CN203135209U - Multi-chip stress-free semiconductor laser packaging clamp - Google Patents
Multi-chip stress-free semiconductor laser packaging clamp Download PDFInfo
- Publication number
- CN203135209U CN203135209U CN 201320159379 CN201320159379U CN203135209U CN 203135209 U CN203135209 U CN 203135209U CN 201320159379 CN201320159379 CN 201320159379 CN 201320159379 U CN201320159379 U CN 201320159379U CN 203135209 U CN203135209 U CN 203135209U
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- semiconductor laser
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- baffle plate
- chip
- side baffle
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Abstract
The utility model discloses a multi-chip stress-free semiconductor laser packaging clamp belonging to the semiconductor laser chip packaging technology field. The multi-chip stress-free semiconductor laser packaging clamp comprises a pedestal, which is symmetrically provided with two sliding blocks capable of sliding leftwards and rightwards. A top pressing block is disposed between the two sliding blocks, and an upper surface of the top pressing block is contacted with a fixed pressure-applying elastic sheet. The structure adopts the symmetrized assembly design way and the side surface follow-up-free pressure type, therefore the pressing stress applied to the chips can be prevented during the temperature rising process, the continuous pressure applying function of the top pressure-applying elastic sheet can be facilitated, and the sizes of conventional clamps can be reduced.
Description
Technical field
The utility model relates to the unstressed packaging and positioning device of a kind of multi-chip plane array laser, belongs to semiconductor laser chip encapsulation technology field.
Background technology
In recent years, along with the epitaxial structure of semiconductor laser chip is optimized gradually, highly reliable, high-power, high efficiency semiconductor laser is able to extensive use gradually in fields such as laser pumping, laser processings.And the raising of multi-chip high power products power index, also further increased the encapsulation difficulty of product, the encapsulation stress problem becomes at present more and more distinct issues gradually, therefore, low thermal resistance, unstressedly is encapsulated into necessary in the current semiconductor laser application process.The utility model patent is exactly at the designed encapsulation anchor clamps of the disposable sintering of multi-chip.
In actual applications, multi-chip encapsulation is general adopts manual finishing, and its general utility tool is few, assembling process is complicated, positioning accuracy is low etc. generally becomes a series of unfavorable factors that restriction packaging efficiency and reliability improve.
The possible problem of above assembling process mainly shows following several respects: 1, do not form assembling jig special-purpose, that be suitable for producing in batches as yet; 2, the assembling process artifical influence factor is many, and it is serious to assemble inconsistent phenomenon, influences the quality of product; 3, assembling process is not easy to realize, watch window is narrow with the adjustment window.Above problem has had a strong impact on multi-chip plane array efficiency of assembling and assembling effect.
The utility model content
The technical problems to be solved in the utility model provides the unstressed semiconductor laser encapsulation of a kind of multi-chip anchor clamps, structure adopts symmetrization trim designs mode, adopt the side not have the follow-up pressure type, avoid temperature rise process chips institute compression chord, and the auxiliary top shell fragment of exerting pressure continues the effect of the application of force, dwindled the volume of existing anchor clamps simultaneously.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of multi-chip is unstressed, and semiconductor laser encapsulates anchor clamps, it is characterized in that comprising base, be symmetrically arranged with two slide blocks that can horizontally slip on the described base, place the top briquetting between two slide blocks, the upper surface of described top briquetting contacts with the shell fragment of fixing of exerting pressure.
Said structure is described further, and the left and right sides of described base is respectively equipped with left side baffle plate and right side baffle plate, and the outside of described two slide blocks contacts with two screws that pass left side baffle plate and right side baffle plate.The horizontally slipping of two slide blocks in the utility model realized by the screw that passes left side baffle plate and right side baffle plate, by adjustment screw, and the position of adjustable slide, thus the position, the left and right sides of realizing laser chip is adjusted.
Said structure is described further, described two slide blocks top is placed upper left block and upper right block respectively, the left side of upper left block contacts with left side baffle plate right flank, the left surface contact of the upper right block in right side of upper right block, the two ends of the described shell fragment of exerting pressure are fixed on upper left block and the upper right block by screw.Wherein, by the adjustment of left side baffle plate and right side baffle plate, can realize the fixing of upper right block and upper left block.
Said structure is described further, is provided with the side bit block in the side of top briquetting.Adjust the front and back position of top briquetting soon by the side contraposition.
The beneficial effect that adopts technique scheme to produce is: the utility model is by the feeding of the screw of left side baffle plate and right side baffle plate, and the realization side does not have the fastening scheme of follow-up pressure type, has avoided temperature rise process chips institute compression chord; Overall structure adopts the assembling jig of symmetrization design, both can avoid local infiltration difference in the sintering process, is conducive to improve assembly precision again; The top utilizes the spring-piece type force way to guarantee welding quality between heat sink and time heat sink, the effect built on the sand of having avoided weight to cause; Adjust the bottom surface number of pins of top briquetting, in order to cooperate the encapsulation requirement of different number of chips; The volume of these anchor clamps is little, thermal capacity is little, is conducive to improve chip mass encapsulation ability, improves with batch consistency of product.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is structure assembling schematic diagram of the present utility model;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is A-A cutaway view among Fig. 2;
Wherein: 1, base, 2-1, right side baffle plate, 2-2, left side baffle plate, 3-1, upper right block, 3-2, upper left block, 4, the shell fragment of exerting pressure, 5, the side bit block, 6, screw, 7, the top briquetting, 8, chip, 9, heat sink, 10, inferior heat sink.
Embodiment
With reference to the accompanying drawings as can be known, the utility model is specifically related to the unstressed semiconductor laser encapsulation of a kind of multi-chip anchor clamps, is used for the encapsulation location of multi-chip.
Concrete structure comprises base 1, be symmetrically arranged with two slide blocks that can horizontally slip on the described base 1, place top briquetting 7 between two slide blocks, be provided with side bit block 5 in the side of top briquetting 7, the upper surface of top briquetting 7 contacts with the shell fragment of fixing 4 of exerting pressure.
The realization that horizontally slips of slide block in the utility model, can be respectively equipped with left side baffle plate 2-2 and right side baffle plate 2-1 in the left and right sides of base 1, the outside of two slide blocks contacts with the screw 6 that passes left side baffle plate 2-2 and right side baffle plate 2-1, promote the slide block outside by screw 6, can realize the left and right adjusting of slide block.
Above two slide blocks, place upper left block 3-2 and upper right block 3-1 respectively, the left side of upper left block 3-2 contacts with left side baffle plate 2-2 right flank, the left surface contact of the upper right block 3-1 in the right side of upper right block 3-1, the two ends of the described shell fragment 4 of exerting pressure are fixed on upper left block 3-2 and the upper right block 3-1 by screw 6.
Assembly structure of the present utility model is left-right symmetric, can avoid local infiltration difference in the sintering process, is conducive to improve assembly precision again.
When the utility model specifically uses, at first successively with right side baffle plate 2-1, left side baffle plate 2-2, upper right block 3-1, upper left block 3-2, side bit block 5 is assembled on the base 1, be n chip 8 then with quantity, n+1 only shelves 1 base centre position heat sink 9 and 1 times heat sink 10 successively, as shown in Figure 3, then with shell fragment 4, top briquetting 7 is installed on upper right block 3-1 and upper left block 3-2 upper surface by screw 6, at last screw 6 is suitably tightened, can finish the location of chip, be placed into after above-mentioned each parts are assembled and carry out sintering in the sintering furnace.
During actual the use, these anchor clamps were compared with former anchor clamps, and its volume is little, thermal capacity is little, were conducive to improve chip mass encapsulation ability, improved with batch consistency of product.
Claims (4)
1. the unstressed semiconductor laser of multi-chip encapsulates anchor clamps, it is characterized in that comprising base (1), be symmetrically arranged with two slide blocks that can horizontally slip on the described base (1), place top briquetting (7) between two slide blocks, the upper surface of described top briquetting (7) contacts with the shell fragment of fixing of exerting pressure (4).
2. the unstressed semiconductor laser of multi-chip according to claim 1 encapsulates anchor clamps, the left and right sides that it is characterized in that described base (1) is respectively equipped with left side baffle plate (2-2) and right side baffle plate (2-1), and the outside of described two slide blocks contacts with two screws (6) that pass left side baffle plate (2-2) and right side baffle plate (2-1).
3. the unstressed semiconductor laser of multi-chip according to claim 2 encapsulates anchor clamps, it is characterized in that placing upper left block (3-2) and upper right block (3-1) respectively above described two slide blocks, the left side of upper left block (3-2) contacts with left side baffle plate (2-2) right flank, the left surface contact of the upper right block in right side (3-1) of upper right block (3-1), the two ends of the described shell fragment of exerting pressure (4) are fixed on upper left block (3-2) and the upper right block (3-1) by screw (6).
4. the unstressed semiconductor laser encapsulation of multi-chip according to claim 3 anchor clamps is characterized in that being provided with side bit block (5) in the side of top briquetting (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320159379 CN203135209U (en) | 2013-04-02 | 2013-04-02 | Multi-chip stress-free semiconductor laser packaging clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320159379 CN203135209U (en) | 2013-04-02 | 2013-04-02 | Multi-chip stress-free semiconductor laser packaging clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203135209U true CN203135209U (en) | 2013-08-14 |
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ID=48943151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320159379 Expired - Lifetime CN203135209U (en) | 2013-04-02 | 2013-04-02 | Multi-chip stress-free semiconductor laser packaging clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203135209U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409964A (en) * | 2014-12-03 | 2015-03-11 | 山东华光光电子有限公司 | Semiconductor laser sintering clamp and sintering method thereof |
| CN104934851A (en) * | 2015-06-19 | 2015-09-23 | 郑州大学 | Fixture for packaging stack array of semiconductor laser |
| CN105244288A (en) * | 2015-08-28 | 2016-01-13 | 中国电子科技集团公司第四十七研究所 | Method for packaging integrated circuit |
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
-
2013
- 2013-04-02 CN CN 201320159379 patent/CN203135209U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104409964A (en) * | 2014-12-03 | 2015-03-11 | 山东华光光电子有限公司 | Semiconductor laser sintering clamp and sintering method thereof |
| CN104409964B (en) * | 2014-12-03 | 2018-02-09 | 山东华光光电子股份有限公司 | A kind of semiconductor laser sintering fixture and its sintering method |
| CN104934851A (en) * | 2015-06-19 | 2015-09-23 | 郑州大学 | Fixture for packaging stack array of semiconductor laser |
| CN104934851B (en) * | 2015-06-19 | 2018-08-14 | 郑州大学 | A kind of fixture for semiconductor laser stacks encapsulation |
| CN105244288A (en) * | 2015-08-28 | 2016-01-13 | 中国电子科技集团公司第四十七研究所 | Method for packaging integrated circuit |
| CN105244288B (en) * | 2015-08-28 | 2017-11-07 | 中国电子科技集团公司第四十七研究所 | Method for encapsulating integrated circuit |
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN105428994B (en) * | 2015-12-21 | 2018-05-25 | 中国电子科技集团公司第十三研究所 | A kind of high power laser strip-like chip is sintered fixture |
| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
| CN109872956B (en) * | 2017-12-05 | 2020-11-27 | 山东华光光电子股份有限公司 | Rapid feeding device and method for tube seat for semiconductor laser |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130814 |
|
| CX01 | Expiry of patent term |