CN203204538U - Computer case cooling device - Google Patents
Computer case cooling device Download PDFInfo
- Publication number
- CN203204538U CN203204538U CN2013202327945U CN201320232794U CN203204538U CN 203204538 U CN203204538 U CN 203204538U CN 2013202327945 U CN2013202327945 U CN 2013202327945U CN 201320232794 U CN201320232794 U CN 201320232794U CN 203204538 U CN203204538 U CN 203204538U
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- China
- Prior art keywords
- cooling device
- air
- heat
- computer
- cabinet
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- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer case cooling device which comprises a case body. A hard disk, a CD driver, a power source and a CPU are arranged in the case body. The computer case cooling device is characterized in that one side in the case body is provided with a horn-shaped airflow regulation cover; the front end of the airflow regulation cover is provided with an air inlet; a wind power device is arranged in the air inlet; the rear end of the airflow regulation cover is provided with an air outlet which is communicated with a heat sink; the heat sink is arranged on the upper end face of the CPU. The computer case cooling device guarantees that the temperature in the case body is always in a low state, so that the whole case body is always in a stable and safe operating state. According to the working principle of semiconductors, the amount of power consumed by computer parts will be increased when the temperature is high; the higher the temperature of the parts is, the larger the amount of consumed power is; when the temperature of the parts is excessively high, a computer crash will be caused, and the computer crash consumes the maximum amount of power. The computer case cooling device saves electric energy, guarantees stable operating states of components in the case body, and also effectively prolongs the service life of the components.
Description
Technical field
The utility model belongs to computer cooling device field, specifically, relates to a kind of cabinet cooling device.
Background technology
In the modern society, the use of computer is more and more to popularize, but along with the safety problem of computer also just becomes a big problem.In the common computer, through the long-pending full dust of regular meeting, cause and the CPU heat in time can't be come out, thereby cause CPU overheated, job insecurity on the cpu heat.The rising of cpu heat temperature, simultaneously bulk temperature constantly raises in the cabinet, and machine part is overheated, causes the computer can not steady operation, even causes crashing.In addition, each parts temperature is too high in the cabinet, and each part life is shortened, and causes losing and loss economically of data.
Summary of the invention
The technical problems to be solved in the utility model is to overcome above-mentioned defective, and a kind of reasonable in design, simple in structure, accumulation that can reduce dust and the cabinet cooling device of good heat dissipation effect are provided.
For addressing the above problem, the technical scheme that the utility model adopts is:
A kind of cabinet cooling device comprises the cabinet casing, is provided with hard disk, CD-ROM drive, power supply and CPU in the cabinet casing, it is characterized in that: the side in the described cabinet casing is provided with trumpet-shaped air-flow adjustment cover; The front end of described air-flow adjustment cover is air intake opening, is provided with wind force device in the air intake opening, and the rear end of air-flow adjustment cover is the gas outlet, and the gas outlet is communicated with heat abstractor; Described heat abstractor is arranged on the upper surface of CPU.
As a kind of improvement, the diameter of the air intake opening of described air-flow adjustment cover is greater than the diameter of gas outlet, and wind force device is installed on the diameter of air intake opening.
As a kind of improvement, described heat abstractor comprises the heat sink that is installed on the CPU upper surface, vertically is arranged with some heat radiator that are parallel to each other on the heat sink; Described heat sink is provided with heat dissipating housing, and heat radiator is all in heat dissipating housing.
As a kind of improvement, described heat sink is provided with six heat radiator, and the distance between each heat radiator is 0.5cm.
As a kind of improvement, described heat radiator is the plates of being made by aluminum alloy materials; Heat sink is the plate body of being made by aluminum alloy materials.
As a kind of improvement, described wind force device is the large diameter fan of the slow-speed of revolution, and fan is installed in the air intake opening of air-flow adjustment cover.
Owing to adopted technique scheme, compared with prior art, the utility model adopts slow-speed of revolution major diameter fan, and the area owing to the suction air when air intake opening is very big, rotation speed of the fan is lower in addition, so wind speed is lower, the dust of larger particles can not be sucked into, and can adopt sponge to filter impurity such as dust at air intake opening according to actual needs, therefore the air that enters in the cabinet cleans, simultaneously, rotation speed of the fan is low, and also having avoided piling up in the cabinet has dust.Have, along with air channel in the air-flow adjustment cover becomes more and more narrower, air pressure is increasing again, and the speed that air flows is also said more and more faster relatively, thereby has enough air quantity to have the heat that CPU comes out, and guarantees the work of CPU safety and stability.Owing to taken into full account inlet air flow path in the cabinet during design, interior each parts of cabinet can both well be dispelled the heat, make the heat in the cabinet can be good at coming out, guaranteed that temperature in chassis is in lower state all the time, whole cabinet casing is in a kind of duty of stability and safety all the time.The utility model had both been saved electric energy, had guaranteed the stable working state of parts in the cabinet again, had also effectively prolonged the life-span of parts simultaneously.
The utility model is described in further detail below in conjunction with the drawings and specific embodiments simultaneously.
Description of drawings
Fig. 1 is the structural representation of a kind of embodiment of the utility model;
Fig. 2 is the structural representation of the heat abstractor among a kind of embodiment of the utility model.
Among the figure: the 1-heat abstractor; The 2-fan; The 3-hard disk; 4-air-flow adjustment cover; The 5-CD-ROM drive; 6-cabinet casing; The 7-power supply; The 11-heat dissipating housing; The 12-heat radiator; The 13-heat sink.
Embodiment
Embodiment:
As shown in Figure 1 and Figure 2, a kind of cabinet cooling device comprises cabinet casing 6, is provided with hard disk 3, CD-ROM drive 5, power supply 7 and CPU in the cabinet casing 6.Above-mentioned hard disk 3, CD-ROM drive 5, power supply 7 and CPU all belong to prior art, and their installation site and interconnected relationship repeat no more.In the utility model, the side in the cabinet casing 6 is provided with trumpet-shaped air-flow adjustment cover 4.The front end of air-flow adjustment cover 4 is air intake opening, is provided with wind force device in the air intake opening, and the rear end of air-flow adjustment cover 4 is the gas outlet, and the gas outlet is communicated with heat abstractor 1.Described heat abstractor 1 is arranged on the upper surface of CPU.
In the present embodiment, the diameter of the air intake opening of described air-flow adjustment cover 4 is greater than the diameter of gas outlet, and wind force device is installed on the diameter of air intake opening.In the present embodiment, wind force device is the large diameter fan 2 of the slow-speed of revolution, and fan 2 is installed in the air intake opening of air-flow adjustment cover 4.
Described heat abstractor 1 comprises the heat sink 13 that is installed on the CPU upper surface, vertically is arranged with some heat radiator that are parallel to each other 12 on the heat sink 13, and heat sink 13 is provided with heat dissipating housing 11, and heat radiator 12 is all in heat dissipating housing 11.Consider volume in the cabinet casing and the effect of heat radiation, heat sink 13 is provided with six heat radiator 12, and the distance between each heat radiator 12 is 0.5cm.
In the present embodiment, consider the needs of heat radiation, heat radiator 12 is plates of being made by aluminum alloy materials, and heat sink 13 is plate bodys of being made by aluminum alloy materials.
Slow-speed of revolution major diameter fan area owing to the suction air when air intake opening is very big, rotation speed of the fan is lower in addition, so wind speed is lower, the dust of larger particles can not be sucked into, and can adopt sponge to filter impurity such as dust at air intake opening according to actual needs, therefore the air that enters in the cabinet cleans, simultaneously, rotation speed of the fan is low, and also having avoided piling up in the cabinet has dust.Have, along with air channel in the air-flow adjustment cover becomes more and more narrower, air pressure is increasing again, and the speed that air flows is also said more and more faster relatively, thereby has enough air quantity to have the heat that CPU comes out, and guarantees the work of CPU safety and stability.Owing to taken into full account inlet air flow path in the cabinet during design, interior each parts of cabinet can both well be dispelled the heat, make the heat in the cabinet can be good at coming out, guaranteed that temperature in chassis is in lower state all the time, whole cabinet casing is in a kind of duty of stability and safety all the time.According to semi-conductive principle of work, computer part power consumption when temperature is high will increase, and the more high power consumption of part temperatures is more big, and part temperatures is too high, will cause computer crash, when during computer crash being the power consumption maximum.So the utility model had both been saved electric energy, guaranteed the stable working state of parts in the cabinet again, also effectively prolonged the life-span of parts simultaneously.
The utility model is not limited to above-mentioned preferred implementation, and anyone should learn the structural change of making under enlightenment of the present utility model, every with the utlity model has identical or akin technical scheme, all belong to protection domain of the present utility model.
Claims (6)
1. a cabinet cooling device comprises the cabinet casing, is provided with hard disk, CD-ROM drive, power supply and CPU in the cabinet casing, it is characterized in that: the side in the described cabinet casing is provided with trumpet-shaped air-flow adjustment cover; The front end of described air-flow adjustment cover is air intake opening, is provided with wind force device in the air intake opening, and the rear end of air-flow adjustment cover is the gas outlet, and the gas outlet is communicated with heat abstractor; Described heat abstractor is arranged on the upper surface of CPU.
2. according to the cabinet cooling device described in the claim 1, it is characterized in that: the diameter of the air intake opening of described air-flow adjustment cover is greater than the diameter of gas outlet, and wind force device is installed on the diameter of air intake opening.
3. according to the cabinet cooling device described in the claim 2, it is characterized in that: described heat abstractor comprises the heat sink that is installed on the CPU upper surface, vertically is arranged with some heat radiator that are parallel to each other on the heat sink; Described heat sink is provided with heat dissipating housing, and heat radiator is all in heat dissipating housing.
4. according to the cabinet cooling device described in the claim 3, it is characterized in that: described heat sink is provided with six heat radiator, and the distance between each heat radiator is 0.5cm.
5. according to the cabinet cooling device described in the claim 4, it is characterized in that: described heat radiator is the plates of being made by aluminum alloy materials; Heat sink is the plate body of being made by aluminum alloy materials.
6. according to the cabinet cooling device described in the claim 1, it is characterized in that: described wind force device is the large diameter fan of the slow-speed of revolution, and fan is installed in the air intake opening of air-flow adjustment cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202327945U CN203204538U (en) | 2013-05-01 | 2013-05-01 | Computer case cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202327945U CN203204538U (en) | 2013-05-01 | 2013-05-01 | Computer case cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203204538U true CN203204538U (en) | 2013-09-18 |
Family
ID=49148631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202327945U Expired - Fee Related CN203204538U (en) | 2013-05-01 | 2013-05-01 | Computer case cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203204538U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857270A (en) * | 2020-07-21 | 2020-10-30 | 重庆电力高等专科学校 | Device beneficial to heat dissipation of computer |
-
2013
- 2013-05-01 CN CN2013202327945U patent/CN203204538U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857270A (en) * | 2020-07-21 | 2020-10-30 | 重庆电力高等专科学校 | Device beneficial to heat dissipation of computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130918 Termination date: 20170501 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |