CN203014758U - Single-layer ceramic sealed housing and crystal oscillator employing same - Google Patents
Single-layer ceramic sealed housing and crystal oscillator employing same Download PDFInfo
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- CN203014758U CN203014758U CN 201220628655 CN201220628655U CN203014758U CN 203014758 U CN203014758 U CN 203014758U CN 201220628655 CN201220628655 CN 201220628655 CN 201220628655 U CN201220628655 U CN 201220628655U CN 203014758 U CN203014758 U CN 203014758U
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Abstract
The utility model discloses a single-layer ceramic sealed housing comprising a ceramic base and a cover plate mutually fixed, wherein the ceramic base at least comprises a ceramic substrate, an internal electrode and an external electrode, which are electrically conductive, are respectively arranged on the inner side and the outer side of the ceramic substrate, and the ceramic substrate is a single-layer ceramic substrate. The ceramic base further comprises a metalized ring and a metallic ring arranged on the ceramic substrate, and the ceramic base and the cover plate are bonded together through parallel seam welding or low temperature metal solder welding via the metallic ring to form an air tight space for accommodating an electronic chip. A conventional multilayer ceramic sheet cofired structure is replaced by a single-layer substrate. which reduces cost, minimizes size, simplifies structure, facilitates processing and improves production efficiency. The single-layer ceramic sealed housing is widely applicable to components with quartz crystal attached on the surface and other electronic components.
Description
Technical field
The utility model relates to a kind of package casing and uses the crystal oscillator of this shell.
Background technology
Due to the development of mobile phone, static digital camera, PC mainboard, notebook computer and video-game, increasing substantially can appear in the demand expectation of crystal oscillator.
As shown in Figure 1, traditional crystal oscillator comprises at least 2 layers of ceramic substrate 1,3, reaches the capping 9 fixing with ceramic substrate, and the top of inboard ceramic substrate 3 is provided with interior electrode 8, the below of outside ceramic substrate 1 is provided with external electrode 2, described interior electrode 8 and external electrode 2 mutual conduction.A quartz crystal 11 is fixed by tack coat 10 in the top of described interior electrode 8, and described quartz crystal 11 is arranged on by in ceramic substrate 3 and the formed enclosure space of capping 9.In order to increase enclosure space, also be installed with on the inboard ceramic substrate 3 of prior art on 4, the three layers of ceramic substrate 4 of the 3rd layer of ceramic substrate in a week and also be provided with metal layer 5, scolder 6 and becket 7.Capping 9 is adopted parallel seam welding or the melting welding of Precious Metals-Gold ashbury metal with the encapsulation of becket 7.
But because the ceramic wafer of traditional quartz crystal oscillator pasted on surface ceramic packaging shell is to be burnt altogether by three layers of potsherd stack to form, the production cost of ceramic substrate is always high, manufacturing expense is expensive, simultaneously three stackedly add common burning, during making, specification requirement is high, output is subject to the restriction of technology, equipment each side, production efficiency and product yield reduce, can not be satisfied with the growing market demand far away, therefore seek a kind of more simple design and the lower package casing of price and replenish and replace existing Multi-layer ceramic package product necessary.
The utility model content
The utility model purpose is to provide a kind of single-layer ceramic package casing and uses the crystal oscillator of this shell.
The purpose of this utility model will be achieved by the following technical programs:
A kind of single-layer ceramic package casing, comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises a ceramic substrate at least, the interior outside of described ceramic substrate arranges respectively interior electrode and external electrode, described interior electrode and external electrode electrically conduct mutually, described ceramic substrate is the single-layer ceramic substrate, described base of ceramic also comprises metallization ring and the becket that is arranged on described ceramic substrate, described base of ceramic and cover plate rely on this becket to adopt parallel seam welding or the melting welding of low-temperature metal scolder to combine, and form the airtight space that holds electronic chip.
Preferably, described ceramic substrate is the co-sintering structure of mono-layer oxidized aluminium Ceramic Array substrate and metal paste.
Preferably, offer through hole on described ceramic substrate, described interior electrode and external electrode are by this through hole energising conducting.
Preferably, also be provided with insulation support layer between described ceramic substrate and interior electrode.
Preferably, the square that is shaped as the both sides that are separately positioned on ceramic substrate of described external electrode.
Preferably, described interior electrode is shaped as strip-like-shaped.
the utility model has also disclosed a kind of crystal oscillator that uses the single-layer ceramic package casing, comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises a ceramic substrate at least, the interior outside of described ceramic substrate arranges respectively interior electrode and external electrode, described interior electrode and external electrode electrically conduct mutually, the top of described interior electrode is installed with a quartz crystal, described quartz crystal is arranged on by in base of ceramic and the formed enclosure space of cover plate, described ceramic substrate is the single-layer ceramic substrate, described base of ceramic also comprises metallization ring and the becket that is arranged on described ceramic substrate, described base of ceramic and cover plate rely on this becket to adopt parallel seam welding or the melting welding of low-temperature metal scolder to combine, the airtight space of quartz crystal is held in formation.
Preferably, described ceramic substrate is the co-sintering structure of mono-layer oxidized aluminium Ceramic Array substrate and metal paste.
The beneficial effects of the utility model are mainly reflected in: the single-layer ceramic substrate replaces multi-layer ceramic chip co-sintering structure, reduces costs, and reduces equipment volume, designs simplification, easily processing, enhance productivity, and can be widely used in surface attaching quartz crystal element and other electronic devices and components.
Description of drawings
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is traditional quartz crystal oscillator pasted on surface ceramic packaging shell mechanism schematic diagram.
Fig. 2 is the structural representation of the utility model single-layer ceramic package casing substrate.
Fig. 3 is the utility model single-layer ceramic packaged quartz crystal oscillator structure schematic diagram.
Fig. 4 a is the first embodiment schematic diagram of the utility model insulation support layer structure.
Fig. 4 b is the first embodiment schematic diagram of the utility model insulation support layer structure
Fig. 5 a is the first embodiment schematic diagram of electrode metal layer in the utility model.
Fig. 5 b is the second embodiment schematic diagram of electrode metal layer in the utility model.
The first embodiment schematic diagram of electrode metal layer in Fig. 6 a the utility model.
Fig. 6 b is the second embodiment schematic diagram of electrode metal layer in the utility model.
Fig. 7 is the second embodiment schematic diagram of the utility model metal cover board.
Embodiment
In conjunction with Fig. 2 and shown in Figure 3, the base of ceramic that package casing of the present utility model interfixes and cover plate, described base of ceramic comprises a ceramic substrate 21,31 at least, and described ceramic substrate 21,31 the interior outside arrange respectively interior electrode 25,35 and external electrode 28,38.described interior electrode 25, 35 and external electrode 28, 38 electrically conduct mutually, interior electrode 25, 35 top is provided with silver slurry 302, the effect of described silver slurry 302 is to make on it to set firmly better a quartz crystal 301, described quartz crystal 301 is arranged on by in base of ceramic and the formed enclosure space of cover plate, described base of ceramic also comprises the metallization ring (32) and becket (34) that is arranged on ceramic substrate (31), the three welds together, described base of ceramic and cover plate rely on this becket (34) to adopt parallel seam welding or the melting welding of low-temperature metal scolder to combine.
Described ceramic substrate 31 adopts mono-layer oxidized aluminium Ceramic Array substrate and metal paste co-sintering structures, and the Ceramic Array substrate potsherd of making a living is conducive to precise silk screen typography and mass industrialized production, and production efficiency is high, can effectively reduce cost of manufacture.
Offer through hole 37 on described ceramic substrate 31, described external electrode 38 and interior electrode 35 are W(or the base metal conductors such as Mo/Mn, Cu, Ni of filling by this through hole 37) metal paste, realize electrical connection after solidifying after sintering, the while metal is this through hole 37 of shutoff also, guarantees the sealing of sealing-in shell.
Also be provided with insulation support layer 26,36 between described ceramic substrate 31 and interior electrode 35.Specifically as shown in Figs. 4a and 4b, insulation support layer 26,36 adopts thick film high temperature dielectric paste silk screen printing and sintering process to make, insulation support layer 36 is used for the height of padded quartz crystal 301, make quartz crystal 301 and ceramic substrate 31 maintain a certain distance (greater than 50 μ m), the connection of being connected with external electrode for interior electrode 36 simultaneously reserves a path.
During encapsulation, utilize parallel seam welding to connect directly base of ceramic and metal cover board sealing-in, can utilize sealed in unit to realize mass industrialized production.
As shown in Fig. 5 a, 5b and Fig. 6 a, 6b, the square that is shaped as the both sides that are separately positioned on ceramic substrate 31 of described external electrode 38.Described interior electrode 35 be shaped as strip-like-shaped.External electrode 38 and interior electrode 35 adopt thick film conductor paste silk screen printing and sintering process to make metal layer at the ceramic substrate outer surface, can be the metals such as W, Mo/Mn, Cu, Ni, nickel plating or gold on metal layer.Interior electrode and external electrode are electrically connected to reliably by Ceramic Array via metal realization in flakes.
Fig. 7 has disclosed a kind of cover plate, it is the metal cover board with locator protrusions 101, this locator protrusions can snap onto the effect of the position of playing the described metal cover board in location in the metal flange ring, and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
This single-layer ceramic packaging shell structure is simple, volume is little, lightweight, be convenient to mass industrialized production, meet electronic devices and components miniaturization and surface-pasted development trend.
The utility model surface label individual layer dress ceramic packaging shell has following features:
1. compare the surface mount ceramic packaging shell of multi-layer ceramics co-sintering structure, volume is little, lightweight, simple in structure.
2. adopt mono-layer oxidized aluminium array ceramics and traditional thick-film technique, technical maturity is fit to industrialized mass.
3. adopt thick-film material to make insulation support layer 36, effectively solve the problem of quartz wafer 301 and ceramic substrate 31 maintenance certain distances (greater than 50 μ m) with simple method.Reserve and the interconnective path of external electrode 38 for interior electrode 35 simultaneously.
The utility model still has numerous embodiments, and all employing equivalents or equivalent transformation and all technical schemes of forming are within all dropping on protection range of the present utility model.
Claims (8)
1. single-layer ceramic package casing, comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises a ceramic substrate (31) at least, the interior outside of described ceramic substrate (31) arranges respectively interior electrode (35) and external electrode (48), described interior electrode (35) and external electrode (38) electrically conduct mutually, it is characterized in that: described ceramic substrate is the single-layer ceramic substrate, described base of ceramic also comprises the metallization ring (32) and becket (34) that is arranged on described ceramic substrate (31), described base of ceramic and cover plate rely on this becket (34) to adopt parallel seam welding or the melting welding of low-temperature metal scolder to combine, the airtight space of electronic chip is held in formation.
2. single-layer ceramic package casing according to claim 1, it is characterized in that: described ceramic substrate is the co-sintering structure of mono-layer oxidized aluminium Ceramic Array substrate and metal paste.
3. single-layer ceramic package casing according to claim 1 is characterized in that: offer through hole (37) on described ceramic substrate (31), described interior electrode (35) with external electrode (38) by this through hole (37) energising conducting.
4. single-layer ceramic package casing according to claim 1, is characterized in that: also be provided with insulation support layer (36) between described ceramic substrate (31) and interior electrode (35).
5. single-layer ceramic package casing according to claim 1, is characterized in that: the square that is shaped as the both sides that are separately positioned on ceramic substrate (32) of described external electrode.
6. single-layer ceramic package casing according to claim 1 is characterized in that: described interior electrode be shaped as strip-like-shaped.
7. crystal oscillator that uses the single-layer ceramic package casing, comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises a ceramic substrate (31) at least, the interior outside of described ceramic substrate (31) arranges respectively interior electrode (35) and external electrode (48), described interior electrode (35) and external electrode (38) electrically conduct mutually, the top of described interior electrode (35) is installed with a quartz crystal (301), described quartz crystal (301) is arranged on by in base of ceramic and the formed enclosure space of cover plate, it is characterized in that: described ceramic substrate is the single-layer ceramic substrate, described base of ceramic also comprises the metallization ring (32) and becket (34) that is arranged on described ceramic substrate (31), described base of ceramic and cover plate rely on this becket (34) to adopt parallel seam welding or the melting welding of low-temperature metal scolder to combine, the airtight space of quartz crystal (301) is held in formation.
8. crystal oscillator according to claim 7, it is characterized in that: described ceramic substrate is the co-sintering structure of mono-layer oxidized aluminium Ceramic Array substrate and metal paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628655 CN203014758U (en) | 2012-11-26 | 2012-11-26 | Single-layer ceramic sealed housing and crystal oscillator employing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628655 CN203014758U (en) | 2012-11-26 | 2012-11-26 | Single-layer ceramic sealed housing and crystal oscillator employing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203014758U true CN203014758U (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201220628655 Expired - Fee Related CN203014758U (en) | 2012-11-26 | 2012-11-26 | Single-layer ceramic sealed housing and crystal oscillator employing same |
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| CN (1) | CN203014758U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840789A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Single-layer ceramic packaging shell and crystal oscillator using shell |
| CN106486427A (en) * | 2016-11-21 | 2017-03-08 | 成都嘉纳海威科技有限责任公司 | A kind of package casing based on LCP substrate and preparation method |
-
2012
- 2012-11-26 CN CN 201220628655 patent/CN203014758U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840789A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Single-layer ceramic packaging shell and crystal oscillator using shell |
| CN106486427A (en) * | 2016-11-21 | 2017-03-08 | 成都嘉纳海威科技有限责任公司 | A kind of package casing based on LCP substrate and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20151126 |