CN203192862U - Bidirectional semiconductor cold-hot chip - Google Patents
Bidirectional semiconductor cold-hot chip Download PDFInfo
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- CN203192862U CN203192862U CN 201320127216 CN201320127216U CN203192862U CN 203192862 U CN203192862 U CN 203192862U CN 201320127216 CN201320127216 CN 201320127216 CN 201320127216 U CN201320127216 U CN 201320127216U CN 203192862 U CN203192862 U CN 203192862U
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Abstract
The utility model relates to a bidirectional semiconductor cold-hot chip. The chip comprises a plurality of NP-type semiconductor units, each of which includes an N-type semiconductor and a P-type semiconductor; one side of the N-type semiconductor and the corresponding P-type semiconductor in each NP-type semiconductor unit is connected with a first flow guide piece; for every two adjacent NP-type semiconductor units, the other side of the P-type semiconductor in one NP-type semiconductor unit and the adjacent N-type semiconductor in the other NP-type semiconductor unit is connected with a second flow guide piece; each first flow guide piece is connected with a cold-end heat conduction column which directly extends in an outer space; each second flow guide piece is connected with a hot-end heat conduction column which directly extends in an outer space; two sides of the bidirectional semiconductor cold-hot chip are respectively provided with heat conduction insulating layers which are respectively covered on the first flow guide pieces and the second flow guide pieces; and the cold-end heat conduction columns and the hot-end heat conduction columns respectively extend out from the heat conduction insulating layers.
Description
Technical field
The utility model relates to a kind of cold and hot temperature generation device, refers to a kind of semiconductor cold-hot chip that utilizes N type semiconductor and P type semiconductor to produce refrigeration, heating effect respectively in the chip both sides especially.
Background technology
As everyone knows, in 1834 Frenchman's Peltier (PELTIEREFFECT) found that the contact place can produce the phenomenon of heat release and heat absorption when electric current is flowed through the contact that two different conductors form.According to above-mentioned principle; semiconductor cooler is utilized by people as a kind of refrigerator device is comparatively general; semiconductor cooler is a kind of cooling device of being made up of semiconductor; its core coolant is partly arranged mutually by many N-types and P type semiconductor particle and is formed; be connected with general conductor between N type semiconductor and the P type semiconductor and form a complete circuit; bonding conductor is normally made by copper, aluminium or other metallic conductors; overall semiconductor refrigerator outside is picked up by two potsherds, and the insulation of potsherd palpus and heat conduction are good.
In application in practice, for semiconductor refrigeration material, not only need N-type and P type semiconductor characteristic, also need to change semi-conductive thermoelectric power, conductance and thermal conductivity according to the impurity that mixes, make this particular semiconductor can become the material that satisfies refrigeration.Common used material is to be the ternary solid solution alloy of matrix with the bismuth telluride at present, and wherein the P type is Bi2Te3-Sb2Te3, and N-type is Bi2Te3-Bi2Se3, adopts vertical zone-melting technique to extract crystalline material.
Its concrete operation principle is, when a N type semiconductor material and P type semiconductor material be coupled to galvanic couple to the time, in this circuit, connect direct current after, just can energy-producing transfer, electric current absorbs heat by the joint that the N-type element flows to P type element, becomes cold junction; Flow to the joint release heat of N-type element by P type element, become the hot junction, in concrete work, utilizing the temperature difference generation refrigeration in cold junction and hot junction.
As shown in Figure 1, with regard to the semiconductor cooler that occurs on the market at present, the both sides up and down of its N type semiconductor and P type semiconductor need sequential layer to establish soldering layer 1, water conservancy diversion lamella 2, heat conduction glue-line 3 and ceramic heat conductive insulating layer 4 respectively, wherein, the effect of soldering layer 1 is that water conservancy diversion lamella 2 is separately fixed on N type semiconductor and the P type semiconductor, and the effect of heat conduction glue-line 3 is to carry out the heat conduction when ceramic heat conductive insulating layer 4 is fixed on water conservancy diversion lamella 2 between ceramic heat conductive insulating layer 4 and water conservancy diversion lamella 2.
For this type of conventional semiconductors refrigerator, its advantage is, easy to install, useful life is longer, noiselessness, cooling and warming conversion convenient (change the sense of current and can realize cold and hot conversion) can not pollute environment because not comprising the refrigerant (as freon etc., be commonly called as snow kind) of any kind of in its component part.Though its application is comparatively extensive because conventional semiconductors refrigerator electricity conversion benefit is lower, so its fail to be used in the electrical equipment or other products of big power consumption always, such as, it also is not used on the equipment such as air-conditioning, warmer.
Study the lower reason of its electricity conversion benefit, we can find it mainly is to cause owing to being provided with too much layer structure in the both sides up and down of N type semiconductor and P type semiconductor, as mentioned above, heat conduction glue-line 3 is generally made by high-efficiency heat conduction glue, and the conductive coefficient of high-efficiency heat conduction glue is generally below 5W/m.k, pottery heat conductive insulating layer 4 is generally made by the high-efficiency heat conduction pottery, and the conductive coefficient maximum of high-efficiency heat conduction pottery is about 25W/m.k, the conductive coefficient of soldering layer 1 is about 67W/m.k, so cold (or heat) that PN type semiconductor produces is by soldering layer 1, water conservancy diversion lamella 2, after deriving, heat conduction glue-line 3 and ceramic heat conductive insulating layer 4 several poor efficiency Heat Conduction Material reduce greatly, thereby must cause the whole electricity conversion benefit of semiconductor cooler low, do not occur but also occur a kind of technology that can promote the whole electricity conversion of semiconductor cooler benefit now, and this is the major defect for conventional art.
The utility model content
The utility model provides a kind of semiconductor cold-hot two-way chip, pass through to improve the structure of conventional semiconductors chip in the technical solution of the utility model, thereby can allow the electricity conversion benefit of chip obtain obviously significantly promoting, product of the present utility model can be applied on the cooling and warming product of big power consumption, make this series products have environmental protection more and energy-conservation characteristics, be convenient for people to use, and this is exactly to be main purpose of the present utility model.
The technical scheme that the utility model adopts is: the two-way chip of a kind of semiconductor cold-hot, and it comprises some NP type semiconductor units, several these NP type semiconductor units are arranged the cold and hot generating unit that forms the two-way chip of this semiconductor cold-hot in proper order.
Each this NP type semiconductor unit all comprises N type semiconductor and P type semiconductor, be connected with first flow deflector at this N type semiconductor and this P type semiconductor one side, flow to this P type semiconductor by this N type semiconductor by this first flow deflector at this side electric current and absorb heat, this side becomes cold junction, be connected with second flow deflector at this P type semiconductor of two adjacent arbitrarily these NP type semiconductor units and an other side of this N type semiconductor, flow to this N type semiconductor release heat by this P type semiconductor by this second flow deflector at this other side electric current, this other side becomes the hot junction, and this first flow deflector and this second flow deflector correspondence are connected the both sides of this N type semiconductor and this P type semiconductor.
Be connected with the cold junction heating column at each respectively on this first flow deflector, this cold junction heating column is directly stretched and is located in the space outerpace, this cold junction of the two-way chip of this semiconductor cold-hot carries out exchange heat by this cold junction heating column and space outerpace, be connected with the hot junction heating column at each respectively on this second flow deflector, this hot junction heating column is directly stretched and is located in the space outerpace, and exchange heat is carried out by this hot junction heating column and space outerpace in this hot junction of the two-way chip of this semiconductor cold-hot.
Both sides at the two-way chip of this semiconductor cold-hot are respectively arranged with the heat conductive insulating layer, and this heat conductive insulating layer is located at respectively on this first flow deflector and this second flow deflector, and this cold junction heating column and this hot junction heating column stretch out from this heat conductive insulating layer respectively.
This cold junction heating column and this hot junction heating column are made by heat-conducting metal, and this heat conductive insulating layer is made by heat-conducting insulation material.
This cold junction heating column and this hot junction heating column are become by heat-conducting metal aluminium or copper, and this heat conductive insulating layer is made by heat-conducting insulation material potsherd or resin fibre material.
This cold junction heating column and this hot junction heating column adopt the mode of welding directly to be connected respectively on this first flow deflector and this second flow deflector.
Between this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides, be provided with sealing unit, the sealing unit is made by the heat conductive insulating fluid sealant, form a closed cavity by up and down this heat conductive insulating layer and the sealing of sealing unit of both sides, several these NP type semiconductor units are arranged in the sealing inner chamber.
In concrete enforcement, the sealing unit further comprises sealant layer, the sealing glue-line is separately positioned on the top of this heat conductive insulating layer of upside and the bottom of this heat conductive insulating layer of downside, makes integral sealing effect better by the gap between sealing glue-line sealing heating column and the heat conductive insulating layer.
This cold junction heating column and this first flow deflector combine and form cold junction heat conduction diversion column, this hot junction heating column and this second flow deflector combine and form hot junction heat conduction diversion column, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column correspondence are connected the both sides of this N type semiconductor and this P type semiconductor, and this cold junction heat conduction diversion column and this hot junction heat conduction diversion column stretch out from this heat conductive insulating layer respectively.
This cold junction heat conduction diversion column and this hot junction heat conduction diversion column are made by aluminium or copper conductive heat conducting material, the whole height control of this cold junction heat conduction diversion column and this hot junction heat conduction diversion column is at 10 to 100 millimeters, its cross section is rectangle, the length control of rectangle is at 3 to 8 millimeters, and width is controlled at 1 to 3 millimeter.
Be respectively arranged with the post groove at this cold junction heat conduction diversion column and this hot junction heat conduction diversion column.
This post groove vertically is arranged on this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, the width control of this post groove is between 1 to 2 millimeter, be connected this arbitrarily adjacent N type semiconductor, this cold junction heat conduction diversion column between this P type semiconductor is provided with this post groove at least between this N type semiconductor and this P type semiconductor, be connected this any adjacent N type semiconductor, this hot junction heat conduction diversion column between this P type semiconductor is provided with this post groove at least between this N type semiconductor and this P type semiconductor.
Adopt the mode of compression molding to make this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column integral body are in the form of sheets, this cold junction heat conduction diversion column comprises that two sheet pin and at least two stretch out lamellar body, two these sheet pin are connected the both sides that this stretches out lamellar body, two these sheet pin are welded on respectively on adjacent this N type semiconductor and this P type semiconductor, and any adjacent this stretches out and form this post groove between the lamellar body.
This hot junction heat conduction diversion column comprises that two sheet pin and at least two stretch out lamellar body, two of this hot junction heat conduction diversion column these sheet pin be connected this hot junction heat conduction diversion column this stretch out the both sides of lamellar body, two of this hot junction heat conduction diversion column these sheet pin are welded on respectively on adjacent this P type semiconductor and this N type semiconductor, and this of this any adjacent hot junction heat conduction diversion column stretches out and form this post groove between the lamellar body.
This heat conductive insulating layer is pressed on respectively on this sheet pin of this sheet pin of this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, and this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides is clamped in the both sides of the two-way chip of this semiconductor cold-hot simultaneously by grip unit.
This cold junction heat conduction diversion column and this hot junction heat conduction diversion column utilize the metal bar bending to form, this cold junction heat conduction diversion column comprises first barred body, second barred body and connects the arc rod, this connection arc rod is connected between this first barred body and this second barred body, this first barred body, this second barred body are connected on adjacent this N type semiconductor and this P type semiconductor, and the gap between this first barred body and this second barred body forms this post groove.
This hot junction heat conduction diversion column comprises first barred body, second barred body and connects the arc rod, this connection arc rod of this hot junction heat conduction diversion column is connected between this second barred body of this first barred body of this hot junction heat conduction diversion column and this hot junction heat conduction diversion column, this first barred body of this hot junction heat conduction diversion column, this second barred body are connected on adjacent this P type semiconductor and this N type semiconductor, and this first barred body of this hot junction heat conduction diversion column and the gap between this second barred body form this post groove.
In concrete enforcement, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, comprise copper post and aluminium coating respectively, this aluminium coating is wrapped in the outside of this copper post, the some radiating fins of cold rolling formation on this aluminium coating outer surface, in concrete enforcement, heat at first is delivered on this copper post, then by this aluminium coating heat is outwards distributed efficiently.
On this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, can be arranged with the insulation gap plate respectively in addition, this insulation gap plate is made by resin fibre class material, and this insulation gap plate is arranged on arbitrarily adjacent two these cold junction heat conduction diversion columns or arbitrarily between adjacent two these hot junction heat conduction diversion columns.
This insulation gap plate be arranged on arbitrarily adjacent two these cold junction heat conduction diversion columns or arbitrarily between adjacent two these hot junction heat conduction diversion columns to reach the effect that insulation is isolated, can also play the effect that frame is held this cold junction heat conduction diversion column and this hot junction heat conduction diversion column by this insulation gap plate in addition.
Sealed heat-dissipating casing is fixed on this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides, by sealing heat-dissipating casing and this heat conductive insulating layer around determining the sealed heat-dissipating chamber, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column are separately positioned in the sealing heat radiation chamber, and the sealing heat radiation is filled with superconducting fluid in the chamber.
The beneficial effects of the utility model are: chip of the present utility model and traditional chip are under same power consumption, electricity conversion benefit can improve more than tens of times, in concrete the application, not only can utilize chip of the present utility model to be used for making high-power refrigeration product by the technical solution of the utility model, such as, family's air-conditioning, air conditioning for automobiles, central air-conditioning, refrigerator, freezer etc., it can also be used for making the high-power product that heats, such as, warmer, water heater etc.Utilize the technical solution of the utility model not only the energy consumption that has the said goods now can be reduced, can also stop simultaneously to use in traditional air-conditioning the refrigerant pollution on the environment, in addition, because the utility model employed voltage in work is so that the product that safe voltage utilizes the utility model technology to produce has higher fail safe, and when utilizing technology of the present utility model making air-conditioning equipment owing to cancelled the influence that compressor also can reduce NOISE ON ENVIRONMENT greatly.
Description of drawings
Fig. 1 is the structural representation of conventional art.
Fig. 2 is the structural representation of flow deflector of the present utility model and heating column.
Fig. 3 is the structural representation of flow deflector of the present utility model, heating column, heat conductive insulating layer.
Fig. 4 combines the structural representation of formation heat conduction diversion column for heating column of the present utility model and flow deflector.
Fig. 5 is provided with the structural representation of post groove for heat conduction diversion column of the present utility model.
Fig. 6 adopts cold junction heat conduction diversion column that the mode of compression molding makes and the structural representation of hot junction heat conduction diversion column for the utility model.
Fig. 7 is that the utility model cold junction heat conduction diversion column and hot junction heat conduction diversion column are the structural representations that utilizes the metal bar bending to form.
Fig. 8 comprises the structural representation of copper post and aluminium coating for the utility model diversion column.
Fig. 9 is for being arranged with the structural representation of insulation gap plate on the utility model diversion column.
Figure 10,11,12 installs the structural representation of sealed heat-dissipating casing additional for the utility model.
Embodiment
Shown in Fig. 2 to 10, the two-way chip of a kind of semiconductor cold-hot, it comprises some NP type semiconductor units 10.
Several these NP type semiconductor unit 10 orders are arranged the cold and hot generating unit that forms the two-way chip of this semiconductor cold-hot.
Each this NP type semiconductor unit 10 all comprises N type semiconductor 20 and P type semiconductor 30.
As shown in Figure 2, be connected with first flow deflector 11 at this N type semiconductor 20 with these P type semiconductor 30 1 sides, flow to this P type semiconductor 30 by this N type semiconductor 20 by this first flow deflector 11 at this side electric current and absorb heat, this side becomes cold junction.
Be connected with second flow deflector 12 at this P type semiconductor 30 of two adjacent arbitrarily these NP type semiconductor units 10 and an other side of this N type semiconductor 20, flow to this N type semiconductor 20 release heat by this P type semiconductor 30 by this second flow deflector 12 at this other side electric current, this other side becomes the hot junction.
This first flow deflector 11 and this second flow deflector, 12 correspondences are connected the both sides of this N type semiconductor 20 and this P type semiconductor 30.
Be connected with cold junction heating column 40 at each respectively on this first flow deflector 11, this cold junction heating column 40 is directly stretched and is located in the space outerpace.
This cold junction of the two-way chip of this semiconductor cold-hot carries out exchange heat by this cold junction heating column 40 with space outerpace.
Specific descriptions are, are by this cold junction heating column 40 " cold " that this cold junction produces to be delivered in the space outerpace for this cold junction of the two-way chip of this semiconductor cold-hot.
Be connected with hot junction heating column 50 at each respectively on this second flow deflector 12, this hot junction heating column 50 is directly stretched and is located in the space outerpace.
This hot junction of the two-way chip of this semiconductor cold-hot is carried out exchange heat by this hot junction heating column 50 with space outerpace.
Specific descriptions are, are by this hot junction heating column 50 " heat " that this hot junction produces to be delivered in the space outerpace for this hot junction of the two-way chip of this semiconductor cold-hot.
As shown in Figure 3, be respectively arranged with heat conductive insulating layer 60 in the both sides of the two-way chip of this semiconductor cold-hot, this heat conductive insulating layer 60 is located at respectively on this first flow deflector 11 and this second flow deflector 12.
This cold junction heating column 40 and this hot junction heating column 50 stretch out from this heat conductive insulating layer 60 respectively.
The utility model is in concrete work, this cold junction heating column 40 and this hot junction heating column 50 are directly stretched respectively and are located in the space outerpace, so " cold " " heat " in this cold junction heating column 40 and this hot junction heating column 50 can be directly transferred in the space outerpace, thereby promote integrally-built electricity conversion benefit greatly.
But because this cold junction heating column 40 and this hot junction heating column 50 are connected on this first flow deflector 11 and this second flow deflector 12, that is to say that having electric current in this cold junction heating column 40 and this hot junction heating column 50 in energising work passes through, but the utility model in concrete work its inner operating voltage less than safe voltage 36V, so can there be potential safety hazard in the mode that in the technical solutions of the utility model this cold junction heating column 40 and this hot junction heating column 50 is exposed in the space outerpace.
In concrete enforcement, this cold junction heating column 40 and this hot junction heating column 50 are made by heat-conducting metal, such as, aluminium or copper.
This heat conductive insulating layer 60 is made by heat-conducting insulation material, such as, potsherd or resin fibre material etc.
Because the conductive coefficient of aluminium is about 230W/m.k, the conductive coefficient of copper is about 370W/m.k, far above the 25W/m.k of pottery, substitute the mode that traditional ceramic heat conductive insulating layer of usefulness wraps up fully and can promote integrally-built electricity conversion benefit greatly so in the utility model, directly stretch the mode that is located in the space outerpace respectively with this cold junction heating column 40 and this hot junction heating column 50.
Though the conductive coefficient height of copper heating column in concrete enforcement, its density is big, and is expensive, and the conductive coefficient of aluminium matter heating column is low slightly, but density is little, low price, and two kinds of materials can be selected for use according to different purposes.
In concrete enforcement, this cold junction heating column 40 and this hot junction heating column 50 can adopt the mode of welding directly to be connected respectively on this first flow deflector 11 and this second flow deflector 12.
The technical solution of the utility model is in concrete enforcement, and this cold junction heating column 40 and this hot junction heating column 50 can select to have only the heating column of a side to stretch out from this heat conductive insulating layer 60.
But in concrete the application, select this cold junction heating column 40 and this hot junction heating column 50 from this heat conductive insulating layer 60, to stretch out the radiating effect that can promote cold junction and hot junction simultaneously simultaneously respectively, thereby can promote the electricity conversion benefit of the utility model product greatly.
In concrete enforcement, if this N type semiconductor 20 and this P type semiconductor 30 are directly exposed in air, thus can be because the moisture that comprises in the air or other materials influence the situation in useful life to product generation corrosion of the present utility model and oxidation.
For fear of the generation of above-mentioned situation, between this heat conductive insulating layer 60 of the two-way chip of this semiconductor cold-hot both sides, be provided with sealing unit 70.
Sealing unit 70 is made by the heat conductive insulating fluid sealant.
Form a closed cavity by up and down this heat conductive insulating layer 60 and 70 sealings of sealing unit of both sides, several these NP type semiconductor units 10 are arranged in the sealing inner chamber.
The setting by sealing unit 70 can guarantee that thereby the sealing of sealing inner chamber reaches raising the utility model product purpose in useful life.
In concrete enforcement, sealing unit 70 can also comprise sealant layer, the sealing glue-line is separately positioned on the top of this heat conductive insulating layer 60 of upside and the bottom of this heat conductive insulating layer 60 of downside, makes integral sealing effect better by the gap between sealing glue-line sealing heating column and the heat conductive insulating layer.
In another preferred embodiment of the present utility model, as shown in Figure 4, this cold junction heating column 40 combines with this first flow deflector 11 and forms cold junction heat conduction diversion column 80, that is to say by this cold junction heat conduction diversion column 80 and replaces this cold junction heating column 40 and this first flow deflector 11 simultaneously.
In concrete work, the function that this cold junction heat conduction diversion column 80 had both had this cold junction heating column 40 also has the function of this first flow deflector 11 simultaneously.
This hot junction heating column 50 combines with this second flow deflector 12 and forms hot junction heat conduction diversion column 90, that is to say by this hot junction heat conduction diversion column 90 and replaces this hot junction heating column 50 and this second flow deflector 12 simultaneously.
In concrete work, the function that this hot junction heat conduction diversion column 90 had both had this hot junction heating column 50 also has the function of this second flow deflector 12 simultaneously.
This cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 correspondences are connected the both sides of this N type semiconductor 20 and this P type semiconductor 30.
This cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 stretch out from this heat conductive insulating layer 60 respectively.
In concrete enforcement, this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 can be made by aluminium, copper or other conductive heat conducting materials.
Applicant draws through a large amount of experiments, and the whole height control of this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 is at 10 to 100 millimeters, and its cross section is rectangle, and the length control of rectangle is at 3 to 8 millimeters, and width is controlled at 1 to 3 millimeter.
When this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 when being cylindric, its diameter control is at 1 to 3 millimeter.
In concrete enforcement, the cross section of this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 is generally rectangle or circle, because rectangle or circular cross section can guarantee contact reliability and the compactness of diversion column and N type semiconductor and P type semiconductor.
Wherein, the control of the diameter of circular cross section is at 1 to 3 millimeter.
The length control of rectangular cross section is at 3 to 8 millimeters, and width is controlled at 1 to 3 millimeter.
When heating column and flow deflector separate independent the setting owing to need to be connected by soldering between the two, and the conductive coefficient of tin is about 67 W/m.k, conductive coefficient far below aluminium or copper, that is to say far below making heating column, the conductive coefficient of flow deflector metal, so the applicant is for reducing tin welding spot to the conduction loss of cold (or heat), the special improvement adopts heating column directly to undertake heat conduction and two kinds of functions of water conservancy diversion, direct and the N with the water conservancy diversion heating column, P type particle connects, can reduce once welding like this, not only can reduce the loss of cold (or heat), but also can reduce the resistance of flow deflector, thereby raising conversion efficiency, just above-mentioned this cold junction heating column 40 and this first flow deflector 11 are integrated into this cold junction heat conduction diversion column 80, this hot junction heating column 50 and this second flow deflector 12 are integrated into the mode of this hot junction heat conduction diversion column 90.
As shown in Figure 5, in order to promote the conversion efficiency of the utility model product, promote the utility model reliability of products.Be respectively arranged with post groove 100 at this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90.
The utility model characteristic owing to chip of the present utility model in concrete enforcement (simultaneously produces cold, another side produces heat) determined can to reach tens to 100 in the temperature difference on several millimeters the thick chip only more and spent, such characteristic has determined this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 to expand with heat and contract with cold frequently, frequently will inevitably cause diversion column and N(P and expand with heat and contract with cold) the easy sealing-off of type particle weld and cooling piece outage was lost efficacy, for solving this defective, mechanism design mode by this post groove 100 can be reserved the position of expanding with heat and contract with cold, thereby promote the reliability of integral product, can significantly promote the useful life of chip.
Thereby can promote the heat sinking benefit raising efficiency of the contact area raising product between diversion column and the external environment condition in addition greatly by the mechanism design mode of this post groove 100.
In concrete enforcement, this post groove 100 vertically is arranged on this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90.
The width control of this post groove 100 is between 1 to 2 millimeter.
Be connected this arbitrarily adjacent N type semiconductor 20, this cold junction heat conduction diversion column 80 between this P type semiconductor 30 is provided with this post groove 100 at least between this N type semiconductor 20 and this P type semiconductor 30, to reach the expand with heat and contract with cold effect of position of reservation.
Be connected this arbitrarily adjacent N type semiconductor 20, this hot junction heat conduction diversion column 90 between this P type semiconductor 30 is provided with this post groove 100 at least between this N type semiconductor 20 and this P type semiconductor 30, to reach the expand with heat and contract with cold effect of position of reservation.
The mode applicant of this post groove 100 is set through think the manufacture craft more complicated that this post groove 100 is set respectively after putting into practice in a large number on this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90, so the applicant draws following execution mode through groping after the practice for above-mentioned.
As shown in Figure 6, the mode of execution mode one, employing compression molding is made this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90, and this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 integral body are in the form of sheets.
This cold junction heat conduction diversion column 80 comprises that two sheet pin 81 and at least two stretch out lamellar body 82, two these sheet pin 81 are connected the both sides that this stretches out lamellar body 82, two these sheet pin 81 are welded on respectively on adjacent this N type semiconductor 20 and this P type semiconductor 30, this stretches out between the lamellar body 82 and be arranged in parallel, and any adjacent this stretches out and form this post groove 100 between the lamellar body 82.
This hot junction heat conduction diversion column 90 comprises that two sheet pin 91 and at least two stretch out lamellar body 92, two these sheet pin 91 are connected the both sides that this stretches out lamellar body 92, two these sheet pin 91 are welded on respectively on adjacent this P type semiconductor 30 and this N type semiconductor 20, this stretches out between the lamellar body 92 and be arranged in parallel, and any adjacent this stretches out and form this post groove 100 between the lamellar body 92.
This heat conductive insulating layer 60 is pressed on respectively on this sheet pin 91 of this sheet pin 81 of this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90.
This heat conductive insulating layer 60 of the two-way chip of this semiconductor cold-hot both sides is clamped in the both sides of the two-way chip of this semiconductor cold-hot simultaneously by grip unit, thereby this sheet pin 81 of this cold junction heat conduction diversion column 80 and these sheet pin 91 glands of this hot junction heat conduction diversion column 90 can be connected on this N type semiconductor 20 and this P type semiconductor 30.
In concrete enforcement, this grip unit can be clamping devices such as fishbolt.
Making chip of the present utility model by above-mentioned mode can cut down finished cost simultaneously and to reduce the difficulty of processing.
As shown in Figure 7, execution mode two, this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 utilize circle or square metal bar bending to form.
This cold junction heat conduction diversion column 80 comprises first barred body 83, second barred body 84 and connects arc rod 85, this connection arc rod 85 is connected between this first barred body 83 and this second barred body 84, this first barred body 83, this second barred body 84 are connected on adjacent this N type semiconductor 20 and this P type semiconductor 30, and the gap between this first barred body 83 and this second barred body 84 forms this post groove 100.
This hot junction heat conduction diversion column 90 comprises first barred body 93, second barred body 94 and connects arc rod 95, this connection arc rod 95 of this hot junction heat conduction diversion column 90 is connected between this second barred body 94 of this first barred body 93 of this hot junction heat conduction diversion column 90 and this hot junction heat conduction diversion column 90, this first barred body 93 of this hot junction heat conduction diversion column 90, this second barred body 94 are connected on adjacent this P type semiconductor 30 and this N type semiconductor 20, and this first barred body 93 of this hot junction heat conduction diversion column 90 and the gap between this second barred body 94 form this post groove 100.
As shown in Figure 8, this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 in concrete enforcement in the above-mentioned execution mode two comprise copper post 86 and aluminium coating 87 respectively.
This aluminium coating 87 is wrapped in the outside of this copper post 86, the some radiating fins of cold rolling formation on these aluminium coating 87 outer surfaces.
In concrete enforcement, heat at first is delivered on this copper post 86, then by this aluminium coating 87 heat is outwards distributed efficiently.
Shown in Fig. 8,9, in concrete enforcement, on this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90, can be arranged with insulation gap plate 88 respectively, this insulation gap plate 88 can be made by resin fibre class insulating material.
This insulation gap plate 88 is arranged on arbitrarily adjacent two these cold junction heat conduction diversion columns 80 or arbitrarily between adjacent two these hot junction heat conduction diversion columns 90.
This insulation gap plate 88 be arranged on arbitrarily adjacent two these cold junction heat conduction diversion columns 80 or arbitrarily between adjacent two these hot junction heat conduction diversion columns 90 to reach the effect that insulation is isolated, can also play the effect that frame is held this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 by this insulation gap plate 88 in addition.
In concrete enforcement, cold (or heat) that chip of the present utility model produces can be taken out of by air exhauster or other devices, be stained with behind dust or the dirt influence cold (or heat) easily because of long-term use and derive and influence heat radiation for reducing on the heat conduction diversion column, the while also more convenient user required cold (or hot) presented with form more easily.
Shown in Fig. 8 to 12, in each above-mentioned embodiment, can install sealed heat-dissipating casing 120 additional, sealing heat-dissipating casing 120 is fixed on this heat conductive insulating layer 60 of the two-way chip of this semiconductor cold-hot both sides, by sealing heat-dissipating casing 120 and this heat conductive insulating layer 60 around determining the sealed heat-dissipating chamber.
This cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 are separately positioned in the sealing heat radiation chamber; the sealing heat radiation is filled with superconducting fluid in the chamber; utilize sealing heat-dissipating casing 120 and superconducting fluid cold and hot efficiently can also protect diversion column not to be subjected to pollution and the corrosion of air when outwards transmitting what this cold junction heat conduction diversion column 80 and this hot junction heat conduction diversion column 90 were produced, reduce the later maintenance work of product.
Various execution mode of the present utility model is mainly used in the air-conditioning equipment at present as mentioned above, in concrete enforcement, at cold junction and hot junction blower fan or superconducting fluid are set respectively, cold or hot the exporting in the space outerpace that the utility model chip is produced, thereby the effect that reaches refrigeration or heat.
The utility model can be realized the effect of freezing or heating according to above-mentioned execution mode in concrete enforcement, working method is inverted then can utilizes chip of the present utility model to carry out thermo-electric generation.
The utility model mainly generates electricity according to the thermo-electric generation principle, thermo-electric generation mainly is to observe Xi Baike (seebeck) effect: in the open circuit that two kinds of different conductors (P type and N-type) are formed, if there is temperature difference in two nodes of conductor, to produce electromotive force E, Xi Baike effect that Here it is in this open circuit.
The characteristic of the utility model chip still can not produce cold and hot by electric current, when the cold and hot temperature difference was arranged, chip also can produce electric current simultaneously simultaneously.Design by this chip product, because the efficient conduction to heat, the benefit of generating is also significantly improved, and the said goods also can structurally be arranged in pairs or groups out and be generated electricity according to actual extraneous circumstance, and this also is the clean energy resource that is equal to solar energy.
Claims (10)
1. two-way chip of semiconductor cold-hot, it comprises some NP type semiconductor units, several these NP type semiconductor units are arranged the cold and hot generating unit that forms the two-way chip of this semiconductor cold-hot in proper order, it is characterized in that:
Each this NP type semiconductor unit all comprises N type semiconductor and P type semiconductor, be connected with first flow deflector at this N type semiconductor and this P type semiconductor one side, this side becomes cold junction, be connected with second flow deflector at this P type semiconductor of two adjacent arbitrarily these NP type semiconductor units and an other side of this N type semiconductor, this other side becomes the hot junction, this first flow deflector and this second flow deflector correspondence are connected the both sides of this N type semiconductor and this P type semiconductor
Be connected with the cold junction heating column at each respectively on this first flow deflector, this cold junction heating column is directly stretched and is located in the space outerpace, is connected with the hot junction heating column at each respectively on this second flow deflector, and this hot junction heating column is directly stretched and is located in the space outerpace,
Both sides at the two-way chip of this semiconductor cold-hot are respectively arranged with the heat conductive insulating layer, and this heat conductive insulating layer is located at respectively on this first flow deflector and this second flow deflector, and this cold junction heating column and this hot junction heating column stretch out from this heat conductive insulating layer respectively.
2. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 1, it is characterized in that: between this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides, be provided with sealing unit, the sealing unit is made by the heat conductive insulating fluid sealant, form a closed cavity by up and down this heat conductive insulating layer and the sealing of sealing unit of both sides, several these NP type semiconductor units are arranged in the sealing inner chamber.
3. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 1, it is characterized in that: this cold junction heating column and this first flow deflector combine and form cold junction heat conduction diversion column, this hot junction heating column and this second flow deflector combine and form hot junction heat conduction diversion column, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column correspondence are connected the both sides of this N type semiconductor and this P type semiconductor, and this cold junction heat conduction diversion column and this hot junction heat conduction diversion column stretch out from this heat conductive insulating layer respectively.
4. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 3 is characterized in that: be respectively arranged with the post groove at this cold junction heat conduction diversion column and this hot junction heat conduction diversion column.
5. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 4, it is characterized in that: this post groove vertically is arranged on this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, the width control of this post groove is between 1 to 3 millimeter, be connected this adjacent N type semiconductor arbitrarily, this cold junction heat conduction diversion column between this P type semiconductor is provided with this post groove at least between this N type semiconductor and this P type semiconductor, be connected this adjacent N type semiconductor arbitrarily, this hot junction heat conduction diversion column between this P type semiconductor is provided with this post groove at least between this N type semiconductor and this P type semiconductor.
6. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 5, it is characterized in that: this cold junction heat conduction diversion column and this hot junction heat conduction diversion column integral body are in the form of sheets, this cold junction heat conduction diversion column comprises that two sheet pin and at least two stretch out lamellar body, two these sheet pin are connected the both sides that this stretches out lamellar body, two these sheet pin are connected on adjacent this N type semiconductor and this P type semiconductor, any adjacent this stretches out and forms this post groove between the lamellar body
This hot junction heat conduction diversion column comprises that two sheet pin and at least two stretch out lamellar body, two of this hot junction heat conduction diversion column these sheet pin be connected this hot junction heat conduction diversion column this stretch out the both sides of lamellar body, two of this hot junction heat conduction diversion column these sheet pin are connected on adjacent this P type semiconductor and this N type semiconductor, and this of this any adjacent hot junction heat conduction diversion column stretches out and form this post groove between the lamellar body.
7. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 6, it is characterized in that: this heat conductive insulating layer is pressed on respectively on this sheet pin of this sheet pin of this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, and this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides is clamped in the both sides of the two-way chip of this semiconductor cold-hot simultaneously by grip unit.
8. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 5, it is characterized in that: this cold junction heat conduction diversion column comprises first barred body, second barred body and connects the arc rod, this connection arc rod is connected between this first barred body and this second barred body, this first barred body, this second barred body are connected on adjacent this N type semiconductor and this P type semiconductor, gap between this first barred body and this second barred body forms this post groove
This hot junction heat conduction diversion column comprises first barred body, second barred body and connects the arc rod, this connection arc rod of this hot junction heat conduction diversion column is connected between this second barred body of this first barred body of this hot junction heat conduction diversion column and this hot junction heat conduction diversion column, this first barred body of this hot junction heat conduction diversion column, this second barred body are connected on adjacent this P type semiconductor and this N type semiconductor, and this first barred body of this hot junction heat conduction diversion column and the gap between this second barred body form this post groove.
9. the two-way chip of a kind of semiconductor cold-hot as claimed in claim 8, it is characterized in that: this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, comprise copper post and aluminium coating respectively, this aluminium coating is wrapped in the outside of this copper post, the some radiating fins of cold rolling formation on this aluminium coating outer surface
Be arranged with the insulation gap plate respectively on this cold junction heat conduction diversion column and this hot junction heat conduction diversion column, this insulation gap plate is arranged on arbitrarily adjacent two these cold junction heat conduction diversion columns or arbitrarily between adjacent two these hot junction heat conduction diversion columns.
10. as any two-way chip of described a kind of semiconductor cold-hot in the claim 3 to 9, it is characterized in that: sealed heat-dissipating casing is fixed on this heat conductive insulating layer of the two-way chip of this semiconductor cold-hot both sides, by sealing heat-dissipating casing and this heat conductive insulating layer around determining the sealed heat-dissipating chamber, this cold junction heat conduction diversion column and this hot junction heat conduction diversion column are separately positioned in the sealing heat radiation chamber, and the sealing heat radiation is filled with superconducting fluid in the chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320127216 CN203192862U (en) | 2013-03-20 | 2013-03-20 | Bidirectional semiconductor cold-hot chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320127216 CN203192862U (en) | 2013-03-20 | 2013-03-20 | Bidirectional semiconductor cold-hot chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203192862U true CN203192862U (en) | 2013-09-11 |
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ID=49109694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320127216 Expired - Fee Related CN203192862U (en) | 2013-03-20 | 2013-03-20 | Bidirectional semiconductor cold-hot chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203192862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178201A (en) * | 2013-03-20 | 2013-06-26 | 刘宇 | Cold and hot bidirectional chip of semiconductor |
-
2013
- 2013-03-20 CN CN 201320127216 patent/CN203192862U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178201A (en) * | 2013-03-20 | 2013-06-26 | 刘宇 | Cold and hot bidirectional chip of semiconductor |
| CN103178201B (en) * | 2013-03-20 | 2015-07-08 | 刘宇 | Cold and hot bidirectional chip of semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20160320 |
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| CF01 | Termination of patent right due to non-payment of annual fee |