CN203261568U - Circuit board contact structure - Google Patents
Circuit board contact structure Download PDFInfo
- Publication number
- CN203261568U CN203261568U CN 201320179671 CN201320179671U CN203261568U CN 203261568 U CN203261568 U CN 203261568U CN 201320179671 CN201320179671 CN 201320179671 CN 201320179671 U CN201320179671 U CN 201320179671U CN 203261568 U CN203261568 U CN 203261568U
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- layer
- weld pad
- contact point
- circuit board
- point structure
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Abstract
The utility model provides a circuit board contact structure which comprises a circuit base board, a conducting layer, a first coating layer, and a first welding pad. The circuit base board is provided with at least one hole which comprises a hole wall and a first hole opening. The conducting layer is arranged to coat the hole wall and the first hole opening, and forms a corresponding first opening at the first hole opening. The first coating layer is hermetically arranged at the first opening. The first welding pad is arranged to cover the first coating layer and the conducting layer. The conducting layer conducts electricity to the first welding pad.
Description
Technical field
The utility model relates to a kind of circuit board contact point structure, especially relates to a kind of perforate that dope layer is arranged at circuit substrate, so that the first pad-shaped is formed in the circuit board contact point structure on dope layer.
Background technology
Circuit board is used for making electrical communication and fixed electronic element between circuit in information, communication, consumer electronics industry, can be described as indispensable important zero element.Yet, progress along with semiconductor manufacturing engineering technology, in order to make circuit board can reach lightening, high density, high-performance and reduce the problems such as machining and surface treatment cost, so that electronic component is microminiaturized and become more meticulous, the importing of surface adhering technical has replaced traditional manufacturing engineering technology, and make the density of electronic component increase, and then promote the function of electronic product.
Yet; In the manufacturing engineering process; In order to prevent that any material from falling into perforate; And the material cost in saving copper facing operation; Usually can be after perforate copper facing for the first time forms conductive layer; With plug glue technology, perforate is filled up; The recycling brush grinding machine is ground to unnecessary excessive glue smooth; Carry out afterwards copper facing operation for the second time and form weld pad; But in the operation of grinding the glue that overflows; Must grind again by first permanent circuit substrate; Because the hardness of the resin that adopts of plug glue is higher; Easily cause circuit substrate to rock in process of lapping; And therefore the circuit substrate that is fixed may cause slight crack; Cause the yield of manufacturing engineering to reduce.
See also Fig. 1 and Fig. 2.Fig. 1 is the front contact point structure generalized section of grinding that the first prior art is shown, and Fig. 2 is the generalized section that the contact point structure of the first prior art is shown.As extremely shown in Figure 2 in Fig. 1.Existing contact point structure PA100 forms perforate PA11 after circuit substrate PA1 carries out bore operation, conductive layer PA2 in the hole wall PA111 of perforate PA11 plating, be filled in resin again and form resin bed PA3 in perforate PA11, utilize excessive glue that brush grinding machine will overflow the first opening PA21 and the second opening PA22 to be ground to smooth, carry out afterwards electroplating activity and form the first weld pad PA4 and the second weld pad PA5.
Because the quality of resin bed PA3 is harder, need to bestow larger stress when grinding could polish resin bed PA3, and must bestow larger stress permanent circuit substrate P A1 simultaneously could grind smoothly, but polish process still can make circuit substrate PA1 cause unnecessary rocking, and the stress of permanent circuit substrate P A1 can make circuit substrate PA1 produce slight crack.
Please continue to consult Fig. 3.Fig. 3 is the generalized section that the electrical pin of contact point structure connection of the second prior art is shown.As shown in the figure, contact point structure PA100 cuts into contact point structure PA100a, conductive solder layer PA6a is fixedly arranged on the surface that forms at the first weld pad PA4a and resin bed PA3a, yet, because the tack between conductive solder layer PA6a and resin bed PA3a is not good, the phenomenon that easily causes conductive solder layer PA6a to peel off comes off after even may be on electrical pin PA200a is affixed, and then yield is reduced, cause the unnecessary waste of production cost.
The utility model content
In view of the above-mentioned problems, because existing contact point structure can utilize plug glue technology usually, perforate is filled up, the quality of the resin that adopts because of plug glue when grinding is harder, makes circuit substrate easily cause slight crack because grinding rocking of producing; In addition, not good because of the tack of resin bed and conductive solder interlayer after the conductive solder layer is welded in contact point structure, make the conductive solder layer easily come off, and then being arranged on circuit substrate of causing that electrical pin can't be firm.
Edge this, the purpose of this utility model is for providing a kind of circuit board contact point structure, the dope layer that its utilization is easy to grind is covered in opening, so as to solving the slight crack problem that causes because of grinding in manufacturing engineering, and can adopt more frivolous circuit substrate, and then save processing cost and the material cost of manufacturing engineering; In addition, the open space that circuit substrate forms in perforate after cutting makes the conductive solder layer can be attached to conductive layer and the first weld pad, and then makes electrical pin closely be attached to the first weld pad by the conductive solder layer.
The utility model provides a kind of circuit board contact point structure, and it comprises a circuit substrate, a conductive layer, one first dope layer and one first weld pad.Circuit substrate offers at least one perforate, and perforate has a hole wall and one first aperture.The conductive layer mulched ground is arranged at hole wall and the first aperture, and forms one first corresponding opening in the first place, aperture.The first dope layer is arranged at the first opening hermetically.The first weld pad mulched ground is arranged at the first dope layer and conductive layer.Wherein, conductive layer conducting electrically is in the first weld pad.
In a preferred embodiment of the present utility model, above-mentioned circuit board contact point structure also comprises one second dope layer, and perforate also comprises one second aperture, and conductive layer more mulched ground be arranged at the second aperture, and form one second corresponding opening in the second place, aperture, and the second dope layer is arranged at the second opening hermetically.
In a preferred embodiment of the present utility model, the conductive layer of circuit board contact point structure, the first dope layer and the second dope layer enclose and consist of a space.The preferably, the space is an open space.
In a preferred embodiment of the present utility model, above-mentioned circuit board contact point structure also comprises a conductive solder layer, closely be attached to conductive layer in open space, and be attached to the first weld pad, so as to for the user, one electrical pin being electrically connected at the first weld pad regularly.
Because existing contact point structure can utilize plug glue technology usually, perforate is filled up, the quality of the resin that easily adopts because of plug glue when grinding is harder, makes circuit substrate easily cause slight crack because grinding rocking of producing; In addition, not good because of the tack of resin bed and conductive solder interlayer after the conductive solder layer is welded in contact point structure, make the conductive solder layer easily come off, and then being arranged on circuit substrate of causing that electrical pin can't be firm.
Edge this, the purpose of this utility model is for providing a kind of circuit board contact point structure, the first dope layer that its utilization is easy to grind and the second coating layer are covered in the first opening and the second opening, so as to solving the slight crack problem that in manufacturing engineering, circuit substrate causes because of grinding, and can adopt more frivolous circuit substrate, and then save processing cost and the material cost of manufacturing engineering; In addition, the open space that circuit substrate forms in perforate after cutting makes the conductive solder layer can be attached to conductive layer and the first weld pad, and then makes electrical pin closely be attached to the first weld pad by the conductive solder layer.
The specific embodiment that the utility model adopts will be further described by following embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the front contact point structure generalized section of grinding that the first prior art is shown;
Fig. 2 is the contact point structure generalized section that the first prior art is shown;
Fig. 3 is that the contact point structure that the second prior art is shown connects electrical pin generalized section;
Fig. 4 is the circuit board contact point structure schematic perspective view that the utility model the first embodiment is shown;
Fig. 5 is the circuit board contact point structure generalized section that the utility model the first embodiment is shown;
Fig. 6 is the circuit board contact point structure schematic perspective view that the utility model the second embodiment is shown; And
Fig. 7 is that the circuit board contact point structure that the utility model the second embodiment is shown connects electrical pin generalized section.
Reference numeral
PA100, PA100a: contact point structure PA1: circuit substrate
PA11: perforate PA111: hole wall
PA2: conductive layer PA21: the first opening
PA22: the second opening PA3, PA3a: resin bed
PA4, PA4a: the first weld pad PA5: the second weld pad
PA6a: conductive solder layer PA200a: electrical pin
100,100a: circuit board contact point structure 1,1a: circuit substrate
11,11a: perforate 111,111a: hole wall
112,112a: the first aperture 113,113a: the second aperture
2,2a: conductive layer 21,21a: the first opening
22,22a: the second opening 3,3a: the first dope layer
4,4a: the second dope layer 5,5a: the first weld pad
6,6a: the second weld pad 7a: conductive solder layer
200a: electrical pin S1, S2: space
Embodiment
Due to circuit board contact point structure provided by the utility model, its relevant combination execution mode is too numerous to enumerate especially, therefore give unnecessary details no longer one by one at this.Yet the person skilled in the art knows that all this only for for example, is not to limit creation itself.The detailed description of relevant preferred embodiment of the present utility model is as follows.
See also Fig. 4 and Fig. 5.Fig. 4 is the schematic perspective view that the circuit board contact point structure of the utility model the first embodiment is shown; Fig. 5 is the generalized section that the circuit board contact point structure of the utility model the first embodiment is shown.As shown in the figure, a kind of circuit board contact point structure 100 comprises a circuit substrate 1, a conductive layer 2, one first dope layer 3, one second dope layer 4, one first weld pad 5 and one second weld pad 6.Circuit substrate 1 offers a perforate 11, and perforate 11 has a hole wall 111, one first aperture 112 and one second aperture 113.
Conductive layer 2 is arranged at hole wall 111, the first aperture 112 and the second aperture 113 with chemical deposition or plating mode with the copper mulched ground, and form one first corresponding opening 21 in 112 places, the first aperture, and form one second corresponding opening 22 in 113 places, the second aperture.On practice, the two sides of circuit substrate 1 can be provided with circuit (not shown), and conductive layer 2 is used for the circuit on turning circuit substrate 1 two sides.And in other preferred embodiment, the metal that conductive layer 2 adopts is gold, silver, tin, terne metal and gun-metal one wherein, but is not limited to above-mentioned.
The first dope layer 3 is arranged at the first opening 21 hermetically, and the second dope layer 4 is arranged at the second opening 22 hermetically.Conductive layer 2, the first dope layer 3 and the second dope layer 4 enclose and consist of a space S 1, and space S 1 is to be an enclosure space in the present embodiment, in manufacturing engineering, material and impurity drop into space S 1 and the first dope layer 3 and the second dope layer 4 are in order to intercept, and then keep good conduction property.In addition; In the present embodiment; The first dope layer 3 and the second dope layer 4 are ink lay; Compared to resin; The hardness of printing ink is less; Therefore in polish process; Can easily the first dope layer 3 and the second dope layer 4 be ground to conductive layer 2; And the conductive layer 2 of part is exposed; Compared to prior art in the time grinding away higher than the resin bed of conductive layer; Circuit substrate is produced to be rocked or slight crack; First dope layer 3(the second dope layer 4 that uses due to the present embodiment) be soft material; Therefore can not make circuit substrate 1 rock or produce slight crack; And, because circuit substrate 1 is easy to fix, therefore more can be applicable to the circuit substrate 1 of thinner thickness, and then reduce the cost of machining, reach simultaneously the effect that electronic component is lightening.
The first weld pad 5 is arranged at circuit substrate 1 with chemical deposition or plating mode with copper, and be covered on conductive layer 2 and the first dope layer 3, and the second weld pad 6 also is arranged at circuit substrate 1 with chemical deposition or plating mode with copper, and covers conductive layer 2 and the second dope layer 4.Wherein, in the first weld pad 5 and the second weld pad 6, the electronic component (not shown) that therefore is arranged at the first weld pad 5 or the second weld pad 6 also can be by conductive layer 2 conductings in the circuit on circuit substrate 1 two sides due to conductive layer 2 conducting electrically.Furthermore, because the present embodiment is provided with respectively the first dope layer 3 and the second dope layer 4 at the first opening 21 and the second opening 22 places, therefore can make the first weld pad 5 and the second weld pad 6 arrange respectively and can not enter in space S 1, and then effectively reduce the cost of required copper product in manufacturing engineering.Yet in other preferred embodiment, the metal that the first weld pad and the second weld pad adopt can be gold, silver, tin, terne metal and gun-metal one wherein, but is not limited to above-mentioned.
Please continue to consult Fig. 6 and Fig. 7.Fig. 6 is the schematic perspective view that the circuit board contact point structure of the utility model the second embodiment is shown, and Fig. 7 is the generalized section that the circuit board contact point structure of the utility model the second embodiment is shown.As shown in the figure, a kind of circuit board contact point structure 100a comprises a circuit substrate 1a, a conductive layer 2a, one first dope layer 3a, one second dope layer 4a, one first weld pad 5a and one second weld pad 6a.Circuit substrate 1a offers a perforate 11a, and perforate 11a has a hole wall 111a, one first aperture 112a and one second aperture 113a.
The first dope layer 3a is arranged at the first opening 21a hermetically, and the second dope layer 4a is arranged at the second opening 22a hermetically.Conductive layer 2a, this first dope layer 3a and this second dope layer 4a enclose and consist of a space S 2, and space S 2 is to be an open space in the present embodiment, in manufacturing engineering, material and impurity drop into space S 2 and the first dope layer 3a and the second dope layer 4a are in order to intercept, and then keep good conduction property.In addition; In the present embodiment; The first dope layer 3a and the second dope layer 4a are ink lay; Because the hardness of printing ink is little compared to resin; Therefore in polish process; Can easily the first dope layer 3a and the second dope layer 4a be ground to conductive layer 2a; And the conductive layer 2a of part is exposed; Compared to prior art in the time grinding away higher than the resin bed of conductive layer; Circuit substrate is produced to be rocked or slight crack; First dope layer 3a(the second dope layer 4a that uses due to the present embodiment) be soft material; Therefore can not make circuit substrate 1 rock or produce slight crack; And, because circuit substrate 1 is easy to fix, therefore more can be applicable to the circuit substrate 1a of thinner thickness, and then reduce the cost of machining, reach simultaneously the effect that electronic component is lightening.
The first weld pad 5a is arranged at circuit substrate 1a with chemical deposition or plating mode with copper, and is covered on conductive layer 2a and the first dope layer 3a.The second weld pad 6a also is arranged at circuit substrate 1a with chemical deposition or plating mode with copper, and covers conductive layer 2a and the second dope layer 4a.Wherein, in the first weld pad 5a and the second weld pad 6a, the electronic component (not shown) that therefore is arranged at the first weld pad 5a or the second weld pad 6a also can be by conductive layer 2a conducting in the circuit on circuit substrate 1a two sides due to conductive layer 2a conducting electrically.Furthermore, because the present embodiment is provided with respectively the first dope layer 3a and the second dope layer 4a at the first opening 21a and the second opening 22a place, therefore can make the first weld pad 5a and the second weld pad 6a arrange respectively and can not enter in space S 2, and then effectively reduce the cost of required copper product in manufacturing engineering.Yet in other preferred embodiment, the metal that the first weld pad and the second weld pad adopt can be gold, silver, tin, terne metal and gun-metal one wherein, but is not limited to above-mentioned.
In other preferred embodiment, the circuit board contact point structure also can include a plurality of perforates, and wherein a plurality of spaces also can comprise open space or enclosure space simultaneously.
In sum, compared to existing contact point structure, in a kind of circuit board contact point structure provided by the utility model, the first dope layer that utilization is easy to grind and the second dope layer are covered in respectively the first opening and the second opening, so as to solving the slight crack problem that causes because of grinding in manufacturing engineering, and can adopt more frivolous circuit substrate, and then save processing cost and the material cost of manufacturing engineering; In addition, the open space that circuit substrate forms in perforate after cutting makes the conductive solder layer can be attached to conductive layer and the first weld pad (the second weld pad), and then makes electrical pin closely be attached to the first weld pad by the conductive solder layer.
By the above detailed description of preferred embodiments, hope can be known description feature of the present utility model and spirit more, and with the above-mentioned preferred embodiment that is disclosed, category of the present utility model is limited.Such as the personnel that have common knowledge in affiliated technical field can do other all improvement and variation according to above-described embodiment explanation of the present utility model.Yet all improvement and variation that these are done according to the utility model embodiment, should still belong to creation spirit of the present utility model and the claim scope that defines in.
Claims (5)
1. a circuit board contact point structure, is characterized in that, comprises:
One circuit substrate offers at least one perforate, and this perforate has a hole wall and one first aperture;
One conductive layer, mulched ground are arranged at this hole wall and this first aperture, and form one first corresponding opening in this place, the first aperture;
One first dope layer is arranged at this first opening hermetically; And
One first weld pad, mulched ground are arranged at this first dope layer and this conductive layer;
Wherein, the conducting electrically of this conductive layer is in this first weld pad.
2. circuit board contact point structure according to claim 1, it is characterized in that, also comprise one second dope layer, and this perforate also comprises one second aperture, this conductive layer more mulched ground is arranged at this second aperture, and form one second corresponding opening in this place, the second aperture, and this second dope layer is arranged at this second opening hermetically.
3. circuit board contact point structure according to claim 2, is characterized in that, this conductive layer, this first dope layer and this second dope layer enclose and consist of a space.
4. circuit board contact point structure according to claim 3, is characterized in that, this space is an open space.
5. circuit board contact point structure according to claim 4, it is characterized in that, also comprise a conductive solder layer, closely be attached to this conductive layer in this open space, and be attached to this first weld pad, so as to for the user, one electrical pin being electrically connected at this first weld pad regularly.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320179671 CN203261568U (en) | 2013-04-11 | 2013-04-11 | Circuit board contact structure |
| HK13107120A HK1179470A2 (en) | 2013-04-11 | 2013-06-18 | Contact structure of the circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320179671 CN203261568U (en) | 2013-04-11 | 2013-04-11 | Circuit board contact structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203261568U true CN203261568U (en) | 2013-10-30 |
Family
ID=49230454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320179671 Expired - Fee Related CN203261568U (en) | 2013-04-11 | 2013-04-11 | Circuit board contact structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203261568U (en) |
| HK (1) | HK1179470A2 (en) |
-
2013
- 2013-04-11 CN CN 201320179671 patent/CN203261568U/en not_active Expired - Fee Related
- 2013-06-18 HK HK13107120A patent/HK1179470A2/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| HK1179470A2 (en) | 2013-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20170411 |