CN203065621U - Non-full-contact conductive roller wheel - Google Patents
Non-full-contact conductive roller wheel Download PDFInfo
- Publication number
- CN203065621U CN203065621U CN 201220740715 CN201220740715U CN203065621U CN 203065621 U CN203065621 U CN 203065621U CN 201220740715 CN201220740715 CN 201220740715 CN 201220740715 U CN201220740715 U CN 201220740715U CN 203065621 U CN203065621 U CN 203065621U
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- China
- Prior art keywords
- electroplated
- roller
- contact block
- full
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 claims description 54
- 239000004020 conductor Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 abstract 3
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241000272165 Charadriidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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Abstract
The utility model relates to a non-full-contact conductive roller wheel and belongs to the field of electronic information equipment. The non-full-contact conductive roller wheel comprises a roller wheel, wherein the roller wheel is used for an integrated circuit (IC) card encapsulation frame to be electroplated to pass through; and the roller wheel is connected with the negative electrode of a rectifier. The non-full-contact conductive roller wheel is characterized in that wide conductive contact blocks (3) and narrow conductive contact blocks (4) are distributed on the roller wheel (1) at intervals; and the wide conductive contact blocks (3) and the narrow conductive contact blocks (4) are arranged at the position corresponding to an electric lead on the edge of the IC card encapsulation frame to be electroplated. The non-full-contact conductive roller wheel only contacts with the lead part outside the IC card encapsulation frame to be electroplated, so the contacting surface is prevented from being worn and scratched.
Description
Technical field
A kind of non-full-contact conductive roller belongs to the electronic message unit field.
Background technology
The present full-contact metallic conduction roller that adopts at the board of IC packaging frame production line, effect has two: the one, be connected with electroplated IC-card packaging frame contact surface with the rectifier of board, as the tie point of electroplated IC-card packaging frame and rectifier, form the loop.The 2nd, because board is longer, make electroplated IC-card packaging frame obtain a tension force through motor drives metallic conduction roller, guarantee the direction of electroplated IC-card packaging frame.But the metallic conduction roller directly contacts with electroplated IC-card packaging frame all surfaces, because the influence of frictional force is easy to cause electroplated IC-card packaging frame surface is frayed and scratches, and influences electroplated IC-card packaging frame outward appearance.
With reference to accompanying drawing 2, tradition full-contact conductive roller, contact conducting surface 6 be the cylinder outer surface of one, directly contacts with electroplated IC-card packaging frame all surfaces, and full contact roller 5 is easy to when rotating to cause owing to the influence of frictional force electroplated IC-card packaging frame surface is frayed and scratches.
Summary of the invention
The technical problems to be solved in the utility model is: overcome the deficiencies in the prior art, provide a kind of the contact with electroplated IC-card packaging frame point type not cause a kind of non-full-contact conductive roller that frays or scratch.
The technical scheme that its technical problem that solves the utility model adopts is: this non-full-contact conductive roller, comprise be used to the roller that electroplated IC-card packaging frame is passed through, roller links to each other with the negative pole of rectifier, it is characterized in that: described roller is provided with wide conduction contact block and the narrow conduction contact block that distributes alternately, and wide conduction contact block is located at the position corresponding with the conductor wire at electroplated IC-card packaging frame edge with narrow conduction contact block.Roller contacts with the conductor wire at electroplated IC-card packaging frame edge, is electroplated IC-card packaging frame conduction.
Described roller middle part is provided with central shaft, and central shaft is rotating cylinder, and central shaft one end is established base, and roller can be rotated by driven by motor by base; Wide conduction contact block and narrow conduction contact block are the ring texture that fixedly protrudes from the central shaft outside surface, the outside of central shaft is wide conduction contact block, the spacing of wide conduction contact block and adjacent wide conduction contact block is two electroplated IC-card packaging frame length, and adjacent wide conduction contact block and narrow conduction contact block spacing are single electroplated IC-card packaging frame length.
The base of described central shaft one end is the gear base.The gear base can rely on the gear driven of electric motor to rotate, and then drives the roller rotation.
The narrow conduction contact block of non-full contact roller is established 3 ~ 5, and wide conduction contact block is established 4 ~ 6.
The wide conduction contact block that protrudes is that product contacts the effect of playing conduction and fixing with narrow conduction contact block.
Electroplated IC-card packaging frame is the form for not cutting by roller the time, single electroplated IC-card packaging frame is evenly arranged, single electroplated IC-card packaging frame per two is classified one group as, and every group of outward flange has conductor wire, and every group of interior adjacent also has the conductor wire of close together.Evenly arrange between group and the group, at regular intervals.
Electroplated IC-card packaging frame is when entering board and electroplate, need motor-operated non-full-contact conductive roller to rotate to provide tension force to guarantee that the direction of electroplated IC-card packaging frame in board can not be offset, identical with the effect of the original full contact roller of board, different with full contact roller is, full contact roller all contacts conduction with electroplated IC-card packaging frame, non-full-contact conductive roller contacts with the edge lead of electroplated IC-card packaging frame the loop of plating is provided, and the roller after the change does not have influence on the conductive capability of electroplated IC-card packaging frame.The contact area of non-full-contact conductive roller and electroplated IC-card packaging frame diminishes with respect to full contact roller, does not contact fully with roller for the electroplated IC-card packaging frame contact surface part that appearance requirement is arranged.
Compared with prior art, the beneficial effect that a kind of non-full-contact conductive roller of the present utility model has is: non-full-contact conductive roller of the present utility model, contact area is reduced greatly, original most of area that contacts with electroplated IC-card packaging frame is cut out, only contact with lead position beyond the electroplated IC-card packaging frame unit, do not contact with the contact surface that appearance requirement is arranged.Can not cause the contact block surface of appearance requirement to fray and scratch.Non-full-contact conductive roller, contact with the lead at the edge of electroplated IC-card packaging frame, can realize conducting function, through facts have proved, only contact with the edge conductor wire and can satisfy electroplated IC-card packaging frame and normally conduct electricity needs, through repeatedly measuring, can not appear under the normal current and can't obtain normal thickness, can not cause the inhomogeneous problem of distribution of current yet.
Description of drawings
Fig. 1 is a kind of non-full-contact conductive roller structural representation.
Fig. 2 is traditional full-contact conductive roller structural representation.
Wherein: 1, roller 2, central shaft 3, wide conduction contact block 4, narrow conduction contact block 5, full contact roller 6, contact conducting surface.
Embodiment
Fig. 1 is the most preferred embodiment of a kind of non-full-contact conductive roller of the utility model, is described further below in conjunction with 1 pair of the utility model of accompanying drawing.Fig. 1 compares with Fig. 2, and contact area reduces greatly, only is connected with the edge lead of electroplated IC-card packaging frame.
With reference to accompanying drawing 1: a kind of non-full-contact conductive roller of the utility model, for IC-card packaging frame production lines is led the used roller of electroplated IC-card packaging frame, comprise roller 1, roller 1 comprises central shaft 2, article five, wide conduction contact block 3 and four narrow conduction contact blocks 4, central shaft 2 is cylinder, one end is established base, base is the revolving gear base, rotating and then drive roller by motor drives rotates, wide conduction contact block 3 is fixing with narrow conduction contact block 4 and protrudes from the ring texture of central shaft 1 outside surface, wide conduction contact block 3 distributes alternately with narrow conduction contact block 4, the outside of central shaft 2 is wide conduction contact block 3, and wide conduction contact block 3 is single electroplated IC-card packaging frame length with narrow conduction contact block 4 spacings.The outer peripheral conductor wire of wide conduction contact block 3 corresponding contact two adjacent electroplated IC-card packaging frames, the conductor wire between narrow conduction contact block 4 corresponding these adjacent electroplated IC-card packaging frames of contact.
The no base end of roller 1 can be established ring cap, for electroplated IC-card package frame is erected a guide effect.
Roller 1 links to each other with the negative pole of rectifier.Roller is that metal material contacts with the conductor wire at electroplated IC-card packaging frame edge, is electroplated IC-card packaging frame conduction.
Conduction contact block on the roller 1 only is located at the position corresponding with the conductor wire at every row's electroplated IC-card packaging frame edge, and other positions all built on stilts function contact surface with electroplated IC-card packaging frame are contactless.
On the roller 1 narrow conduction contact block can establish 3 ~ 5, wide conduction contact block is established 4 ~ 6.Width before can cutting according to electroplated IC-card packaging frame is decided.
Roller 1 provides powered rotation by the base transmission with electric motor.Move gear interlock transmission between base and electric motor, also transmission belt or chain gear.
Concrete working process is as follows: electroplated IC-card packaging frame is when entering board and electroplate, opening driven by motor roller 1 rotates, two rollers that contact with electroplated IC-card packaging frame contact surface side use non-full-contact conductive roller of the present utility model, and the roller that contacts with face of weld need not to change; Wherein earlier the no base end of a non-full-contact conductive roller of contact electroplated IC-card packaging frame to establish that ring cap comes be electroplated IC-card packaging frame guiding.The base of roller 1 by an end transmits electric motor and provides powered rotation that the required tension force of electroplated IC-card packaging frame is provided and keep the direction of electroplated IC-card packaging frame in board not to be offset, the wide conduction contact block 3 of roller 1 contacts with the edge lead of per two groups of electroplated IC-card packaging frames, and narrow conduction contact block 4 contacts with lead between every group of electroplated IC-card packaging frame.Roller 1 links to each other with the negative pole of rectifier again, and the loop of plating is provided.Electroplate not fraying or scratch under the situation of framework contact surface.
The above, it only is preferred embodiment of the present utility model, be not to be the restriction of the utility model being made other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solutions of the utility model content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solutions of the utility model according to technical spirit of the present utility model.
Claims (3)
1. non-full-contact conductive roller, comprise be used to the roller (1) that electroplated IC-card packaging frame is passed through, roller (1) links to each other with the negative pole of rectifier, it is characterized in that: described roller (1) is provided with wide conduction contact block (3) and the narrow conduction contact block (4) that distributes alternately, and wide conduction contact block (3) is located at the position corresponding with the conductor wire at electroplated IC-card packaging frame edge with narrow conduction contact block (4).
2. a kind of non-full-contact conductive roller according to claim 1, it is characterized in that: described roller (1) middle part is provided with central shaft (2), central shaft (2) is rotating cylinder, and central shaft (2) one ends are established base, and roller (1) can be rotated by driven by motor by base; Wide conduction contact block (3) is the ring texture that fixedly protrudes from central shaft (2) outside surface with narrow conduction contact block (4), the outside of central shaft (2) is wide conduction contact block (3), wide conduction contact block (3) is two electroplated IC-card packaging frame length with the spacing of adjacent wide conduction contact block (3), and adjacent wide conduction contact block (3) is single electroplated IC-card packaging frame length with narrow conduction contact block (4) spacing.
3. a kind of non-full-contact conductive roller according to claim 1, it is characterized in that: the base of described central shaft (2) one ends is the gear base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220740715 CN203065621U (en) | 2012-12-30 | 2012-12-30 | Non-full-contact conductive roller wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220740715 CN203065621U (en) | 2012-12-30 | 2012-12-30 | Non-full-contact conductive roller wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203065621U true CN203065621U (en) | 2013-07-17 |
Family
ID=48764433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220740715 Expired - Lifetime CN203065621U (en) | 2012-12-30 | 2012-12-30 | Non-full-contact conductive roller wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203065621U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652731A (en) * | 2021-08-20 | 2021-11-16 | 四川威纳尔特种电子材料有限公司 | Conductive guide wheel device of metal wire and electroplating production line |
-
2012
- 2012-12-30 CN CN 201220740715 patent/CN203065621U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113652731A (en) * | 2021-08-20 | 2021-11-16 | 四川威纳尔特种电子材料有限公司 | Conductive guide wheel device of metal wire and electroplating production line |
| CN113652731B (en) * | 2021-08-20 | 2022-07-29 | 四川威纳尔特种电子材料有限公司 | Conductive guide wheel device of metal wire and electroplating production line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee after: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255086 No. 187, run Avenue, Zibo hi tech Industrial Development Zone, Shandong, China Patentee before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| PP01 | Preservation of patent right |
Effective date of registration: 20160617 Granted publication date: 20130717 |
|
| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20161217 Granted publication date: 20130717 |
|
| PP01 | Preservation of patent right |
Effective date of registration: 20161217 Granted publication date: 20130717 |
|
| PD01 | Discharge of preservation of patent | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20180213 Granted publication date: 20130717 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180726 Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255086 No. 187, Zhong run Avenue, high tech Industrial Development Zone, Zibo, Shandong. Patentee before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Patentee before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130717 |
|
| CX01 | Expiry of patent term |