CN203173808U - Automatic bonding equipment for bonding anode of long glass column - Google Patents
Automatic bonding equipment for bonding anode of long glass column Download PDFInfo
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- CN203173808U CN203173808U CN 201320171690 CN201320171690U CN203173808U CN 203173808 U CN203173808 U CN 203173808U CN 201320171690 CN201320171690 CN 201320171690 CN 201320171690 U CN201320171690 U CN 201320171690U CN 203173808 U CN203173808 U CN 203173808U
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- glass cylinder
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Abstract
The utility model discloses automatic bonding equipment for bonding an anode of a long glass column. The equipment comprises a shell, a control system and a bonding system, wherein the bonding system comprises at least one bonding furnace, a bonding module arranged corresponding to the bonding furnace, a drive mechanism for driving the bonding furnace and the bonding module to move and regulate, a detection mechanism for identifying the location of bonded elements, and a feed mechanism for delivering the bonded elements to the bonding furnace one by one for bonding. By cooperation of the detection mechanism, the feed mechanism, the bonding furnace and the bonding module, the aims of automatic identification and automatic bonding are realized; anode and cathode clips are arranged up and down; the long glass column is gradually tightly pressed and fixed on a silicon wafer when an under-draught cylinder moves down; and the anode and cathode clips are respectively in contact with the silicon wafer and the long glass column, so that batch production of long glass column type sensors is realized, full automatic control of the bonding process is realized by the control system, the bonding precision and the production efficiency are improved, and the bonding cost is lowered.
Description
Technical field
The utility model relates to the bonding techniques field of electronic devices and components, is specifically related to a kind of automation bonding apparatus for long glass cylinder anode linkage.
Background technology
The MEMS technology grows up in the IC technical foundation, but the MEMS device has diversity and complexity, mainly shows: (1) function diversity has optical MEMS, biological MEMS, RF MEMS etc.; (2) diversity structure has two-dimensional structure, two-dimentional half hitch structure, three-dimensional structure, also has moving component; (3) diversity of interface and signal kinds, have electrical interface, optical interface, with the interface of extraneous medium; (4) diversity of material comprises structural material, conductive material, functional material, insulating materials etc.Its 26S Proteasome Structure and Function of different MEMS differs greatly, its applied environment, market demand also differ widely, and optimal MEMS is its overall structure, still, based on different processing technologys, the physical dimension with complexity and the MEMS unit of different materials, be difficult to be integrated in one.It is very difficult to make the complicated micro-system that sensing, driving and mechanical part are combined together based on existing MEMS technology.Finish the final making of MEMS, especially three-dimensional micro-system manufacturing process faces the problems such as dismounting of assembling, encapsulation and the system of each split.
The basic principle of anode linkage is that silicon chip is connect positive source, glass connects negative pole, silicon chip is aimed at, is assembled together with glass, after being heated to certain temperature, under the effect of plus high-pressure DC electric field, form firm chemical bond between silicon chip and the glass, make silicon-glass interface form good connection.Existing MEMS bonding apparatus adopts wafer level bonding mode substantially, wafer level bonding mode is conducive to the processing of device in enormous quantities, adopt scribing equipment to obtain the bond devices of single chip behind the bonding, but just can't use the mode of wafer bonding for the sensor of some special structure form, micro-acceleration gauge as typical sandwich structure, the sensors of glass column form etc. relatively are fit to adopt single-chip anode linkage means.
There is not special single-chip bonding apparatus in the market, can only carry out the bonding processing by developing some manual bonding apparatus voluntarily, the bonding low precision, and be of limited application, only be suitable for laboratory research, can't realize the production of small lot for some ripe sensors, production efficiency is lower, and the bonding cost is higher.
Therefore, in view of above problem, be necessary to propose a kind of bonding apparatus with the automation batch process of the anode linkage of realizing special construction sensor such as long glass cylinder, improve bonding precision and production efficiency, reduce the bonding cost.
The utility model content
In view of this, the utility model provides a kind of bonding apparatus of realizing long glass cylinder anode linkage automation batch process, improves bonding precision and production efficiency to reach, and reduces the purpose of bonding cost.
A kind of automation bonding apparatus for long glass cylinder anode linkage according to the purpose of this utility model proposition, the bonding that is used for bonding element silicon chip and long glass cylinder, this equipment comprises casing, control system and bonding system, described bonding system comprise at least one bonding stove, bonding module with the corresponding setting of described bonding stove, drive described bonding stove and described bonding module and move the driving mechanism of adjusting its horizontal level, the testing agency of identification bonding element position, the bonding element is delivered to the enterprising line unit of described bonding stove one by one closes the feed mechanism of processing;
Described bonding stove one side is provided with the magazine of placing the bonding finished product, and the branch frame that silicon chip and long glass cylinder are evenly arranged successively, and described burst case is in the below of described testing agency, and described magazine and described minute frame are with the same moved further of described bonding stove;
Described bonding module comprises following air cylinder, be horizontally placed on insulating bar on the described air cylinder down, be positioned at the carriage of described insulating bar front end; Described carriage is provided be used to the pressure head that is fixed the bonding element, at least one side of described carriage is provided with the negative electrode shell fragment, described insulating bar lower end is provided with the positive electrode shell fragment, described positive electrode shell fragment contacts with silicon chip, described negative electrode shell fragment contacts with long glass cylinder, and described negative electrode shell fragment is higher than the setting of described positive electrode shell fragment.
Preferably, described bonding stove comprises the bonding body of heater, and described bonding body of heater is provided with for adsorbing the fixedly adsorption hole of silicon chip.
Preferably, also be provided with block on the described bonding stove.
Preferably, the front end of described negative electrode shell fragment curves inwardly, and its end is provided with the arc bayonet socket.
Preferably, described bonding stove is at least two.
Preferably, described feed mechanism comprises the absorption hand, drives X-axis sliding platform, Y-axis sliding platform and the Z axle sliding platform of described absorption hand operation, and described absorption hand front end is provided with suction nozzle.
Preferably, described testing agency is microscope.
Preferably, described driving mechanism comprises the electronic slide unit of X-axis and the electronic slide unit of Y-axis, also is provided with insulating assembly between described driving mechanism and described bonding stove.
Compared with prior art, the advantage of the disclosed automation bonding apparatus for long glass cylinder anode linkage of the utility model is: by testing agency is set, the feed mechanism of automation and bonding stove, the mating reaction of bonding module, realized automation identification, the purpose of automation bonding, by will be just, negative electrode shell fragment upper and lower settings, long glass cylinder is fixed on silicon chip progressively in the descending process of following air cylinder, just, the negative electrode shell fragment respectively with silicon chip, long glass cylinder contacts, realize the batch process of long glass column build sensor, bonding process is by the control system Automatic Control, improve bonding precision and production efficiency, reduce the bonding cost.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the disclosed a kind of automation bonding apparatus front view for long glass cylinder anode linkage of the utility model.
Fig. 2 is the structural representation of the disclosed a kind of automation bonding apparatus bonding system for long glass cylinder anode linkage of the utility model.
Fig. 3 is the local enlarged diagram of the disclosed a kind of automation bonding apparatus bonding system for long glass cylinder anode linkage of the utility model.
The title of the numeral among the figure or the corresponding component of alphabetical representative:
1, temp controlled meter 2, casing 3, microscope 4, display screen 5, bonding module 6, bonding stove 7, feed mechanism 8, system control panel 9, electric cabinet
5-1, following air cylinder 5-2, insulating bar 5-3, branch frame 5-4, magazine 5-5, the electronic slide unit 5-6 of Y-axis, insulating assembly 5-7, the electronic slide unit of X-axis
6-1, pressure head 6-2, carriage 6-3, positive electrode shell fragment 6-4, negative electrode shell fragment 6-5, block 6-6, bonding body of heater
7-1, Y-axis sliding platform 7-2, X-axis sliding platform 7-3, Z axle sliding platform 7-4, suction nozzle 7-5, absorption hand
The specific embodiment
Existing MEMS bonding apparatus adopts wafer level bonding mode substantially, but just can't use the mode of wafer bonding for the sensor of some special structure form, there is not special single-chip bonding apparatus in the market, can only carry out the bonding processing by developing some manual bonding apparatus voluntarily, there is the bonding low precision, has the bonding limitation, can't realize the production of small lot for some ripe sensors, problems and shortcomings such as production efficiency is lower, and the bonding cost is higher.
The utility model is at deficiency of the prior art, and the utility model provides a kind of bonding apparatus of realizing long glass cylinder anode linkage automation batch process, improves bonding precision and production efficiency to reach, and reduces the purpose of bonding cost.
To be clearly and completely described the technical solution of the utility model by the specific embodiment below.Obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all belong to the scope of the utility model protection.
A kind of automation bonding apparatus for long glass cylinder anode linkage according to the purpose of this utility model proposition, the bonding that is used for bonding element silicon chip and long glass cylinder, this equipment comprises casing 2, control system (not shown) and bonding system, control system comprises temp controlled meter 1, display screen 4, system control panel 8 and electric cabinet 9, bonding system comprises at least one bonding stove 6, bonding module 5 with the 6 corresponding settings of bonding stove, drive bonding stove 6 and move the driving mechanism of adjusting its horizontal level with bonding module 5, the testing agency of identification bonding element position, the bonding element is delivered to bonding stove 6 one by one carries out the feed mechanism 7 that bonding is handled.
Driving mechanism comprises the electronic slide unit 5-7 of X-axis and the electronic slide unit 5-5 of Y-axis, and 6 in driving mechanism and bonding stove also are provided with insulating assembly 5-6.Regulate the position of burst 5-3 by the electronic slide unit 5-5 of the electronic slide unit 5-7 of X-axis and Y-axis, make center and the microscope center-aligned of bonding element, so that the picking up of feed mechanism.
Bonding module 5 comprises following air cylinder 5-1, be horizontally placed on down insulating bar 5-2 on the air cylinder 5-1, be positioned at the carriage 6-2 of insulating bar 5-2 front end; Carriage 6-2 is provided be used to the pressure head 6-1 that is fixed the bonding element, at least one side of carriage 6-2 is provided with negative electrode shell fragment 6-4, insulating bar 5-2 lower end is provided with positive electrode shell fragment 6-3, positive electrode shell fragment 6-3 contacts with silicon chip, negative electrode shell fragment 6-4 contacts with long glass cylinder, because silicon chip is descending, long glass cylinder bonding is fixed on the silicon chip, therefore, negative electrode shell fragment 6-4 is higher than positive electrode shell fragment 6-3 setting.Wherein the negative electrode shell fragment can be and is arranged at one-sided one, also can be two that bilateral symmetry arranges, and two negative electrode shell fragments are set can grip long glass cylinder both sides, guarantees the stability of bonding.
The bonding stove is provided with for adsorbing the fixedly adsorption hole (not shown) of silicon chip, by adsorption hole silicon chip is located.Successively silicon chip and long glass cylinder are positioned on the bonding body of heater 6-6 by feed mechanism, and guarantee silicon chip and long glass cylinder center conllinear, following air cylinder 5-1 is descending, pressure head 6-1 is pressed on the long glass cylinder, in the descending process of following air cylinder, positive electrode shell fragment 6-3 contacts with silicon chip, and negative electrode shell fragment 6-4 contacts with long glass cylinder, carries out bonding and handles.
Also be provided with block 6-5 on the bonding stove 6, negative electrode shell fragment 6-4 can inwardly compress with long glass cylinder under the restriction of block 6-5 and contact when following air cylinder 5-1 was descending.Block is that insulating materials is made, and specifically can be ceramic block.
The front end of negative electrode shell fragment 6-4 curves inwardly, and its end is provided with the arc bayonet socket, is convenient to contact with the external wall of long glass column.
Feed mechanism 7 comprises absorption hand 7-5, drives X-axis sliding platform 7-2, Y-axis sliding platform 7-1 and the Z axle sliding platform 7-3 of absorption hand 7-5 operation, and absorption hand 7-5 front end is provided with suction nozzle 7-4.According to the position of microscopic examination bonding element, drive the operation of absorption hand Three Degree Of Freedom by X, Y, the effect of Z axle sliding platform, adjust the position of absorption hand.
The bonding stove is 3, alternately bonding work.Wherein the quantity of bonding stove also can be 2 or a plurality of, can realize that continuous bonding operation gets final product, and concrete quantity depends on the circumstances, and does not limit at this.
The operation principle of this bonding apparatus is as follows:
Silicon chip and long glass cylinder are thrown into respectively on the branch frame 5-3, driving mechanism drives and divides frame 5-3 to move, the center of first silicon chip is corresponding with the microscope center, 7 operations of control system control feed mechanism, make absorption hand 7-5 corresponding with the central shaft of microscope 3, absorption hand 7-5 draws silicon chip silicon slice placed is placed first bonding body of heater 6-6, and is by adsorption hole that silicon chip absorption is fixing; Driving mechanism drives and divides frame 5-3 to move, the center of first long glass cylinder is corresponding with the microscope center, the operation of control system control feed mechanism, make absorption hand 7-5 corresponding with the central shaft of microscope 3, absorption hand 7-5 draws long glass cylinder long glass cylinder is positioned on the silicon chip, guarantee silicon chip and long glass cylinder center conllinear, after the bonding element installs on first bonding stove, adsorb the hand repetition aforesaid operations that resets and respectively second, third bonding stove is carried out material loading; After material loading is finished, following air cylinder 5-1 is descending, pressure head 6-1 is pressed on the long glass cylinder, in the descending process of following air cylinder 5-1, positive electrode shell fragment 6-3 contacts with silicon chip, negative electrode shell fragment 6-4 contacts with long glass cylinder spacing inwardly the compression down of block 6-5, under the furnace temperature that is fit to and high pressure effect, finishes the bonding of silicon chip and long glass cylinder; The following air cylinder 5-1 absorption hand that resets draws finished product to magazine, and at this moment, first bonding stove operation is finished, and the absorption hand continues its material loading, and this equipment is realized producing in batches according to the continuous cycling of above step.
The utility model discloses a kind of automation bonding apparatus for long glass cylinder anode linkage, by testing agency is set, the feed mechanism of automation and bonding stove, the mating reaction of bonding module, realized automation identification, the purpose of automation bonding, by will be just, negative electrode shell fragment upper and lower settings, long glass cylinder is fixed on silicon chip progressively in the descending process of following air cylinder, just, the negative electrode shell fragment respectively with silicon chip, long glass cylinder contacts, realize the batch process of long glass column build sensor, bonding process is by the control system Automatic Control, improve bonding precision and production efficiency, reduce the bonding cost.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments herein.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the wideest scope consistent with principle disclosed herein and features of novelty.
Claims (8)
1. automation bonding apparatus that is used for long glass cylinder anode linkage, the bonding that is used for bonding element silicon chip and long glass cylinder, this equipment comprises casing, control system and bonding system, it is characterized in that, described bonding system comprises at least one bonding stove, with the bonding module of the corresponding setting of described bonding stove, drive described bonding stove and described bonding module and move the driving mechanism, the testing agency that identifies bonding element position that adjust its horizontal level, the bonding element is delivered to the enterprising line unit of described bonding stove one by one closes the feed mechanism of processing;
Described bonding stove one side is provided with the magazine of placing the bonding finished product, and the branch frame that silicon chip and long glass cylinder are evenly arranged successively, and described burst case is in the below of described testing agency, and described magazine and described minute frame are with the same moved further of described bonding stove;
Described bonding module comprises following air cylinder, be horizontally placed on insulating bar on the described air cylinder down, be positioned at the carriage of described insulating bar front end; Described carriage is provided be used to the pressure head that is fixed the bonding element, at least one side of described carriage is provided with the negative electrode shell fragment, described insulating bar lower end is provided with the positive electrode shell fragment, described positive electrode shell fragment contacts with silicon chip, described negative electrode shell fragment contacts with long glass cylinder, and described negative electrode shell fragment is higher than the setting of described positive electrode shell fragment.
2. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 is characterized in that, described bonding stove comprises the bonding body of heater, and described bonding body of heater is provided with for adsorbing the fixedly adsorption hole of silicon chip.
3. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 is characterized in that, also is provided with block on the described bonding stove.
4. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 it is characterized in that the front end of described negative electrode shell fragment curves inwardly, and its end is provided with the arc bayonet socket.
5. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 is characterized in that, described bonding stove is at least two.
6. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1, it is characterized in that, described feed mechanism comprises the absorption hand, drives X-axis sliding platform, Y-axis sliding platform and the Z axle sliding platform of described absorption hand operation, and described absorption hand front end is provided with suction nozzle.
7. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 is characterized in that, described testing agency is microscope.
8. the automation bonding apparatus for long glass cylinder anode linkage as claimed in claim 1 is characterized in that, described driving mechanism comprises the electronic slide unit of X-axis and the electronic slide unit of Y-axis, also is provided with insulating assembly between described driving mechanism and described bonding stove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320171690 CN203173808U (en) | 2013-04-08 | 2013-04-08 | Automatic bonding equipment for bonding anode of long glass column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320171690 CN203173808U (en) | 2013-04-08 | 2013-04-08 | Automatic bonding equipment for bonding anode of long glass column |
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| Publication Number | Publication Date |
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| CN203173808U true CN203173808U (en) | 2013-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320171690 Expired - Fee Related CN203173808U (en) | 2013-04-08 | 2013-04-08 | Automatic bonding equipment for bonding anode of long glass column |
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| CN (1) | CN203173808U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103232024A (en) * | 2013-04-08 | 2013-08-07 | 苏州大学 | Automated bonding device used in long glass column anodic bonding |
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2013
- 2013-04-08 CN CN 201320171690 patent/CN203173808U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103232024A (en) * | 2013-04-08 | 2013-08-07 | 苏州大学 | Automated bonding device used in long glass column anodic bonding |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 Termination date: 20160408 |