide) of polyamides, acryl resin (Acrylic), monox (Silicon Dioxide, SiO2), silicon nitride (Silicon Nitride, Si3N4), aluminium oxide (Aluminum Oxide, Al2O3) or hexamethyldisilazane (Hexame thy ldisilazane, HMDS), or aforementioned combination form.
In one embodiment, the attached pattern layer can only be arranged on the shielding layer 200 of bonding land M (as the attached pattern layer 240C of Fig. 1 C-2 or the attached pattern layer 240D of Fig. 1 C-3).
In one embodiment, the width of lead-in wire 260a can equal the width of the attached pattern layer of its below, and the 260a that namely goes between will have identical upper end out line with the attached pattern layer, for example the attached pattern layer 240D of the attached pattern layer 240B of Fig. 1 C-1 or Fig. 1 C-3.Need point out, the width that the live width of each 260a that goes between equals the attached pattern layer of its below belongs to comparatively ideal situation, and in actual product, the width of each 260a that goes between also can be less than the width of the attached pattern layer below it.
More particularly, when the width of lead-in wire 260a is equal to or less than the width of attached pattern layer of its below, this moment, the attached pattern layer was except can selecting the aforementioned insulating material of mentioning, also can be formed by conductive material, as tin indium oxide, indium zinc oxide, oxidation gallium indium tin, carbon nanotube, Nai Miyin line, or aforementioned combination forms.Be understood that, 260a is electrically insulated each other due to each lead-in wire, and when the attached pattern layer adopts conductive material, the attached pattern layer that is formed at the 260a below that respectively goes between also will be electrically insulated each other.
As shown in Fig. 1 E, in the present embodiment, sensing electrode layer 300 is arranged on the cover plate 100 of visible area 110, and extends on shielding layer 200 from visible area 110, and then guarantees that the position of shielding layer 200 button signs can have touch controllable function.In the present embodiment, sensing electrode layer 300 comprises: the first axial electrode that plural number is arranged along a first direction, and each first axial electrode comprises the connecting line 320 of a plurality of the first electrode blocks 310, adjacent the first electrode block 310 of a plurality of connection; The second axial electrode that plural number is arranged along a second direction, and respectively second axial electrode comprises a plurality of the second electrode blocks 330, and wherein each second electrode block 330 is arranged at connecting line 320 both sides; Plural number bonding line 350, be electrically connected the second adjacent electrode block 320; Insulation course 340, be arranged between connecting line 320 and bonding line 350, in order to connecting line 320 and the bonding line 350 of being electrically insulated.In the present embodiment, insulation course 340 comprises plural collets 340a, and each collets 340a is arranged between connecting line 320 and bonding line 350.The first electrode block 310, connecting line 320, the second electrode block 330 adopt transparent conductive material to form, as tin indium oxide, indium zinc oxide, carbon nanotube, Nai Miyin line, Graphene, or aforementioned being combined to form.Bonding line 350 can adopt the transparent conductive materials such as the metal materials such as silver, copper, tin indium oxide, or aforementioned combination.Insulation course 340 can adopt the insulating material identical with attached pattern layer 240A, and then both can form simultaneously.In another embodiment, sensing electrode layer 300 also can adopt other electrode structure, as the electrode structure of the non-cross-over connection of Fig. 9.
The lead-in wire 260a of signal lead layer 260 can be by transparent conductive materials such as the metal materials such as copper, silver, aluminium, tin indium oxides (ITO), or aforementioned combination forms, and the 260a that namely goes between can adopt the material identical with bonding line 350.Separately it should be noted that, the quantity of bonding land M and position can be according to shape and the sizes of sensing electrode layer 340, and the number of lead-in wire 260a adjusts, the quantity shown in being not limited to as shown.
Please also refer to Fig. 1 E and Fig. 2 E, protective seam 400 is arranged on cover plate 100, is covered in shielding layer 200, sensing electrode layer 300, reaches on part signal trace layer 260.It should be noted that, in Fig. 1 E, the profile of partly go between 260a and sensing electrode layer 300 represents with phantom line segments; system is to illustrate that this part protected seam is covered, and the position of protective seam 400 please also refer to Fig. 2 E, below each embodiment about this characteristic of protective seam; all, as example, repeat no more.Protective seam 400 can be consisted of monox or photoresistance.Protective seam 400 exposes the lead-in wire 260a that is positioned at bonding land M, in order to follow-uply by conducting resinl (not illustrating), the lead-in wire 260a in the M of bonding land is engaged in to flexible circuit board.Separately, protective seam 400, except protecting whole touch-control structure, also also is conducive to improve lead-in wire 260a in the problem that easily comes off from shielding layer 200.
Please refer to Fig. 3 E and Fig. 4 E, wherein Fig. 3 E shows the touch panel structure provided floor map of another embodiment of the utility model, and Fig. 4 E shows in Fig. 3 E the contactor control device structural profile schematic diagram along I-I ' line, and the parts system that wherein is same as Fig. 1 E and Fig. 2 E uses identical label and the description thereof will be omitted.In the present embodiment, touch panel structure providedly be similar to the touch panel structure provided of Fig. 1 E and Fig. 2 E, difference is in the attached pattern layer 240 of rim area 120 and may extend on whole visible area 110, and namely insulation course 340 adopts same material with attached pattern layer 240, and can in same step, form.On insulation course 340 corresponding to the position of each the second electrode block 330, be formed with hollow hole 340b, bonding line 350 is electrically connected the second adjacent electrode block 330 by hollow hole 340b, and lead-in wire 260a also is electrically connected the first electrode block 310 or the second electrode block 330 by hollow hole 340.Moreover protective seam 400 more comprises spaced plural number protection piece 400a, and correspondence is arranged on the lead-in wire 260a of the interior bonding line 350 of visible area 110 and rim area.Identical with previous embodiment, be positioned at not protected seam 400 coverings of lead-in wire 260a of bonding land M.Touch panel structure provided other characteristic of the present embodiment is identical with last embodiment, repeats no more herein.
Please refer to Fig. 5 E and Fig. 6 E, wherein Fig. 5 E shows the contactor control device structural plan schematic diagram of another embodiment of the utility model, and Fig. 6 E shows in Fig. 5 E the contactor control device structural profile schematic diagram along I-I ' line, and the parts system that wherein is same as Fig. 1 E and Fig. 2 E uses identical label and the description thereof will be omitted.In the present embodiment, touch panel structure providedly be similar to the touch panel structure provided of Fig. 1 E and Fig. 2 E, difference be in, with respect to cover plate 100, conversion has been carried out in the position of the bonding line 350 of sensing electrode layer 300 and the first electrode block 310, connecting line 320, the second electrode block 330.Body ground more specifically, bonding line 350 is arranged on cover plate 100 accordingly, each collets 340a of insulation course 340 is arranged on bonding line 350, the first electrode block 310, the staggered row of the second electrode block 330 put and play on cover plate 100, the first adjacent electrode block 310 is electrically connected by the connecting line 320 that is arranged on collets 340a, and the second adjacent electrode block 330 is electrically connected by bonding line 350.Touch panel structure provided other characteristic and first of the present embodiment is implemented identical, repeats no more herein.
Please refer to Fig. 7 E and Fig. 8 E, wherein Fig. 7 E shows the touch panel structure provided floor map of another embodiment of the utility model, and Fig. 8 E shows in Fig. 7 E the touch panel structure provided diagrammatic cross-section along I-I ' line, and the parts system that wherein is same as Fig. 3 E and Fig. 4 E uses identical label and the description thereof will be omitted.In the present embodiment, touch panel structure providedly be similar to the touch panel structure provided of Fig. 3 E and Fig. 4 E, difference be in, with respect to cover plate 100, conversion has been carried out in the position of the bonding line 350 of sensing electrode layer and the first electrode block 310, connecting line 320, the second electrode block 330, body ground more specifically, and bonding line 350 is arranged on cover plate 100 accordingly, insulation course 340 is covered on cover plate 100 comprehensively, and is formed with hollow hole 340b on the insulation course 340 corresponding to each the second electrode block 330 link positions.The first electrode block 310, the staggered row of the second electrode block 330 are placed on insulation course 340.The first adjacent electrode block 310 is electrically connected by the connecting line 320 that is arranged on insulation course 340; Bonding line 350 is electrically connected the second adjacent electrode block 330 by hollow hole 340b.Separately, the touch panel structure provided protective seam 400 of the present embodiment is covered in the first electrode block 310, connecting line 320, the second electrode block 330 and part and goes between 260a above, and is positioned at not protected seam 400 coverings of lead-in wire 260a of bonding land M.Touch panel structure provided other characteristic of the present embodiment is identical with the touch panel structure provided enforcement that 3E and 4E figure illustrate, and repeats no more herein.
Separately touch panel structure provided in conjunction with Fig. 9 please, be understood that, the structure of sensing electrode layer 300 of the present utility model can be not limited to the structure of aforementioned each embodiment twin shaft cross-over connection, also can adopt the structure as Fig. 9.
The utility model separately provides a kind of manufacturing method thereof of contact panel, comprise following steps: form a shielding layer on a cover plate, cover plate has a visible area and reaches the rim area around visible area, in rim area, define at least one bonding land, and shielding layer is positioned at rim area, it is arranged on cover plate, and is positioned at rim area; Form an attached pattern layer, it is arranged on shielding layer, and is positioned at bonding land; Form a sensing electrode layer, it is arranged on cover plate, and is positioned at visible area; Form a signal lead layer, it is arranged on shielding layer, and is positioned at rim area, and the signal lead layer comprises the plural number lead-in wire, and respectively end of lead-in wire is electrically connected at the sensing electrode layer, and the other end converges on the attached pattern layer of bonding land.In one embodiment, the sensing electrode layer can extend on the shielding layer of rim area from visible area.
Separately, adoptable concrete fabrication steps below will be described in detail when sensing electrode layer 300 adopts the electrode structure as Fig. 2 E, Fig. 4 E, Fig. 6 E or Fig. 8 E in detail.Need first chat brightly, in concrete fabrication steps, other characteristic of NM each element can be with reference to aforementioned each touch panel structure provided description.
Figure 1A to 1E system shows the manufacture method floor map according to the contactor control device structure of the utility model embodiment, and Fig. 2 A to Fig. 2 E shows respectively in Figure 1A to Fig. 1 E the contactor control device structural profile schematic diagram along I-I ' line.Please refer to Figure 1A and Fig. 2 A, prepare a cover plate 100, it has a visible area 110 and around the rim area 120 of visible area 110.Then, form shielding layer 200 on cover plate 100, and shielding layer 200 is positioned at rim area 120.Shielding layer 200 can have plural hollow-out parts (not illustrating), as button sign of common contactor control device etc.In the present embodiment, shielding layer 200 can be consisted of printing ink or photoresist.For ink material, can adopt the technique of printing; For photoresist, can adopt photoetching process.
Please refer to Figure 1B and Fig. 2 B, the modes such as photoetching process or typography that see through form the first axial electrode that plural number is arranged along a first direction on the cover plate 100 of visible area 110, and respectively first axial electrode comprises the connecting line 320 of the first electrode block 310 that a plurality of the first electrode blocks 310, a plurality of connection are adjacent; The second axial electrode that plural number is arranged along a second direction, and respectively second line of induction axial electrode comprises a plurality of the second electrode blocks 330, and wherein each second electrode block 330 is arranged at connecting line 320 both sides.Wherein, part the first electrode block 310 may extend on the shielding layer 200 of rim area 120, and then guarantees that follow-up contact panel fringe region has preferably touch-control effect.
Please refer to Fig. 1 C and Fig. 2 C, see through photoetching process and form insulation course 340.Insulation course 340 comprises plural collets 340a, and each collets 340a is arranged on connecting line 320, and collets 340a system is in order to follow-up connecting line 320 and the bonding line 350 of being electrically insulated.
Further, the part edge that attached pattern layer 240A is carried over to rim area 120 is formed on shielding layer 200.Attached pattern layer 240A can consist of insulating material, as polypropylene (Polypropylene), the inferior acid amides (Polyimide) of polyamides, acryl resin (Acrylic), monox (Silicon Dioxide, SiO2), silicon nitride (Silicon Nitride, Si3N4), aluminium oxide (Aluminum Oxide, Al2O3) or hexamethyldisilazane (Hexame thy ldisilazane, HMDS), or aforementioned combination forms, and, when the attached pattern layer adopts the insulating material identical with insulation course 340, can form simultaneously with insulation course 340.
In one embodiment, the attached pattern layer can only be arranged on the shielding layer 200 of bonding land M (as the attached pattern layer 240C of Fig. 1 C-2 or the attached pattern layer 240D of Fig. 1 C-3).
In another embodiment, as shown in Fig. 1 C-1, the direction that attached pattern layer 240B carries over lead-in wire (as shown in the lead-in wire 260a of Fig. 1 D) extension of follow-up formation is formed on shielding layer 200, the width of the lead-in wire 260a of follow-up formation can equal the width of the attached pattern layer of its below, and both will have identical upper end out line.Need point out, the width that the width of the lead-in wire 260a of follow-up formation equals the attached pattern layer of its below belongs to comparatively ideal situation, and in actual product, the width of the lead-in wire 260a of follow-up formation also can be less than the width of the attached pattern layer below it.
More particularly, when the width of the lead-in wire 260a of follow-up formation is equal to or less than the width of attached pattern layer of its below (as shown in Fig. 1 C-1 and Fig. 1 C-3), this moment, the attached pattern layer was except can selecting the aforementioned insulating material of mentioning, also can be formed by conductive material, as tin indium oxide, indium zinc oxide, oxidation gallium indium tin, carbon nanotube, Nai Miyin line, or aforementioned combination forms.When the attached pattern layer adopted conductive material, in the present embodiment, it can form simultaneously with the first electrode block 310, connecting line 320, second electrode block 330 of sensing electrode layer 300.
Please refer to Fig. 1 D and Fig. 2 D, see through sputter, the photoetching process corresponding bonding line 350 that forms on each collets 340a, to be electrically connected the second adjacent electrode block 330b.So far, namely form the sensing electrode layer 300 of Fig. 1 E and Fig. 2 E.
Moreover, through sputter, photoetching process, on attached pattern layer 240A, 240B, 240C or the 240D of rim area 120, form signal lead layer 260, signal lead layer 260 comprises plural number lead-in wire 260a, the end of each 260a that goes between is electrically connected on the first electrode block 310 or the second electrode block 320, and the other end converges to bonding land M.In the present embodiment, lead-in wire 260a can form simultaneously with bonding line 350.In another embodiment, lead-in wire 260a and bonding line 350 can form in different step.
Please refer to Fig. 1 E and Fig. 2 E, on cover plate 100, form protective seam 400, with cover part signal lead layer 260 and sensing electrode layer 300.It should be noted that herein; be positioned at the lead-in wire 260a of bonding land M; protected seam 400 does not cover; so that on the follow-up lead-in wire 260a that flexible circuit board is engaged to zone so far; simultaneously, for showing difference, in Fig. 1 E; lead-in wire 260a and sensing electrode layer 300 that protected seam 400 covers, its profile represents with phantom line segments.
In one embodiment; before forming protective seam 400; can be through on the lead-in wire 260a of mode in the M of bonding land such as printing process, forming a peelable glue-line (not illustrating); and after forming protective seam 400; remove peelable glue-line and on protective seam 400; adopt this mode can avoid protective seam 400 to be covered in the lead-in wire 260a of bonding land M; and owing between the lead-in wire 260a of bonding land M and shielding layer 200, being formed with attached pattern layer 240A; so the lead-in wire 260a of bonding land M is difficult for the effect of stress owing to peeling off peelable glue-line, and the problem that comes off.
Fig. 3 A to Fig. 3 E system shows the manufacture method floor map according to the contactor control device structure of another embodiment of the utility model, and Fig. 4 A to Fig. 4 E shows respectively in Fig. 3 A to Fig. 3 E along the contactor control device structural profile schematic diagram of I-I ' line, and the parts system that wherein is same as Figure 1A to Fig. 2 E uses identical label and the description thereof will be omitted.Wherein Fig. 3 A and Fig. 4 A, Fig. 3 B and the corresponding making technology of Fig. 4 B are identical with last embodiment, repeat no more herein.
Please refer to Fig. 3 C and Fig. 4 C, after the structure that forms as Fig. 3 B and Fig. 4 B, different from last embodiment, the attached pattern layer 240 that the present embodiment forms adopts identical material with insulation course 340, both form in same step, and are formed with hollow hole 340b on the insulation course 340 of corresponding each second electrode block 330.For showing difference, be insulated the first electrode block 310, connecting line 320, the second electrode block 330 that layer 340 covers, its profile represents with phantom line segments.
Please refer to Fig. 3 D and Fig. 4 D, see through sputter, the photoetching process corresponding bonding line 350 that forms on insulation course 340, make each bonding line 350 be electrically connected the second adjacent electrode block 330 via every a pair of hollow hole 340b.Moreover, through sputter, photoetching process, on the attached pattern layer 240 of rim area 120, forming plural number lead-in wire 260a, each 260a that goes between also is electrically connected the first electrode block 310 or the second electrode block 330 by hollow hole 340b.
Please refer to Fig. 3 E and Fig. 4 E, on cover plate 100, form protective seam 400, with cover part signal lead layer 260 and shielding layer 200.Be positioned at the lead-in wire 260a of bonding land M, protected seam 400 does not cover.In the present embodiment, protective seam 400 comprises spaced plural number protection piece 400a, to cover bonding line 350.
Fig. 5 A to Fig. 5 E system shows the manufacture method floor map according to the contactor control device structure of another embodiment of the utility model, and Fig. 6 A to Fig. 6 E shows respectively in Fig. 5 A to Fig. 5 E along the contactor control device structural profile schematic diagram of I-I ' line, and the parts system that wherein is same as Figure 1A to Fig. 2 E uses identical label and the description thereof will be omitted.Please refer to Fig. 5 A and Fig. 6 A, prepare a cover plate 100, and form a shielding layer 200 on the cover plate 100 of rim area 120.
Please refer to Fig. 5 B and Fig. 6 B, see through sputter, the photoetching process corresponding bonding line 350 that forms on cover plate 100.Bonding line 350 can be consisted of the material that is same as the bonding line 350 in previous embodiment.
Then, please refer to Fig. 5 C and Fig. 6 C, on the cover plate 100 of visible area 110, form insulation course 340, insulation course 340 comprises the spaced collets 340a of plural number, and each collets 340a is formed on bonding line 350.Moreover the part edge that attached pattern layer 240A is carried over to rim area 120 is formed on shielding layer 200.Another attached pattern layer also can adopt other aspect, as the attached pattern layer of Fig. 5 C-1 to Fig. 5 C-3.In the present embodiment, attached pattern layer 240A, 240B, 240C or 240D can form simultaneously or successively with insulation course 340.
Please refer to Fig. 5 D and 6D, on the cover plate 100 of visible area 110, form staggered plural the first electrode block 310 and plural the second electrode block 330, and part the second electrode block 330 extends on the shielding layer 200 of rim area 120, and the second adjacent electrode block is electrically connected by cross-over connection wire 350.On each collets 340a, also be formed with simultaneously connecting line 320, in order to be electrically connected the first adjacent electrode block 310.Moreover, through sputter, photoetching process, on attached pattern layer 240A, 240B, 240C or the 240D of rim area 120, form plural number lead-in wire 260a, to be electrically connected the first electrode block 310 and the second electrode block 330.In another embodiment, can before forming the first electrode block 310 and the second electrode block 330, form plural number lead-in wire 260a.
Please refer to Fig. 5 E and Fig. 6 E, on cover plate 100, form protective seam 400, to cover signal lead layer 260 and sensing electrode layer 300, wherein be positioned at not protected seam 400 coverings of lead-in wire 260a of bonding land M.
Fig. 7 A to Fig. 7 E system shows the manufacture method floor map according to the contactor control device structure of another embodiment of the utility model, and Fig. 8 A to Fig. 8 E shows respectively in Fig. 7 A to Fig. 7 E along the contactor control device structural profile schematic diagram of I-I ' line, and the parts system that wherein is same as Fig. 3 A to Fig. 4 E uses identical label and the description thereof will be omitted.Wherein Fig. 7 A and Fig. 8 A, Fig. 7 B and the corresponding making technology of Fig. 8 B are identical with last embodiment, repeat no more herein.
Please refer to Fig. 7 C and Fig. 8 C, after the structure that forms as Fig. 7 B and Fig. 8 B, different from last embodiment, on the cover plate 100 of visible area 110, form attached pattern layer 240 and insulation course 340, in the present embodiment, attached pattern layer 240 and insulation course 340 adopt identical material, and form in same step.Insulation course 340 has plural hollow hole 340b, and hollow hole 340b exposes part bonding line 350.Attached pattern layer 240 can be consisted of the material that is same as attached pattern layer 240A, 240B, 240C or 240D in previous embodiment.
Please refer to Fig. 7 D to Fig. 8 D, on attached pattern layer 240, form staggered plural the first electrode block 310 and plural the second electrode block 330, and part the first electrode block 310 extends on the attached pattern layer 240 of rim area 120, the present embodiment has also formed connecting line 320 simultaneously, and it is in order to be electrically connected the first adjacent electrode block.Bonding line 350 is electrically connected the second adjacent electrode block 330 by hollow hole 340b.Moreover, through sputter, photoetching process, on the attached pattern layer 240 of rim area 120, form plural number lead-in wire 260a, to be electrically connected the first electrode block 310 and the second electrode block 320.In another embodiment, can before forming the first electrode block 310 and the second electrode block 330, form plural number lead-in wire 260a.
Please refer to Fig. 7 E and Fig. 8 E, on cover plate 100, form protective seam 400, cover lead-in wire the 260, first electrode block 310, connecting line 320 and the second electrode 330, the lead-in wire 260a that wherein is positioned at bonding land M not protected seam 400 covers.
According to the utility model embodiment, after rim area forms shielding layer and before forming thereon the plural number lead-in wire, formation one attached pattern layer between the shielding layer of bonding land and lead-in wire.Owing to seeing through the attached pattern layer, increase the adhesion between shielding layer and lead-in wire, therefore can improve while engaging flexible circuit board, or while removing peelable glue-line, the easy problem that comes off from shielding layer of lead-in wire.Moreover, when the sensing electrode layer adopts as Fig. 1 E etc. while having the electrode structure of insulation course, owing to utilizing same processing procedure to form simultaneously attached pattern layer and insulation course during forming insulation course, therefore without the increase fabrication steps.
Although the utility model discloses as above with preferred embodiment; so it is not in order to limit the utility model; under any, in technical field, have and usually know the knowledgeable; within not breaking away from spirit and scope of the present utility model; when doing to change and retouching, therefore protection domain of the present utility model is as the criterion when looking accompanying the claim person of defining.
Claims (10)
1. a contact panel, is characterized in that, comprising:
One cover plate, have a visible area and reach the rim area around this visible area, in this rim area, defines at least one bonding land;
One shielding layer, be arranged on this cover plate, and be positioned at this rim area;
One attached pattern layer, be arranged on this shielding layer, and be positioned at least this bonding land;
One sensing electrode layer, be arranged on this cover plate, and extend on this shielding layer of this rim area from this visible area;
One signal lead layer, be arranged on this shielding layer, and be positioned at this rim area, and this signal lead layer comprises the plural number lead-in wire, and respectively an end of this lead-in wire is electrically connected at this sensing electrode layer, and the other end converges on the attached pattern layer of this bonding land.
2. contact panel according to claim 1, is characterized in that, respectively the width of this lead-in wire is equal to or less than the width of the attached pattern layer of its below.
3. according to claim 1 or the 2nd described contact panel, it is characterized in that, this attached pattern layer is consisted of insulating material.
4. contact panel according to claim 3, is characterized in that, this insulating material is the inferior acid amides of polypropylene, polyamides, acryl resin, silicon dioxide, silicon nitride, aluminium oxide or hexamethyldisilazane.
5. contact panel according to claim 2, is characterized in that, this attached pattern layer is consisted of conductive material.
6. contact panel according to claim 5, is characterized in that, this conductive material attached pattern layer consists of tin indium oxide, indium zinc oxide, oxidation gallium indium tin, carbon nanotube or Nai Miyin line.
7. contact panel according to claim 1, is characterized in that, this sensing electrode layer comprises:
The first axial electrode that plural number is arranged along a first direction, and each first axial electrode comprises the connecting line of described the first electrode block that a plurality of the first electrode blocks, a plurality of connection are adjacent;
The second axial electrode that plural number is arranged along a second direction, and respectively second axial electrode comprises a plurality of the second electrode blocks, and wherein said each second electrode block is arranged at described connecting line both sides;
The plural number bonding line, be electrically connected this adjacent second electrode block;
One insulation course, be arranged between this connecting line and this bonding line, in order to this connecting line and this bonding line of electrically becoming attached to.
8. contact panel according to claim 7, is characterized in that, this insulation course comprises plural collets, and respectively these collets are arranged between this connecting line and this bonding line.
9. contact panel according to claim 7, is characterized in that, on this insulation course corresponding to the position of this second electrode block respectively, is formed with hollow hole, and this bonding line is electrically connected this adjacent second electrode block by this hollow hole.
10. contact panel according to claim 7, is characterized in that, this insulation course adopts identical material with this attached pattern layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200792764U CN203299771U (en) | 2013-02-04 | 2013-02-04 | Touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200792764U CN203299771U (en) | 2013-02-04 | 2013-02-04 | Touch panel |
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| Publication Number | Publication Date |
|---|---|
| CN203299771U true CN203299771U (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200792764U Expired - Fee Related CN203299771U (en) | 2013-02-04 | 2013-02-04 | Touch panel |
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| Country | Link |
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| CN (1) | CN203299771U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103970332A (en) * | 2013-02-04 | 2014-08-06 | 瑞世达科技(厦门)有限公司 | Touchpad and manufacturing method thereof |
| CN107153288A (en) * | 2017-06-20 | 2017-09-12 | 武汉华星光电技术有限公司 | A kind of contact panel and touch-control display panel |
-
2013
- 2013-02-04 CN CN2013200792764U patent/CN203299771U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103970332A (en) * | 2013-02-04 | 2014-08-06 | 瑞世达科技(厦门)有限公司 | Touchpad and manufacturing method thereof |
| WO2014117708A1 (en) * | 2013-02-04 | 2014-08-07 | Ray-Star Technology (Xiamen) Inc. | Touch panel and methods for forming the same |
| CN107153288A (en) * | 2017-06-20 | 2017-09-12 | 武汉华星光电技术有限公司 | A kind of contact panel and touch-control display panel |
| CN107153288B (en) * | 2017-06-20 | 2020-06-16 | 武汉华星光电技术有限公司 | Touch panel and touch display panel |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160512 Address after: 361009, No. 199, Sakamoto Road, information photoelectric Park, torch hi tech Zone, Fujian, Xiamen Patentee after: TPK Touch Solutions (Xiamen) Inc. Address before: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee before: Ray-Star Technology (Xiamen) Inc. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20220204 |
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