CN203128353U - Ammonia nitrogen recycling device of circuit board etching wastewater - Google Patents
Ammonia nitrogen recycling device of circuit board etching wastewater Download PDFInfo
- Publication number
- CN203128353U CN203128353U CN 201320061855 CN201320061855U CN203128353U CN 203128353 U CN203128353 U CN 203128353U CN 201320061855 CN201320061855 CN 201320061855 CN 201320061855 U CN201320061855 U CN 201320061855U CN 203128353 U CN203128353 U CN 203128353U
- Authority
- CN
- China
- Prior art keywords
- ammonia nitrogen
- triple effect
- triple
- etching
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The utility model relates to an ammonia nitrogen recycling device of circuit board etching wastewater. The ammonia nitrogen recycling device comprises a copper removal high-ammonia nitrogen tank, a triple-effect evaporation tower, a triple-effect condensed liquid tank, an ion exchange column group, a standard water storage tank and a cooling crystallizer, wherein the copper removal high-ammonia nitrogen tank, the triple-effect evaporation tank, the triple-effect condensed liquid tank, the ion exchange column group and the standard water storage tank are connected in sequence; the triple-effect evaporation tower is connected with the cooling crystallizer; and the cooling crystallizer is connected with the copper removal high-ammonia nitrogen tank. The ammonia nitrogen recycling device of the circuit board etching wastewater is simple in process flow and capable of recycling the ammonia nitrogen resources in the circuit board etching wastewater.
Description
Technical field
The utility model relates to a kind of waste water reclamation device, particularly a kind of ammonia nitrogen retrieving arrangement of circuit card etching waste water.
Background technology
The acid chlorization copper etchant solution
1) etching mechanism: Cu+CuCl
2→ Cu
2Cl
2
Cu
2Cl
2+4Cl
-→2(CuCl
3)
2-
2) influence the factor of etch-rate: the principal element that influences etch-rate is Cl in the solution
-, Cu
+, Cu
2+Content and the temperature of etching solution etc.
A, Cl
-The influence of content: chlorine ion concentration and etch-rate have close relationship in the solution, and when concentration of hydrochloric acid raise, etching period reduced.In containing the HCl solution of 6N etching period be at least in the aqueous solution 1/3, and can improve molten copper amount.But concentration of hydrochloric acid can not surpass 6N, and it is big and to equipment corrosion to be higher than the volatile quantity of 6N hydrochloric acid, and along with the increase of acid concentration, the solubleness of cupric chloride reduces rapidly.
Add Cl
-The reason that can improve etch-rate is: in when, in Cupric Chloride Solution the etching reaction of copper taking place, and the Cu of generation
2Cl
2Not soluble in water, then form one deck protochloride copper film on the surface of copper, this film can stop further carrying out of reaction.Excessive Cl
-Energy and Cu
2Cl
2Complexing forms the complex ion (CuCl of solubility
3)
2-, dissolve from the copper surface, thereby improved etch-rate.
B, Cu
+The influence of content: according to etching reaction mechanism, along with the etching of copper will form univalent copper ion.Micro-Cu
+Will reduce etch-rate significantly.So in etching operation, will keep Cu
+Content in a low scope.
C, Cu
2+The influence of content: the Cu in the solution
2+Content has certain influence to etch-rate.Generally speaking, Cu in the solution
2+When concentration was lower than 2mol/L, etch-rate was lower; Speed is higher when 2mol/L.Along with constantly carrying out of etching reaction, the content of copper can increase gradually in the etching solution.When copper content was increased to finite concentration, etch-rate will descend.In order to keep etching solution to have constant etch-rate, must be the control of the copper content in the solution in certain scope.
D, temperature are to the influence of etch-rate: along with the rising of temperature, etch-rate is accelerated, but temperature is also unsuitable too high, generally controls in 45 ~ 55 ℃ of scopes.The too high meeting of temperature causes that HCl volatilizees too much, causes solution component out of proportion.In addition, if the etching solution temperature is too high, some resist layer can be damaged.
Alkaline copper chloride etching solution
1) etching mechanism: CuCl
2+ 4NH
3→ Cu (NH
3)
4Cl
2
Cu(NH
3)
4Cl
2+Cu→2Cu(NH
3)
2Cl
2) influence the factor of etch-rate: the Cu in the etching solution
2+The temperature of concentration, pH value, ammonium chloride concentration and etching solution is all influential to etch-rate.
A, Cu
2+The influence of ionic concn: Cu
2+Be oxygenant, so Cu
2+Concentration be the principal element that influences etch-rate.The relation of research copper concentration and etch-rate shows: when 0 ~ 82g/L, etching period is long; When 82 ~ 120g/L, etch-rate is lower, and solution control difficulty; When 135 ~ 165g/L, etch-rate is high and solution-stabilized; When 165 ~ 225g/L, the solution instability trends towards producing precipitation.
The influence of b, pH value of solution value: the pH value of etching solution should remain between 8.0 ~ 8.8, and is when the pH value drops to 8.0 when following, unfavorable to the metal resist layer on the one hand; On the other hand, the copper in the etching solution can not be become ammoniacal copper complex ion by complete complexing, and precipitation will appear in solution, and at bottom land formation sludge, these sludges can be formed sclerderm at well heater, may damage well heater, also can block pumps and nozzle, cause difficulty to etching.If the pH value of solution value is too high, ammonia supersaturation in the etching solution, free ammonia is discharged into the atmosphere, and causes environmental pollution; Simultaneously, the pH value of solution increases also can increase the degree of lateral erosion, thereby influences etched precision.
The influence of c, ammonium chloride content: the chemical reaction by etching regeneration as can be seen: [Cu (NH3)
2]
+Regeneration excessive N H need be arranged
3And NH
4Cl exists, if lack NH in the solution
4Cl, a large amount of [Cu (NH
3)
2]
+Can not get regeneration, etch-rate will reduce, so that loses etch capabilities.So the content of ammonium chloride is very big to the etch-rate influence.Carry out along with etched, constantly add ammonium chloride.
D, Temperature Influence: etch-rate and temperature have much relations, and etch-rate is accelerated along with the rising of temperature.The etching solution temperature is lower than 40 ℃, and etch-rate is very slow, and etch-rate crosses and can increase side etching quantity slowly, influences etching quality; Temperature is higher than 60 ℃, and etch-rate obviously increases, but NH
3Volatile quantity also increase greatly, cause contaminate environment and make in the etching solution chemical composition out of proportion.So the general control of temperature is advisable at 45 ~ 55 ℃.
Etching solution produces the acid waste liquid or the alkaline waste liquor that contain cupric ion in a large number through after repeatedly recycling.Because copper belongs to heavy metal, has toxicity.Acid waste liquid and alkaline waste liquor are directly discharged meeting contaminated land and water source, and cause the wasting of resources; And existing circuit card etching waste water reclamation enterprise only reclaims the copper in the waste water, and the ammonia nitrogen resource can't reclaim.
Shortcoming/the deficiency of prior art:
Prior art is to typically use the lower metal of murder by poisoning cupric ion is replaced from acidity or alkaline waste water reclaiming this class acidity or alkaline waste water, its production cost height, and need to consume a large amount of resources.
The utility model content
Technical problem to be solved in the utility model is that present employed cupric etching Wastewater Recovery need consume ample resources and cost recovery height, shortcomings such as the ammonia nitrogen wasting of resources.
The utility model is achieved through the following technical solutions above-mentioned purpose:
At the shortcoming of existing cupric etching Wastewater Recovery equipment, design a kind of ammonia nitrogen retrieving arrangement of circuit card etching waste water, comprise the high ammonia nitrogen jar of copper removal, triple effect evaporation tower, triple effect condensate drum, ion exchange column group, water store tank up to standard, crystallisation by cooling machine; The high ammonia nitrogen jar of described copper removal, triple effect evaporation tower, triple effect condensate drum and ion exchange column group, water store tank up to standard are connected successively; Described triple effect evaporation tower is connected with the crystallisation by cooling machine; The crystallisation by cooling machine is connected with the high ammonia nitrogen jar of copper removal.The tail washings of etching waste water after reclaiming through copper delivered to the further copper removal of the high ammonia nitrogen jar of copper removal, and then concentrate in the triple effect evaporation tower, last tail washings is delivered to the crystallisation by cooling machine and is cooled off and obtain ammonia chloride crystal, and the saturated mother liquor of ammonium chloride of discharging from the crystallisation by cooling machine is sent the high ammonia nitrogen jar of copper removal again back to and utilized again.Deliver to the triple effect condensate drum at the steam of triple effect evaporation tower generation and carry out cooling liquid, waste gas cooled is delivered to ion exchange column group and is carried out the toxic gas purification, and obtains water up to standard, and water up to standard is delivered in whose hold-up vessel up to standard.
The described device technique flow process of the utility model tool is simple, takes full advantage of behind the waste water reclamation ammonia nitrogen resource in the tail washings and recycles.
Description of drawings
Fig. 1 is the construction module synoptic diagram of the utility model embodiment one.
Embodiment
Embodiment one: as shown in Figure 1, comprise the high ammonia nitrogen jar of copper removal, triple effect evaporation tower, triple effect condensate drum, ion exchange column group, water store tank up to standard, crystallisation by cooling machine; The high ammonia nitrogen jar of described copper removal, triple effect evaporation tower, triple effect condensate drum and ion exchange column group, water store tank up to standard are connected successively; Described triple effect evaporation tower is connected with the crystallisation by cooling machine; The crystallisation by cooling machine is connected with the high ammonia nitrogen jar of copper removal.The tail washings of etching waste water after reclaiming through copper delivered to the further copper removal of the high ammonia nitrogen jar of copper removal, and then concentrate in the triple effect evaporation tower, last tail washings is delivered to the crystallisation by cooling machine and is cooled off and obtain ammonia chloride crystal, and the saturated mother liquor of ammonium chloride of discharging from the crystallisation by cooling machine is sent the high ammonia nitrogen jar of copper removal again back to and utilized again.Deliver to the triple effect condensate drum at the steam of triple effect evaporation tower generation and carry out cooling liquid, waste gas cooled is delivered to ion exchange column group and is carried out the toxic gas purification, and obtains water up to standard, and water up to standard is delivered in whose hold-up vessel up to standard.
Claims (1)
1. the ammonia nitrogen retrieving arrangement of a circuit card etching waste water is characterized in that comprising the high ammonia nitrogen jar of copper removal, triple effect evaporation tower, triple effect condensate drum, ion exchange column group, water store tank up to standard, crystallisation by cooling machine; The high ammonia nitrogen jar of described copper removal, triple effect evaporation tower, triple effect condensate drum and ion exchange column group, water store tank up to standard are connected successively; Described triple effect evaporation tower is connected with the crystallisation by cooling machine; The crystallisation by cooling machine is connected with the high ammonia nitrogen jar of copper removal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320061855 CN203128353U (en) | 2013-02-01 | 2013-02-01 | Ammonia nitrogen recycling device of circuit board etching wastewater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320061855 CN203128353U (en) | 2013-02-01 | 2013-02-01 | Ammonia nitrogen recycling device of circuit board etching wastewater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203128353U true CN203128353U (en) | 2013-08-14 |
Family
ID=48936351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320061855 Expired - Fee Related CN203128353U (en) | 2013-02-01 | 2013-02-01 | Ammonia nitrogen recycling device of circuit board etching wastewater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203128353U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103833174A (en) * | 2014-03-28 | 2014-06-04 | 文登市西郊热电有限公司 | Device and method for treating high-concentration ammonia nitrogen wastewater |
| CN107354461A (en) * | 2017-09-13 | 2017-11-17 | 田成 | A kind of printed circuit board acidic etching waste liquor process for regenerating, recovering and reutilizing |
-
2013
- 2013-02-01 CN CN 201320061855 patent/CN203128353U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103833174A (en) * | 2014-03-28 | 2014-06-04 | 文登市西郊热电有限公司 | Device and method for treating high-concentration ammonia nitrogen wastewater |
| CN103833174B (en) * | 2014-03-28 | 2016-04-13 | 文登市西郊热电有限公司 | A kind of device for treating high-concentration ammonia and method |
| CN107354461A (en) * | 2017-09-13 | 2017-11-17 | 田成 | A kind of printed circuit board acidic etching waste liquor process for regenerating, recovering and reutilizing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104355474B (en) | A kind of technique extracting cupric ion from trade effluent | |
| CN111032917B (en) | Ammonia distillation recycling process and system for alkaline etching waste liquid of circuit board | |
| CN101984097A (en) | Method for comprehensive recovery of heavy metal from spent solder stripper | |
| CN105002500A (en) | Alkaline CuC12 spent etching solution copper removal regeneration method | |
| CN103436885A (en) | Method for recycling tin removal waste liquor | |
| CN204779821U (en) | Etching solution recycle and regeneration and carry copper device | |
| CN109678196B (en) | Method for fully recycling anions and cations in microetching waste liquid | |
| CN102942278A (en) | Method for treating acidic copper-containing waste liquid | |
| CN204417598U (en) | A kind of cupric micro-etched waste liquid recycling device | |
| CN104911596A (en) | Device and method for cyclic regeneration and copper extraction of etching liquid | |
| CN108359990A (en) | A kind of alkaline etching liquid and its recycling method | |
| CN1584129B (en) | Method for separating copper from copper-containing waste liquid | |
| CN103274483B (en) | The nickel recovery process of nickel coating strip waste liquid | |
| CN112374521A (en) | Process for extracting calcium chloride from waste incineration fly ash | |
| CN203128353U (en) | Ammonia nitrogen recycling device of circuit board etching wastewater | |
| CN203433266U (en) | Device for recycling photoresist resin in developing solution | |
| CN203128352U (en) | Exhaust liquor treatment device for recovering etching wastewater | |
| CN203128222U (en) | Basic copper chloride synthesizing device of circuit board etching wastewater | |
| CN203065289U (en) | Copper sulfate synthesizing device of circuit board etching wastewater | |
| CN103086558A (en) | Treatment method of copper chloride hydroxide production wastewater | |
| CN103305848A (en) | Method for preparing etching liquid by purifying and regenerating high-concentration ammonia nitrogen waste liquor | |
| CN101863569B (en) | Tungsten-containing wastewater treatment method in tungsten smelting | |
| CN104230084B (en) | High salt contains the retrieving arrangement of sodium-chlor and glycerine in glycerine high concentrated organic wastewater | |
| CN103357247A (en) | Washing system and washing method | |
| CN102510669A (en) | Method for chemically cleaning copper surface of substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20200201 |