CN203072296U - Structure molded by welding heat radiation fin sets - Google Patents
Structure molded by welding heat radiation fin sets Download PDFInfo
- Publication number
- CN203072296U CN203072296U CN 201320035538 CN201320035538U CN203072296U CN 203072296 U CN203072296 U CN 203072296U CN 201320035538 CN201320035538 CN 201320035538 CN 201320035538 U CN201320035538 U CN 201320035538U CN 203072296 U CN203072296 U CN 203072296U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- hole
- scolding tin
- pipe hole
- metal fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiator for electronic products and especially relates to a radiator formed by molding heat radiation fin sets, particularly to a structure molded by welding the heat radiation fin sets. The structure comprises at least more than one metal fins, heat pipe holes and extension parts, wherein each heat pipe hole is in the metal fin and the periphery of the heat pipe hole extends to one side to form the extension part. Each metal fin also comprises a tin soldering hole, and the tin soldering hole is positioned right above the heat pipe hole. A notch is below the tin soldering hole and is corresponding to the extension part formed by extending the periphery of the heat pipe hole to one side. According to the technical scheme, the tin soldering hole is not arranged in the edge of the heat pipe hole and is not overlapped with the extension part formed by extending the periphery of the heat pipe hole to one side, so that the structure is reasonable in design and easy to manufacture. The extension part is provided with the notch, so that solder joints are uniform and the thermal conduction efficiency is raised.
Description
Technical field
The utility model relates to a kind of radiator of electronic product, especially the radiator of radiating fin composing type, particularly radiating fin bond pads shaped structure.
Background technology
The radiating fin composing type structure of prior art is disclosed as: on April 3rd, 2002, the patent No. is ZL01219113.2, Granted publication number is the technical scheme of CN2484643Y, at fin perforation is arranged, one side of perforation is extended with the joint portion, at the upper limb of boring a hole the less pore in an aperture is arranged.Communicate with perforation at the pore described in this scheme, welding wire is placed utilize hot melting mode that radiating fin and heat pipe are welded together to be integral in the pore.
There is following defective in above-mentioned prior art: the one, and structural design is unreasonable, and described pore is positioned at the upper limb of perforation, and a side of perforation is extended with the joint portion, and pore overlaps with the depth extension, and this design has increased difficulty to manufacturing.The 2nd, fin manufacture craft difficulty height.The 3rd, should not control during melting welding, solder joint is inhomogeneous, and heat conduction efficiency reduces.
Summary of the invention
The utility model radiating fin bond pads shaped structure has overcome the defective of above-mentioned prior art, is guaranteeing heat pipe under situation that the fin one is combined, has realized simple in structurely, simple for production, and structural design is more reasonable, has improved the purpose of heat conduction efficiency.
The technical solution of the utility model is: radiating fin bond pads shaped structure, comprise the above metal fins of a slice at least, and the extension that stretches out to a side of the heat pipe hole on described metal fins and heat pipe hole peripheral, it is characterized in that on described metal fins, also comprising a scolding tin hole, described scolding tin hole be positioned at the heat pipe hole directly over, under described scolding tin hole, with described heat pipe hole peripheral jagged to the extension institute corresponding position that a side is stretched out.
Above-mentioned radiating fin bond pads shaped structure, the distance between described scolding tin hole and the heat pipe bore edges is the thickness of a metal fins.
Above-mentioned radiating fin bond pads shaped structure, the distance between described scolding tin hole and the heat pipe bore edges is the thickness of two metal fins.
Above-mentioned radiating fin bond pads shaped structure, the width of described breach is identical with the diameter in described scolding tin hole.
Adopt technical solutions of the utility model, because the scolding tin hole is not arranged on the edge in heat pipe hole, the extension that stretches out to a side with the heat pipe hole peripheral does not overlap, thus reasonable in design, make simple.Be provided with breach at extension, can make solder joint even, improve heat conduction efficiency.
Description of drawings
Fig. 1 is the utility model radiating fin bond pads shaped structure front view.
Fig. 2 is A-A cutaway view shown in Figure 1.
Fig. 3 is B-B cutaway view shown in Figure 1.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further:
Seeing Fig. 1, Fig. 2, shown in Figure 3, is an embodiment of the present utility model.It is a slice metal fins structure shown in the figure.The extension 21 that has heat pipe hole 2 and heat pipe hole 2 peripheries to stretch out to a side in described metal fins 1, described heat pipe hole 2 is used for wearing heat pipe, and described extension 21 is used for increasing the contact area of metal fins and heat pipe to play a part fixing and to improve heat conduction efficiency.On described metal fins 1, also comprise a scolding tin hole 3, described scolding tin hole 3 be positioned at heat pipe hole 2 directly over, this scolding tin hole 3 is non-intersect not tangent with heat pipe hole 2 yet, and certain distance H is arranged between the two, and described distance H is between the thickness of thickness to two metal fins of a metal fins.Under described scolding tin hole 3, jagged 22 to the extension institute corresponding position that a side is stretched out with described heat pipe hole peripheral, best mode is that the width of described breach 22 is identical with the diameter in described scolding tin hole 3.So can make solder joint even, improve heat conduction efficiency.
Claims (4)
1. radiating fin bond pads shaped structure, comprise the above metal fins of a slice at least, and the extension that stretches out to a side of the heat pipe hole on described metal fins and heat pipe hole peripheral, it is characterized in that on described metal fins, also comprising a scolding tin hole, described scolding tin hole be positioned at the heat pipe hole directly over, under described scolding tin hole, with described heat pipe hole peripheral jagged to the extension institute corresponding position that a side is stretched out.
2. radiating fin bond pads shaped structure according to claim 1 is characterized in that the distance between described scolding tin hole and the heat pipe bore edges is the thickness of a metal fins.
3. radiating fin bond pads shaped structure according to claim 1 is characterized in that the distance between described scolding tin hole and the heat pipe bore edges is the thickness of two metal fins.
4. according to claim 1 or 2 or 3 described radiating fin bond pads shaped structures, it is characterized in that the width of described breach is identical with the diameter in described scolding tin hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320035538 CN203072296U (en) | 2013-01-23 | 2013-01-23 | Structure molded by welding heat radiation fin sets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320035538 CN203072296U (en) | 2013-01-23 | 2013-01-23 | Structure molded by welding heat radiation fin sets |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203072296U true CN203072296U (en) | 2013-07-17 |
Family
ID=48771035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320035538 Expired - Fee Related CN203072296U (en) | 2013-01-23 | 2013-01-23 | Structure molded by welding heat radiation fin sets |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203072296U (en) |
-
2013
- 2013-01-23 CN CN 201320035538 patent/CN203072296U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20150123 |
|
| EXPY | Termination of patent right or utility model |