CN203128651U - Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line - Google Patents
Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line Download PDFInfo
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- CN203128651U CN203128651U CN 201220724489 CN201220724489U CN203128651U CN 203128651 U CN203128651 U CN 203128651U CN 201220724489 CN201220724489 CN 201220724489 CN 201220724489 U CN201220724489 U CN 201220724489U CN 203128651 U CN203128651 U CN 203128651U
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Abstract
The utility model relates to a miniature PVD (Physical Vapor Deposition) module. A dynamic sealing design between a shell and a transmission belt is achieved by adopting a roller set arranged between the shell and the transmission belt and using a sealing connection relationship between the roller set and the shell as well as the transmission belt. As a mobile target material device is arranged, the small-scale design of the target material device is realized, and the manufacturing cost of the whole module is greatly reduced; a temperature detection device is used for measuring the surface temperature in the shell, the temperature of the target material device and the temperature of a semiconductor substrate arranged on the transmission belt in real time, accordingly the heat output of the target device can be controlled, and therefore a film coating process can be carried out at a reasonable temperature; and in addition, a PVD control system can be used for realizing the automatic control of the whole film coating process. Therefore, miniaturization and modularization of a PVC film coating process in the semiconductor integrated manufacturing production line are achieved.
Description
Technical field
The utility model relates to the design field of semiconductor production equipment, relates in particular to the miniature PVD module for the integrated manufacturing line of semi-conductor.
Background technology
Owing to need be finished step by step by a plurality of technologies in the process of the integrated manufacturing of semi-conductor, as clean, drying treatment, isolation processing, PVD plated film etc., and each processing step all need carry out under airtight environment, to adopting integrated sealing manufacturing system in this prior art usually, each step process is carried out under same airtight environment.In the integrated manufacturing processed of whole semi-conductor, the PVD plated film is the core procedure of semi-conductor moulding.PVD refers to utilize physical process to realize substance transfer, and atom or molecule are transferred to process on the substrate surface by the source.In present semiconductor fabrication, the basic skills of PVD coating technique has the method for vacuum-evaporation, vacuum sputtering and vacuum ion membrane plating.Vacuum-evaporation refers to the film material is placed evaporation source in the vacuum chamber, really stop up under the condition at height, make its evaporation by the evaporation heating, after the linear dimension of mean free path greater than vacuum chamber of steam molecule, atom under the steam condition and molecule seldom are subjected to impact and the obstruction of other molecules or atom after the effusion of evaporation source surface, can be directly to reach on the substrate surface that is plated, because substrate temperature is lower, just condenses thereon and form plated film.In the prior art, each technical process of semi-conductor integrated manufacturing system all needs to carry out under airtight environment, after finishing a technical process, need semi-conductor half cost is taken out, to carry out next step art breading, but it is had relatively high expectations to the vacuum of space after taking out, and therefore causes the integrated producing apparatus of semi-conductor to make difficulty, factory building huge.Producer's investment is founded the factory need bear a large amount of fund input in early stage on the one hand, usually build the time that the semiconductor integrated manufacturing system needs the several years on the other hand, as seen it is big and of long duration to build semiconductor integrated manufacturing system fund input amount at present, and causes the difficulty of producer's turnover of funds easily.
The utility model content
The purpose of this utility model is to overcome the defective of prior art, and the miniature PVD module that aims to provide for the integrated manufacturing line of semi-conductor realizes modular design to realize the PVD mechanism in the semiconductor production equipment.
The utility model is to realize like this, the miniature PVD module that is used for the integrated manufacturing line of semi-conductor, comprise a housing, described housing both lateral sides is respectively equipped with the entrance and exit that passes through for transport tape, and described transport tape is separated into epicoele and cavity of resorption with described housing, the entrance and exit place of described housing is provided with the cylinder group of the described transport tape of dynamic clamp respectively, each described cylinder group comprises the last cylinder that is attached at the transport tape upside and the bottom roll that is attached at the transport tape downside, also be provided with first servomotor that drives described cylinder group running on the described housing, the sidewall of described cavity of resorption offers the venting hole that connects air extractor, described venting hole is provided with adaptive with it gas exhausting valve, be provided with mobile target device in the described cavity of resorption, described cavity of resorption is provided with the acceleration electromagnetic field between described transport tape and described target device, this miniature PVD module also comprises the PVD Controlling System, described PVD Controlling System comprises the weather gauge of being located in the described epicoele and monitoring described epicoele internal gas pressure in real time, also comprise and measure described shell inner surface temperature, measure the temperature-detecting device that described target unit temp and mensuration are positioned over the temperature of the semiconductor substrate on the described transport tape, also comprise described first servomotor of control, described gas exhausting valve, target device and the controller that accelerates the electromagnetic field working order, described controller respectively with described first servomotor, gas exhausting valve, the target device, accelerate electromagnetic field, air pressure is taken into account temperature-detecting device and is electrically connected.
Particularly, described target device comprises heating kettle for the splendid attire target, is fixed in heating unit and a screw mandrel that rotates on the described heating kettle, and described heating kettle or heating unit are provided with the threaded hole adaptive with described screw mandrel.
Particularly, described target device also comprises to be located at described housing sidewall and to drive second servomotor that described screw mandrel rotates, and described second servomotor is electrically connected with described controller.
Particularly, described acceleration magnetic field comprises that two are arranged at the electro-magnet of described cavity of resorption inner side-wall respectively.
Particularly, described housing comprises aluminum hull skin, silicon rubber thermal insulation layer and stainless steel internal layer from outside to inside successively.
Particularly, described housing comprises loam cake and the lower cover of mutual fastening, described loam cake and described transport tape and last cylinder are enclosed described epicoele, described lower cover and described transport tape and bottom roll are enclosed described cavity of resorption, has the gap that forms described entrance and exit between the cross side of described loam cake and lower cover, be provided with the male and female groove syndeton between vertical side of described loam cake and lower cover, be provided with joint strip in the described male and female groove.
Particularly, each described surface of going up cylinder and bottom roll is provided with elastic layer, each described surface, both ends of going up cylinder and bottom roll is in contact with one another and shrink-fit, each described going up has the gap of passing through for described transport tape between cylinder and the bottom roll, and shrink-fit between each described upward cylinder and bottom roll and the described transport tape.
Particularly, be provided with in the described housing and support each described upper support piece and lower support piece of going up cylinder and bottom roll respectively, each described upper support piece is provided with part and accommodates the described arc accepting groove of going up cylinder, described lower support piece is provided with the arc accepting groove that part is accommodated described bottom roll, each described arc accepting groove is describedly gone up cylinder and bottom roll shrink-fit respectively with each, and each described upper support piece is connected with described housing seal with the lower support piece.
Particularly, establish the circulation cooling tank in each described upper support piece and the lower support piece, described circulation cooling tank is connected with the water-cooling system of outside.
Particularly, each described upper support piece two ends is provided with bearing, each described two ends of going up cylinder is installed in the described bearing, and each described upper support piece and described housing are slidingly connected on vertical direction, be provided with spring between each described upper support piece upside and the described case top, described spring is pressed and is located between described upper support piece and the described case top.
The beneficial effects of the utility model: miniature PVD module of the present utility model arranges described cylinder group by adopting between described housing and described transport tape, utilize the relation of being tightly connected of described cylinder group and housing and described transport tape, reach the dynamic seal design between described housing and the described transport tape; By mobile target device is set, realized the miniaturization Design of target device, significantly reduced the manufacturing cost of whole module; Be positioned over the temperature of the semiconductor substrate on the described transport tape by the described shell inner surface temperature of the real-time mensuration of described temperature-detecting device, the described target unit temp of mensuration and mensuration, can control the thermal discharge of described target device accordingly, thereby guarantee under rational temperature, to carry out in the coating process; In addition, the utility model adopts described PVD Controlling System, can realize the automatization control of whole coating process.Therefore, the utility model has been realized microminiaturization and the modularization with PVD coating process in the integrated manufacturing line of semi-conductor.
Description of drawings
Fig. 1 is the external structure synoptic diagram of the utility model one preferred embodiment;
Fig. 2 is the sectional view of Fig. 1 section A-A;
Fig. 3 is the structural representation after Fig. 1 removes housing;
Fig. 4 is the sectional view of Fig. 3 section B-B;
Fig. 5 is the enlarged view of Fig. 2 partial view C.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Please refer to Fig. 1 ~ 4, the miniature PVD module that is used for the integrated manufacturing line of semi-conductor, comprise a housing 1, described housing 1 both lateral sides is respectively equipped with entrance 11 and the outlet of passing through for transport tape 2 12, be placed with semiconductor substrate to be processed on the wherein said transport tape 2, described transport tape 2 is separated into epicoele 13 and cavity of resorption 14 with described housing 1, the entrance 11 of described housing 1 and outlet 12 places are provided with the cylinder group 3 of the described transport tape 2 of dynamic clamp respectively, each described cylinder group 3 comprises the last cylinder 31 that is attached at transport tape 2 upsides and the bottom roll 32 that is attached at transport tape 2 downsides, also be provided with first servomotor 4 that drives described cylinder group 3 runnings on the described housing 1, the sidewall of described cavity of resorption 14 offers the venting hole 15 that connects air extractor (not drawing among the figure), described venting hole 15 is provided with adaptive with it gas exhausting valve (not drawing among the figure), be provided with mobile target device 5 in the described cavity of resorption 14, described cavity of resorption 14 is provided with between described transport tape 2 and described target device 5 and accelerates electromagnetic field 6, this miniature PVD module also comprises the PVD Controlling System, described PVD Controlling System comprises the weather gauge of being located in the described epicoele 13 and monitoring described epicoele 13 internal gas pressures in real time, also comprise and measure described housing 1 internal surface temperature, measure the temperature-detecting device (not drawing among the figure) that described target device 5 temperature and mensuration are positioned over the temperature of the semiconductor substrate on the described transport tape 2, also comprise described first servomotor 4 of control, described gas exhausting valve, target device 5 and the controller that accelerates electromagnetic field 6 working ordeies, described controller respectively with described first servomotor, gas exhausting valve, the target device, accelerate electromagnetic field, air pressure is taken into account temperature-detecting device and is electrically connected.Wherein, described air extractor can be arranged at the inside of described housing 1, in the utility model, considers the maintenance for ease of entire equipment, and described air extractor is arranged at the outside of described housing 1.
Below in conjunction with the principle of work of above-described embodiment to introduce characteristics of the present utility model.
Above-mentioned miniature PVD module is in use together used with module in the integrated manufacturing line of other semi-conductor, its with other modules between be connected by described transport tape 2, be placed with semiconductor substrate to be processed on the described transport tape 2.Because in the integrated manufacturing processed of semi-conductor, the essential good sealing property that keeps, the utility model is for realizing the sealed relationship of described transport tape 2 and described housing 1, offer entrance 11 and the outlet of passing through for described transport tape 2 12 in described housing 1 both lateral sides, and in described housing 1, in described entrance 11 and outlet 12 places cylinder group 3 is set respectively, by the described transport tape 2 of described cylinder group 3 clampings, thereby reach mutually dynamic sealed relationship between described housing 1 and the transport tape 2.
Above-mentioned miniature PVD module in the course of the work, at first make described gas exhausting valve be in the state of unlatching by described controller, and make described air extractor enter working order, extract described housing 1 gas inside out, make described housing 1 enter vacuum state, in this process, air pressure by the described housing of the real-time monitoring of described weather gauge 1 inside, and the atmospheric pressure value that records transferred to described controller, when described control detects described housing 1 inside and is in vacuum state, described controller is controlled described target device 5 and is entered working order, makes the target of placing on the described target device 5 be in evaporation or distillation, becomes the vapour particles state.In the utility model, for reducing the manufacturing cost of whole module, described target device 5 is arranged to the mobile target of miniaturization, by coming and going mobile in the downside of described transport tape 2 described target device 5, the target that makes described target device 5 produce can be distributed between described transport tape 2 and the described target device 5 uniformly, reaches the homogeneity of assurance plated film and the cheap double effects of manufacturing cost.In addition, between described target device 5 and described transport tape 2, arrange and accelerate electromagnetic field 6, charged target particle is attached on the semiconductor substrate that is positioned on the described transport tape 2 fast, have great significance for the speed that improves plated film.In addition, semiconductor substrate manufacturing for different size, its PVD plated film time is different, the running status of described first servomotor 4 determine to be positioned over each semiconductor substrate on the described transport tape 2 in described housing 1 time and accept time of PVD plated film, in the utility model, by described controller is controlled the running condition of described first servomotor 4, control the speed that described transport tape 2 turns round thereby reach.So, during miniature PVD module that the staff uses that the utility model provides, can be in advance at specification and the plated film requirement of semiconductor substrate to be processed, set described controller and control data accordingly, reach rational control and be positioned over the time of each semiconductor substrate in described housing 1 on the described transport tape 2.In the utility model, also by described temperature-detecting device respectively real-time described housing 1 internal surface temperature of mensuration, measure the temperature that described target device 5 temperature and mensuration are positioned over the semiconductor substrate on the described transport tape 2, can be by the contrast to three's temperature difference, determine the thermal discharge of described target device 5, to realize the constant control of described housing 1 internal temperature.
Please refer to Fig. 2 ~ 3, in the present embodiment, described target device 5 comprises heating kettle 51 for the splendid attire target, is fixed in heating unit 52 and a screw mandrel 53 that rotates on the described heating kettle 51, and described heating kettle 51 is provided with the threaded hole adaptive with described screw mandrel 53.So, described heating unit 52 can axially be gone up reciprocal movement in company with what described heating kettle 51 1 coexisted described screw mandrel 53.Wherein, the miniature PVD module that provides for ease of the utility model and the annexation of other processing modules are provided, described screw mandrel 53 is vertical with the direction that described transport tape 2 advances, its two ends are rotationally connected with described housing 1 both sides longitudinally by bearing respectively, so can make described housing 1 both lateral sides keep putting sky, be convenient to itself and being connected of other processing modules.Described target device 5 also comprises an electric power connection line 54, and described electric power connection line 54 1 ends are connected on the described heating unit 52, and the other end is passed by the longitudinal side wall of described housing 1, and is connected with external power source.In addition, mobile in described housing 1 for ease of described target device 5, the length dimension of described electric power connection line 54 is slightly larger than described housing 1 length dimension longitudinally.
Please refer to Fig. 2, in the present embodiment, described target device 5 also comprises to be located at described housing 1 sidewall and to drive second servomotor 55 that described screw mandrel 53 rotates, and described second servomotor 55 is electrically connected with described controller.So, can control parameter by setting for described controller, thereby control the speed of described second servo 55 runnings, thereby reach the speed that the described screw mandrel 53 of control rotates, and then control described target device 5 in the translational speed of described transport tape 2 downsides.
Please refer to Fig. 2 and Fig. 3, in the present embodiment, described acceleration magnetic field 6 comprises that two are arranged at the electro-magnet of described cavity of resorption 14 inner side-walls respectively.So, in described cavity of resorption 14, between described transport tape 2 and described target device 5, can form an electromagnetic field, when the charged target particle that is particle state enters this electromagnetic field, to produce electromagnetic force, charged target particle is attached on the semiconductor substrate that is positioned on the described transport tape 2 fast.Certainly, also can between described transport tape 2 and described target device 5, make up vertical electric field, also can reach same technique effect.
Please refer to Fig. 5, in the present embodiment, described housing 1 comprises aluminum hull skin 16, silicon rubber thermal insulation layer 17 and stainless steel internal layer 18 from outside to inside successively.Wherein, can to adopt silicon be that macromolecular material is made to described silicon rubber thermal insulation layer 17.In the technique scheme, provide a kind of housing 1 structure preferable with insulation effect, reduce whole miniature PVD module in the course of the work to extraneous distribute heat with this, in order to improve Working environment, avoid operating ambient temperature too high.
Please refer to Fig. 1 and Fig. 2, in the present embodiment, described housing 1 comprises the loam cake 102 and lower cover 103 of mutual fastening, described loam cake 102 is enclosed described epicoele 13 with described transport tape 2 and last cylinder 31, described lower cover 103 is enclosed described cavity of resorption 14 with described transport tape 2 and bottom roll 32, has the gap that forms described entrance 11 and outlet 12 between the cross side of described loam cake 102 and lower cover 103, be provided with the male and female groove syndeton between vertical side of described loam cake 102 and lower cover 103, be provided with joint strip in the described male and female groove.In the technique scheme, a kind of housing of being convenient to implement 1 structure is provided, this housing 1 is made of the loam cake 102 that separates and lower cover 103, vertical side of described loam cake 102 and lower cover 103 adopts the sealing of male and female groove syndeton and fitted seal adhesive tape, so can make described housing 1 be convenient to implement, possess good sealing effectiveness simultaneously again.
Please refer to Fig. 3 and Fig. 4, in the present embodiment, each described surface of going up cylinder 31 and bottom roll 32 is provided with elastic layer, each described surface, both ends of going up cylinder 31 and bottom roll 32 is in contact with one another and shrink-fit, each described going up has the gap of passing through for described substrate 2 between cylinder 31 and the bottom roll 32, and shrink-fit between each described upward cylinder 31 and bottom roll 32 and the substrate 2.Wherein, described elastic layer adopts silicon rubber to be made.Technique scheme has been given the concrete sealing means of described cylinder group 3, by being in contact with one another part, described upward cylinder 31, bottom roll 32 and substrate 2 be arranged to Elastic Contact, so, in described cylinder group 3 operation process of described substrate 2 companions, can keep good sealing effectiveness constantly, realize dynamic seal.
Please refer to Fig. 1, Fig. 3 and Fig. 4, in the present embodiment, be provided with in the described housing 1 and support each described upper support piece 81 and lower support piece 82 of going up cylinder 31 and bottom roll 32 respectively, each described upper support piece 81 is provided with part and accommodates the described arc accepting groove 7 of going up cylinder 31, described lower support piece 82 is provided with the arc accepting groove 7 that part is accommodated described bottom roll 32, each described arc accepting groove 7 is describedly gone up cylinder 31 and bottom roll 32 shrink-fit respectively with each, and each described upper support piece 81 and lower support piece 82 are tightly connected with described housing 1.Provided the concrete sealing mounting means of described cylinder group 3 in the technique scheme, it is by adopting the upper support piece 81 and lower support piece 82 that is tightly connected with described housing 1, and in described upper support piece 81 and described lower support piece 82, offer with the described arc accepting groove 7 of going up cylinder 31 and bottom roll 32 shrink-fit and carry out accommodating of part, to realize described upper support piece 81 and described upward being tightly connected between the cylinder 31, being tightly connected between described lower support piece 82 and the described bottom roll 31, thus realize the relation of being tightly connected of described cylinder group 3 and described housing 1.Wherein, the radian of described arc accepting groove 7 preferably is set in
Between, in the present embodiment, the radian of described arc accepting groove 7 is π.
Please refer to Fig. 1, Fig. 2 and Fig. 3, in the present embodiment, owing to adopt the mode of connection of shrink-fit between described cylinder group 3 and each described upper support piece 81 and the lower support piece 82, certainly will cause joint face to generate heat because of friction, for distributing to the external world faster because of the heat that above-mentioned reason produces, establish the circulation cooling tank in each described upper support piece 81 and the lower support piece 82, described circulation cooling tank is connected with the water-cooling system of outside.Particularly, described circulation cooling tank is connected by the water-cooling system of cooling duct 9 with the outside, and described cooling duct 9 runs through described housing 1 by vertical side of described housing 1.
Please refer to Fig. 1, Fig. 2 and Fig. 3, in the present embodiment, each described upper support piece 81 two ends is provided with bearing 811, each described two ends of going up cylinder 31 is installed in the described bearing 811, and each described upper support piece 81 is slidingly connected on vertical direction with described housing 1, be provided with spring 10 between each described upper support piece 81 upside and described housing 1 top, described spring 10 is pressed and is located between described upper support piece 81 and described housing 1 top.So, by at each described upper support piece 81 two ends bearing 811 being set, and the described cylinder 31 of going up is installed in the described bearing 811, so on the relation of position, described upper support piece 81 and described cylinder 31 relative fixed that go up can be made, described upper support piece 81 and the described cylinder 31 of going up an integral body can be considered as.Therefore, the annexation between described upper support piece 81 and the described housing 1 is disposed on the vertical direction is slidingly connected, can make the described cylinder 31 of going up have the degree of freedom of displacement in vertical direction.When the semiconductor substrate of different thickness specification through out-of-date, the described cylinder 31 of going up can slide on vertical direction in company with described upper support piece 81, to adapt to the variation of partly leading substrate thickness.Simultaneously, for making the described cylinder 31 of going up to keep that half guide plate substrate on the described transport tape 2 is possessed good pressuring action, be provided with the spring 10 of pressurized between each described upper support piece 81 upside and described housing 1 top, the external tension force that presents when utilizing described spring 10 pressurizeds, the described cylinder 31 of going up possesses under the downward effect constantly, to guarantee the described sealing effectiveness of going up between cylinder 31 and the described transport tape 2.In addition, 32 sidewalls that are installed on described housing 1 of each described bottom roll, the mode that also adopts bearing to install is not given unnecessary details at this.
In the present embodiment, described housing 1 vertical side is provided with operator-machine-interface and the display screen that intercoms mutually with described controller.So, can the temperature parameter of the pneumatic parameter of described weather gauge monitoring gained and described temperature-detecting device monitoring gained is sent to described operator-machine-interface and be shown by described display screen by described controller, so that the staff controls the working order of whole miniature PVD module.
In sum, miniature PVD module of the present utility model arranges described cylinder group 3 by adopting between described housing 1 and described transport tape 2, utilize the relation of being tightly connected of described cylinder group 3 and housing 1 and described transport tape 2, reach the dynamic seal design between described housing 1 and the described transport tape 2; By mobile target device 5 is set, realized the miniaturization Design of target device 5, significantly reduced the manufacturing cost of whole module; Be positioned over the temperature of the semiconductor substrate on the described transport tape by the described shell inner surface temperature of the real-time mensuration of described temperature-detecting device, the described target unit temp of mensuration and mensuration, can control the thermal discharge of described target device 5 accordingly, thereby guarantee under rational temperature, to carry out in the coating process; In addition, the utility model adopts described PVD Controlling System, can realize the automatization control of whole coating process.Therefore, the utility model has been realized microminiaturization and the modularization with PVD coating process in the integrated manufacturing line of semi-conductor,
The above only is the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (10)
1. the miniature PVD module that is used for the integrated manufacturing line of semi-conductor, comprise a housing, it is characterized in that: described housing both lateral sides is respectively equipped with the entrance and exit that passes through for transport tape, and described transport tape is separated into epicoele and cavity of resorption with described housing, the entrance and exit place of described housing is provided with the cylinder group of the described transport tape of dynamic clamp respectively, each described cylinder group comprises the last cylinder that is attached at the transport tape upside and the bottom roll that is attached at the transport tape downside, also be provided with first servomotor that drives described cylinder group running on the described housing, the sidewall of described cavity of resorption offers the venting hole that connects air extractor, described venting hole is provided with adaptive with it gas exhausting valve, be provided with mobile target device in the described cavity of resorption, described cavity of resorption is provided with the acceleration electromagnetic field between described transport tape and described target device, this miniature PVD module also comprises the PVD Controlling System, described PVD Controlling System comprises the weather gauge of being located in the described epicoele and monitoring described epicoele internal gas pressure in real time, also comprise and measure described shell inner surface temperature, measure the temperature-detecting device that described target unit temp and mensuration are positioned over the temperature of the semiconductor substrate on the described transport tape, also comprise described first servomotor of control, described gas exhausting valve, target device and the controller that accelerates the electromagnetic field working order, described controller respectively with described first servomotor, gas exhausting valve, the target device, accelerate electromagnetic field, air pressure is taken into account temperature-detecting device and is electrically connected.
2. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 1, it is characterized in that: described target device comprises heating kettle for the splendid attire target, is fixed in heating unit and a screw mandrel that rotates on the described heating kettle, and described heating kettle or heating unit are provided with the threaded hole adaptive with described screw mandrel.
3. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 2, it is characterized in that: described target device also comprises to be located at described housing sidewall and to drive second servomotor that described screw mandrel rotates, and described second servomotor is electrically connected with described controller.
4. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 1, it is characterized in that: described acceleration magnetic field comprises that two are arranged at the electro-magnet of described cavity of resorption inner side-wall respectively.
5. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 1, it is characterized in that: described housing comprises aluminum hull skin, silicon rubber thermal insulation layer and stainless steel internal layer from outside to inside successively.
6. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 1, it is characterized in that: described housing comprises loam cake and the lower cover of mutual fastening, described loam cake and described transport tape and last cylinder are enclosed described epicoele, described lower cover and described transport tape and bottom roll are enclosed described cavity of resorption, has the gap that forms described entrance and exit between the cross side of described loam cake and lower cover, be provided with the male and female groove syndeton between vertical side of described loam cake and lower cover, be provided with joint strip in the described male and female groove.
7. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 1, it is characterized in that: each described surface of going up cylinder and bottom roll is provided with elastic layer, each described surface, both ends of going up cylinder and bottom roll is in contact with one another and shrink-fit, each described going up has the gap of passing through for described transport tape between cylinder and the bottom roll, and shrink-fit between each described upward cylinder and bottom roll and the described transport tape.
8. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 7, it is characterized in that: be provided with in the described housing and support each described upper support piece and lower support piece of going up cylinder and bottom roll respectively, each described upper support piece is provided with part and accommodates the described arc accepting groove of going up cylinder, described lower support piece is provided with the arc accepting groove that part is accommodated described bottom roll, each described arc accepting groove is describedly gone up cylinder and bottom roll shrink-fit respectively with each, and each described upper support piece is connected with described housing seal with the lower support piece.
9. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 8 is characterized in that: establish the circulation cooling tank in each described upper support piece and the lower support piece, described circulation cooling tank is connected with outside water-cooling system.
10. the miniature PVD module for the integrated manufacturing line of semi-conductor according to claim 7, it is characterized in that: each described upper support piece two ends is provided with bearing, each described two ends of going up cylinder is installed in the described bearing, and each described upper support piece and described housing are slidingly connected on vertical direction, be provided with spring between each described upper support piece upside and the described case top, described spring is pressed and is located between described upper support piece and the described case top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220724489 CN203128651U (en) | 2012-12-25 | 2012-12-25 | Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220724489 CN203128651U (en) | 2012-12-25 | 2012-12-25 | Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line |
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| CN203128651U true CN203128651U (en) | 2013-08-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050385A (en) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | Micro PVD (Physical Vapor Deposition) module for use in semiconductor integrated manufacturing production line |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050385A (en) * | 2012-12-25 | 2013-04-17 | 王奉瑾 | Micro PVD (Physical Vapor Deposition) module for use in semiconductor integrated manufacturing production line |
| CN103050385B (en) * | 2012-12-25 | 2015-05-27 | 王奉瑾 | Micro PVD (Physical Vapor Deposition) module for use in semiconductor integrated manufacturing production line |
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