CN203204669U - High temperature-resistant electronic label - Google Patents
High temperature-resistant electronic label Download PDFInfo
- Publication number
- CN203204669U CN203204669U CN 201320249763 CN201320249763U CN203204669U CN 203204669 U CN203204669 U CN 203204669U CN 201320249763 CN201320249763 CN 201320249763 CN 201320249763 U CN201320249763 U CN 201320249763U CN 203204669 U CN203204669 U CN 203204669U
- Authority
- CN
- China
- Prior art keywords
- substrate
- high temperature
- resistant electronic
- electronic tag
- electronic label
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a high temperature-resistant electronic label. The electronic label comprises a substrate (1), the substrate (1) is provided with a planar spiral antenna (2), and the substrate (1) is circular and made of PI material. The high temperature-resistant electronic label enables the substrate to resist relatively high temperature, and the unoccupied area of the substrate is relatively small.
Description
Technical field
The utility model relates to a kind of electronic tag, specifically is a kind of high temperature resistant electronic tag.
Background technology
Electronic tag is a kind of label based on the RFID technical design, it is RFID tag, a kind of electronic tag is arranged at present, it comprises substrate, be located at the antenna of the snail shape on the substrate, the chip that is connected with antenna electric, substrate is generally rectangle, substrate is generally by the PET material layer be pressed together on respectively double-edged two aluminium laminations of PET material layer and consist of, this electronic tag has the following disadvantages: the heat resisting temperature of PET material only has about 88 degree, when this electronic tag is used in the higher environment of temperature, the easy temperature distortion of substrate, affect the normal use of electronic tag, and when rectangular substrate arranges the antenna of snail shape, the two ends of substrate have larger area vacant, so that substrate causes unnecessary waste, production cost have been improved.
The utility model content
Technical problem to be solved in the utility model is to provide the heat resisting temperature of substrate higher, the high temperature resistant electronic tag that the vacant area of substrate is less.
For solving the problems of the technologies described above, the high temperature resistant electronic tag that the utility model provides, it comprises substrate, and substrate is provided with the antenna of snail shape, and described substrate is circular, the substrate of described substrate for being made by the PI material.
After adopting above structure, the utility model compared with prior art has advantages of following:
Because substrate adopts the PI material to make, the heat resisting temperature of PI material can reach 200 degree～300 degree, so that the heat resisting temperature of substrate is higher, when this high temperature resistant electronic tag was used in the higher environment of temperature, substrate was not easy temperature distortion, ensure the normal use of this high temperature resistant electronic tag, because substrate is circular, when the substrate of circle arranged the antenna of snail shape, the vacant area of substrate was less simultaneously, so that the area that substrate is wasted is less, saved production cost.
As improvement, the thickness of described substrate is 0.07 millimeter～0.08 millimeter; So that substrate production processing is comparatively convenient, and can guarantee that the antenna of being located on the substrate normally uses.
As improvement, the thickness of described substrate is 0.077 millimeter; So that substrate production processing is comparatively convenient, and can guarantee that the antenna of being located on the substrate normally uses.
As improvement, the diameter of described substrate is 0.5 millimeter; Diameter is that 0.5 millimeter substrate has enough arranged antenna and chip on it, further reduces the unnecessary waste of substrate.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Wherein, 1, substrate; 2, antenna; 3, chip.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in more detail.
By shown in Figure 1, the high temperature resistant electronic tag of the utility model comprises substrate 1, substrate 1 is provided with the antenna 2 of snail shape and the chip 3 that is electrically connected with antenna 2, described substrate 1 is circular, the substrate 1 of described substrate 1 for being made by the PI material, PI material Chinese is commonly called as polyimide, it is the aromatic heterocycle polymer compound that molecular structure contains the imide chain link, English name Polyimide (being called for short PI), can be divided into equal benzene type PI, solubility PI, polyamide-imides (PAI) and polyimide (PEI) four classes, the PI material is one of best kind of thermotolerance in the present engineering plastics.
The thickness of described substrate 1 is 0.077 millimeter.
The diameter of described substrate 1 is 0.5 millimeter.
Below only use better example with regard to the utility model and made explanation, but can not be interpreted as it is limitations on claims, structure of the present utility model can have other variations, is not limited to said structure.In a word, all various variations of doing in the protection domain of independent claims of the present utility model are all in protection domain of the present utility model.
Claims (4)
1. high temperature resistant electronic tag, it comprises substrate (1), substrate (1) is provided with the antenna (2) of snail shape, it is characterized in that: described substrate (1) is for circular, the substrate (1) of described substrate (1) for being made by the PI material.
2. high temperature resistant electronic tag according to claim 1, it is characterized in that: the thickness of described substrate (1) is 0.07 millimeter～0.08 millimeter.
3. high temperature resistant electronic tag according to claim 2, it is characterized in that: the thickness of described substrate (1) is 0.077 millimeter.
4. high temperature resistant electronic tag according to claim 1, it is characterized in that: the diameter of described substrate (1) is 0.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320249763 CN203204669U (en) | 2013-05-10 | 2013-05-10 | High temperature-resistant electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320249763 CN203204669U (en) | 2013-05-10 | 2013-05-10 | High temperature-resistant electronic label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203204669U true CN203204669U (en) | 2013-09-18 |
Family
ID=49148758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320249763 Expired - Lifetime CN203204669U (en) | 2013-05-10 | 2013-05-10 | High temperature-resistant electronic label |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203204669U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10166707B2 (en) | 2016-12-19 | 2019-01-01 | Securitag Assembly Group Co., Ltd | RFID device and method for making the same |
-
2013
- 2013-05-10 CN CN 201320249763 patent/CN203204669U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10166707B2 (en) | 2016-12-19 | 2019-01-01 | Securitag Assembly Group Co., Ltd | RFID device and method for making the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Gao Bo Inventor after: Si Haitao Inventor after: Ye Tao Inventor before: Wu Jun Inventor before: Si Haitao Inventor before: Gao Bo |
|
| CP03 | Change of name, title or address |
Address after: 315104 Jin Yuan Road, Yinzhou District investment and business center, Zhejiang, Ningbo, China, No. 669 Patentee after: ZHEJIANG LAXCEN INFORMATION TECHNOLOGY CO.,LTD. Address before: 315000 Zhejiang city of Ningbo province Yinzhou District Qiming Road No. 818 building 20, No. 133 Patentee before: NINGBO LAXCEN RADIO FREQUENCY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Floor 1-4, east side of building F, No. 288, Jingu Middle Road (East), Yinzhou District, Ningbo, Zhejiang 315105 Patentee after: Lixin Technology Co.,Ltd. Address before: 315104 No. 669 Jin Yuan Road, Yinzhou District investment center, Zhejiang, Ningbo Patentee before: ZHEJIANG LAXCEN INFORMATION TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130918 |