CN203119779U - Inverter control power board - Google Patents
Inverter control power board Download PDFInfo
- Publication number
- CN203119779U CN203119779U CN 201320075799 CN201320075799U CN203119779U CN 203119779 U CN203119779 U CN 203119779U CN 201320075799 CN201320075799 CN 201320075799 CN 201320075799 U CN201320075799 U CN 201320075799U CN 203119779 U CN203119779 U CN 203119779U
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- CN
- China
- Prior art keywords
- power
- base plate
- amplifier board
- inverter control
- power amplifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses an inverter control power board which comprises bottom plates, power tubes and radiators, wherein the power tubes and the radiators are installed on one bottom plate, and the radiating surfaces of the power tubes are installed on the radiators. The radiators need to have conductive properties, be used as input/output wiring ports and radiate heat of the power tubes generating much heat. The radiation and current sharing problems are well solved. The inverter control power board has high versatility, and for different power, requirements of most of occasions can be met by decreasing or increasing the number of parallel-connected MOSFET tubes or connecting a plurality of the power boards in parallel.
Description
Technical field
The utility model relates to a kind of power amplifier board, and in particular, the utility model relates generally to a kind of inverter control power amplifier board with heat sinking function.
Background technology
In the prior art, traditional power device has field-effect transistor (MOSFET) and insulated gate bipolar transistor (IGBT) etc., the device that the heat that they all are that electric current is big, caloric value is high, produced by big electric current easily damages.Particularly in the occasion of using MOSFET, correspondence is high-power, the place of big electric current, and it normally needs to adopt a plurality of MOSFET parallel-connection structures, and this just needs to solve equal flow problem and heat dissipation problem.If all the flow problem solution is bad, the capacity at the beginning of just can not get designing; If it is bad that heat dissipation problem solves, can cause the MSOFET heating, might burn device, produce quality accident.
The utility model content
Consider the problems referred to above of prior art, according to the disclosed aspect of the utility model, the utility model is by the following technical solutions: a kind of inverter control power amplifier board, comprise base plate and power tube, base plate is provided with power tube, it is characterized in that: also comprise metal heat sink, described metal heat sink is fixedly connected on the base plate, and be arranged near the power tube place, the radiating surface of power tube is fixed on the metal heat sink.
Further technical scheme is: fixedly install on the described base plate to four group powers, be parallel to each other between the described power tube;
Further technical scheme is: described base plate is printed circuit board (PCB), has laid the metal conducting layer that thickness reaches the 3-6 ounce on the described printed circuit board (PCB);
Further technical scheme is: described metal heat sink is fixedly connected on the place apart from base plate 1-3mm;
Further technical scheme is: described metal heat sink is fixedly connected on the place apart from base plate 2mm;
Further technical scheme is: described power tube is by being welded to connect on base plate;
Further technical scheme is: the mounting hole site that also is provided with stand-by power supply, driving port and fixing cooling fins on the described base plate;
Further technical scheme is: describedly be provided with anodal input power supply area near the power pipe end, be provided with negative pole input power supply area away from the power pipe end.
Compared with prior art, one of the beneficial effects of the utility model are: by at original base plate metal heat sink being set, the bigger power tube of heating is dispelled the heat, it has well solved heat radiation and equal flow problem, and the versatility height is for different power, by reducing or increase MOSFET pipe in parallel, perhaps a plurality of power amplifier board parallel connections just can be satisfied most use occasions.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model cooling fin part structural representation;
Fig. 3 is the utility model circuit theory schematic diagram.
Embodiment
Below in conjunction with accompanying drawing the utility model is further elaborated.
Consider the problems referred to above of prior art, according to the disclosed aspect of the utility model, the utility model is by the following technical solutions: as shown in Figure 1, a kind of inverter control power amplifier board, comprise base plate 101,103,104, power tube 102 and radiator 105, installation power pipe 102 and radiator 105 on the base plate 101, radiator 105 is fixedly connected on the base plate 101, the radiating surface of power tube 102 is installed in above the radiator 105, it is parallel installation between the metal heat sink 105, and the right and left do not have shelter, and use is that the outside adds fan and dries to metal heat sink 105 coolings very easily.Power amplifier board can add the fan heat radiation very easily when heat radiation own can not meet the demands like this, and radiating effect improves.Metal heat sink 105 is not only as heat transmission, but also as conductive material, to flow through big electric current above it, flow to power tube by metal heat sink 105 just such as electric current, also export to external loading (as reactor or transformer) by metal heat sink 105.
According to an embodiment who is more preferably of the present utility model, as shown in Figure 1, base plate 101 is pcb boards, and the shop copper thickness of pcb board has reached 3 ~ 6 ounces, can guarantee that like this electric current about 65A flows through.Pcb board is divided into 4 zones according to voltage, is respectively 2 on Fig. 1,3,4,5, and zone 2 is just to import power supply, and zone 3 is input power-s, zone the 4, the 5th, and output is divided into these 4 zones and can reduces the generation of heat, and reduces mutual interference.Power tube 102(is such as MSOFET among Fig. 1) their arrangement is symmetry and alignment, the so just good current-sharing of energy has reduced the generation of heat; Their mounting means is earlier two metal heat sinks 105 in centre to be vertically mounted on the base plate according to position among the figure, note, the height of metal heat sink 105 is suitable, its height from base plate 101 remains on about 1-3mm and gets final product, again with power tube 102(such as MOSFET) be welded on the base plate 101, note making middle perforate and 201 alignment of the perforate above the metal heat sink 105 of power tube 102, after welding finishes, be fixed together with key screw power tube 102 and metal heat sink 105, also be provided with power supply leading-out terminal 106 above the base plate 101, can need the place of power supply that DC power supply is provided to other.Also be provided with above the base plate 101 and drive port 107, just can control power tube 102 operate as normal above the power amplifier board according to corresponding port.The external wiring hole 108 of going back power-above the base plate 101.
According to an embodiment who is more preferably of the present utility model, metal heat sink as shown in Figure 2, being made up of multi-disc fin 205 on the radiator, is the position, hole 201 of installation power pipe above the metal fin 205, and power tube directly is fixed on position, hole 201 on the fin 205 with screw.Also be provided with output port 202 above the fin 205, be installed in two fin 205 in base plate 101 centre position as shown in Figure 1 as the power supply positive input.Two fin that are installed in base plate 101 close both sides end position are as shown in Figure 1 drawn as output.Also be provided with above the fin 205 and metal heat sink 105 between interconnect the installing hole 203 of support.As shown in Figure 1, power-is connected to hole 108 on the base plate, four identical radiators 105 are fixed on above the base plate 101, and 202 holes on its middle two radiators 205 will be as the positive input port of power supply, and all the other will be as output port by 202 holes on two radiators 205 on both sides.As shown in Figure 1, the hole 203 usefulness plastic columns above base plate 101 top two radiators 105 are coupled together, the hole 203 usefulness plastic columns above base plate 101 following two radiators 105 are coupled together.
As shown in Figure 3, Fig. 3 is the circuit theory key diagram, the part on the left side is 15 parts above the base plate, the part on the right is the schematic diagram of base plate other parts, only drawn a group power (as MOSFET) on the figure, reality has designed six groups of equal-wattage pipes on base plate, the L on the figure is external loading (as reactor or transformer).Operation principle is to drive signal DB1 and DB2 DB3 and DB4 can not be simultaneously for high.When Q17 and Q20 opened, Q19 and Q18 must close, and electric current is flowed through Q20 to power-from Q17 through external loading; When Q19 and Q18 opened, Q17 and Q20 must close, and electric current is flowed through Q18 to power-from Q19 through external loading.The mode of connection is to meet the T1 of external loading and T2 to hold the output port 202 on the metal heat sink 105 and fin 205 above the corresponding power amplifier board.
" embodiment " who speaks of in this manual, " another embodiment ", " embodiment ", etc., refer to concrete feature, structure or the characteristics described in conjunction with this embodiment and be included among at least one embodiment that the application's generality describes.A plurality of local appearance statement of the same race is not necessarily to refer to same embodiment in specification.Furthermore, when describing a concrete feature, structure or characteristics in conjunction with arbitrary embodiment, what advocate is to realize that in conjunction with other embodiment this feature, structure or characteristics also drop in the scope of the present utility model.
Although be described with reference to the utility model of a plurality of explanatory embodiment of the present utility model here, but, should be appreciated that, those skilled in the art can design a lot of other modification and execution modes, and these are revised and execution mode will drop within the disclosed principle scope and spirit of the application.More particularly, in the scope of, accompanying drawing open in the application and claim, can carry out multiple modification and improvement to building block and/or the layout of subject combination layout.Except modification that building block and/or layout are carried out with improving, to those skilled in the art, other purposes also will be tangible.
Claims (8)
1. an inverter control power amplifier board comprises base plate and power tube, and base plate is provided with power tube, it is characterized in that: also comprise metal heat sink, described metal heat sink is fixedly connected on the base plate, and is arranged near the power tube place, and the radiating surface of power tube is fixed on the metal heat sink.
2. according to the described inverter control of claim 1 power amplifier board, it is characterized in that: fixedly install on the described base plate to four group powers, be parallel to each other between the described power tube.
3. according to the described inverter of claim 1 control power amplifier board, it is characterized in that: described base plate is printed circuit board (PCB), has laid the metal conducting layer that thickness reaches the 3-6 ounce on the described printed circuit board (PCB).
4. according to the described inverter control of claim 1 power amplifier board, it is characterized in that: described metal heat sink is fixedly connected on the place apart from base plate 1-3mm.
5. according to the described inverter control of claim 1 power amplifier board, it is characterized in that: described metal heat sink is fixedly connected on the place apart from base plate 2mm.
6. according to the described inverter control of claim 1 power amplifier board, it is characterized in that: described power tube is by being welded to connect on base plate.
7. according to the described inverter control of claim 1 power amplifier board, it is characterized in that: the mounting hole site that also is provided with stand-by power supply, driving port and fixing cooling fins on the described base plate.
8. according to the described inverter of claim 1 control power amplifier board, it is characterized in that: describedly be provided with anodal input power supply area near the power pipe end, be provided with negative pole input power supply area away from the power pipe end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075799 CN203119779U (en) | 2013-02-18 | 2013-02-18 | Inverter control power board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320075799 CN203119779U (en) | 2013-02-18 | 2013-02-18 | Inverter control power board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203119779U true CN203119779U (en) | 2013-08-07 |
Family
ID=48900092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320075799 Expired - Lifetime CN203119779U (en) | 2013-02-18 | 2013-02-18 | Inverter control power board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203119779U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110401397A (en) * | 2018-04-25 | 2019-11-01 | 日本电产艾莱希斯株式会社 | Control device for inverter |
-
2013
- 2013-02-18 CN CN 201320075799 patent/CN203119779U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110401397A (en) * | 2018-04-25 | 2019-11-01 | 日本电产艾莱希斯株式会社 | Control device for inverter |
| CN110401397B (en) * | 2018-04-25 | 2023-06-16 | 日本电产艾莱希斯株式会社 | Inverter control device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |