CN203052384U - Side-entry type LED (light emitting diode) backlight source with integrated heat pipes - Google Patents
Side-entry type LED (light emitting diode) backlight source with integrated heat pipes Download PDFInfo
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- CN203052384U CN203052384U CN2012203106752U CN201220310675U CN203052384U CN 203052384 U CN203052384 U CN 203052384U CN 2012203106752 U CN2012203106752 U CN 2012203106752U CN 201220310675 U CN201220310675 U CN 201220310675U CN 203052384 U CN203052384 U CN 203052384U
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- backlight source
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- backlit source
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Abstract
The utility model discloses a side-entry type LED (light emitting diode) backlight source with integrated heat pipes. The side-entry type LED backlight source comprises an LED array light bar, an LED backlight source substrate and the heat pipes, wherein the LED backlight source substrate is provided with a bulged bar-shaped cavity, and one side along the axial direction of the cavity is provided with an opening; the heat pipe is inserted into the cavity through one end of the cavity; the LED array light bar is arranged on the outer surface of one side of the cavity; and S-shaped flat heat pipes are distributed on the back surface of the LED backlight source substrate. The heat pipes are integrated with the substrate through a tube plate compression-tension jointing process and a low temperature braze welding process, so contact thermal resistance between the heat source and the heat transfer elements can be reduced, the heat radiating area is larger, the temperature of the backlight source can be effectively lowered, the temperature equalization performance of the LED array light bar is greatly improved, the optical performance of LEDs of the backlight source is improved, and the reliability and the stability of the backlight source are strengthened. Besides, the processes are simple and efficient, and the cost is low, so the side-entry type LED backlight source is suitable for industrialized production.
Description
Technical field
The utility model relates to LED-backlit source substrate, relates in particular to a kind of side entering type LED-backlit source with integrated heat pipe.
Background technology
The LED-backlit source owing to its local dimming, advantages such as colour gamut is wide, the life-span is long, energy-conserving and environment-protective are widely used in the back light system of flat-panel monitor.Yet the performance of LED depends on its operating temperature to a great extent, and the too high meeting of operating temperature causes LED brightness reduction, wavelength shift, life-span decay etc.In the course of work, the temperature homogeneity of backlight source module has directly determined its YC uniformity.
Large scale LED-backlit source is because its physical dimension is big, therefore the problem of heat-radiating substrate top and the bottom non-uniform temperature is also very obvious, because factors such as heat radiation cross-ventilation, the temperature on substrate top always is greater than the temperature of bottom, as on the thick substrate of 2mm, nearly 10 ℃ of the temperature difference of substrate top and bottom.
Existing heat dissipation technology is heat abstractor to be set to reduce the temperature of backlight in back, LED-backlit source.The heat abstractor in LED-backlit source is made of certain thickness aluminium base and radiating fin, and radiating fin is evenly distributed on the aluminium base.Usually aluminium base is more thick, and its radiating effect is more good.Usually adopt at present the heat-radiating substrate of 2mm thickness in the industry, but can cause the substrate about 10 ℃ temperature difference up and down like this, this YC uniformity for the LED-backlit source is very disadvantageous.And to guarantee that the substrate upper and lower temperature difference is no more than 2 ℃, the thickness of substrate is at least 10mm.In addition, radiating fin has also taken certain space, thereby has increased thickness and the weight of LCD greatly, does not meet the lightening requirement of LCD.
Summary of the invention
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, and a kind of side entering type LED-backlit source with integrated heat pipe is provided, and the thermal conductivity height improves the heat radiation of LED striation, has promoted the photoelectric properties in LED-backlit source.
The utility model is achieved through the following technical solutions:
A kind of side entering type LED-backlit source with integrated heat pipe, comprise led array striation, LED-backlit source substrate, heat pipe, the shape chamber that has a protruding strip on the substrate of described LED-backlit source, axial side along this shape chamber has an opening, described heat pipe inserts in the shape chamber by an end in shape chamber, described led array striation is arranged on the opposite side outer surface in this shape chamber, and the back side of described LED-backlit source substrate is distributed with snakelike flat hot pipe.
The diameter of described heat pipe is 3mm~8mm, and its inwall is the capillary wick structure of groove array.
Above-mentioned processing method with side entering type LED-backlit source of integrated heat pipe comprises the steps:
(1) presses heaving heat pipe
(1) end of waiting to press bloated heat pipe by the shape chamber is inserted in the shape chamber, be fixed on fixedly in the rectangular enclosure between the fixture block and slip fixture block;
(2) opposite heat tube, LED-backlit source substrate carry out integral body and preheat, heating-up temperature is 200~220 ℃, rotary screw rod promotes the slip fixture block, and the heat pipe of giving prominence in opening outside, shape chamber is flattened, and after the pressing temperature is risen to 270~290 ℃, heat pipe in the shape chamber is expanded, be incubated 1~2 minute, stop heating, cooling is after 2~3 minutes naturally, unclamp the slip fixture block, finish.
(2) the snakelike flat hot pipe of low temperature brazing
(1) process at the back side of LED-backlit source substrate the degree of depth be 0.2mm and with the corresponding groove of snakelike flat hot pipe shape, be used for to place snakelike flat hot pipe;
With sand papering LED-backlit source substrate back, carry out ultrasonic wave again and clean, scavenging period is 3~5 minutes;
(2) ultrasonic wave is carried out on snakelike flat hot pipe surface and clean, the time is 3~5 minutes;
(3) scolder is placed in the groove, coat scaling powder at scolder, and snakelike flat hot pipe correspondingly is placed on the scolder in the groove, again LED-backlit source substrate and snakelike flat hot pipe are put into two clamping plates, by the screw lock clamping plate, make fastening being held within it of LED-backlit source substrate and snakelike flat hot pipe;
(4) LED-backlit source substrate and snakelike flat hot pipe are carried out the integral body heating, heating-up temperature is 190~200 ℃, so that scolder dissolves, finishes the welding of snakelike flat hot pipe and LED-backlit source substrate;
(5) after welding is finished, naturally cool to room temperature, use ultrasonic wave erase residual scaling powder at last;
Above-mentioned scolder is rolling welding wire, and described scaling powder is liquid scaling powder.
The utility model has following advantage and effect with respect to prior art:
The utility model thermal conductivity height can improve the heat radiation of LED striation greatly, promotes the photoelectric properties in LED-backlit source, and technology is with low cost, and technological means is simple and easy to do, is applicable to production in enormous quantities.
Description of drawings
Fig. 1 is the side entering type LED-backlit source overall structure schematic diagram that the utlity model has integrated heat pipe;
Fig. 2 is LED-backlit source structure schematic diagram among Fig. 1;
Fig. 3 is LED-backlit source schematic cross-section;
Fig. 4 is heat pipe 3 schematic cross-sections;
Fig. 5 is by pressing heaving heat pipe technology and being used the anchor clamps schematic diagram;
Fig. 6 is by the snakelike flat hot pipe technology of low temperature brazing and used the anchor clamps schematic diagram.
The specific embodiment
Below in conjunction with specific embodiment the utility model is done further concrete detailed description the in detail.
Embodiment
As shown in Figure 1, the utlity model has the side entering type LED-backlit source of integrated heat pipe, comprise led array striation 1, LED-backlit source substrate 2, heat pipe 3;
As shown in Figure 3.The shape chamber 4 that has a protruding strip on the described LED-backlit source substrate 1 has an opening along the axial side in this shape chamber 4, and described heat pipe 3 inserts in the shape chamber 4 by an end in shape chamber 4, and described led array striation 1 is arranged on the opposite side outer surface in this shape chamber 4;
As shown in Figure 2.The back side of described LED-backlit source substrate 2 is distributed with snakelike flat hot pipe 13.
As shown in Figure 4.The diameter of described heat pipe 3 is 3mm~8mm, and its inwall is the capillary wick structure of groove array.
Have the processing method in the side entering type LED-backlit source of integrated heat pipe, comprise the steps:
(1) presses heaving heat pipe, as shown in Figure 5
(1) end of waiting to press bloated heat pipe 3 by shape chamber 4 is inserted in the shape chamber 4, be fixed on fixedly in the rectangular enclosure between the fixture block 33 and slip fixture block 44;
(2) opposite heat tube 3, LED-backlit source substrate 2 carry out integral body and preheat, heating-up temperature is 200~220 ℃, rotary screw rod 22 promotes slip fixture block 44, and the heat pipe of giving prominence in 4 opening outsides, shape chamber 3 is flattened, and after the pressing temperature is risen to 270~290 ℃, heat pipe 3 in the shape chamber 4 is expanded, be incubated 1~2 minute, stop heating, cooling is after 2~3 minutes naturally, unclamp slip fixture block 44, finish.
(2) the snakelike flat hot pipe of low temperature brazing, as shown in Figure 6
(1) process at the back side of LED-backlit source substrate 2 degree of depth be 0.2mm and with the corresponding groove of snakelike flat hot pipe 13 shapes, be used for to place snakelike flat hot pipe 13;
With substrate 2 back sides, sand papering LED-backlit source, carry out ultrasonic wave again and clean, scavenging period is 3~5 minutes;
(2) ultrasonic wave is carried out on snakelike flat hot pipe 13 surfaces and clean, the time is 3~5 minutes;
(3) scolder is placed in the groove, coat scaling powder at scolder, and snakelike flat hot pipe 13 correspondingly is placed on the scolder in the groove, again LED-backlit source substrate 2 and snakelike flat hot pipe 13 are put into two clamping plates 55, by screw lock clamping plate 55, make LED-backlit source substrate 2 and snakelike flat hot pipe 13 fastening being held within it;
(4) LED-backlit source substrate 2 and snakelike flat hot pipe 13 are carried out the integral body heating, heating-up temperature is 190~200 ℃, so that scolder dissolves, finishes the welding of snakelike flat hot pipe and LED-backlit source substrate 2;
(5) after welding is finished, naturally cool to room temperature, use ultrasonic wave erase residual scaling powder at last;
Described scolder is rolling welding wire, and described scaling powder is liquid scaling powder.
As mentioned above, just can realize the utility model preferably.
Claims (2)
1. side entering type LED-backlit source with integrated heat pipe, it is characterized in that comprising led array striation, LED-backlit source substrate, heat pipe, the shape chamber that has a protruding strip on the substrate of described LED-backlit source, axial side along this shape chamber has an opening, described heat pipe inserts in the shape chamber by an end in shape chamber, described led array striation is arranged on the opposite side outer surface in this shape chamber, and the back side of described LED-backlit source substrate is distributed with snakelike flat hot pipe.
2. the side entering type LED-backlit source with integrated heat pipe according to claim 1 is characterized in that the diameter of described heat pipe is 3mm~8mm, and its inwall is the capillary wick structure of groove array.
Priority Applications (1)
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CN2012203106752U CN203052384U (en) | 2012-06-28 | 2012-06-28 | Side-entry type LED (light emitting diode) backlight source with integrated heat pipes |
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CN2012203106752U CN203052384U (en) | 2012-06-28 | 2012-06-28 | Side-entry type LED (light emitting diode) backlight source with integrated heat pipes |
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CN203052384U true CN203052384U (en) | 2013-07-10 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102748672A (en) * | 2012-06-28 | 2012-10-24 | 华南理工大学 | Lateral LED (Light-emitting Diode) backlight with integrated heat tube and manufacturing method |
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2012
- 2012-06-28 CN CN2012203106752U patent/CN203052384U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102748672A (en) * | 2012-06-28 | 2012-10-24 | 华南理工大学 | Lateral LED (Light-emitting Diode) backlight with integrated heat tube and manufacturing method |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130710 Termination date: 20160628 |