CN201293297Y - Heat radiation metal substrate suitable for high power LED lamp - Google Patents
Heat radiation metal substrate suitable for high power LED lamp Download PDFInfo
- Publication number
- CN201293297Y CN201293297Y CNU2008201472531U CN200820147253U CN201293297Y CN 201293297 Y CN201293297 Y CN 201293297Y CN U2008201472531 U CNU2008201472531 U CN U2008201472531U CN 200820147253 U CN200820147253 U CN 200820147253U CN 201293297 Y CN201293297 Y CN 201293297Y
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- metal substrate
- led lamp
- radiating metal
- heat radiating
- heat radiation
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a heat radiation metal basal plate suitable for high power LED lamp, which mainly consists of a metal basal plate 1, a heat conducting isolation layer 2, a copper coating layer 3 and a high temperature resistant high voltage resistant erosion resistant layer 4; which is characterized in that: the heat conducting isolation layer 2 is disposed on the outer side of the smooth surface 11 of the heat radiation metal basal plate 1; the copper coating layer 3 is disposed out of the heat conducting isolation layer 2; and the high temperature resistant high voltage resistant erosion resistant layer 4 is disposed out of the copper coating layer 3. Wherein, one side of the heat radiation metal basal plate 1 is smooth surface 11, while the other three sides are fins surface 12; and the smooth surface 11 can be a curved surface, a convex surface, concave surface or V-shaped surface. The utility model effectively solves the heat radiation and cost problem of LED lamp.
Description
Technical field
The utility model relates to the LED lamp, especially a kind of heat radiating metal substrate that is applicable to high-powered LED lamp.
Background technology
Along with the progress of science and technology and the development of society, the LED illuminating lamp has obtained unprecedented development, LED is called as the century new light sources, but in actual applications, problems such as difficult heat radiation and cost be higher have been run into, existing LED illuminating lamp adopts mostly LED is welded on 3 millimeters the thin, planar aluminium or copper base, pass through heat-conducting cream again, immovable fitting such as screw or glue is on fin, form by secondary optics change hot spot forms again, exist the processing technology thermal conductivity low, problems such as light loss, the application conditions of high-power LED illuminating lamp is very strict, should constant current can not just can reach satisfied light efficiency by high temperature again, existing traditional handicraft can not effectively solve heat radiation and cost problem with making, and has limited applying of its again.
The utility model content
The purpose of this utility model is a kind of addressing the above problem of development, is applicable to that the Will led light source directly is welded on the heat radiating metal substrate that is applicable to high-powered LED lamp that employing curved surface on the heat radiating metal substrate of LED lamp and abnormity form.
The utility model is mainly by the heat radiating metal substrate, the heat conductive insulating layer, covering copper layer and high temperature high voltage resistant anticorrosive coat forms, it is characterized in that: the heat radiating metal substrate shiny surface outside is the heat conductive insulating layer, the heat conductive insulating layer outside is to cover the copper layer, covering the copper layer outside is the high temperature high voltage resistant anticorrosive coat, wherein, the heat radiating metal substrate is that the one side that forms by the stretch change of (extruding) mould and (extruding) technology that stretches is a shiny surface, three faces are fin faces in addition, shiny surface can be curved, convex, concave panel or V-arrangement face, heat radiating metal substrate also can have the fin grafting of fin to form with special-shaped by special-shaped metal substrate.
When processing heat radiating metal substrate: at first shiny surface is polished and make mirror process, do first insulating barrier of heat conductive insulating layer then in the shiny surface outside, do second insulating barrier of heat conductive insulating layer after the oven dry again, do the 3rd insulating barrier of heat conductive insulating layer after the oven dry again, do the part of welding the LED lamp as required then does and covers the copper layer in the outside of heat conductive insulating layer, and then do the high temperature high voltage resistant anticorrosive coat in the outside of covering the copper layer, form a kind of heat radiating metal substrate with anti-high pressure, high temperature resistant, high solderability.
When using the heat radiating metal substrate, great power LED is welded on makes mould bar or modular unit body on the heat radiating metal substrate, a plurality of mould bars or the modular unit body connection slot tight fit by prior design is assembled into half garden face or curved body, V face body, tread body or the like, when energising work, form illuminator, forming the light multi-angle sends out, reach the aluminium base that omits original technology, heat-conducting cream, processing steps such as secondary optics mirror, solve the light loss problem, the thermal conductivity problem, at the welding LED back side of mould bar or module heat pipe being installed again goes into thermal conductance in the air to dispel the heat once more, make the temperature control of LED lamp under favourable condition of work, can mix reflective mirror change uniformity of light at the gap and the periphery of the LED lamp that welds, spot size effectively solves the heat radiation and the cost problem of LED lamp, reaches purpose of design.
The utlity model has following advantage:
1, via enforcement of the present utility model, effectively solve the heat dissipation problem of high-power LED lamp, good heat dissipation effect, adult is low.
Description of drawings
Below in conjunction with accompanying drawing the utility model is further specified.
Fig. 1 is the structural representation of the utility model embodiment one.
Fig. 2 is the structural representation of the heat radiating metal substrate of the utility model embodiment two.
Fig. 3 is the structural representation of the heat radiating metal substrate of the utility model embodiment three.
Fig. 4 is the structural representation of the heat radiating metal substrate of the utility model embodiment four.
Among the figure, 1 heat radiating metal substrate, 11 shiny surfaces, 12 fin faces, 2 heat conductive insulating layers, 3 cover copper layer, 4 high temperature high voltage resistant anticorrosive coats
The specific embodiment
The utility model shown in the figure mainly by heat radiating metal substrate 1, heat conductive insulating layer 2, cover copper layer 3 and high temperature high voltage resistant anticorrosive coat 4 is formed, it is characterized in that: shiny surface 11 outsides of heat radiating metal substrate 1 are heat conductive insulating layers 2, heat conductive insulating layer 2 outside are to cover copper layer 3, covering copper layer 3 outside is high temperature high voltage resistant anticorrosive coat 4, wherein, heat radiating metal substrate 1 one side is a shiny surface 11, and three faces are fin faces 12 in addition, and shiny surface 11 can be curved, convex, concave panel or V-arrangement face.
In Fig. 1, shiny surface 11 is in the circular surface outside.
In Fig. 2, shiny surface 11 is in the circular surface inboard.
In Fig. 3, shiny surface 11 is in the square surface inboard.
In Fig. 4, shiny surface 11 is in the square surface outside.
The utility model is simple in structure, good heat dissipation effect, and adult is low, is widely used in the heat radiating metal substrate field of high-powered LED lamp.
Claims (3)
1, a kind of heat radiating metal substrate that is applicable to high-powered LED lamp mainly by heat radiating metal substrate (1), heat conductive insulating layer (2), cover copper layer (3) and high temperature high voltage resistant anticorrosive coat (4) is formed, it is characterized in that: (110 outsides are heat conductive insulating layer (2) to the shiny surface of heat radiating metal substrate (1), heat conductive insulating layer (2) outside is to cover copper layer (3), and covering copper layer (3) outside is high temperature high voltage resistant anticorrosive coat (4).
2, a kind of heat radiating metal substrate that is applicable to high-powered LED lamp according to claim 1 is characterized in that described heat radiating metal substrate (1) one side is shiny surface (11), and three faces are fin face (12) in addition.
3, a kind of heat radiating metal substrate that is applicable to high-powered LED lamp according to claim 2 is characterized in that described shiny surface (11) can be curved, convex, concave panel or V-arrangement face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201472531U CN201293297Y (en) | 2008-09-03 | 2008-09-03 | Heat radiation metal substrate suitable for high power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201472531U CN201293297Y (en) | 2008-09-03 | 2008-09-03 | Heat radiation metal substrate suitable for high power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201293297Y true CN201293297Y (en) | 2009-08-19 |
Family
ID=41006776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201472531U Expired - Fee Related CN201293297Y (en) | 2008-09-03 | 2008-09-03 | Heat radiation metal substrate suitable for high power LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201293297Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2467442B (en) * | 2009-02-02 | 2013-08-07 | Goodrich Corp | Thermal management composite heat shield |
| AT14163U1 (en) * | 2014-04-02 | 2015-05-15 | Rxf Solution Gmbh | lighting element |
-
2008
- 2008-09-03 CN CNU2008201472531U patent/CN201293297Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2467442B (en) * | 2009-02-02 | 2013-08-07 | Goodrich Corp | Thermal management composite heat shield |
| US9718447B2 (en) | 2009-02-02 | 2017-08-01 | Goodrich Corporation | Thermal management composite heat shield |
| AT14163U1 (en) * | 2014-04-02 | 2015-05-15 | Rxf Solution Gmbh | lighting element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN SOGOOD OPTOELECTRONIC INDUSTY CO., LTD. Free format text: FORMER OWNER: SHENZHEN SOGOOD GROUP COMPANY Effective date: 20120210 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20120210 Address after: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Aviation Road measurements Sokkia science and Technology Park Comprehensive community building nine Patentee after: ShenZhen SOGOOD Group Company Address before: 518000 Guangdong city of Shenzhen province Baoan District West Township Industrial Park, E A 3 aisuojia type plant Patentee before: ShenZhen SOGOOD Group Company |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20140903 |
|
| EXPY | Termination of patent right or utility model |