CN203205396U - Wafer cooling and positioning machine - Google Patents
Wafer cooling and positioning machine Download PDFInfo
- Publication number
- CN203205396U CN203205396U CN 201320178907 CN201320178907U CN203205396U CN 203205396 U CN203205396 U CN 203205396U CN 201320178907 CN201320178907 CN 201320178907 CN 201320178907 U CN201320178907 U CN 201320178907U CN 203205396 U CN203205396 U CN 203205396U
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- Prior art keywords
- wafer
- seat
- cooling
- sliding
- horizontal slide
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- 238000001816 cooling Methods 0.000 title claims abstract description 32
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- 230000003028 elevating effect Effects 0.000 claims description 14
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Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer cooling positioning machine, include: the wafer cooling seat is arranged on the top of the base and is provided with a cooling device; the lifting driving device is arranged on the base or the wafer cooling seat and comprises a slide rail fixing seat and a lifting seat, wherein the bottom end of the lifting seat is provided with an extension plate extending into the lower part of the bottom of the base; a wafer placing part which is assembled on the extending plate of the lifting seat and is in a shape of upwards penetrating and protruding out of the central area of the wafer cooling seat; two transverse sliding devices respectively arranged at two opposite sides of the base or the wafer cooling seat, wherein each transverse sliding device comprises a sliding rail seat and a sliding seat, and the sliding seat further comprises an inner side surface and an outer side surface; at least one group of wafer positioning parts which are arranged on the inner side surface of the sliding seat; the wafer can be cooled and corrected on the same machine table through the lifting driving device and the transverse sliding device, so that the purposes of saving the conveying time and improving the manufacturing efficiency are achieved.
Description
Technical field
The utility model relates to a kind of wafer-process device, particularly a kind of innovation wafer cooling localization machine that makes wafer can make cooling and correction operation on same board.
Background technology
Press, fast development along with science and technology, it has been quite general that the high-tech electronic product is used in the daily life, electronic products such as mobile phone, mainboard, digital camera for example, this electronic product inside is all installed and is covered with many IC semiconductors, and the semi-conductive material source of IC is exactly wafer, for can be in response to the wilderness demand of various high-tech electronic product, so the Foundry industry is target how to produce wafer more fast and accurately all, constantly researches and develops and improve breakthrough.
The procedure of wafer is complicated and accurate, include haply: little shadow, etching, diffusion, ion cloth are planted, film etc., the thin portion of wherein said little shadow flow process includes surface clean, linging, baking (comprising soft roasting and hard roasting), exposure again, develops etc., wherein because wafer can produce about 80 ℃ to 170 ℃ high temperature in bake process, therefore must just can descend one procedure through cooling operations earlier again; In addition, influence accuracy in order to prevent wafer from after some processing work flow, producing displacement deviation, so wafer also can be delivered to positioning machine table earlier in the middle of next flow process and carries out correction operation being transported to, can understand by the above, not only procedure is very many and its cooling is to carry out respectively at different platform with positioning operation for wafer, therefore increase relatively and transport the shared time of wafer, well imagine, how to integrate the wafer operation procedure and reduce the shipping time, for promoting the whole very important key of efficient of making.
Summary of the invention
Main purpose of the present utility model is to provide a kind of wafer cooling localization machine;
For achieving the above object, the utility model by the following technical solutions:
A kind of wafer cooling localization machine comprises: a pedestal comprises that a top, a bottom, two sidepieces and a wafer import end; One wafer refrigerating seat, setting is positioned on the top of pedestal, and this wafer refrigerating seat has a cooling device, uses the torrid zone that the wafer refrigerating seat is produced and walks and the effect that obtains to cool; One lifting drives device, setting is positioned pedestal or wafer refrigerating seat, comprise a slide rail holder and an elevating bracket, wherein this elevating bracket bottom has and is an extension board that extends into base bottom below, and make this elevating bracket relatively the slide rail holder do the oscilaltion displacement; At least one wafer positioning part, be mounted on the extension board of elevating bracket and be upwards to stretch through and protrude wafer refrigerating seat middle section kenel, described wafer positioning part comprises a top and a link, and wherein the top of this wafer positioning part is used when supplying existing wafer to import the end importing by wafer and can be put the location; Two horizontal slide devices, be divided into relative two sides of pedestal or wafer refrigerating seat, each horizontal slide device all includes a slide track seat and a sliding seat, and the sliding seat of two horizontal slide devices is can be along the relative lateral displacement kenel of slide track seat, and wherein this sliding seat more includes a medial surface and a lateral surface; At least one group of wafer location division is divided into the medial surface of sliding seat relatively, and each wafer location division all includes a locating surface, and described locating surface is the kenel that arranges of corresponding wafer shape;
Innovate unique design by this, make the utility model contrast prior art, make wafer can on same board, make cooling and correction operation in order to do seeing through lifting drive device with horizontal slide device, reach the practical improvement of saving the shipping time and promoting manufacturing efficient.
Description of drawings
Fig. 1 is combination stereogram of the present utility model.
Fig. 2 inserts the illustrative view of wafer for the utility model.
Fig. 3 is placed in the planar side view on wafer positioning part top for the utility model wafer.
Fig. 4 drives device and makes wafer be placed in illustrative view on the wafer refrigerating seat for the utility model sees through lifting.
Fig. 5 is the illustrative view of the horizontal slide device of the utility model location wafer.
Fig. 6 is the vertical view of the horizontal slide device of the utility model location wafer.
Fig. 7 is the cardon of doing of hookup 6.
Fig. 8 is the enforcement illustration of the utility model cooling device.
Embodiment
Shown in Fig. 1,2,3,4, the utility model wafer cooling localization machine A comprises following formation:
One pedestal 10 comprises that a top 11, a bottom 12, two sidepieces 13 and a wafer import end 14;
One wafer refrigerating seat 20, setting is positioned on the top 11 of pedestal 10, and this wafer refrigerating seat 20 has a cooling device 21, uses the torrid zone that wafer refrigerating seat 20 is produced and walks and the effect that obtains to cool;
One lifting drives device 30, setting is positioned pedestal 10 or wafer refrigerating seat 20, comprise a slide rail holder 31 and an elevating bracket 32, wherein these elevating bracket 32 bottoms have and are an extension board 33 that extends into 12 belows, pedestal 10 bottoms, and make this elevating bracket 32 relatively slide rail holder 31 do the oscilaltion displacement;
At least one wafer positioning part 34, be mounted on the extension board 33 of elevating bracket 32 and be upwards to stretch through and protrude wafer refrigerating seat 20 middle section kenels, described wafer positioning part 34 comprises a top 35 and a link 36, and wherein the top 35 of this wafer positioning part 34 is used when supplying existing wafer 01 to import end 14 importings by wafer and can be put the location;
Two horizontal slide devices 40, be divided into relative two sides of pedestal 10 or wafer refrigerating seat 20, each horizontal slide device 40 all comprises a slide track seat 41 and a sliding seat 42, and the sliding seat 42 of two horizontal slide devices 40 is can be along slide track seat 41 relative lateral displacement kenels, and wherein this sliding seat 42 also comprises a medial surface 43 and a lateral surface 44;
At least one group of wafer location division 45 is divided into the medial surface 43 of sliding seat 42 relatively, and each wafer location division 45 all includes a locating surface 46, and described locating surface 46 is the kenel that arranges of corresponding wafer 01 shape;
Wherein said wafer positioning part 34 can be the individual cylinder kenels that protrude out wafer refrigerating seat 20 of majority, and it arranges the wafer 01 contrapositions storing that kenel can supply different sizes; The medial surface 43 of each sliding seat 42 is provided with two groups of wafer location divisions 45 that are levels layout type attitude and different size relatively, uses for the wafer 01 of different sizes and does to proofread and correct contraposition; As shown in Figure 1, this wafer positioning part 34 can be six cylinder kenels, and three cylinders in the outer part can be put location (as shown in Figure 3) for bigger wafer 01 contraposition, and three cylinders in the inner part then can be put location (figure is expression not) for less wafer 01 contraposition; In addition, as shown in Figure 5, the medial surface 43 of this two sides sliding seat 42 all is provided with two-layer wafer location division 45 up and down, the bigger wafer in location 01 is used in the wafer location division 45 on this upper strata, the less not expression of wafer 01(figure in location is then used in the wafer location division 45 of lower floor), be the utility model preferred embodiments more than, but be not limited thereto.
Wherein the cooling device 21 of wafer refrigerating seat 20 can be a heat exchange circulation pipe 22 of being located at wafer refrigerating seat 20 bottoms, this heat exchange circulation pipe 22 includes an introducing port 23 and an export mouth 24, uses to import cooling water or greenhouse gas (as carbon dioxide (CO2), nitrous oxide (N2O), hydrogen fluorine carbide (HFCs), perfluorinated hydrocarbon (PFCs) and sulphur hexafluoride (SF6) etc.) to wafer refrigerating seat 20 cooling effect of absorbing heat.
As shown in Figure 1, but wherein this lifting drive device 30 and be oscilaltion displacement start kenel by one first drive member 301; 40 of described horizontal slide devices are laterally slide displacement start kenel by one second drive member 401; Described first drive member 301 and second drive member 401 can adopt type of drive such as air pressure, oil pressure or motor.
Form design by above-mentioned structure, be described as follows with regard to use start situation of the present utility model now:
As shown in Figure 2, when wafer 01 need cool off through overbaking (comprising soft roasting and hard roasting), can import end 14(by wafer by delivery board and be shown in Fig. 6) import (shown in arrow L1) and put on the top 35 that is positioned wafer positioning part 34 (please contrast shown in Figure 3), this moment as shown in Figure 4,32 of the elevating brackets that this lifting drives device 30 can move down (shown in arrow L2) together with wafer positioning part 34, and make wafer 01 recline being placed in the operation (heat of this wafer 01 can conduct to wafer refrigerating seat 20 rapidly and see through cooling device 21 cooling effect is walked to reach in the torrid zone) that cools of wafer refrigerating seat 20 tops, after the person of connecing treats that wafer 01 has cooled off, as shown in Figure 5, this elevating bracket 32 namely can move up (shown in arrow L3) to make wafer 01 disengaging wafer refrigerating seat 20, at this moment, be located at two horizontal slide devices 40 of relative two sides of pedestal 10,42 of its sliding seats can relatively inwardly slippage (shown in arrow L4), and make wafer location division 45 contrapositions folder be against wafer 01 periphery with reach proofread and correct positioning action (please contrast consult shown in Figure 6, the locating surface 46 of described wafer location division 45 can corresponding wafer current 01 shape be set as the cambered surface kenel, but be not limited thereto), after to be positioned the finishing, as shown in Figure 7, relatively outwards slippage (shown in arrow L5) is to discharge wafer 01 for described sliding seat 42, and delivery board can be imported by wafer and hold 14 to insert (shown in arrow L6) wafer 01 below so that wafer 01 is transported to next work flow this moment; By the above, the utility model can drive device 30 by lifting in fact makes wafer 01 can make cooling and correction operation on same board with horizontal slide device 40, reaches advantage and the practicality of saving the shipping time and promoting manufacturing efficient.
The effect explanation:
It is true as follows that the utility model effect is promoted:
The utility model wafer cooling localization machine mainly drives the innovation structure kenel design that device, at least one wafer positioning part, horizontal slide device and wafer location division constitute by pedestal, wafer refrigerating seat, lifting, make the utility model contrast [background technology] conventional construction of putting forward, drive device and make wafer can on same board, make cooling and correction operation with horizontal slide device in order to do seeing through lifting, reach practical improvement and the preferable industry of saving the shipping time and promoting manufacturing efficient and utilize benefit.
The above; only be the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by described protection range with claim.
Claims (5)
1. a wafer cools off localization machine, it is characterized in that comprising:
One pedestal comprises that a top, a bottom, two sidepieces and a wafer import end;
One wafer refrigerating seat, setting is positioned on the top of pedestal, and this wafer refrigerating seat has a cooling device;
One lifting drives device, setting is positioned pedestal or wafer refrigerating seat, comprise a slide rail holder and an elevating bracket, wherein this elevating bracket bottom has and is an extension board that extends into base bottom below, and make this elevating bracket relatively the slide rail holder do the oscilaltion displacement;
At least one wafer positioning part, be mounted on the extension board of elevating bracket, upwards stretch through and protrude wafer refrigerating seat middle section, described wafer positioning part comprises a top and a link, and wherein the top of this wafer positioning part is used when supplying existing wafer to import the end importing by wafer and can be put the location;
Two horizontal slide devices, be divided into relative two sides of pedestal or wafer refrigerating seat, each horizontal slide device all includes a slide track seat and a sliding seat, and the sliding seat of two horizontal slide devices is along the relative lateral displacement of slide track seat, and wherein this sliding seat also includes a medial surface and a lateral surface;
At least one group of wafer location division is divided into the medial surface of sliding seat relatively, and each wafer location division all includes a locating surface, and described locating surface is the kenel that arranges of corresponding wafer shape.
2. wafer cooling localization machine according to claim 1 it is characterized in that described wafer positioning part is the individual cylinder kenels that protrude out the wafer refrigerating seat of majority, and it arranges the wafer contraposition storing that kenel can supply different sizes; The medial surface of each sliding seat is provided with two groups of wafer location divisions that are levels layout type attitude and different size relatively, uses for the wafer of different sizes and does to proofread and correct contraposition.
3. wafer according to claim 1 and 2 cools off localization machine, it is characterized in that described cooling device is a heat exchange circulation pipe of being located at wafer refrigerating seat bottom, this heat exchange circulation pipe includes an introducing port and an export mouth, uses to import the cooling effect of absorbing heat of cooling water or greenhouse gas.
4. wafer cooling localization machine according to claim 1 is characterized in that described lifting drives device by one first drive member oscilaltion displacement start; Described horizontal slide device is then by the horizontal slide displacement start of one second drive member.
5. wafer cooling localization machine according to claim 1 and 2 is characterized in that the corresponding wafer shape of locating surface of each wafer location division is set as the cambered surface kenel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101221226U TWM449349U (en) | 2012-11-02 | 2012-11-02 | Wafer cooling positioning machine |
| TW101221226 | 2012-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203205396U true CN203205396U (en) | 2013-09-18 |
Family
ID=48472795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320178907 Expired - Fee Related CN203205396U (en) | 2012-11-02 | 2013-04-11 | Wafer cooling and positioning machine |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203205396U (en) |
| TW (1) | TWM449349U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103981504A (en) * | 2014-06-03 | 2014-08-13 | 上海先进半导体制造股份有限公司 | Physical vapor deposition machine table and cooling cavity thereof |
-
2012
- 2012-11-02 TW TW101221226U patent/TWM449349U/en not_active IP Right Cessation
-
2013
- 2013-04-11 CN CN 201320178907 patent/CN203205396U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103981504A (en) * | 2014-06-03 | 2014-08-13 | 上海先进半导体制造股份有限公司 | Physical vapor deposition machine table and cooling cavity thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM449349U (en) | 2013-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 Termination date: 20190411 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |