CN203236531U

CN203236531U - OLED substrate cutting system

Info

Publication number: CN203236531U
Application number: CN 201320056984
Authority: CN
Inventors: 向欣; 任海; 张晓茗; 王小月
Original assignee: Sichuan CCO Display Technology Co Ltd
Current assignee: Sichuan CCO Display Technology Co Ltd
Priority date: 2013-02-01
Filing date: 2013-02-01
Publication date: 2013-10-16
Anticipated expiration: 2023-02-01

Abstract

The utility model discloses an OLED substrate cutting system which comprises a cutting tool and a rack. The cutting tool is fixed on the rack. The OLED substrate cutting system is characterized in that the substrate cutting system further comprises a front guiding laser device, and the front guiding laser device is fixed in the front of the heading direction of the cutting tool on the rack. Due to the fact that the front guiding laser device is adopted in the substrate cutting system, an OLED substrate to be cut is heated and melted to form a laser hot melting region before being cut, when the cutting tool meets the hot melting region during the cutting process, the cutting tool can conduct cutting along the hot melting region easily, and therefore the probability that OLED display units are rejected due to cutting is lowered. According to the preferable scheme, a deviating tool wheel structure which is adopted further increases the probability that the cutting tool meets the laser hot melting region in the cutting process, and a vacuum corrugated pipe which is additionally arranged can clean waste produced during the cutting process so that influences on cutting tool marks can be avoided, and the yield of substrate cutting is further improved.

Description

The oled substrate diced system

Technical field

The utility model belongs to OLED Display Technique field, relates to the production technology of oled panel, relates in particular to a kind of oled substrate diced system.

Background technology

In flat panel display, many merits such as display is frivolous with it for Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED), active illuminating, fast-response speed, wide viewing angle, rich color and high brightness, low-power consumption, high-low temperature resistant and to be known as by industry be third generation Display Technique after liquid crystal display (LCD).Active OLED(Active Matrix OLED, AMOLED) be also referred to as active matrix OLED, AMOLED is because driving by integrated thin-film transistor (TFT) and capacitor in each pixel and by the method that capacitor is kept voltage, thereby can realize large scale, resolution panels, be the emphasis of current research and the developing direction of following Display Technique.

In the production technology of oled panel, at first be to carry out series of process at a very large substrate to process, when finish all comprise the techniques such as circuit arrangement, organic material evaporation and encapsulation after, by an oled substrate diced system whole substrate cut become several display units.Be depicted as the cutter structure figure of existing oled substrate diced system such as Fig. 1 a and 1b, comprise a taper break bar 11, support the cutter shaft 2 of taper break bar 11 and the fixing knife rest 3 of cutter shaft, wherein taper break bar 11 specifically is fixed on the cutter shaft 2 by bearing 4.Existing oled substrate cutting method is that the colyliform break bar of taper break bar 11 is fixed on the knife rest 3, makes its operation realize cutting by control driven by motor knife rest.Fig. 2 a is depicted as the schematic diagram of existing tapered knife wheel cutting oled substrate, wherein oled substrate is divided into several OLED electrode zones 6 by substrate cut zone 5, described taper break bar 11 acts on substrate cut zone 5, is in theory to cut according to standard cutting tool marks 17.Because oled substrate has generated a large amount of show electrodes that gather before cutting, if the taper break bar skew occurs causes cutting to OLED electrode zone 6 in actual cutting process, will cause the oled substrate circuit damage of this unit and scrap.Fig. 2 b is depicted as a kind of actual cutting tool marks 18 in generative process, and the reasons such as this tool marks may be worn and torn owing to break bar, substrate impurity or mechanical oscillation form, and this will cause the display unit on the left side among Fig. 2 b to be scrapped.

The utility model content

The deficiency of the utility model to easily occurring for existing oled substrate diced system scrapping because of electrode damage owing to the display unit that the reasons such as break bar wearing and tearing, substrate impurity or mechanical oscillation cause cutting out proposed a kind of oled substrate diced system.

The technical solution of the utility model is: a kind of oled substrate diced system, comprise cutting tool and frame, described cutting tool is fixed on the frame, it is characterized in that, described substrate cut system also comprises leading laser instrument, and described leading laser instrument is fixed in the place ahead of cutting tool direction of advance on the frame.

Further, above-mentioned cutting tool comprises knife rest and cutter shaft, wherein cutter shaft is fixed on the knife rest, it is characterized in that, described cutting tool also comprises the deflection break bar, described deflection break bar comprises the first half-cone break bar and the second half-cone break bar, described half-cone break bar comprise that two radiuses do not wait with the vertical circular base plane and the taper plane that is connected two baseplanes of axis, described the first half-cone break bar and the second half-cone break bar are fixed on the cutter shaft, and guarantee that two larger baseplanes of radius in four baseplanes of the first and second half-cone break bars are mutually close.

Further, above-mentioned diced system also comprises vacuum tube, and described vacuum tube is fixed in the rear of the direction of advance of cutting tool on the frame.

The beneficial effects of the utility model are: oled substrate diced system of the present utility model has formed territory, LASER HEAT melting zone by adopting leading laser instrument that oled substrate to be cut is generated heat to melt before cutting, when cutting tool runs into this hot melt zone in the process of cutting, just cut along this hot melt zone easily, thereby reduced the OLED display unit because the possibility that the waste product that cutting causes occurs.The deflection cutting wheel structure that adopts in preferred scheme has further increased the probability that cutting tool meets with territory, LASER HEAT melting zone in cutting process, the vacuum corrugated pipe of setting up has then further improved the yields of oled substrate cutting by the refuse that the cleaning cutting process produces to avoid it that cutting tool marks are exerted an influence.

Description of drawings

Fig. 1 a is existing cutter structure figure;

Fig. 1 b is the left view of cutter shown in Fig. 1 a;

Fig. 2 a is the existing substrate cut incision principle figure of system;

Fig. 2 b is a kind of actual cutting diagram of existing substrate cut system;

Fig. 3 a is cutter structure figure of the present utility model;

Fig. 3 b is the left view of cutter shown in Fig. 3 a;

Fig. 4 a is oled substrate diced system diagram of the present utility model;

Fig. 4 b is the cutting diagram of substrate cut of the present utility model system.

Description of reference numerals: taper break bar 11, cutter shaft 2, knife rest 3, bearing 4, substrate cut zone 5, OLED electrode zone 6, standard cutting tool marks 17 are cut tool marks 18 unusually, deflection break bar 21, territory, LASER HEAT melting zone 27, leading laser instrument 28, vacuum tube 29.

The specific embodiment

Below in conjunction with the drawings and specific embodiments the utility model is done further detailed description.

Fig. 4 a is depicted as a concrete form of oled substrate diced system of the present utility model, in the present embodiment, described oled substrate diced system comprises cutting tool and frame, described cutting tool is fixed on the frame, this substrate cut system also comprises leading laser instrument 28, and described leading laser instrument 28 is fixed in the place ahead of cutting tool direction of advance on the frame.The direction of advance of the leading cutting tool here refers to the tool motion direction that shows in the process of diced system cutting substrate, refer to that also in the process of diced system cutting substrate leading laser instrument remains on the place ahead of the direction of motion of cutting tool and leading laser instrument 28 is fixed on its place ahead.And cutting tool and leading laser instrument 28 all are installed on the leading screw, and relative position immobilizes.This position relationship includes but not limited to that leading laser instrument synchronous rotating moves to the place ahead of the current cut direction of this cutting tool when cutting tool turns in the process of cutting.The leading laser action of use described in the present embodiment in the principle that cutting zone forms the hot melt zone is: because OLED meeting sputter or some metal materials that mix on substrate in manufacture process, these metal materials have very strong sensitiveness to the laser of specific wavelength, and laser is actually and acts on these materials and then make the substrate heating softening.

Because in the scheme of above-described embodiment, break bar need in the situation that touch the hot melt zone could be along hot melt zone cutting, touch the probability in hot melt zone in cutting process in order to increase break bar, the present embodiment has been made improvement to cutting tool among the upper embodiment.Cutting tool comprises cutter shaft 2 and knife rest 3 in the scheme of the present embodiment, and wherein cutter shaft 2 is fixed on the knife rest 3, and the upper end of knife rest 3 is fixed on by on the motor-driven screw mandrel guide rail, and operating personnel control the cutting movement of break bar by the control motor.Described cutting tool also comprises deflection break bar 21, this deflection break bar 21 comprises two half-cone break bars, described half-cone break bar comprise that two radiuses do not wait with the vertical circular base plane and the conical camber that is connected two baseplanes of axis, and the axis of half-cone break bar passes the center of two baseplanes simultaneously, it is the part that the profile of half-cone break bar shows as cone, the two halves taper break bar here is fixed on the cutter shaft, and guarantees that two larger baseplanes of radius in four baseplanes of two halves taper break bar are mutually close.Cutting tool according to the scheme constructs of the present embodiment should have the structure shown in Fig. 3 a and Fig. 3 b.

This cutting wheel structure can be in the zone that guarantees that the cutting tool marks have all increased the cutting tool marks in the substrate cut zone under with interior prerequisite, so also just increased the probability that after tool marks are extended and territory, LASER HEAT melting zone crosses, and the substrate chip that produces between these two break bars also can easilier be siphoned away by vacuum tube, thereby can not affect the effect of cutting.

Above-mentioned deflection break bar 21 and the annexation between the knife rest 3 connect by bearing 4.

Although adopted above-mentioned a plurality of technical schemes, but can not guarantee that still waste product does not appear in cutting process 100%, the refuse that wherein produces in cutting process affects the problem that cutter makes cutter depart from desirable cut direction and still exists, in order further to solve problems, the present embodiment is set up vacuum tube 29 on the basis of above-mentioned diced system, and described vacuum tube is fixed in the rear of the direction of advance of cutting tool on the frame.Vacuum tube 29 is installed on the leading screw, immobilizes with the relative position of scribing wheel and leading laser instrument.The direction of advance of the cutting tool of mentioning among the direction of advance of the cutting tool here and the first embodiment has identical definition, and the vacuum tube of setting up can adopt the mode of vacuum suction will be partial to the refuse that produces in the break bar cutting process and siphon away.

Concrete, above-mentioned vacuum tube can be vacuum corrugated pipe, and profile comprises corrugated structure shown in Fig. 4 a, and this structure can improve the vacuum tube dynamic.

Below in conjunction with Fig. 4 b principle of the present utility model and effect are described in further detail:

Territory, LASER HEAT melting zone 27 is zones of the of short duration hot melt state that forms under the leading laser action among the figure, is present in theory the dead ahead of cutting tool direction of advance.But because the factors such as interference of craft precision and other external conditions, the deflection break bar is not necessarily at first aimed at the hot melt zone and is cut according to described hot melt zone in the process that cutting is advanced.If adopt the structure of deflection break bar, because this cutting wheel structure can be in the zone that guarantees that the cutting tool marks have all increased the cutting tool marks in the substrate cut zone under with interior prerequisite, so also just increased the probability that after tool marks are extended and territory, LASER HEAT melting zone crosses, and the substrate chip that produces between these two break bars also can easilier be siphoned away by vacuum tube, thereby can not affect the effect of cutting.When deflection after break bar enters territory, LASER HEAT melting zone, because the deflection break bar possesses two conical cambers, if (not hot melt) cutting zone of conical camber and hard contacts the active force that will be subject to from the level of the cutting zone of hard; Further, depart from (left avertence or right avertence) hot melt zone if be partial to for a certain reason break bar, reaction force that will be subject to from the hard cutting zone in two conical cambers so, another then is subject to the reaction force from the hot melt zone, these two reaction forces are uneven in the horizontal direction, the power in the accurate territory, self-heating melting zone of must getting on very well is less, and therefore under the effect of these two reaction forces, the deflection break bar can be partial to the hot melt zone again.And, when the deflection break bar begins to cut, substrate forms tool marks because the break bar cutting produces broken, be positioned at the territory, LASER HEAT melting zone 27 in these deflection break bar two edge of a knife centre positions through the laser hot melt, molecular structure changes and easier to be chipping, and therefore extend the easier position along the LASER HEAT melting zone of tool marks of cutting.In sum, can find out when the deflection break bar from territory, LASER HEAT melting zone contact, will continue along territory, LASER HEAT melting zone the cutting oled substrate, reduced the probability that causes the situation appearance that display unit scraps because of cutting process damaged substrate electrode zone.

Those of ordinary skill in the art will appreciate that, embodiment described here is in order to help reader understanding's principle of the present utility model, should to be understood to that protection domain of the present utility model is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from the utility model essence according to disclosed these technology enlightenments of the utility model, and these distortion and combination are still in protection domain of the present utility model.

Claims

1. oled substrate diced system, comprise cutting tool and frame, described cutting tool is fixed on the frame, it is characterized in that, described substrate cut system also comprises leading laser instrument, and described leading laser instrument is fixed in the place ahead of cutting tool direction of advance on the frame.

2. a kind of oled substrate diced system according to claim 1, described cutting tool comprises knife rest and cutter shaft, wherein cutter shaft is fixed on the knife rest, it is characterized in that, described cutting tool also comprises the deflection break bar, described deflection break bar comprises the first half-cone break bar and the second half-cone break bar, described half-cone break bar comprise that two radiuses do not wait with the vertical circular base plane and the taper plane that is connected two baseplanes of axis, described the first half-cone break bar and the second half-cone break bar are fixed on the cutter shaft, and guarantee that two larger baseplanes of radius in four baseplanes of the first and second half-cone break bars are mutually close.

3. a kind of oled substrate diced system according to claim 1 and 2 also comprises vacuum tube, and described vacuum tube is fixed in the rear of the direction of advance of cutting tool on the frame.

4. a kind of oled substrate diced system according to claim 2, the annexation between deflection break bar and the knife rest is to connect by bearing.