CN203119289U - Laser equipment and optical module - Google Patents
Laser equipment and optical module Download PDFInfo
- Publication number
- CN203119289U CN203119289U CN 201220747949 CN201220747949U CN203119289U CN 203119289 U CN203119289 U CN 203119289U CN 201220747949 CN201220747949 CN 201220747949 CN 201220747949 U CN201220747949 U CN 201220747949U CN 203119289 U CN203119289 U CN 203119289U
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- box body
- heat
- laser equipment
- block
- laser
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Abstract
The utility model discloses laser equipment and an optical module. The laser equipment comprises a box body, a heat conducting block, a refrigeration assembly and a laser assembly, wherein the refrigeration assembly and the laser assembly are arranged in the box body; the box body is provided with a first opening; the heat conducting block penetrates through the first opening from the box body and extends out of the box body; and the refrigeration assembly is thermally coupled to the heat conducting part and the laser assembly which are located in the box body. According to the mode disclosed by the utility model, the temperature inside the laser equipment can be effectively reduced when the laser equipment is in operation.
Description
Technical field
The utility model relates to the semi-conductor laser equipment technical field, particularly relates to a kind of laser equipment and optical module.
Background technology
Laser equipment is the device that utilizes the stimulated radiation principle that light is amplified in the material that some is stimulated or vibrate and launch.Laser equipment is widely used in the optical communication, is used for the signal of telecommunication is changed into light signal, perhaps, light signal is changed into the signal of telecommunication.
At present, Chang Yong laser equipment comprises coaxial laser equipment and dish (Butterfly) laser equipment that adopts TO (Transistor-Outline is commonly called as coaxial shape) encapsulation.The coaxial laser equipment of TO encapsulation is owing to adopt the TO encapsulating structure, have with low cost, characteristics of producing easily.But generate heat easily during the coaxial laser equipment work of TO encapsulation, and the good radiating mode of coaxial laser equipment neither one of TO encapsulation.The coaxial laser equipment of TO encapsulation constantly gathers heat in the course of work, make the coaxial laser equipment of TO encapsulation be operated under the higher temperature, thereby influence the service behaviour of the coaxial laser equipment of TO encapsulation, such as: power output occurs and reduce, wave length shift, noise become defective such as big.
The utility model content
The technical problem that the utility model execution mode mainly solves provides a kind of laser equipment and optical module, in the time of can effectively reducing laser equipment work, and the laser equipment temperature inside.
First aspect provides a kind of laser equipment, comprises that laser equipment comprises box body, heat-conducting block and is arranged at box body interior cooling assembly and laser module; Box body is provided with first perforate; Heat-conducting block passes first perforate in box body, and extends to outside the box body; Cooling assembly respectively with the heat-conducting block part that is positioned at box body and laser module thermal coupling.
In conjunction with the first aspect implementation, in first kind of possibility implementation of first aspect, laser equipment also comprises radiating block; Radiating block and heat-conducting block stretch out an end thermal coupling of box body.
In first kind of possibility implementation in conjunction with first aspect, in second kind of possibility implementation of first aspect, radiating block is provided with an opening; Heat-conducting block stretches out an end of box body and inserts in the opening, and be connected with radiating block.
In conjunction with second kind of possibility implementation of first aspect, in the third possibility implementation of first aspect, laser equipment also comprises heat-conducting glue; Heat-conducting glue is arranged between radiating block and the heat-conducting block.
In conjunction with the first aspect implementation, in the 4th kind of possibility implementation of first aspect, laser equipment also comprises link block; Link block comprises connecting circuit and ceramic pin; Connecting circuit comprises internal interface and external interface; Box body also comprises second perforate; Link block is passed second perforate, and internal interface is exposed in the box body, and external interface is exposed to outside the box body; Internal interface connects laser module, and external interface connects input signal.
In the 4th kind of possibility implementation in conjunction with first aspect, in the 5th kind of possibility implementation of first aspect, connecting circuit is embedded in ceramic pin, and one-body molded with ceramic pin.
In the 5th kind of possibility implementation in conjunction with first aspect, in the 6th kind of possibility implementation of first aspect, laser module comprises laser equipment chip, back light detector, thermistor and heat sink; Heat sink upper surface carrying laser equipment chip, back light detector and thermistor, heat sink lower surface is attached at cooling assembly; The quantity of internal interface has a plurality of, is connected with laser equipment chip, back light detector and thermistor respectively.
In the 4th kind of possibility implementation in conjunction with first aspect, in the 7th kind of possibility implementation of first aspect, box body comprises base; First perforate and second perforate all are arranged at base.
Second aspect provides a kind of optical module, and optical module comprises shell, following shell, radiating block and laser equipment; Laser equipment comprises box body, heat-conducting block and is arranged at box body interior cooling assembly and laser module; Box body is provided with first perforate; Heat-conducting block passes first perforate, and the end that heat-conducting block stretches out box body is connected with radiating block; Last shell and following shell grip radiating block; Cooling assembly and partly thermal coupling, laser module and cooling assembly thermal coupling of the heat-conducting block that is positioned at box body.
In conjunction with the implementation of second aspect, in first kind of possibility implementation of second aspect,, radiating block is provided with an opening; Heat-conducting block stretches out an end of box body and inserts in the opening, and is connected with radiating block.
The beneficial effect of the utility model execution mode is: laser module is arranged on the cooling assembly, and cooling assembly is arranged on the other end of heat-conducting block, an end of heat-conducting block extend to box body outside.When laser equipment was worked, the heat that laser module produces was transferred to cooling assembly, and cooling assembly is pumped heat to heat-conducting block, and heat and distributes outside box body outside heat-conducting block is transferred to box body, has reduced the laser equipment temperature inside effectively.
Description of drawings
In order to be illustrated more clearly in embodiment of the present invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in execution mode or the description of the Prior Art below, apparently, accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic perspective view of the utility model laser equipment first execution mode;
Fig. 2 is the schematic cross-section of laser equipment shown in Figure 1;
Fig. 3 is the part schematic cross-section of laser equipment shown in Figure 1;
Fig. 4 is the schematic perspective view of the utility model laser equipment second execution mode;
Fig. 5 is the schematic cross-section of laser equipment shown in Figure 4;
Fig. 6 is the part schematic cross-section of laser equipment shown in Figure 4;
Fig. 7 is the laser module structural representation in the utility model laser equipment second execution mode;
Fig. 8 is the schematic perspective view of a kind of execution mode of the utility model optical module;
Fig. 9 is the schematic cross-section of optical module shown in Figure 8.
Embodiment
See also Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is the schematic perspective view of the utility model laser equipment first execution mode, and Fig. 2 is the schematic cross-section of laser equipment shown in Figure 1, and Fig. 3 is the part schematic cross-section of laser equipment shown in Figure 1.As shown in the figure, described laser equipment 10 comprises box body 11, heat-conducting block 14 and is arranged at cooling assembly 12 and laser module 13 in the box body 11.Box body 11 comprises the cap 112 of base 111 and band lens.
Be positioned at heat-conducting block 14 parts and cooling assembly 12 thermal couplings of box body 11, cooling assembly 12 and laser module 13 thermal couplings, particularly, the lower surface of cooling assembly 12 is smooth in heat-conducting block 14 parts that are positioned at box body, and the lower surface of laser module 13 is smooth in the upper surface of cooling assembly 12.
Further, cooling assembly 12 can have default maximum temperature, when the temperature value that detects laser module 13 when cooling assembly 12 surpasses default maximum temperature, cooling assembly 12 starts, the transfer of heat that produces during with laser module 13 work is to heat-conducting block 14, heat transmits outside the box bodys 11 along heat-conducting block 14, and distributes outside box body 11, thereby reduces laser equipment 10 temperature inside.
It should be noted that, the structure of laser equipment 10 such as above-mentioned description, but the assembling mode of laser equipment 10 is as follows: make heat-conducting block 14 pass first perforate 1111 of base 111 earlier, weld together by high-temperature solder between the inwall of first perforate 1111 of heat-conducting block 14 and base 111, and form sealing; Be reference plane with base 111, band laser module 13 is smooth in the part of the heat-conducting block 14 that is positioned at box body 11, and the accurate position of the light-emitting window of the laser equipment chip (not shown) in definite laser module 13; Lens in the cap 112 of band lens are aimed at the light-emitting window of laser equipment chip, will be encapsulated with cap 112 and the base 111 of lens again, thereby finish the assembling of laser equipment 10.
In the utility model execution mode, by heat-conducting block 14 is passed box body 11, cooling assembly 12 and the part thermal coupling that is positioned at the heat-conducting block 14 of box body 11, further, cooling assembly 12 and laser module 13 thermal couplings, thus form one by the heat dissipation channel to box body 11 in the box body 11.When laser equipment 10 work, the heat that laser module 11 produces is transferred to cooling assembly 12, and to heat-conducting block 14, heat is outside heat-conducting block 14 is transferred to box body 11 to cooling assembly 12 with transfer of heat, heat is distributed outside box body 11, thereby reduced laser equipment 10 temperature inside effectively.
See also Fig. 4, Fig. 5, Fig. 6 and Fig. 7, Fig. 4 is the schematic perspective view of the utility model laser equipment second execution mode, Fig. 5 is the schematic cross-section of laser equipment shown in Figure 4, Fig. 6 is the part schematic cross-section of laser equipment shown in Figure 4, and Fig. 7 is the laser module structural representation in the utility model laser equipment second execution mode.As shown in the figure, described laser equipment 20 comprises box body 21, heat-conducting block 24 and is arranged at cooling assembly 22 and laser module 23 in the box body 21.Box body 21 comprises the cap 212 of base 211 and band lens.That laser module 23 comprises is heat sink 231, thermistor 232, laser equipment chip 233 and back light detector 234.
The cap 212 of band lens is covered on base 211, forms box body 21.Base 211 is provided with first perforate 2111, and certainly, first perforate 2111 also can be arranged at the side 2121 of the cap 212 of band lens.Heat-conducting block 24 passes first perforate 2111 in box body 21, and extends to outside the box body 21.Weld together by high-temperature solder between the inwall of first perforate 2111 of heat-conducting block 24 and base 211, and form sealing.The material of heat-conducting block 24 is heat-conducting effect material preferably, for example: casting glue, silicone grease, silica gel sheet, phase-change material and gel etc.
Need to prove: cooling assembly 22 can have default working temperature, the temperature value that detects laser module 23 when cooling assembly 22 surpasses default working temperature, cooling assembly 22 starts starts working, the transfer of heat that produces during with laser module 23 work is to heat-conducting block 24, heat is outside heat-conducting block 24 transmission box bodys 21, and distribute outside box body 21, thereby reduce laser equipment 20 temperature inside.
Further, laser equipment 20 also comprises radiating block 25, link block 26 and line (not shown).Link block 26 comprises connecting circuit 261 and ceramic pin 262.Connecting circuit 27 comprises internal interface 2612 and external interface 2611.The quantity of internal interface 2612 and external interface 2611 is a plurality of.
Connecting circuit 261 is arranged on the ceramic pin 262, and connecting circuit 261 is to be embedded on the ceramic pin 262 by ceramic metalizing process, and is one-body molded with ceramic pin 262.Link block 26 is passed second perforate 2112, and internal interface 2612 is exposed in the box body 21, and external interface 2611 is exposed to outside the box body 21.Internal interface 2612 is connected with thermistor 232, laser equipment chip 233 and back light detector 234 respectively by line, and external interface 2611 receives input signal, such as: power supply signal, control signal etc.Pottery pin 262 is made by ceramic lamination techniques.Wherein, if first perforate 2111 and second perforate 2112 form than large opening for being connected, after then link block 26 superposes with heat-conducting block 24, pass this together than large opening, by high-temperature solder, that link block 26, heat-conducting block 24 and this inwall welding than large opening is fixing then.
In the utility model execution mode, by heat-conducting block 24 is passed box body 21, being positioned at box body 21 outer heat-conducting block 24 parts is connected with radiating block 25, be positioned at the part and cooling assembly 22 thermal couplings of the heat-conducting block 24 of box body 21, cooling assembly 22 and laser module 23 thermal couplings, thus form one by the heat dissipation channel to box body 21 in the box body 21.When laser equipment 20 work, the heat that laser module 23 produces is transferred to cooling assembly 23, cooling assembly 23 is pumped heat to heat-conducting block 24, the radiating block 25 of heat outside heat-conducting block 24 is transferred to box body 21, radiating block 25 distributes heat outside box body 21, thereby has reduced laser equipment 20 temperature inside effectively.
See also Fig. 8 and Fig. 9, the structural representation of a kind of embodiment of optical module that it provides for the utility model.Optical module 30 comprises shell 31, following shell 32, radiating block 33 and laser equipment 34.Laser equipment 34 comprises box body 341, heat-conducting block 342 and is arranged at cooling assembly 343 and laser module 344 in the box body 341.
Be positioned at heat-conducting block 342 parts and cooling assembly 343 thermal couplings of box body 341, laser module 344 and cooling assembly 343 thermal couplings, particularly, the lower surface of cooling assembly 343 is smooth in heat-conducting block 343 parts that are positioned at box body 341, and the lower surface of laser module 344 is smooth in the upper surface of cooling assembly 343.
The material of heat-conducting block 342 is for being heat-conducting effect material preferably, for example: casting glue, silicone grease, silica gel sheet, phase-change material and gel etc.
In the utility model execution mode, by heat-conducting block 342 is passed box body 341, being positioned at box body 341 outer heat-conducting block 342 parts is connected with radiating block 33, be positioned at the part and cooling assembly 343 thermal couplings of the heat-conducting block 342 of box body 341, cooling assembly 343 and laser module 344 thermal couplings, thus form one by the heat dissipation channel to box body 342 in the box body 341.When laser equipment 30 work, the heat that laser module 344 produces is transferred to cooling assembly 343, cooling assembly 343 arrives heat-conducting block 342 with transfer of heat, the radiating block 33 of heat outside heat-conducting block 342 is transferred to box body 341, radiating block 33 distributes heat outside box body 341, thereby has reduced laser equipment 30 temperature inside effectively.
The above only is execution mode of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (10)
1. a laser equipment is characterized in that,
Described laser equipment comprises box body, heat-conducting block and is arranged at box body interior cooling assembly and laser module;
Described box body is provided with first perforate;
Described heat-conducting block passes described first perforate in box body, and extends to outside the described box body;
Described cooling assembly respectively with the described heat-conducting block part and the described laser module thermal coupling that are positioned at box body.
2. laser equipment according to claim 1 is characterized in that,
Described laser equipment also comprises radiating block;
Described radiating block and described heat-conducting block stretch out an end thermal coupling of box body.
3. laser equipment according to claim 2 is characterized in that,
Described radiating block is provided with an opening;
Described heat-conducting block stretches out an end of box body and inserts in the described opening, and is connected with described radiating block.
4. laser equipment according to claim 3 is characterized in that,
Described laser equipment also comprises heat-conducting glue;
Described heat-conducting glue is arranged between described radiating block and the described heat-conducting block.
5. laser equipment according to claim 1 is characterized in that,
Described laser equipment also comprises link block; Described link block comprises connecting circuit and ceramic pin;
Described connecting circuit comprises internal interface and external interface;
Described box body also comprises second perforate;
Described link block is passed described second perforate, and described internal interface is exposed in the described box body, and described external interface is exposed to outside the described box body;
Described internal interface connects laser module, and described external interface connects input signal.
6. laser equipment according to claim 5 is characterized in that,
Described connecting circuit is embedded in described ceramic pin, and one-body molded with described ceramic pin.
7. laser equipment according to claim 6 is characterized in that,
Described laser module comprises laser equipment chip, back light detector, thermistor and heat sink;
Described heat sink upper surface carries described laser equipment chip, described back light detector and described thermistor, and described heat sink lower surface is attached at described cooling assembly;
The quantity of described internal interface has a plurality of, is connected with laser equipment chip, back light detector and thermistor respectively.
8. according to the described laser equipment of claim 5, it is characterized in that,
Described box body comprises base;
Described first perforate and second perforate all are arranged at described base.
9. an optical module is characterized in that,
Described optical module comprises shell, following shell, radiating block and laser equipment;
Described laser equipment comprises box body, heat-conducting block and is arranged at described box body interior cooling assembly and laser module;
Described box body is provided with first perforate;
Described heat-conducting block passes described first perforate, and the end that described heat-conducting block stretches out described box body is connected with described radiating block;
The described shell of going up grips described radiating block with following shell;
Described cooling assembly and partly thermal coupling, described laser module and the described cooling assembly thermal coupling of described heat-conducting block that is positioned at described box body.
10. optical module according to claim 9 is characterized in that,
Described radiating block is provided with an opening;
Described heat-conducting block stretches out an end of described box body and inserts in the described opening, and is connected with described radiating block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220747949 CN203119289U (en) | 2012-12-31 | 2012-12-31 | Laser equipment and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220747949 CN203119289U (en) | 2012-12-31 | 2012-12-31 | Laser equipment and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203119289U true CN203119289U (en) | 2013-08-07 |
Family
ID=48899607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220747949 Expired - Lifetime CN203119289U (en) | 2012-12-31 | 2012-12-31 | Laser equipment and optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203119289U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022439A (en) * | 2014-05-28 | 2014-09-03 | 吴震 | Method of fixing laser diode |
| WO2017143587A1 (en) * | 2016-02-26 | 2017-08-31 | 华为技术有限公司 | Optical assembly packaging structure, optical assembly, optical module and related devices and systems |
| CN108390255A (en) * | 2018-02-22 | 2018-08-10 | 青岛海信宽带多媒体技术有限公司 | Optical secondary module and optical module |
-
2012
- 2012-12-31 CN CN 201220747949 patent/CN203119289U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022439A (en) * | 2014-05-28 | 2014-09-03 | 吴震 | Method of fixing laser diode |
| WO2017143587A1 (en) * | 2016-02-26 | 2017-08-31 | 华为技术有限公司 | Optical assembly packaging structure, optical assembly, optical module and related devices and systems |
| CN108603989A (en) * | 2016-02-26 | 2018-09-28 | 华为技术有限公司 | Optical assembly encapsulating structure, optical assembly, optical module and relevant apparatus and system |
| US10644481B2 (en) | 2016-02-26 | 2020-05-05 | Huawei Technologies Co., Ltd. | Optical component packaging structure, optical component, optical module, and related apparatus and system |
| CN108390255A (en) * | 2018-02-22 | 2018-08-10 | 青岛海信宽带多媒体技术有限公司 | Optical secondary module and optical module |
| US11973311B2 (en) | 2018-02-22 | 2024-04-30 | Hisense Broadband Multimedia Technologies Co., Ltd. | To package for DFB laser with TEC vertically mounted in groove of heatsink |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |
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| CX01 | Expiry of patent term |