CN203217447U - Fin plate and industrial personal computer using same - Google Patents

Abstract

The utility model discloses a fin plate for manufacturing an electronic device casing. The fin plate comprises a base plate and a heat conduction module. The base plate is made of a first heat conduction material, and the heat conduction module is embedded in the inner lateral side of the base plate and made of a second heat conduction material which is better in heat conduction performance compared with the first heat conduction material. The utility model further provides an industrial personal computer using the fin plate as a back plate. By means of the fin plate, a material good in heat transfer effect and a material good in radiating effect can be combined, and a radiating effect is remarkably improved.

Description

A kind of fin keel and the industrial computer that uses this fin keel

Technical field

The utility model relates to computer equipment manufacturing technology field, specifically, relates to a kind of fin keel for electronic equipment casing; The utility model provides a kind of industrial computer that uses above-mentioned fin keel simultaneously.

Background technology

Along with the expansion of computing machine in industrial range of application, it is more and more using the field of industrial computer.But because the applied environment relative complex, industrial computer (IPC) is compared with PC (PC) and is required to have higher reliability and functional, structurally also can more adapt to the applied environment of various complexity.

Industrial computer is the computing machine that designs for industry spot specially, and industry spot generally has strong vibrations, and dust is more, so the working environment of industrial computer generally all compares badly, thus for the requirement of each assembly stability of industrial computer inside also than higher.The subject matter of industrial computer when work is its heat dissipation problem, and industrial computer adopts heat radiator, radiator fan to realize the central processing unit in the industrial computer (being CPU) is dispelled the heat usually.Heat radiator can take some industrial computer inner spaces, is unfavorable for the industrial computer miniaturization; And the radiator fan that the principle of utilizing thermal convection is dispelled the heat tends to the dust in the environment is brought into industrial computer inside, influences the operate as normal of each assembly of industrial computer inside.

For controlling the industrial computer internal heat effectively, fuselage adopts large tracts of land fin-shaped aluminum alloy materials as the heat radiation conduction device, effectively the heat of internal system is dissipated fast, can adapt to harsh working environment.This heat radiation is passed to device and is called fin keel.

The heat radiation fin keel of existing industrial computer generally adopts aluminium or aluminium alloy to make, can better the industrial computer internal heat be shed to the external world, but in many occasions, still can not satisfy the demand of heat radiation industrial computer, especially in the occasion that requires to use totally-enclosed industrial computer, its radiating effect especially can not be satisfied with.

The utility model content

The utility model provides a kind of fin keel, is used for casting of electronic device, and this fin keel has the radiating effect that significantly improves.

The utility model provides a kind of fin keel, is used for casting of electronic device, and this fin keel comprises substrate and heat conducting module; Described substrate adopts first kind of Heat Conduction Material to make, and described heat conducting module is embedded in the medial surface of described substrate, and adopts thermal conductivity to make than first kind of better second kind of Heat Conduction Material of Heat Conduction Material.

Preferably, the heat conducting module of inlaying is tabular.

Preferably, described first kind of Heat Conduction Material is metallic aluminium; Second kind of material is metallic copper.

Preferably, described concrete connected mode of inlaying is: be threaded, key connects or pin connects.

Preferably, described inlaying adopts interference fit to realize.

The utility model provides a kind of industrial computer simultaneously, and this industrial computer uses the described fin keel of above-mentioned each technical scheme.

Preferably, described fin keel is as the backboard of this industrial computer.

The new construction that the utility model provides is changed into by two kinds of Heat Conduction Materials and being made by the fin keel of only being made by single Heat Conduction Material in the past; The single structure of fin keel changes into and adopts first kind of Heat Conduction Material as substrate under the prior art, and the better second kind of Heat Conduction Material of another heat conductivility is mounted to the composite structure of substrate inboard; By two kinds of Heat Conduction Materials of suitable selection, can balance heat conduction and thermal absorption, obtain more preferably radiating effect.

Description of drawings

The fin keel structure front elevation that Fig. 1 provides for the utility model embodiment;

The vertical view of the fin keel structure that provides among the utility model embodiment is provided Fig. 2;

The side sectional view of the fin keel structure that Fig. 3 provides for the utility model embodiment.

Fig. 4 is the partial enlarged drawing of Fig. 3.

Embodiment

In view of defective and the deficiency that existing industrial computer housing exists, this is implemented a kind of novel fin keel structure of novel proposition and is used for the industrial computer housing.The new construction that this utility model provides changes the composite structure that adopts the better Heat Conduction Material of another kind of heat conductivility and archipterygium to harden and close into by the single structure that is only dispelled the heat by fin keel in the past, by cooperatively interacting of two kinds of materials, significantly improves the radiating effect of fin keel.

Specifically describe the fin keel that this utility model provides below.

Referring to figs. 1 through Fig. 4, the utility model provides a kind of fin keel for casting of electronic device.This fin keel comprises substrate 1 and heat conducting module 2.

Be equivalent to the fin keel of prior art at described substrate 1, just its medial surface is provided with corresponding recessed portion for inlaying heat conducting module 2.Described heat conducting module 2 is embedded in the recessed portion of described substrate 1 medial surface, and this heat conducting module 2 adopts the better second kind of Heat Conduction Material of thermal conductivity to make.The corrugated fin 1-1 that arranges on described substrate 1 lateral surface also is shown among Fig. 1, Fig. 2, and these heat radiator 1-1 can increase area of dissipation, and the heat that substrate 1 is absorbed is dispersed into the outside rapidly.

In the concrete selection of material, a kind of concrete scheme is, described first kind of Heat Conduction Material adopts aluminium or aluminium alloy, and second kind of material selected fine copper, is commonly called as red copper.Aluminium or aluminium alloy have higher specific heat capacity, can absorb more heats, and since cheap, can more heat radiator be set at its lateral surface, to enlarge area of dissipation.Described second kind of Heat Conduction Material then selects the higher fine copper of thermal conductivity coefficient to make because its thermal conductivity is better, this heat conducting module 2 can be rapidly with the described substrate 1 that passes to of the heat of electronic equipment internal.Cooperate by the two, can obtain the better radiating effect of fin keel made than homogenous material, and obtain higher cost performance.

The mode that described heat conducting module 2 embeds substrates 1 has multiple, as be threaded, key connects or pin connects etc.The mode that also can adopt interference fit directly to embed.For example, in substrate 1 as shown in Figure 3, Figure 4, the heat conducting module 2 that adopts interference fit directly the red copper material to be made embeds the recessed portion of substrate 1 inboard.The mode that adopts this interference fit directly to embed, not only simple in structure, and can simplify assembling process, to be convenient to install, shock resistance, vibration performance are good; And this kind embedded mode can guarantee the embedding area maximum of heat conducting module 2, and heat conducting module 2 is the tightst with the combination of substrate 1, significantly strengthens radiating effect.

The industrial computer guidance panel that above-described embodiment is provided is used for industrial computer, can obtain the embodiment of the industrial computer that the utility model provides.

When industrial computer adopts foregoing fin keel as backboard, owing to change aluminium fin keel in the past into combined type fin keel that red copper combines with aluminium, thereby can significantly improve the radiating effect of industrial computer.Under the prerequisite that requires totally-enclosed industry control type, adopt above-mentioned novel fin keel structural cooling performance obviously to be better than adopting single aluminum fin keel or copper fin keel, and have higher cost performance.

More than show and described ultimate principle of the present utility model and principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the instructions just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Though the utility model with preferred embodiment openly as above; but it is not to limit the utility model; any those skilled in the art are not in breaking away from spirit and scope of the present utility model; can make possible change and modification, therefore protection domain of the present utility model should be as the criterion with the scope that the utility model claim is defined.

Claims (7)

1. a fin keel is used for casting of electronic device, it is characterized in that this fin keel comprises substrate and heat conducting module; Described substrate adopts first kind of Heat Conduction Material to make, and described heat conducting module is embedded in the medial surface of described substrate, and adopts thermal conductivity to make than first kind of better second kind of Heat Conduction Material of Heat Conduction Material.

2. fin keel as claimed in claim 1 is characterized in that, the heat conducting module of inlaying is tabular.

3. fin keel as claimed in claim 1 is characterized in that, described first kind of Heat Conduction Material is metallic aluminium; Second kind of material is metallic copper.

4. fin keel as claimed in claim 1 is characterized in that, described concrete connected mode of inlaying is: be threaded, key connects or pin connects.

5. fin keel as claimed in claim 1 is characterized in that, described inlaying adopts interference fit to realize.

6. an industrial computer is characterized in that, uses as each described fin keel among the claim 1-5.

7. industrial computer according to claim 6 is characterized in that, described fin keel is as the backboard of this industrial computer.

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