CN203071058U - Anti-warpage packaging substrate - Google Patents
Anti-warpage packaging substrate Download PDFInfo
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- CN203071058U CN203071058U CN 201220703274 CN201220703274U CN203071058U CN 203071058 U CN203071058 U CN 203071058U CN 201220703274 CN201220703274 CN 201220703274 CN 201220703274 U CN201220703274 U CN 201220703274U CN 203071058 U CN203071058 U CN 203071058U
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- packaging
- reinforced
- base plate
- warpage
- substrate body
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Abstract
The utility model discloses an anti-warpage packaging substrate. The anti-warpage packaging substrate comprises a substrate body and a plurality of structure reinforcing components, wherein a metal circuit is arranged on the surface of the substrate body and consists of a plurality of leads; the substrate body is divided into a non-dense area and a dense area according to the area density of the leads; and the structure reinforcing components are arranged in the non-dense area and are insulated and separated from the leads. The structure reinforcing components facilitate the reinforcement of the structure strength of the substrate of which the lead area distribution density is relatively low and the reduction of the probability that the packaging substrate warps during a heating period.
Description
Technical field
The utility model relates to a kind of bearing substrate of encapsulating products, particularly relevant for a kind of anti-warpage base plate for packaging.
Background technology
Now, the semiconductor packages industry development goes out the packaging structure of various different types, to satisfy various demands, manufacture process with BGA Package (BGA) is example, mainly is after substrate is laid chip, with packing colloid chip is coated again, finish packaging body, and at substrate back the tin ball is set, is welded on the tellite for packaging body is follow-up, to be connected with circuit on the tellite.
When carrying out the base plate for packaging configuration, can't keep average wiring density usually, the regional metal distribution circuit that has is intensive, and some places then circuit are very sparse.In encapsulation process, the deviation situation of so regional line density after heating (for example baking drying, resin solidification, gluing fixed chip, routing or sealing injection molding), can cause the base plate for packaging warpage (warpage) that deforms easily.Produce on the line in the encapsulation of automation, base plate for packaging causes chip to be welded to accurately on the pad of base plate for packaging if out-of-flatness will certainly influence the precision that chip is located, and causes yield to descend.Therefore, present encapsulation dealer is also more and more higher for the requirement of the anti-warpage of base plate for packaging
Because base plate for packaging in the past is after the wiring of finishing signal conductor and peripheral pin pad, usually because the skewness of density metal, cause base plate for packaging follow-up carry out required heat treated after, produce warpage, existing improvement mode is to allow base plate for packaging form copper face boring in large area, producing the effect as grid, and then too high density metal is reduced.Yet if when running into chip characteristics and needing large-area solid copper face as the situation of ground plane, aforesaid mesh design just can't be used, thereby still needs to produce in the face of encapsulation base plate for packaging later the problem of warpage.
So, be necessary to provide a kind of anti-warpage base plate for packaging, to solve the existing in prior technology problem.
The utility model content
Main purpose of the present utility model is to provide a kind of anti-warpage base plate for packaging, and it arranges structure-reinforced between the lower lead of the lip-deep area distributions density of substrate body, to increase board structure intensity herein, lowers the possibility that warpage takes place.
For reaching aforementioned purpose, the utility model one embodiment provides a kind of anti-warpage base plate for packaging, and described anti-warpage base plate for packaging comprises: a substrate body, and its surface is provided with metallic circuit, be made of many leads, described metallic circuit is divided into Shu Qu and Mi Qu according to the area density of lead; And a plurality of structure-reinforced, separate between the adjacent wires in the described thin district in place that arranges and with described wire insulation.
Since substrate body the structural strength in the lower zone of wire glass distribution density relatively a little less than, produce the difference of certain structural strength with the higher zone of density, cause the warping phenomenon because of the initiation of expanding with heat and contract with cold easily, between the adjacent wires in described structure-reinforced the described thin district in place that is intervally arranged, help to increase the lower board structure intensity of wire glass distribution density, equalization whole base plate main body structure intensity, and then lower the possibility that warpage during heating takes place base plate for packaging.
Description of drawings
Fig. 1 is the structural plan schematic diagram of the anti-warpage base plate for packaging of the utility model one embodiment.
Fig. 2 is the local enlarged diagram of Fig. 1.
Fig. 3 is structure-reinforced structural representation between two leads of the utility model one embodiment.
Fig. 4 is structure-reinforced structural representation between two leads of another embodiment of the utility model.
Fig. 4 A is the schematic diagram of warp direction of substrate body of the anti-warpage base plate for packaging of the utility model one embodiment.
Fig. 5 is structure-reinforced structural representation between two leads of the another embodiment of the utility model.
Fig. 6 is structure-reinforced structural representation between two leads of the another embodiment of the utility model.
Embodiment
For allowing the utility model above-mentioned purpose, feature and advantage become apparent, the utility model preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.Moreover, the direction term that the utility model is mentioned, for example " on ", D score, " preceding ", " back ", " left side ", " right side ", " interior ", " outward ", " face inclines " etc., only be the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the utility model, but not in order to limit the utility model.
Please refer to shown in Figure 1ly, Fig. 1 is the structural plan schematic diagram of the anti-warpage base plate for packaging of the utility model one embodiment.The anti-warpage base plate for packaging that the utility model discloses comprises a substrate body 100, a metallic circuit and a plurality of structure-reinforced 30.
Described substrate body 100 mainly refers to the slim organic multilayer printed circuit board (PCB) made for main body by macromolecule resin or composite material (for example epoxy resin and glass fibre), in the utility model one embodiment, described substrate body 100 is the small-sized multilayer board of an encapsulation grade, and can constitute its insulating barrier earlier by glass fibre and epoxy resin, alternately be piled up by insulating barrier and circuit layer again and form.
Described metallic circuit is made of many leads 20, and it is located at the surface of described substrate body 100, and can be subjected to an insulating barrier (not shown) covering protection.Described lead 20 for example is the circuit that copper, iron, aluminium, nickel, zinc or its alloy constitute.Described metallic circuit is divided at least one thin district 100A and at least one close district 100B according to the area density of described lead 20, the spacing of also ascending the throne between the described lead 20 of described thin district 100A is bigger, or says that described metallic circuit has bigger total distributed area at the lead 20 of described close district 100B with respect to the lead 20 at described thin district 100A.
Further with reference to shown in Figure 2, described a plurality of structure-reinforced 30 is arranged in the described thin district 100A and insulate with described lead 20 and separate.Moreover described structure-reinforced 30 can form in described substrate body 100 surfaces with existing line technology with the time with described metallic circuit, and be subjected to aforesaid insulating barrier covering protection together.Described structure-reinforced 30 for example is the metal pattern that copper, iron, aluminium, nickel, zinc or its alloy constitute.
As shown in Figure 2, in one embodiment, described structure-reinforced 30 is to be arranged between the adjacent wires 20, and for example is to arrange with the length direction rule contraposition that is parallel to described substrate body 100 along vertical.Moreover, described structure-reinforced 30 width can decide according to the spacing between two leads 20 and structure-reinforced 30 predetermined quantity, in one embodiment, for example described structure-reinforced 30 width is D, D=S-(N+1) * d/N then, wherein S is the spacing between the two adjacent described leads 20; N is structure-reinforced 30 quantity required on the vertical range line of two adjacent described leads 20; D is described structure-reinforced 30 minimum spacing that technology can realize that arranges.Described structure-reinforced 30 technology that arranges can be for example for using the patterning photoresist film to electroplate the pattern metal circuit of making.
Described structure-reinforced 30 can be irregular or has given shape, when having given shape, can be as Fig. 3, Fig. 4, Fig. 5 and shown in Figure 6, and described structure-reinforced 30 for example is square, rhombus, circle or triangle etc. metal pattern.When described structure-reinforced 30 when being shaped as rhombus, its shaping angle can be by the structures shape of described substrate body 100, for example, shown in Fig. 4 and Fig. 4 A, when described substrate body 100 has the predetermined warp direction P direction of warpage (that is take place easily), since described structure-reinforced 30 preferable in its anti-pull ability than the long-diagonal direction, therefore described structure-reinforced 30 direction than long-diagonal can be consistent with the warp direction P of described substrate body 100, described structure-reinforced 30 direction than short diagonal and then can be with the warp direction P of described substrate body 100 and be vertical.Described warp direction P may be perpendicular to the bearing of trend of described lead 20, but also may be parallel to the bearing of trend of described lead 20, or accompanies the angles less than 90 degree with the bearing of trend of described lead 20.In one embodiment, described warp direction P may be consistent with the length and width direction of described substrate body 100.
In another embodiment, at least two described structure-reinforced 30 adjacent shapes can be complementary or opposite corresponding relation, for example, in Fig. 6, described structure-reinforced 30 triangle that is shaped as, wherein laterally the shape of adjacent two described structure-reinforced 30A, 30B turns upside down, in other embodiments, also can be vertical two adjacent described structure-reinforced shapes and turn upside down, or be laterally to reach vertical two adjacent described structure-reinforced shapes all to turn upside down.So also be conducive to equalization integral body in the anti-warpage ability of different angles, dwindle the difference on the structural strength between each zone.
Or, in one embodiment, described structure-reinforced 30 rectangle that is shaped as, its length and width direction is consistent with the length and width direction of described substrate body 100, so also can increase the structural strength that warpage takes place at long side direction substrate body 100 easily.
In sum, the deficiency that causes the anti-warpage ability in heating process compared to existing base plate for packaging because the metallic circuit area distributions is uneven, anti-warpage base plate for packaging of the present utility model mainly is can increase structure-reinforced of substrate body structural strength by arranging in the lower thin zone of wire glass distribution density, reach the purpose that promotes anti-warpage ability, this since substrate body the structural strength in the lower zone of wire glass distribution density relatively a little less than, produce the difference of certain structural strength with the higher zone of density, cause the warping phenomenon because of the initiation of expanding with heat and contract with cold easily, therefore in described structure-reinforced the described thin district in place that is intervally arranged, particularly be distributed between the adjacent lead, can help to increase the lower board structure intensity of wire glass distribution density, equalization whole base plate main body structure intensity, and then lower base plate for packaging in the possibility of heating process generation warpage.
The utility model is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present utility model.Must be pointed out that disclosed embodiment does not limit scope of the present utility model.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in the scope of the present utility model.
Claims (10)
1. anti-warpage base plate for packaging, it is characterized in that: described anti-warpage base plate for packaging comprises:
One substrate body;
One metallic circuit, it is located at the surface of described substrate body, and is made of many leads, and described metallic circuit is divided at least one thin district and at least one Mi Qu according to the area density of described lead; And
A plurality of structure-reinforced, be arranged in the described thin district and with described wire insulation and separate.
2. anti-warpage base plate for packaging as claimed in claim 1 is characterized in that: described structure-reinforced the metal pattern for copper, iron, aluminium, nickel, zinc or its alloy formation.
3. anti-warpage base plate for packaging as claimed in claim 2 is characterized in that: the length direction rule contraposition vertical and that be parallel to described substrate body of described structure-reinforced edge is arranged.
4. anti-warpage base plate for packaging as claimed in claim 1, it is characterized in that: described structure-reinforced being shaped as is square or circular.
5. anti-warpage base plate for packaging as claimed in claim 1, it is characterized in that: described metallic circuit has bigger total distributed area at the lead of described Mi Qu with respect to the lead in described thin district.
6. anti-warpage base plate for packaging as claimed in claim 1 is characterized in that: described substrate body has a predetermined warp direction; Described structure-reinforced the rhombus that is shaped as, described rhombus one consistent with the warp direction of described substrate body than the direction of long-diagonal.
7. anti-warpage base plate for packaging as claimed in claim 1 is characterized in that: described structure-reinforced the triangle that is shaped as, wherein at least two described structure-reinforced adjacent shapes turn upside down.
8. anti-warpage base plate for packaging as claimed in claim 7 is characterized in that: laterally reach vertical two adjacent described structure-reinforced shapes and all turn upside down.
9. anti-warpage base plate for packaging as claimed in claim 1 is characterized in that: described structure-reinforced the rectangle that is shaped as, and described structure-reinforced length and width direction is consistent with the length and width direction of described substrate body.
10. anti-warpage base plate for packaging as claimed in claim 1, it is characterized in that: described substrate body is made by epoxy resin and glass fibre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220703274 CN203071058U (en) | 2012-12-18 | 2012-12-18 | Anti-warpage packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220703274 CN203071058U (en) | 2012-12-18 | 2012-12-18 | Anti-warpage packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203071058U true CN203071058U (en) | 2013-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220703274 Expired - Fee Related CN203071058U (en) | 2012-12-18 | 2012-12-18 | Anti-warpage packaging substrate |
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| CN (1) | CN203071058U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050475A (en) * | 2012-12-18 | 2013-04-17 | 苏州日月新半导体有限公司 | Anti-warping packaging substrate |
| CN105512360A (en) * | 2015-11-24 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Method for predicting warping after etching of package substrate |
-
2012
- 2012-12-18 CN CN 201220703274 patent/CN203071058U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050475A (en) * | 2012-12-18 | 2013-04-17 | 苏州日月新半导体有限公司 | Anti-warping packaging substrate |
| CN103050475B (en) * | 2012-12-18 | 2015-10-14 | 苏州日月新半导体有限公司 | Anti-warping packaging substrate |
| CN105512360A (en) * | 2015-11-24 | 2016-04-20 | 广州兴森快捷电路科技有限公司 | Method for predicting warping after etching of package substrate |
| CN105512360B (en) * | 2015-11-24 | 2018-11-23 | 广州兴森快捷电路科技有限公司 | The method for predicting warpage after package substrate etches |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20201218 |
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| CF01 | Termination of patent right due to non-payment of annual fee |