CN203065289U - Copper sulfate synthesizing device of circuit board etching wastewater - Google Patents
Copper sulfate synthesizing device of circuit board etching wastewater Download PDFInfo
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- CN203065289U CN203065289U CN 201320061080 CN201320061080U CN203065289U CN 203065289 U CN203065289 U CN 203065289U CN 201320061080 CN201320061080 CN 201320061080 CN 201320061080 U CN201320061080 U CN 201320061080U CN 203065289 U CN203065289 U CN 203065289U
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Abstract
The utility model relates to a copper sulfate synthesizing device of circuit board etching wastewater. The device comprises an acidic etching liquid storage device, an acidic etching liquid purifying and edulcorating tank, a basic etching liquid storage device, a basic etching liquid purifying and edulcorating tank, a neutralization and sedimentation barrel, a first filter press unit, a first pulping barrel, a second filter press unit, an acidifying crystallizing tank, a suction filtration groove and a centrifugal unit. The acidic etching liquid storage device is connected with the acidic etching liquid purifying and edulcorating tank in series. The basic etching liquid storage device is connected with the basic etching liquid purifying and edulcorating tank in series. The acidic etching liquid purifying and edulcorating tank and the basic etching liquid purifying and edulcorating tank are respectively connected with the neutralization and sedimentation barrel. The neutralization and sedimentation barrel, the first filter press unit, the first pulping barrel, the second filter press unit, the second pulping barrel, the acidifying crystallizing tank, the suction filtration groove and the centrifugal unit are sequentially connected in series. The device provided by the utility model is simple in process flow, and neutralization and sedimentation are mainly performed by acid-base characteristics of etching wastewater, so that the copper iron recovery cost in wastewater is effectively reduced.
Description
Technical field
The utility model relates to a kind of waste water reclamation device, particularly a kind of copper sulfate synthesizer of circuit card etching waste water.
Background technology
1) etching mechanism: Cu+CuCl2 → Cu2Cl2
Cu2Cl2+4Cl-→2(CuCl3)2-
2) influence the factor of etch-rate: the principal element that influences etch-rate is the content of Cl-in the solution, Cu+, Cu2+ and the temperature of etching solution etc.
The influence of a, Cl-content: chlorine ion concentration and etch-rate have close relationship in the solution, and when concentration of hydrochloric acid raise, etching period reduced.In containing the HCl solution of 6N etching period be at least in the aqueous solution 1/3, and can improve molten copper amount.But concentration of hydrochloric acid can not surpass 6N, and it is big and to equipment corrosion to be higher than the volatile quantity of 6N hydrochloric acid, and along with the increase of acid concentration, the solubleness of cupric chloride reduces rapidly.
The reason that interpolation Cl-can improve etch-rate is: when in Cupric Chloride Solution the etching reaction of copper taking place, the Cu2Cl2 of generation is not soluble in water, then forms one deck protochloride copper film on the surface of copper, and this film can stop further carrying out of reaction.Excessive Cl-can form complex ion (CuCl3) 2-of solubility with the Cu2Cl2 complexing, dissolves from the copper surface, thereby has improved etch-rate.
The influence of b, Cu+ content: according to etching reaction mechanism, along with the etching of copper will form univalent copper ion.The Cu+ of trace will reduce etch-rate significantly.So in etching operation, will keep the content of Cu+ in a low scope.
The influence of c, Cu2+ content: the Cu2+ content in the solution has certain influence to etch-rate.Generally speaking, when Cu2+ concentration was lower than 2mol/L in the solution, etch-rate was lower; Speed is higher when 2mol/L.Along with constantly carrying out of etching reaction, the content of copper can increase gradually in the etching solution.When copper content was increased to finite concentration, etch-rate will descend.In order to keep etching solution to have constant etch-rate, must be the control of the copper content in the solution in certain scope.
D, temperature are to the influence of etch-rate: along with the rising of temperature, etch-rate is accelerated, but temperature is also unsuitable too high, generally controls in 45 ~ 55 ℃ of scopes.The too high meeting of temperature causes that HCl volatilizees too much, causes solution component out of proportion.In addition, if the etching solution temperature is too high, some resist layer can be damaged.
Alkaline copper chloride etching solution
1) etching mechanism: CuCl2+4NH3 → Cu (NH3) 4Cl2
Cu(NH3)4Cl2+Cu→2Cu(NH3)2Cl
2) influence the factor of etch-rate: the temperature of the Cu2+ concentration in the etching solution, pH value, ammonium chloride concentration and etching solution is all influential to etch-rate.
The influence of a, Cu2+ ionic concn: Cu2+ is oxygenant, so the concentration of Cu2+ is the principal element that influences etch-rate.The relation of research copper concentration and etch-rate shows: when 0 ~ 82g/L, etching period is long; When 82 ~ 120g/L, etch-rate is lower, and solution control difficulty; When 135 ~ 165g/L, etch-rate is high and solution-stabilized; When 165 ~ 225g/L, the solution instability trends towards producing precipitation.
The influence of b, pH value of solution value: the pH value of etching solution should remain between 8.0 ~ 8.8, and is when the pH value drops to 8.0 when following, unfavorable to the metal resist layer on the one hand; On the other hand, the copper in the etching solution can not be become ammoniacal copper complex ion by complete complexing, and precipitation will appear in solution, and at bottom land formation sludge, these sludges can be formed sclerderm at well heater, may damage well heater, also can block pumps and nozzle, cause difficulty to etching.If the pH value of solution value is too high, ammonia supersaturation in the etching solution, free ammonia is discharged into the atmosphere, and causes environmental pollution; Simultaneously, the pH value of solution increases also can increase the degree of lateral erosion, thereby influences etched precision.
The influence of c, ammonium chloride content: the chemical reaction by etching regeneration as can be seen: [Cu (NH3) 2]+regeneration need have excessive N H3 and NH4Cl to exist, if lack NH4Cl in the solution, a large amount of [Cu (NH3) 2]+can not get regenerating, etch-rate will reduce, so that loses etch capabilities.So the content of ammonium chloride is very big to the etch-rate influence.Carry out along with etched, constantly add ammonium chloride.
D, Temperature Influence: etch-rate and temperature have much relations, and etch-rate is accelerated along with the rising of temperature.The etching solution temperature is lower than 40 ℃, and etch-rate is very slow, and etch-rate crosses and can increase side etching quantity slowly, influences etching quality; Temperature is higher than 60 ℃, and etch-rate obviously increases, but the volatile quantity of NH3 also increases greatly, causes contaminate environment and makes in the etching solution chemical composition out of proportion.So the general control of temperature is advisable at 45 ~ 55 ℃.
Etching solution produces the acid waste liquid or the alkaline waste liquor that contain cupric ion in a large number through after repeatedly recycling.Because copper belongs to heavy metal, has toxicity.Acid waste liquid and alkaline waste liquor are directly discharged meeting contaminated land and water source, and cause the wasting of resources.
Shortcoming/the deficiency of prior art:
Prior art is to typically use the lower metal of murder by poisoning cupric ion is replaced from acidity or alkaline waste water reclaiming this class acidity or alkaline waste water, its production cost height, and need to consume a large amount of resources.
The utility model content
Technical problem to be solved in the utility model is that present employed cupric etching Wastewater Recovery need consume shortcomings such as ample resources and cost recovery height.
The utility model is achieved through the following technical solutions above-mentioned purpose:
Shortcoming at existing cupric etching Wastewater Recovery equipment, design a kind of copper sulfate synthesizer of circuit card etching waste water, comprise acidic etching liquid storing unit, acidic etching liquid purification and impurity removal jar, alkaline etching liquid storing unit, alkaline etching liquid purification and impurity removal jar, neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove, centrifugal unit; Acidic etching liquid storing unit and acidic etching liquid purification and impurity removal jar polyphone; Alkaline etching liquid storing unit and alkaline etching liquid purification and impurity removal jar polyphone; Acidic etching liquid purification and impurity removal jar is connected with the neutralization precipitation bucket respectively with alkaline etching liquid purification and impurity removal jar; Neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove and centrifugal unit are contacted successively.The described device technique flow process of the utility model tool simply, mainly utilizes the soda acid characteristic of etching waste water itself to carry out neutralization precipitation, effectively reduces the cupric ion cost recovery in the waste water.
Description of drawings
Fig. 1 is the construction module synoptic diagram of the utility model embodiment one.
Embodiment
Embodiment one: as shown in Figure 1, comprise acidic etching liquid storing unit, acidic etching liquid purification and impurity removal jar, alkaline etching liquid storing unit, alkaline etching liquid purification and impurity removal jar, neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove, centrifugal unit; Acidic etching liquid storing unit and acidic etching liquid purification and impurity removal jar polyphone; Alkaline etching liquid storing unit and alkaline etching liquid purification and impurity removal jar polyphone; Acidic etching liquid purification and impurity removal jar is connected with the neutralization precipitation bucket respectively with alkaline etching liquid purification and impurity removal jar; Neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove and centrifugal unit are contacted successively.
Claims (1)
1. the copper sulfate synthesizer of a circuit card etching waste water is characterized in that comprising acidic etching liquid storing unit, acidic etching liquid purification and impurity removal jar, alkaline etching liquid storing unit, alkaline etching liquid purification and impurity removal jar, neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove, centrifugal unit; Acidic etching liquid storing unit and acidic etching liquid purification and impurity removal jar polyphone; Alkaline etching liquid storing unit and alkaline etching liquid purification and impurity removal jar polyphone; Acidic etching liquid purification and impurity removal jar is connected with the neutralization precipitation bucket respectively with alkaline etching liquid purification and impurity removal jar; Neutralization precipitation bucket, the first press filtration unit, first beater tup, the second press filtration unit, second beater tup, acidizing crystal jar, suction filtration groove and centrifugal unit are contacted successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320061080 CN203065289U (en) | 2013-02-01 | 2013-02-01 | Copper sulfate synthesizing device of circuit board etching wastewater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320061080 CN203065289U (en) | 2013-02-01 | 2013-02-01 | Copper sulfate synthesizing device of circuit board etching wastewater |
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| CN203065289U true CN203065289U (en) | 2013-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320061080 Expired - Fee Related CN203065289U (en) | 2013-02-01 | 2013-02-01 | Copper sulfate synthesizing device of circuit board etching wastewater |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109534384A (en) * | 2019-01-24 | 2019-03-29 | 苏州华锋环保技术有限公司 | High purity copper sulfate production line |
| CN110422872A (en) * | 2019-08-15 | 2019-11-08 | 安徽绿洲危险废物综合利用有限公司 | A kind of Kocide SD of alkaline etching liquid and preparation method thereof |
-
2013
- 2013-02-01 CN CN 201320061080 patent/CN203065289U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109534384A (en) * | 2019-01-24 | 2019-03-29 | 苏州华锋环保技术有限公司 | High purity copper sulfate production line |
| CN110422872A (en) * | 2019-08-15 | 2019-11-08 | 安徽绿洲危险废物综合利用有限公司 | A kind of Kocide SD of alkaline etching liquid and preparation method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20200201 |