CN203038976U - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- CN203038976U CN203038976U CN 201220550115 CN201220550115U CN203038976U CN 203038976 U CN203038976 U CN 203038976U CN 201220550115 CN201220550115 CN 201220550115 CN 201220550115 U CN201220550115 U CN 201220550115U CN 203038976 U CN203038976 U CN 203038976U
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- Prior art keywords
- light
- emitting diode
- hole
- potting resin
- substrate
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- Expired - Lifetime
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- 239000011347 resin Substances 0.000 claims abstract description 70
- 229920005989 resin Polymers 0.000 claims abstract description 70
- 238000005538 encapsulation Methods 0.000 claims description 88
- 238000004382 potting Methods 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003292 glue Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 239000002990 reinforced plastic Substances 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 8
- 238000012536 packaging technology Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 4
- 239000001095 magnesium carbonate Substances 0.000 description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- -1 release cured Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
A light emitting diode comprising: the light emitting diode chip is arranged on the surface of the circuit carrier plate and emits a light source; and the packaging resin is arranged on the LED chip to package the LED chip, wherein the packaging resin has a spherical shape.
Description
Technical field
The utility model is about a kind of light-emitting diode, especially refers to a kind of light-emitting diode with sphere external form potting resin.
Background technology
From the sixties, (Light Emitting Diode, the advantage such as luminous that power consumption LED) is low and long-lasting replace and are used in the daily life throwing light on or purposes such as the indicator light of various electric equipments or light source light-emitting diode gradually.What is more, and light-emitting diode has been applied in large-scale outdoor display billboard or traffic sign towards the development of multicolour and high brightness, shows that its applicable field is very extensive.
Because light-emitting diode needs could be able to use and unlikely being short-circuited under general environment via resin-encapsulated usually, therefore, the structure of potting resin directly influences the light extraction efficiency of this light-emitting diode.Generally speaking, the light emission rate of the light-emitting diode after considering to encapsulate, potting resin forms half ball structure outside light-emitting diode chip for backlight unit, and light-emitting diode can obtain best light emission rate.Yet because considering the light transmittance of potting resin, selected potting resin is difficult to preferably encapsulate this light-emitting diode chip for backlight unit usually under situation about using separately.For solving this problem, known packaged type utilizes a silica gel to form one " enclosure wall " earlier, then usually in the light-emitting diode chip for backlight unit periphery of desire encapsulation, inject this enclosure wall with encapsulation LED with potting resin again, reach the preferably purpose of encapsulation LED chip.Yet because excessive in order to the composition difference of the required composition of the silica gel of making enclosure wall and potting resin, often, formed enclosure wall presents lighttight milky shape, and is very big for the light emission rate influence of this light-emitting diode.In addition, formed potting resin still can't present hemispherical structure in this way, can't make light-emitting diode reach best light emission rate.
Accordingly, development one must not use silica gel to form enclosure wall, and can make potting resin form a hemispherical structure, for the technology of encapsulation LED and the light emission rate that improves light-emitting diode its needs is arranged.
The utility model content
Main purpose of the present utility model is to provide a kind of light-emitting diode, to improve the defective that exists in the known technology.
For achieving the above object, the light-emitting diode that the utility model provides comprises:
One light-emitting diode chip for backlight unit, it is arranged at a circuit support plate surface, and launches a light source; And
One potting resin is arranged on this light-emitting diode chip for backlight unit, and to encapsulate this light-emitting diode chip for backlight unit, wherein, this potting resin has a sphere external form.
Described light-emitting diode, wherein this potting resin, and should be encapsulated template and removed after encapsulation is finished controlling the external form of this potting resin by an encapsulation template.
Described light-emitting diode, wherein this encapsulation template comprises a substrate, it has a upper surface and a lower surface; And at least one through hole, this through hole has cross section in, and is communicated to this lower surface by this upper surface of this substrate.
Described light-emitting diode, wherein this encapsulation template is stainless steel, mould steel, reinforced plastics or aluminium alloy.
Described light-emitting diode, wherein the surface of this encapsulation template has a release layer, and these release series of strata are at least one to be selected from by Teflon, release cured, aluminium oxide, calcium carbonate, magnesium carbonate or its group that forms.
Described light-emitting diode, wherein this through hole is a cylindrical hole or semi-sphere through hole.
Described light-emitting diode, wherein the interior diameter of section of this cylindrical hole is the twice of this substrate thickness.
Described light-emitting diode, wherein this hemisphere face through hole comprises semi-sphere groove and injecting glue groove composition.
Described light-emitting diode, wherein this hemisphere face groove is arranged at the upper surface of this substrate, and this injecting glue groove is arranged at the lower surface of this substrate; Or this hemisphere face groove is arranged at the lower surface of this substrate, and this injecting glue groove is arranged at the upper surface of this substrate.
Described light-emitting diode, wherein this injecting glue groove is a taper external form.
Described light-emitting diode, wherein this encapsulation template comprises at least one exhaust groove, this exhaust groove is connected with this through hole, and is positioned at this lower surface of this substrate.
Described light-emitting diode, wherein this potting resin has the side of a cylindric external form.
In the light-emitting diode that the utility model provides, the potting resin that is used for the encapsulation LED chip need not use silica gel to form the purpose that enclosure wall can reach encapsulation LED, and this potting resin also has the structure of a sphere external form, more can improve the light emission rate of packaged light-emitting diode.
Description of drawings
Figure 1A to 1C is the encapsulation template schematic diagram of the utility model light-emitting diode.
Fig. 2 A to 2D is the LED package schematic flow sheet of the utility model first embodiment.
Fig. 3 A to 3D is the LED package schematic flow sheet of the utility model second embodiment.
Fig. 4 A to 4D is the LED package schematic flow sheet of the utility model the 3rd embodiment.
Fig. 5 A to 5C is the encapsulation template schematic diagram of the utility model light-emitting diode.
Primary clustering symbol description in the accompanying drawing:
Substrate 110,120,120 ';
Upper surface 111,121,121 ';
Lower surface 112,122,122 ';
Cylindrical hole 113,133,153;
Hemisphere face through hole 123,123 ', 143,153 ';
Injecting glue groove 1232,1232 ', 1432;
Light- emitting diode 20,30,40;
Light-emitting diode chip for backlight unit 21,31,41;
Embodiment
An aspect of the present utility model provides a kind of light-emitting diode, comprising: a light-emitting diode chip for backlight unit, and it is arranged at a circuit support plate surface, and launches a light source; And a potting resin, be arranged on this light-emitting diode chip for backlight unit, to encapsulate this light-emitting diode chip for backlight unit, wherein, this potting resin has a sphere external form.And in order to reach the purpose of fixing this potting resin external form, an aspect of the present utility model can be controlled the external form of this potting resin by an encapsulation template, and should encapsulate template and remove after encapsulation is finished.
In the above-mentioned light-emitting diode of the utility model, this encapsulation template can comprise a substrate, and it has a upper surface and a lower surface; And at least one through hole, this through hole has cross section in, and is communicated to this lower surface by this upper surface of this substrate.The utility model is not specially limited the shape of through hole, all can use as long as can reach the through hole that makes potting resin have a sphere external form, and for example, this through hole can be a cylindrical hole or a sphere through hole; In an aspect of the present utility model, this through hole can be a cylindrical hole, and wherein, the interior diameter of section of this cylindrical hole can be the twice of this substrate thickness.Accordingly, the encapsulation template of an aspect can make the potting resin of light-emitting diode have the end face of a sphere external form and the side of a cylindric external form in encapsulation process thus.In another aspect of the present utility model, this through hole then can be the semi-sphere through hole.And for the ease of potting resin being poured in this encapsulation template, this hemisphere face through hole can comprise semi-sphere groove and an injecting glue groove, wherein, the light-emitting diode chip for backlight unit of desire encapsulation can be arranged at this hemisphere face groove, uncured potting resin then can pour into this hemisphere face groove by this injecting glue groove, thereby reaches the purpose of this light-emitting diode of encapsulation.In addition, this injecting glue groove can be a taper external form, so that this uncured potting resin is easy to flow into the hemisphere face groove, and preferably forms a potting resin with hemisphere face external form.
In above-mentioned light-emitting diode of the present utility model, as long as can make the potting resin of light-emitting diode have a sphere external form, the hemisphere face groove that the hemisphere face through hole of this encapsulation template is included and the position of injecting glue groove are not specially limited, for example, in an aspect of the present utility model, this hemisphere face groove can be arranged at the upper surface of this substrate, and this injecting glue groove can be arranged at the lower surface of this substrate; Or in another aspect of the present utility model, this hemisphere face groove can be arranged at the lower surface of this substrate, and this injecting glue groove can be arranged at the upper surface of this substrate, and the utility model is not limited thereto.
In above-mentioned light-emitting diode of the present utility model, in packaging technology, in order to be easy to remove a small amount of gas in the potting resin, this encapsulation template also can comprise at least one exhaust groove, and this exhaust groove can be connected with this through hole, and be positioned at this lower surface of this substrate, be beneficial to remove a small amount of gas in the potting resin, thereby reach the purpose of improving the light-emitting diode light emission rate.
In above-mentioned light-emitting diode of the present utility model, the composition of encapsulation template is not specially limited, as long as its encapsulation template that constitutes can not produce distortion and all can use in packaging technology, for example, this encapsulation template can be by stainless steel, mould steel, reinforced plastics, or aluminium alloy is formed.
In above-mentioned light-emitting diode of the present utility model, for the ease of removing the encapsulation template, the surface of this encapsulation template also can have a release layer, particularly, this release layer can be arranged at this through-hole inner surface, and the composition of this release layer is not specially limited, as long as it can be convenient to make this encapsulation template to be easy to all can use with the potting resin segregator of solidifying, for example, this release layer can at least onely be selected from by Teflon, release cured, aluminium oxide, calcium carbonate, magnesium carbonate or its group that forms.
Accordingly, formed light-emitting diode by the way, it comprises: a light-emitting diode chip for backlight unit, it is arranged at a circuit support plate surface, and launches a light source; An and potting resin, be arranged on this light-emitting diode chip for backlight unit, to encapsulate this light-emitting diode chip for backlight unit, wherein, this potting resin need not use silica gel to form the purpose that enclosure wall can reach encapsulation LED, and this potting resin also has the structure of a sphere external form, more can improve the light emission rate of packaged light-emitting diode.
Below in conjunction with accompanying drawing the utility model is described in detail.
Please refer to Figure 1A to 1C, is the encapsulation template schematic diagram of the utility model light-emitting diode, at first, in order to reach the purpose of this utility model, needs to prepare earlier required encapsulation template 1, shown in Figure 1A.In the utility model, it is the encapsulation template of two kinds of different through hole external forms for example.As shown in Figure 1B, be the cutaway view of the encapsulation template 11 of first embodiment of the present utility model, wherein, this encapsulation template 11 comprises a substrate 110, and it has a upper surface 111 and a lower surface 112; And at least one cylindrical hole 113, this cylindrical hole 113 has cross section 114 in, and is communicated to lower surface 112 by the upper surface 111 of this substrate 110, and the diameter in cross section 114 is the twice of these substrate 110 thickness in being somebody's turn to do.
Shown in Fig. 1 C, be the cutaway view of the encapsulation template 12 of second embodiment of the present utility model, wherein, this encapsulation template 12 comprises a substrate 120, it has a upper surface 121 and a lower surface 122; And at least one hemisphere face through hole 123, this hemisphere face through hole 123 comprises that a hemisphere face groove 1231 and that is arranged at this lower surface 122 is arranged at the injecting glue groove 1232 of this upper surface 121.Accordingly, the encapsulation template of preparing can independently be used in the subsequent embodiment separately, and the external form of control LED package resin reaches the purpose of improving the light-emitting diode light emission rate.
Please refer to Fig. 2 A to 2D, is the LED package schematic flow sheet of the utility model first embodiment, wherein, in the encapsulation flow process, use the external form of the encapsulation template 11 control potting resins of Figure 1B, and this potting resin is the thermohardening type resin.Shown in Fig. 2 A, at first, provide a light emitting diode 2, it comprises a light-emitting diode chip for backlight unit 21 that does not encapsulate as yet, is arranged at a circuit support plate 22 surfaces; Then, shown in Fig. 2 B, to encapsulate template 11 is arranged on this light emitting diode 2, wherein, this light-emitting diode chip for backlight unit 21 is arranged at this cylindrical hole 113 central authorities, in addition, interior cross section 114 diameters of this cylindrical hole 113 are the twice of these substrate 110 thickness, therefore, the angle that makes this light-emitting diode chip for backlight unit 21 extend to 112 of this upper surface 111 and lower surfaces is rendered as 45 degree, to provide this light-emitting diode chip for backlight unit 21 to have best illumination effect, in addition, the utility model can also be looked the demand of use and adjust the angle angle that makes this light-emitting diode chip for backlight unit 21 extend to 112 of this upper surface 111 and lower surfaces arbitrarily; Shown in Fig. 2 C, pour into employed potting resin 23 by the top of cylindrical hole 113, and with this light emitting diode 2 and potting resin 23, together heat to solidify this potting resin 23 together with this encapsulation template 11; At last, shown in Fig. 2 D, after curing is finished, remove this encapsulation template 11, obtain the light-emitting diode 20 that an encapsulation is finished.
Accordingly, above-mentioned the utility model first embodiment provides a light-emitting diode 20, and it comprises: a light-emitting diode chip for backlight unit 21, and it is arranged at a circuit support plate 22 surfaces, and launches a light source; And a potting resin 23, be arranged on this light-emitting diode chip for backlight unit 21, to encapsulate this light-emitting diode chip for backlight unit 21, wherein, this potting resin 23 has the end face of a sphere external form and the side of a cylindric external form.
In above-mentioned light-emitting diode 20 of the present utility model, in packaging technology, in order to be easy to remove a small amount of gas in the potting resin 23, this encapsulation template 11 also can comprise at least one exhaust groove (figure does not show), and this exhaust groove can be connected with this cylindrical hole 113, and be positioned at this lower surface 112 of this substrate 110, be beneficial to remove a small amount of gas in the potting resin 23, thereby reach the purpose of improving light-emitting diode 20 light emission rates; In addition, in above-mentioned light-emitting diode 20 of the present utility model, the composition of encapsulation template 11 is not specially limited, as long as its encapsulation template 11 that constitutes can not produce distortion and all can use in packaging technology, for example, this encapsulation template can be by stainless steel, mould steel, reinforced plastics, or aluminium alloy is formed, in the present embodiment, be to use corrosion resistant plate as encapsulation template 11; In addition, in above-mentioned light-emitting diode 20 of the present utility model, for the ease of removing encapsulation template 11, the surface of this encapsulation template 11 also can have a release layer (figure does not show), particularly, this release layer can be arranged at this cylindrical hole 113 inner surfaces, and the composition of this release layer is not specially limited, as long as it can be convenient to make this encapsulation template to be easy to all can use with the potting resin segregator of solidifying, for example, this release layer can at least onely be selected from by Teflon, release cured, aluminium oxide, calcium carbonate, magnesium carbonate, or its group that forms, in the present embodiment, be to use Teflon as release layer.
Please refer to Fig. 3 A to 3D, is the LED package schematic flow sheet of the utility model second embodiment, wherein, in the encapsulation flow process, use the external form of the encapsulation template 12 control potting resins of Fig. 1 C, and this potting resin is the light-cured type resin.As shown in Figure 3A, at first, provide a light emitting diode 3, it comprises a light-emitting diode chip for backlight unit 31 that does not encapsulate as yet, is arranged at a circuit support plate 32 surfaces; Then, shown in Fig. 3 B, will encapsulate template 12 and be arranged on this light emitting diode 3, wherein, this light-emitting diode chip for backlight unit 31 is arranged at hemisphere face groove 1231 central authorities of this hemisphere face through hole 123; Shown in Fig. 3 C, pour into employed potting resin 33 by injecting glue groove 1232 places, and with this light emitting diode 3 and this potting resin 33, together with this encapsulation template 12 together irradiation to solidify this potting resin 33; At last, shown in Fig. 3 D, after curing is finished, remove this encapsulation template 12, obtain the light-emitting diode 30 that an encapsulation is finished.
Accordingly, above-mentioned the utility model second embodiment provides a light-emitting diode 30, and it comprises: a light-emitting diode chip for backlight unit 31, and it is arranged at a circuit support plate 32 surfaces, and launches a light source; And a potting resin 33, be arranged on this light-emitting diode chip for backlight unit 31, to encapsulate this light-emitting diode chip for backlight unit 31, wherein, this potting resin 33 has the semi-sphere external form.
In above-mentioned light-emitting diode 30 of the present utility model, in packaging technology, in order to be easy to remove a small amount of gas in the potting resin 33, this encapsulation template 12 also can comprise at least one exhaust groove (figure does not show), and this exhaust groove can be connected with the hemisphere face groove 1231 of this hemisphere face through hole 123, and be positioned at this lower surface 122 of this substrate 120, be beneficial to remove a small amount of gas in the potting resin 33, thereby reach the purpose of improving light-emitting diode 30 light emission rates; In addition, in above-mentioned light-emitting diode 30 of the present utility model, the composition of encapsulation template 12 is not specially limited, as long as its encapsulation template 12 that constitutes can not produce distortion and all can use in packaging technology, for example, this encapsulation template can be by stainless steel, mould steel, reinforced plastics, or aluminium alloy is formed, in the present embodiment, be to use the mould steel plate as encapsulation template 12; In addition, in above-mentioned light-emitting diode 30 of the present utility model, for the ease of removing encapsulation template 12, the surface of this encapsulation template 12 also can have a release layer (figure does not show), particularly, this release layer can be arranged at this hemisphere face through hole 123 inner surfaces, and the composition of this release layer is not specially limited, as long as it can be convenient to make this encapsulation template to be easy to all can use with the potting resin segregator of solidifying, for example, this release layer can at least onely be selected from by Teflon, release cured, aluminium oxide, calcium carbonate, magnesium carbonate, or its group that forms, in the present embodiment, be to use release cured as release layer.
Please refer to Fig. 4 A to 4D, is the LED package schematic flow sheet of the utility model the 3rd embodiment.Present embodiment and the 3rd embodiment are roughly the same, institute's difference be in, the hemisphere face groove 1231 ' of employed encapsulation template 12 ' and the position of injecting glue groove 1232 ' are opposite with the encapsulation template 12 of the 3rd embodiment, and employed potting resin is the thermohardening type resin.Accordingly, shown in Fig. 4 A, at first, provide an encapsulation template 12 ', wherein, this encapsulation template 12 ' comprises a substrate 120 ', and it has a upper surface 121 ' and a lower surface 122 '; And at least one hemisphere face through hole 123 ', this hemisphere face through hole 123 ' comprises that a hemisphere face groove 1231 ' and that is arranged at upper surface 121 ' is arranged at the injecting glue groove 1232 ' of lower surface 122 '.Then, shown in Fig. 4 B, locate to pour into employed hot curing potting resin 43 by hemisphere face groove 1231 '; Then, shown in Fig. 4 C, provide a light emitting diode 4, it comprises a light-emitting diode chip for backlight unit 41 that does not encapsulate as yet, is arranged at a circuit support plate 42 surfaces, and wherein, this light-emitting diode chip for backlight unit 41 is arranged at this hemisphere face groove 1231 ' central authorities; Then, with this light emitting diode 4 and this potting resin 43, together heat to solidify this potting resin 43 together with this encapsulation template 12 '; At last, shown in Fig. 4 D, after curing is finished, remove this encapsulation template 12 ', obtain the light-emitting diode 40 that an encapsulation is finished.
Accordingly, above-mentioned the utility model the 3rd embodiment provides a light-emitting diode 40, and it comprises: a light-emitting diode chip for backlight unit 41, and it is arranged at a circuit support plate 42 surfaces, and launches a light source; And a potting resin 43, be arranged on this light-emitting diode chip for backlight unit 41, to encapsulate this light-emitting diode chip for backlight unit 41, wherein, this potting resin 43 has the semi-sphere external form.
Please refer to Fig. 5 A to 5C, is the cutaway view of the encapsulation template of the utility model light-emitting diode.In order to encapsulate a plurality of light-emitting diodes simultaneously, this embodiment provides an encapsulation template with plurality of through holes, shown in Fig. 5 A, is one to have the encapsulation template 13 of a plurality of cylindrical holes 133; Shown in Fig. 5 B, then be one to have the encapsulation template 14 of a plurality of hemisphere face through holes 143, roughly the same with Fig. 1 C, those hemisphere face through holes 143 comprise hemisphere face groove 1431 and injecting glue groove 1432.In addition, the through hole that this encapsulation template with plurality of through holes also can have different external forms simultaneously, shown in Fig. 5 C, this encapsulation template 15 has cylindrical hole 153 and hemisphere face through hole 153 ' simultaneously.Above-mentioned encapsulation template with plurality of through holes, first and second embodiment is roughly the same for its occupation mode and the utility model, does not repeat them here.In addition, have the encapsulation template of plurality of through holes with formation except plurality of through holes is set on single substrate, also can will the substrate of single through hole be set, be combined as the encapsulation template with plurality of through holes in the picture mosaic mode, or the through hole of identical or different kenel is interconnected, so that this encapsulation template has more elasticity in the utilization of encapsulation LED.
Will be appreciated that foregoing is only for the application that the utility model principle is described.Under the prerequisite of the utility model category and spirit, technical field has and knows that usually the knowledgeable can make multiple modification and different configurations under the utility model, and the interest field that is attached to application then is intended to contain these and revises and different configuration.Therefore, when the details that is considered to be the most practical and preferred embodiment in the utility model at present revealed as above the time, have for technical field under the utility model and to know usually for the knowledgeable, can make and be not subject to the multiple change that has comprised size, material, profile, form, function, method of operation, assembling and used according to the concept that proposes herein and principle.
Above-described embodiment is only given an example for convenience of description, and the interest field that the utility model is advocated is from should but not only limiting to above-described embodiment with described being as the criterion of interest field of application.
Claims (11)
1. a light-emitting diode is characterized in that, comprising:
One light-emitting diode chip for backlight unit, it is arranged at a circuit support plate surface, and launches a light source; And
One potting resin is arranged on this light-emitting diode chip for backlight unit, and to encapsulate this light-emitting diode chip for backlight unit, wherein, this potting resin has a sphere external form.
2. light-emitting diode as claimed in claim 1 is characterized in that, the external form of this potting resin is by an encapsulation template control.
3. light-emitting diode as claimed in claim 2 is characterized in that, this encapsulation template comprises a substrate, and it has a upper surface and a lower surface; And at least one through hole, this through hole has cross section in, and is communicated to this lower surface by this upper surface of this substrate.
4. light-emitting diode as claimed in claim 2 is characterized in that, this encapsulation template is stainless steel, mould steel, reinforced plastics or aluminium alloy.
5. light-emitting diode as claimed in claim 3 is characterized in that, this through hole is a cylindrical hole or semi-sphere through hole.
6. light-emitting diode as claimed in claim 5 is characterized in that, the interior diameter of section of this cylindrical hole is the twice of this substrate thickness.
7. light-emitting diode as claimed in claim 5 is characterized in that, this hemisphere face through hole comprises semi-sphere groove and injecting glue groove composition.
8. light-emitting diode as claimed in claim 7 is characterized in that, this hemisphere face groove is arranged at the upper surface of this substrate, and this injecting glue groove is arranged at the lower surface of this substrate; Or this hemisphere face groove is arranged at the lower surface of this substrate, and this injecting glue groove is arranged at the upper surface of this substrate.
9. light-emitting diode as claimed in claim 7 is characterized in that, this injecting glue groove is a taper external form.
10. light-emitting diode as claimed in claim 3 is characterized in that, this encapsulation template comprises at least one exhaust groove, and this exhaust groove is connected with this through hole, and is positioned at this lower surface of this substrate.
11. light-emitting diode as claimed in claim 1 is characterized in that, this potting resin has the side of a cylindric external form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101218306U TWM445268U (en) | 2012-09-21 | 2012-09-21 | Light emitting diode |
| TW101218306 | 2012-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203038976U true CN203038976U (en) | 2013-07-03 |
Family
ID=48090954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220550115 Expired - Lifetime CN203038976U (en) | 2012-09-21 | 2012-10-25 | Light emitting diode |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203038976U (en) |
| TW (1) | TWM445268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
-
2012
- 2012-09-21 TW TW101218306U patent/TWM445268U/en not_active IP Right Cessation
- 2012-10-25 CN CN 201220550115 patent/CN203038976U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM445268U (en) | 2013-01-11 |
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