CN203209367U - Ultrasonic cleaning device for gold bonding wires - Google Patents

Ultrasonic cleaning device for gold bonding wires Download PDF

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Publication number
CN203209367U
CN203209367U CN 201320216415 CN201320216415U CN203209367U CN 203209367 U CN203209367 U CN 203209367U CN 201320216415 CN201320216415 CN 201320216415 CN 201320216415 U CN201320216415 U CN 201320216415U CN 203209367 U CN203209367 U CN 203209367U
Authority
CN
China
Prior art keywords
cleaning
ultrasonic cleaning
bonding wires
tank
gold bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320216415
Other languages
Chinese (zh)
Inventor
田鹏
赵峰
周峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TENGZHOU CHENHUI ELECTRONICS GROUP Ltd
Original Assignee
TENGZHOU CHENHUI ELECTRONICS GROUP Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TENGZHOU CHENHUI ELECTRONICS GROUP Ltd filed Critical TENGZHOU CHENHUI ELECTRONICS GROUP Ltd
Priority to CN 201320216415 priority Critical patent/CN203209367U/en
Application granted granted Critical
Publication of CN203209367U publication Critical patent/CN203209367U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Wire Bonding (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

An ultrasonic cleaning device for gold bonding wires comprises a cleaning tank, an electronic oscillator, a circulating pipe, a filter and a circulating pump, and is characterized in that the cleaning tank is a stainless steel water tank with a convex bottom, a drain hole formed in one end of the bottom is communicated with the circulating pipe, the electronic oscillator is mounted at the other end of the bottom, and a fixed jockey pulley is arranged at the center of the bottom. The circulating pipe is connected with the filter and the circulating pump in sequence, and the other end of the circulating pipe extends into the water tank via the upper edge of the water tank. The ultrasonic cleaning device for the gold bonding wires has the advantages of simplicity, easiness in operation, rapid cleaning, high cleanliness, cleaning thoroughness and the like, and cannot cause damage to the gold bonding wires.

Description

The bonding gold wire ultrasonic cleaning equipment
Affiliated technical field:
The utility model relates to a kind of cleaning device, especially a kind of bonding gold wire cleaning device.
Background technology:
The ultrasonic cleaning process technology refers to utilize cavitation effect of ultrasonic waves that the dirt on the body surface is clashed into, peels off, and has reached the purpose of cleaning.It is fast that it has cleaning speed, cleans characteristics more completely, particularly is applied to the cleaning of some precisions, fragile goods.At present, the cleaning method of known bonding gold wire is to adopt the cleaning fluid direct injection to clean, and does not also have using ultrasound ripple cleaning technique, and therefore, cleaning thorough inadequately do not reach the purpose of complete cleaning.
Summary of the invention:
The purpose of this utility model is to provide a kind of cleaning speed fast, cleans bonding gold wire ultrasonic cleaning equipment more completely.
The purpose of this utility model is achieved in that a kind of bonding gold wire ultrasonic cleaning equipment, it comprises rinse bath, electro coupled oscillator, circulation pipe, filter, circulating pump, it is characterized in that rinse bath is tank at the bottom of the stainless steel convex, end in the bottom has an osculum to be connected with circulation pipe, the other end is installed an electro coupled oscillator, and the central authorities in the bottom establish a stator ring.
According to described bonding gold wire ultrasonic cleaning equipment, it is characterized in that: described circulation pipe is connected with circulating pump with filter in turn, and its other end stretches in the tank through the upper edge of tank.
The beneficial effects of the utility model are, have cleaning speed fast, clean the cleanliness factor height, clean characteristics such as more thorough, can not cause damage by the para-linkage spun gold, device is simple, and is easy to operate.
Description of drawings:
Below in conjunction with drawings and Examples the utility model is further specified.
Accompanying drawing is structural representation of the present utility model.
1 rinse bath, 2 electro coupled oscillators, 3 circulation pipes, 4 filters, 5 circulating pumps, 6 stator rings among the figure.
The specific embodiment:
The utility model as shown in the figure, a kind of bonding gold wire ultrasonic cleaning equipment, it comprises rinse bath (1), electro coupled oscillator (2), circulation pipe (3), filter (4), circulating pump (5), it is characterized in that rinse bath (1) is tank at the bottom of the stainless steel convex, end in the bottom has an osculum to be connected with circulation pipe (3), the other end is installed an electro coupled oscillator (2), and the central authorities in the bottom establish a stator ring (6).Described circulation pipe (3) is connected with circulating pump (5) with filter (4) in turn, and its other end is in rinse bath (1) is goed deep in the upper edge of rinse bath (1).
Operation principle of the present utility model and operating position be as shown in the figure: bonding gold wire (7) enters rinse bath (1) from an end of rinse bath (1), through the stator ring (6) of rinse bath (1) bottom, pulls out from the other end of rinse bath (1) again.Rinse bath is filled it up with cleaning fluid in (1), and electro coupled oscillator (2) sends ultrasonic wave, makes it the cleaning fluid in the rinse bath (1) is radiated ultrasonic wave by rinse bath (1) wall.Owing to be subjected to the ultrasonic wave of radiation, thereby the microbubble that makes it in the interior liquid of groove can keep vibration under the effect of sound wave.When acoustic pressure or the sound intensity are under pressure when arriving to a certain degree, bubble will expand rapidly, and is closed suddenly again then.In this section process, the moment of bubble closure produces shock wave, make bubble produce the pressure of 1012-1013pa on every side, the immense pressure that this ultrasonic cavitation produces can be destroyed the insoluble dirt on the bonding gold wire (7), they are broken up in solution, thereby rapidly bonding gold wire (7) is cleaned out.The cleaning fluid that contains impurity enters circulation pipe (3) from the osculum of rinse bath (1), enters filter (4) again and filters.Under the effect of circulating pump (5), the cleaning fluid after the filtration flows to rinse bath (1) again, and the billon silk is cleaned.

Claims (2)

1. bonding gold wire ultrasonic cleaning equipment, it comprises rinse bath, electro coupled oscillator, circulation pipe, filter, circulating pump, it is characterized in that rinse bath is tank at the bottom of the stainless steel convex, end in the bottom has an osculum to be connected with circulation pipe, the other end is installed an electro coupled oscillator, and the central authorities in the bottom establish a stator ring.
2. according to the described bonding gold wire ultrasonic cleaning equipment of claim 1, it is characterized in that circulation pipe is connected with circulating pump with filter in turn, its other end stretches in the tank through the upper edge of tank.
CN 201320216415 2013-04-20 2013-04-20 Ultrasonic cleaning device for gold bonding wires Expired - Fee Related CN203209367U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320216415 CN203209367U (en) 2013-04-20 2013-04-20 Ultrasonic cleaning device for gold bonding wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320216415 CN203209367U (en) 2013-04-20 2013-04-20 Ultrasonic cleaning device for gold bonding wires

Publications (1)

Publication Number Publication Date
CN203209367U true CN203209367U (en) 2013-09-25

Family

ID=49198938

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320216415 Expired - Fee Related CN203209367U (en) 2013-04-20 2013-04-20 Ultrasonic cleaning device for gold bonding wires

Country Status (1)

Country Link
CN (1) CN203209367U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109570134A (en) * 2018-11-28 2019-04-05 重庆市润金新材料科技有限公司 A kind of bonding gold wire cleaning device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109570134A (en) * 2018-11-28 2019-04-05 重庆市润金新材料科技有限公司 A kind of bonding gold wire cleaning device
CN109570134B (en) * 2018-11-28 2020-08-14 重庆市润金新材料科技有限公司 Bonding gold wire belt cleaning device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130925

Termination date: 20160420