CN203225978U - Heat radiation structure and device comprising same - Google Patents
Heat radiation structure and device comprising same Download PDFInfo
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- CN203225978U CN203225978U CN 201320052423 CN201320052423U CN203225978U CN 203225978 U CN203225978 U CN 203225978U CN 201320052423 CN201320052423 CN 201320052423 CN 201320052423 U CN201320052423 U CN 201320052423U CN 203225978 U CN203225978 U CN 203225978U
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- radiator
- circuit board
- printed circuit
- heat
- pcb
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Abstract
The utility model provides a heat radiation structure and a device comprising the same. The heat radiation structure comprises a printed circuit board, a power element disposed on the printed circuit board, a housing, and a heat radiation device used for transmitting heat of the power element from the printed circuit board to the housing; a heat conduction block is embedded in the position on the printed circuit board opposite to the power element, the heat conduction block has the same thickness as the printed circuit board, and the power element is contacted with the heat conduction block; and the heat radiation device is connected with the heat conduction block and the housing, and enables adaptive deformation in pace with the motion of the printed circuit board. Compared with the prior art, the heat radiation structure and the device comprising the same improve capability of heat radiation.
Description
Technical field
The utility model relates to heat dissipation technology, relates in particular to a kind of radiator structure and comprises the device of this radiator structure.
Background technology
The caloric requirement that power component produces is in the course of the work in time distributed, with the operate as normal of guaranteed output element; Such as, along with chip develops to high integration and high power direction, heat radiation more and more becomes its bottleneck.Current approach generally is at chip upper surface radiator to be installed, and is dissipated in the air by natural heat dissipation or the fan forced convection heat with chip then.But for sensitive chip, because its front end is glass (light need pass through glass), so its front end can't be arranged radiator.
Current scheme is that direct bottom with sensitive chip is installed in printed circuit board (PCB) (Printed Circuit Board, be called for short: PCB), and increase via hole at PCB, the heat of sensitive chip generation is transmitted to the radiator of PCB opposite side by this via hole, radiator is connected with the metal shell of sensitive chip place device, and heat spreads in the air the most at last.In order further to improve the radiating efficiency for sensitive chip, another kind of radiator structure also is provided, for example, part relative with the sensitive chip bottom on PCB is inlayed a heat conduction copper billet that thickness is identical with PCB, make the bottom of a tactility optical chip of this copper billet, another side contact radiator, the contact area increase owing to copper billet and sensitive chip makes radiating efficiency improve like this.
But, owing to sensitive chip need be focused and moved, in order to satisfy the mobile demand of chip, radiator in the above-mentioned radiator structure has two kinds of mounting meanss: based on copper billet and the crust of the device in the two ends difference connection PCB of radiator, a kind of mode is that radiator is installed on the PCB, and PCB and radiator can be mobile with the adjusting of sensitive chip like this, but can't paste shell after radiator moves, namely can't keep well contacting with crust of the device, thereby make heat-sinking capability reduce greatly; Another kind of mode is that radiator is installed on the shell, owing to utilized the area of dissipation of shell, makes heat-sinking capability strengthen greatly, but, when sensitive chip is regulated, can make that the embedding copper part on radiator and the PCB can't excellent contact, also make heat-sinking capability descend.
The utility model content
The utility model provides a kind of radiator structure and comprises the device of this radiator structure, to satisfy the heat-sinking capability that improves under the distance adjustment demand of power component power component.
First aspect provides a kind of radiator structure, comprising: printed circuit board (PCB), the radiator that is installed in power component on the described printed circuit board (PCB), shell and is used for the heat of described power component is conducted to from described printed circuit board (PCB) described shell;
Position relative with described power component on the described printed circuit board (PCB) embeds heat-conducting block, and described heat-conducting block has the thickness identical with described printed circuit board (PCB), and described power component contacts with described heat-conducting block;
Described radiator is connected with described shell with described heat-conducting block respectively, and described radiator can be along with the mobile adaptability deformation of described printed circuit board (PCB).
In conjunction with first aspect, in first kind of possible implementation, described radiator comprises: second end that is used for first end that is connected with described heat-conducting block and is used for being connected with described shell; Described first end is fixed on first metal derby, and described first metal derby connects described heat-conducting block; Described second end is fixed on second metal derby, and described second metal derby connects described shell.
In conjunction with first kind of first aspect possible implementation, in second kind of possible implementation, described first metal derby is provided with first mounting groove, and first end of described radiator embeds described first mounting groove; Described second metal derby is provided with second mounting groove, and second end of described radiator embeds described second mounting groove.
In conjunction with first kind of first aspect possible implementation, in the third possible implementation, described first metal derby is connected with described heat-conducting block welding or by screw.
In conjunction with first kind of first aspect possible implementation, in the 4th kind of possible implementation, described second metal derby is connected with described shell welding or by screw.
In conjunction with in four kinds of possible implementations of first kind of possible implementation to the of first aspect or first aspect any one, in the 5th kind of possible implementation, described radiator be shaped as U-shaped or V-type.
In conjunction with first aspect, in the 6th kind of possible implementation, described radiator is connected by at least two contact sites with described shell.
Second aspect provides a kind of equipment, comprises radiator structure described in the utility model.
In conjunction with second aspect, in first kind of possible implementation, described equipment also comprises: operation element, described operation element is installed on the printed circuit board (PCB) in the described radiator structure, and is connected with regulating spring by adjustment screw between described operation element and the described printed circuit board (PCB).
The radiator structure that the utility model provides and comprise that the technique effect of the device of this radiator structure is: by connecting the heat-conducting block of printed circuit board (PCB) and the radiator of shell respectively, be designed to be able to the structure along with the mobile adaptability deformation of described printed circuit board (PCB), just can guarantee when the distance adjustment of power component, also to keep with heat-conducting block and the good of shell contacting, thereby improve heat-sinking capability with respect to prior art.
Description of drawings
Fig. 1 is the structural representation of the utility model radiator structure one embodiment;
Fig. 2 is the preceding schematic diagram of the installation of another embodiment of the utility model radiator structure;
Fig. 3 is schematic diagram after the installation of another embodiment of the utility model radiator structure;
Fig. 4 is the a-quadrant enlarged drawing among Fig. 3;
Fig. 5 is the structural representation of the another embodiment of the utility model radiator structure;
Fig. 6 is the structural representation of the another embodiment of the utility model radiator structure;
Fig. 7 is the structural representation of the utility model equipment embodiment.
Embodiment
Embodiment one
Fig. 1 is the structural representation of the utility model radiator structure one embodiment, this radiator structure mainly be for power component for example the heat that produces of powerful sensitive chip distribute.This Fig. 1 just schematically represents included member and the annexation thereof of this radiator structure.As shown in Figure 1, this radiator structure can comprise: printed circuit board (PCB) 11, be installed in power component 12, shell 13 and radiator 14 on this printed circuit board (PCB) 11.
Wherein, the position relative with power component 12 embeds heat-conducting block 15 arranged on printed circuit board (PCB) 11, this heat-conducting block 15 is identical with the thickness of printed circuit board (PCB) 11, power component 12 contacts with this heat-conducting block 15, for example, in the contact of the contact-making surface f shown in Fig. 1, the heat of power component 12 generations just can directly pass to this heat-conducting block 15 like this; This heat-conducting block 15 for example is a copper billet.By embed the heat that a heat-conducting block 15 is used for conducted power element 12 at printed circuit board (PCB) 11, can improve radiating efficiency.
The shell 13 of present embodiment is the shell of the device at this radiator structure place; For example, power component 12 is the sensitive chips in the video camera, and this shell is exactly the shell of video camera.Described shell 13 is metal shell normally, is beneficial to heat radiation.The two ends of radiator 14 are connected with shell 13 with heat-conducting block 15 respectively, be used for the heat of power component 12 is conducted to shell 13 from printed circuit board (PCB) 11, the heat that makes power component 12 produce passes through the transmission path of heat-conducting block---radiator---shell, finally is dispersed in the surrounding air by shell 13.
In the present embodiment, radiator 14 can be along with the mobile adaptability deformation of printed circuit board (PCB) 11, this is described as follows for example: suppose that power component 12 is sensitive chips, because this sensitive chip of work requirements of video camera also needs to focus, and drive is installed the printed circuit board (PCB) 11 of this sensitive chip along with sensitive chip is mobile together, to adapt to the needs of focusing.At this moment, the spacing between printed circuit board (PCB) 11 and the shell 13 can change, and for example spacing increases or dwindles; Accordingly, be arranged on the radiator 14 between printed circuit board (PCB) 11 and the shell 13, be that deformation can take place along with the variation of above-mentioned spacing in the present embodiment, in spacing direction elongation or the shortening of printed circuit board (PCB) 11 with shell 13, namely carry out adaptive identical change with above-mentioned spacing such as radiator 14.
By the mobile adaptability deformation of radiator 14 along with printed circuit board (PCB) 11, just can remain radiator 14 and contact with the good of shell 13 with printed circuit board (PCB) 11.Such as, if above-mentioned adaptability deformation can not take place in radiator 14, then when the spacing between printed circuit board (PCB) 11 and the shell 13 changes, can not well contact between radiator 14 and the printed circuit board (PCB) 11, can not well contact between radiator 14 and the shell 13, all can make heat-sinking capability reduce; And the radiator structure of present embodiment has improved heat-sinking capability to power component greatly with respect to this.
Above-mentioned radiator 14 for example can make it to have certain ductility and rigidity by modes such as high-temperature heat treatment, satisfies the deformation demand; In addition, the shape of the connected mode of radiator 14 and heat-conducting block 15 and shell 13 and this radiator 14 self, present embodiment is not done strict restriction, can change flexibly in concrete the enforcement, as long as can satisfy the conductive force of this radiator 14 and the performance of adaptability deformation.
Embodiment two
Present embodiment provides a kind of optional radiator structure, and Fig. 2 is schematic diagram before the installation of another embodiment of the utility model radiator structure, and Fig. 3 is schematic diagram after the installation of another embodiment of the utility model radiator structure, and Fig. 4 is the a-quadrant enlarged drawing among Fig. 3.
Also show operation element among above-mentioned Fig. 2-Fig. 4, this operation element refers to, and for example power component is sensitive chip, and the device at sensitive chip place is video camera, then lens construction spare in the video camera etc. is operation element, is the camera function of finishing this video camera with sensitive chip jointly.Shown in Fig. 2-4, the position relative with the bottom of power component 12 on printed circuit board (PCB) 11, original printed circuit board material is hollowed out, mode by machining embeds a solid heat-conducting block 15, this heat-conducting block 15 for example is copper billet, makes this copper billet and printed circuit board (PCB) 11 form an integral body by interference fit.Power component 12 is welded on the copper billet and pad on the printed circuit board (PCB) 11 by its bottom land and pin.
In the present embodiment, radiator 14 is heat-pipe radiator modules, and it has the function of quick conduction heat, can rapidly heat be conducted to shell 13 from heat-conducting block 15.Concrete, the two ends of radiator 14 are embedded in respectively in two metal derbies, connect heat-conducting block 15 or shell 13 by metal derby again; For example, first end is fixed on first metal derby 16, and second end is fixed on second metal derby 17.Concrete, can on above-mentioned two metal derbies, mounting groove be set all, the two ends of radiator 14 are embedded in the described mounting groove; For example, first mounting groove 18 is set on first metal derby 16, first end of radiator embeds described first mounting groove 18; Second metal derby 17 is provided with second mounting groove 19, and second end of described radiator embeds described second mounting groove 19.In addition, can being aided with other modes, to make that radiator 14 is installed in mounting groove more firm, for example makes that by welding or other modes 14 one-tenth in metal derby and radiator are as a whole.
The first above-mentioned metal derby 16 can be connected by welding manner with the heat-conducting block 15 in the printed circuit board (PCB) 11, also can adopt screw to connect; Wherein, more preferred when adopting welding manner, because this moment the mounting hole site of first metal derby 16 need be set at printed circuit board (PCB) 11, make the arrangement space of printed circuit board (PCB) 11 obtain saving, can not have influence on the cabling on the printed circuit board (PCB) 11; Installation and the needed time of trip bolt of also having saved the screw mode simultaneously, improved installation effectiveness.
Can be connected by screw 20 between the second above-mentioned metal derby 17 and the shell 13, make second metal derby 17 and shell 13 keep firm good the contact; Perhaps, also can weld between second metal derby 17 and the shell 13.
In addition, operation element 21(for example is lens construction spare) be connected on the printed circuit board (PCB) 11 by adjustment screw 22 and regulating spring 23, can be by regulating this adjustment screw 22, make the spacing between printed circuit board (PCB) 11 and the operation element 21 change, and then make the spacing be installed in power component 12 and operation element 21 on the printed circuit board (PCB) 11 change, be that sensitive chip, operation element 21 are video cameras of lens construction spare for power component 12, the adjustment of this spacing is the adjusting to the sensitive chip focal length.
The radiator 14 of present embodiment is can be along with the mobile adaptability deformation of described printed circuit board (PCB), can be under the situation of an end of fixed heat sink 14, use external force makes its other end that trickle displacement take place and does not produce permanent deformation, by discharging external force, it is restored be initial shape.For example, by adjusting adjustment screw 22, make hypotelorism between printed circuit board (PCB) 11 and the operation element 21, be about to the hypotelorism between power component 12 and the operation element 21, at this moment, deformation will take place in the radiator 14 that is connected printed circuit board (PCB) 11 opposite sides, extends in printed circuit board (PCB) 11 and the direction of shell 13 spacings, be equivalent to along with printed circuit board (PCB) 11 moves, remain with printed circuit board (PCB) 11 and contact with the good of shell 13.In like manner, when the spacing between printed circuit board (PCB) 11 and the operation element 21 increased, radiator 14 will shorten, to satisfy the needs that power component 12 is regulated.
The radiator structure of present embodiment, contact by making radiator remain with printed circuit board (PCB) and the good of shell by deformation, make the heat of power component to be delivered on the shell fast through heat-conducting block and radiator, heat-sinking capability is strengthened greatly, makes the heat radiation risk of power component greatly reduce.
Embodiment three
In above-mentioned Fig. 2-Fig. 4, the shape of radiator is to be example with U-shaped, in concrete the enforcement, radiator also can adopt other shape, such as the radiator that can determine to adopt which kind of shape according to the internal structure of the device at its place, for example can adopt pointed radiator, as long as radiator is connected with shell with heat-conducting block respectively.
Fig. 5 is the structural representation of the another embodiment of the utility model radiator structure, and Fig. 6 is the structural representation of the another embodiment of the utility model radiator structure, and these two kinds of radiator structures provide two kinds of optional radiator shapes; Wherein, the radiator among Fig. 6 has by two contact sites with shell and is connected, and increasing the contact area with shell, thereby further improves heat-sinking capability, also can design the contact site more than two in concrete the enforcement.Other structures are identical with embodiment two, repeat no more.
Embodiment four
Present embodiment provides a kind of equipment, and Fig. 7 is the structural representation of the utility model equipment embodiment, and it comprises the described radiator structure of the utility model any embodiment.For example, this equipment is video camera.
This device also comprises: operation element, described operation element are installed on the printed circuit board (PCB) in the described radiator structure, and are connected with regulating spring by adjustment screw between described operation element and the described printed circuit board (PCB).Specific constructive form can be in conjunction with described referring to radiator structure embodiment.
The device of present embodiment, owing to adopted the described radiator structure of the utility model any embodiment, improved heat-sinking capability, the heat that power component produces can be distributed fast, make the heat radiation risk of power component reduce greatly, also improved the service behaviour of this equipment.
It should be noted that at last: above each embodiment is not intended to limit only in order to the technical solution of the utility model to be described; Although have been described in detail with reference to the utility model of aforementioned each embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, and perhaps some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a radiator structure is characterized in that, comprising: printed circuit board (PCB), the radiator that is installed in power component on the described printed circuit board (PCB), shell and is used for the heat of described power component is conducted to from described printed circuit board (PCB) described shell;
Position relative with described power component on the described printed circuit board (PCB) embeds heat-conducting block, and described heat-conducting block has the thickness identical with described printed circuit board (PCB), and described power component contacts with described heat-conducting block;
Described radiator is connected with described shell with described heat-conducting block respectively.
2. radiator structure according to claim 1 is characterized in that, described radiator comprises: second end that is used for first end that is connected with described heat-conducting block and is used for being connected with described shell;
Described first end is fixed on first metal derby, and described first metal derby connects described heat-conducting block; Described second end is fixed on second metal derby, and described second metal derby connects described shell.
3. radiator structure according to claim 2 is characterized in that, described first metal derby is provided with first mounting groove, and first end of described radiator embeds described first mounting groove;
Described second metal derby is provided with second mounting groove, and second end of described radiator embeds described second mounting groove.
4. radiator structure according to claim 2 is characterized in that, described first metal derby is connected with described heat-conducting block welding or by screw.
5. radiator structure according to claim 2 is characterized in that, described second metal derby is connected with described shell welding or by screw.
6. according to the arbitrary described radiator structure of claim 1-5, it is characterized in that, described radiator be shaped as U-shaped or V-type.
7. radiator structure according to claim 1 is characterized in that, described radiator is connected by at least two contact sites with described shell.
8. a device that comprises radiator structure is characterized in that, described radiator structure is the arbitrary described radiator structure of claim 1～7.
9. device according to claim 8, it is characterized in that, also comprise: operation element, described operation element are installed on the printed circuit board (PCB) in the described radiator structure, and are connected with regulating spring by adjustment screw between described operation element and the described printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320052423 CN203225978U (en) | 2013-01-30 | 2013-01-30 | Heat radiation structure and device comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320052423 CN203225978U (en) | 2013-01-30 | 2013-01-30 | Heat radiation structure and device comprising same |
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| Publication Number | Publication Date |
|---|---|
| CN203225978U true CN203225978U (en) | 2013-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320052423 Expired - Fee Related CN203225978U (en) | 2013-01-30 | 2013-01-30 | Heat radiation structure and device comprising same |
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| CN (1) | CN203225978U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107443318A (en) * | 2017-07-20 | 2017-12-08 | 长沙启科电子有限公司 | A kind of device for controlling power tool |
-
2013
- 2013-01-30 CN CN 201320052423 patent/CN203225978U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107443318A (en) * | 2017-07-20 | 2017-12-08 | 长沙启科电子有限公司 | A kind of device for controlling power tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131002 Termination date: 20170130 |
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| CF01 | Termination of patent right due to non-payment of annual fee |