CN203231827U - Backflow measurement plate - Google Patents
Backflow measurement plate Download PDFInfo
- Publication number
- CN203231827U CN203231827U CN201320353070.6U CN201320353070U CN203231827U CN 203231827 U CN203231827 U CN 203231827U CN 201320353070 U CN201320353070 U CN 201320353070U CN 203231827 U CN203231827 U CN 203231827U
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- temperature
- metal substrate
- hot blast
- galvanic couple
- plate
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Abstract
The utility model discloses a backflow measurement plate and relates to the field of temperature test for products. The backflow measurement plate comprises a mental substrate bearing temperature thermocouples. A temperature measurement points corresponding to the temperature thermocouples are positioned on the metal substrate. The backflow measurement plate employs an aluminum alloy substrate as a carrier for a probe of the temperature thermocouple. Aluminum alloy is almost not influenced by temperature within limited range of temperature of a PCB temperature measurement plate. Temperature of the metal substrate and welding points thereon which is affected by current environment hot wind and temperature can be detected simultaneously by utilizing a member point and a hot air hole. Circuits of the probes of temperature thermocouples are fixed on the metal substrate in parallel by utilizing thermosetting adhesive, which can prevent influence caused by movement of probes. The mutual influence can also be prevented by spacing the member point and the hot air hole by a distance.
Description
Technical field
The utility model relates to the temperature test field, is specifically related to a kind of long service life, metal thermometric plate that precision is high.
Background technology
In the prior art, about the method for making of temperature survey plate, have standard at present among the IPC7530-2001 " Guideline For Temperature profiling For mass soldering processes ":
1, thermometric plate main body is chosen with wherein one in batch production board;
2, by temperature acquisition point selection requirement chosen position point, and punching is popped one's head in to place thermocouple temperature measurement below location point;
3, use fixedly temperature probe of high temperature scolding tin, heat conduction viscose glue or three kinds of methods of Kapton Tape.These three kinds of fixing means effects are equal to, and all can use.Conventional thermocouple probe mounting means is: stealthy pin closure means in this way, at first determine the BGA bond pad locations, and secondly get through the hole up to the solder joint center at thermometric backboard face, thermocouple probe penetrates with high temperature scolding tin or hot-setting adhesive from the PCB back side and is fixed on the solder joint.Be other exposed conveying appliance pin components and parts as the collection point, directly thermocouple probe placed between pin and pad and fixing with high temperature scolding tin or hot-setting adhesive etc.
During test, the thermometric plate is placed in the measurement environment, utilizes temperature probe on the thermometric plate to obtain the temperature of each parts under the current environment.Because long-term continual the carrying out of this thermometric process need, but there are the following problems for the selection of thermometric plate, product integrated circuit board PCB base material is at most only by backflow high temperature 6 times, as a two-sided integrated circuit board, after ordinary production finishes, PCB high temperature heats 2 times, after making the thermometric plate, significant change can not take place in PCB and components and parts material in follow-up 4 times are used, and precision and accuracy can guarantee, but along with thermometric plate access times are on the increase, can cause thermometric plate self material to decay gradually, therefore have influence on measuring accuracy, can only use the thermometric plate that more renew behind certain number of times, this just makes the corresponding increase with operation of testing cost.
The utility model content
Because the material reason causes at high temperature short problem in serviceable life, the utility model provides a kind of long service life, temperature survey accurate metal thermometric plate and using method thereof in order to solve existing thermometric plate.Concrete scheme is as follows: plate is measured in a kind of backflow, it is characterized in that comprise the metal substrate that carries temperature thermocouple, described metal substrate is provided with the point for measuring temperature corresponding with temperature thermocouple.
Be preferably: described temperature thermocouple has two, comprise for the hot blast galvanic couple of measures ambient temperature with for the solder joint galvanic couple of measuring weld point temperature, described point for measuring temperature has two, comprises corresponding with the hot blast galvanic couple hot blast hole that is arranged on the metal substrate, with solder joint galvanic couple corresponding elements point.
Be preferably: described hot blast hole and element point are arranged on the same diagonal line of metal substrate and between the two every 1/2 catercorner length.
Be preferably: the area of described metal substrate is 100mm
*100mm, thickness are 1mm.
Be preferably: the diameter in described hot blast hole is 10mm, and the probe of hot blast galvanic couple is arranged on the circle centre position in hot blast hole, and the link tester of hot blast galvanic couple is crossed hot-setting adhesive and is fixed on the metal substrate.
Be preferably: described element point is the through hole of diameter 2.5mm, and the probe of solder joint galvanic couple utilizes screw to be fixed on the through hole place, and the link tester of solder joint galvanic couple is crossed hot-setting adhesive and is fixed on the metal substrate.
Be preferably: on the circuit secured in parallel metal substrate of hot blast galvanic couple and solder joint galvanic couple.
Be preferably: described metal substrate is aluminium alloy base plate.
This programme is with the carrier of aluminium alloy base plate as thermocouple probe, aluminium alloy temperature influence hardly in the temperature limited scope of PCB thermometric plate utilizes element point and hot blast hole can measure hot blast and temperature under the current environment simultaneously to metal substrate and the temperature of solder joint on it.Utilize hot-setting adhesive with the circuit secured in parallel of thermocouple probe on metal substrate, the influence that can avoid pops one's head in is moved.Element point and hot blast hole can be avoided influencing each other between the two from a distance.The method of this programme is utilized the corresponding relation between metal substrate and the thermometric plate, utilize the metal substrate that can not influence precision to take multiple measurements, according to pre-determined relativity, derive and awaiting board card between the temperature curve delta data, process is simple and improved efficient.This method can be set the temperature curve that different relativities obtains treating the side plate card according to the needs of self simultaneously according to different test environments and the area, the thickness that require to arrange metal substrate.The utility model greatly reduces the loss of thermometric plate and has improved work efficiency.
Description of drawings
Fig. 1 structural representation of the present utility model.
Label declaration in the accompanying drawing: 1-metal substrate, 2-hot blast galvanic couple, 3-hot-setting adhesive, 4-hot blast point, 5-element point, 6-probe, 7-solder joint galvanic couple.
Embodiment
As shown in Figure 1, this programme comprises a metal substrate 1 of being made by aluminium alloy, metal substrate 1 is provided with a hot blast point 4 that is used for passing under the test environment temperature through hole place temperature on the metal substrate, and other arranges the element point 5 of a representation element device solder joint that is made of solder joint.Wherein the distance between hot blast point 4 and the element point 5 and position arrange according to the area size of metal substrate 1, are as the criterion not influence each other.Put the 5 corresponding hot blast galvanic couple 2 that corresponding measurement is set respectively and solder joint galvanic couples 7 with hot blast point 4 and element, the metal substrate area of this programme is 100mm
*100mm, thickness is 1mm, wherein hot blast point 4 and element point 5 are positioned on the diagonal line of metal substrate and the 1/2 cornerwise length of being separated by, hot blast is put 4 places and is had the through hole that diameter is 10mm, hot blast galvanic couple 2 lies in a horizontal plane on the metal substrate and 6 centers that are positioned at hot blast point 4 of popping one's head in, and utilizes the circuit of hot-setting adhesive 3 stationary heat wind-powered electricity generations idol 2 in the position of hot blast point limit 5mm.The metal substrate of putting 5 places at element is opened the through hole of a diameter 2.5mm, and the probe of solder joint galvanic couple 7 is surrounded the snare of one 360 degree at a diameter 2.5
*On 8 the screw, again screw is utilized fixed by nut in element is put the through hole at 5 places, same utilize the fixedly circuit 7 of solder joint galvanic couple of hot-setting adhesive 3, solder joint galvanic couple 7 to be attached to equally on the substrate in the position from element point 5mm and parallel with hot blast galvanic couple 2.
Metal substrate is in 200～280 ℃ of scopes of ultimate temperature of thermometric card the time, and itself material characteristic is had no effect, and thermal capacity is highly stable, and therefore error precision can increase the service life in 1 ℃ greatly.Hot blast point 4 is used for measuring the hot blast heating-up temperature of refluxing unit, and hot blast can directly measure the temperature that firing equipment arrives the integrated circuit board surface by the thermocouple probe at through hole center.Element point is used for the heating temperature of analogue measurement element.Owing to directly with hardware substituted component direct fixing thermocouple probe also, got rid of element and be subjected to the influence in immobilization material life-spans such as thermal distortion and viscose.Thermopair on the substrate damages or after life span, can directly change, but can't change the on-gauge plate state consistency in addition.
The using method of the metal substrate of this programme is as follows:
101, utilize existing thermometric plate under current environment, to measure and obtain the product temperature curve;
This step utilizes the thermometric plate of existing P CB plate making as measurement standard earlier, measures to obtain the standardized product temperature curve of this integrated circuit board earlier.
102, utilize metal substrate under same environment, to measure and obtain the metal substrate temperature curve;
Under same environment, measure and obtain the substrate temperature curve again with the metal substrate of this programme.
103, the data of storage products temperature curve and metal substrate temperature curve and foundation corresponding relation between the two;
This moment is because thermometric plate and metal substrate all are in the precision measure scope, so the standard that both observed temperatures under same environment namely can be used as follow-up measurement stores, and sets up the corresponding relation on temperature curve between the two simultaneously.
When 104, like products needs to measure again, directly adopt metal substrate to measure, compare with current metal substrate temperature curve and primary metal substrate temperature curve, obtain this product temperature curve data of this product according to product temperature curve and primary metal substrate temperature curve corresponding relation again.
When this type of like products is measured again, directly adopt metal substrate to measure, the metal substrate temperature curve that obtains and each curve as standard compare, see whether change, if change, can compare according to the canonical measure first time result of this measurement result and storage, and can obtain the integrated circuit board actual temperature curve of this series products according to the corresponding relation of setting.
The above only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, anyly be familiar with the technician of this patent in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned prompting is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solutions of the utility model, any simple modification that foundation technical spirit of the present utility model is done above embodiment, equivalent variations and modification all still belong in the scope of the utility model scheme.
Claims (8)
1. the measurement plate that refluxes is characterized in that comprise the metal substrate (1) that carries temperature thermocouple, described metal substrate (1) is provided with the point for measuring temperature corresponding with temperature thermocouple.
2. plate is measured in a kind of backflow as claimed in claim 1, it is characterized in that, described temperature thermocouple has two, comprise for the hot blast galvanic couple (2) of measures ambient temperature with for the solder joint galvanic couple (7) of measuring weld point temperature, described point for measuring temperature has two, comprise corresponding with hot blast galvanic couple (2) the hot blast hole (4) that is arranged on the metal substrate, with solder joint galvanic couple (7) corresponding elements point (5).
3. plate is measured in a kind of backflow as claimed in claim 2, it is characterized in that, described hot blast hole (4) and element point (5) are arranged on the same diagonal line of metal substrate (1) and between the two every 1/2 catercorner length.
4. reflux as described any one of claim 1-3 and measure plate, it is characterized in that the area of described metal substrate (1) is 100mm
*100mm, thickness are 1mm.
5. plate is measured in a kind of backflow as claimed in claim 2, it is characterized in that, the diameter in described hot blast hole (4) is 10mm, and the probe (6) of hot blast galvanic couple (2) is arranged on the circle centre position in hot blast hole, and the link tester of hot blast galvanic couple (2) is crossed hot-setting adhesive (3) and is fixed on the metal substrate (1).
6. plate is measured in a kind of backflow as claimed in claim 2, it is characterized in that, described element point (5) is the through hole of diameter 2.5mm, and the probe of solder joint galvanic couple (7) utilizes screw to be fixed on the through hole place, and the link tester of solder joint galvanic couple (5) is crossed hot-setting adhesive (3) and is fixed on the metal substrate.
7. plate is measured in a kind of backflow as claimed in claim 2, it is characterized in that, on the circuit secured in parallel metal substrate (1) of hot blast galvanic couple (2) and solder joint galvanic couple (7).
8. plate is measured in a kind of backflow as claimed in claim 1, it is characterized in that described metal substrate (1) is aluminium alloy base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320353070.6U CN203231827U (en) | 2013-06-19 | 2013-06-19 | Backflow measurement plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320353070.6U CN203231827U (en) | 2013-06-19 | 2013-06-19 | Backflow measurement plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203231827U true CN203231827U (en) | 2013-10-09 |
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ID=49287947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320353070.6U Expired - Fee Related CN203231827U (en) | 2013-06-19 | 2013-06-19 | Backflow measurement plate |
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| Country | Link |
|---|---|
| CN (1) | CN203231827U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104155019A (en) * | 2014-08-15 | 2014-11-19 | 中利腾晖光伏科技有限公司 | Temperature measuring device and temperature measuring method |
-
2013
- 2013-06-19 CN CN201320353070.6U patent/CN203231827U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104155019A (en) * | 2014-08-15 | 2014-11-19 | 中利腾晖光伏科技有限公司 | Temperature measuring device and temperature measuring method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131009 Termination date: 20140619 |
|
| EXPY | Termination of patent right or utility model |