CN203014755U - Low-temperature glass-ceramic sealed housing and crystal oscillator employing same - Google Patents
Low-temperature glass-ceramic sealed housing and crystal oscillator employing same Download PDFInfo
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- CN203014755U CN203014755U CN 201220628333 CN201220628333U CN203014755U CN 203014755 U CN203014755 U CN 203014755U CN 201220628333 CN201220628333 CN 201220628333 CN 201220628333 U CN201220628333 U CN 201220628333U CN 203014755 U CN203014755 U CN 203014755U
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Abstract
The utility model discloses a low-temperature glass-ceramic sealed housing and a crystal oscillator employing same. The low-temperature glass-ceramic sealed housing comprises a ceramic base and a cover plate mutually fixed, wherein the ceramic base at least comprises a ceramic substrate, a meltable low-temperature glass ring, and an internal electrode and an external electrode, which are electrically conductive and are respectively arranged on the inner side and the outer side of the ceramic substrate. The ceramic base and the cover plate are bonded together through the low-temperature glass ring. The conventional multilayer ceramic sheet cofired structure is replaced by a single-layer substrate with low temperature as solder. A low-temperature glass-ceramic sealed housing is small, light and simply structured and is mature in processing technology. Moreover, high qualified rate of the product is ensured. The low-temperature glass-ceramic sealed housing is widely applicable to components with quartz crystal attached on the surface and other electronic components.
Description
Technical field
The utility model relates to a kind of package casing and uses the crystal oscillator of this shell.
Background technology
Due to the development of mobile phone, static digital camera, PC mainboard, notebook computer and video-game, increasing substantially can appear in the demand expectation of crystal oscillator.
As shown in Figure 1, traditional crystal oscillator comprises at least 2 layers of ceramic substrate 1,3, reaches the capping 9 fixing with ceramic substrate, and the top of inboard ceramic substrate 3 is provided with interior electrode 8, the below of outside ceramic substrate 1 is provided with external electrode 2, described interior electrode 8 and external electrode 2 mutual conduction.A quartz crystal 11 is fixed by tack coat 10 in the top of described interior electrode 8, and described quartz crystal 11 is arranged on by in ceramic substrate 3 and the formed enclosure space of capping 9.In order to increase enclosure space, also be installed with on the inboard ceramic substrate 3 of prior art on 4, the three layers of ceramic substrate 4 of the 3rd layer of ceramic substrate in a week and also be provided with metal layer 5, scolder 6 and becket 7.Capping 9 is adopted parallel seam welding or the melting welding of Precious Metals-Gold ashbury metal with the encapsulation of becket 7.
But because the ceramic wafer of traditional quartz crystal oscillator pasted on surface ceramic packaging shell is to be burnt altogether by three layers of potsherd stack to form, the production cost of ceramic substrate is always high, manufacturing expense is expensive, simultaneously three stackedly add common burning, during making, specification requirement is high, output is subject to the restriction of technology, equipment each side, production efficiency and product yield reduce, can not be satisfied with the growing market demand far away, parallel seam welding or the weldering of Precious Metals-Gold ashbury metal are generally adopted in the encapsulation of device in addition, sealing apparatus and material are very expensive, and production cost is very high.Therefore seek a kind of simple for structure, adopt ceramic packaging shell comparatively cheap, can mass industrialized production, the production that is used for quartz crystal device replaces existing product extremely urgent.
The utility model content
The utility model purpose is to provide a kind of low temperature glass-ceramic packaging shell and uses the crystal oscillator of this shell.
The purpose of this utility model will be achieved by the following technical programs:
A kind of low temperature glass-ceramic packaging shell, comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises ceramic substrate and the low temperature glass ring that easily melts at least, and the interior electrode and the external electrode that are separately positioned on the outside in described ceramic substrate, described interior electrode and external electrode electrically conduct mutually, and described ceramic substrate and cover plate rely on this low temperature glass loops to be combined.
Preferably, described cover plate is the metal pipe cap of intermediate projections, and the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described ceramic substrate and metal pipe cap relies on this low temperature glass loops to be combined.
Perhaps, described cover plate is middle recessed ceramic pipe cap, and the recessed surrounding in described centre is the sealing-in limit, and recessed sealing-in limit with surrounding, described centre is relative vertical, and the sealing-in limit of described ceramic substrate and ceramic pipe cap relies on this low temperature glass loops to be combined.
Preferably, also be provided with insulation support layer and high-temperature insulation ring between described ceramic substrate and low temperature glass ring.
Preferably, described external electrode is shaped as square on four jiaos that are separately positioned on ceramic substrate (32).
Preferably, described interior electrode is shaped as strip-like-shaped.
The utility model has also disclosed a kind of crystal oscillator that uses low temperature glass-ceramic packaging shell, comprise the ceramic substrate and the cover plate that interfix, be separately positioned on interior electrode and the external electrode in the outside in described ceramic substrate, described interior electrode and external electrode electrically conduct mutually, the top of described interior electrode is installed with a quartz crystal, described quartz crystal is arranged on by in ceramic substrate and the formed enclosure space of cover plate, be provided with the low temperature glass ring of easy fusing between described ceramic substrate and cover plate, described ceramic substrate and cover plate rely on this low temperature glass loops to be combined.
Preferably, described cover plate is the metal pipe cap of intermediate projections, and the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described ceramic substrate and metal pipe cap relies on this low temperature glass loops to be combined.
Perhaps, described cover plate is middle recessed ceramic pipe cap, and the recessed surrounding in described centre is the sealing-in limit, and recessed sealing-in limit with surrounding, described centre is relative vertical, and the sealing-in limit of described ceramic substrate and ceramic pipe cap relies on this low temperature glass loops to be combined.
The beneficial effects of the utility model are mainly reflected in: low temperature glass is replaced multi-layer ceramic chip co-sintering structure as scolder, single-layer ceramic substrate, volume is little, weight reduction, simple in structure, processing technology is ripe, guarantee the high qualification rate of product, can be widely used in surface attaching quartz crystal element and other electronic devices and components.
Description of drawings
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is traditional quartz crystal oscillator pasted on surface ceramic packaging shell mechanism schematic diagram.
Fig. 2 is the structural representation of the utility model low temperature glass-ceramic encapsulated base.
Fig. 3 is the utility model low temperature glass-ceramic packaging (metal sealing cap) quartz oscillator structural representation.
Fig. 4 is the utility model low temperature glass-ceramic packaging (pottery or glass sealing cap) quartz oscillator structural representation.
Fig. 5 is the utility model insulation support layer structural representation.
Fig. 6 a is the first embodiment schematic diagram of electrode metal layer in the utility model.
Fig. 6 b is the second embodiment schematic diagram of electrode metal layer in the utility model.
Fig. 7 is the utility model external electrode metal layer schematic diagram.
Embodiment
In conjunction with Fig. 3 and shown in Figure 4, package casing of the present utility model comprises the ceramic substrate 32,42 that interfixes, the easy low temperature glass ring 35 of fusing, 45 and cover plate, and the interior electrode 36,46 and external electrode 31,41 that is separately positioned on ceramic substrate 32, the 42 interior outsides.Described ceramic substrate 32,42 and low temperature glass ring 35,45 form base of ceramic.Described interior electrode 36,46 and external electrode 31,41 mutually electrically conduct, interior electrode 36,46 top are provided with silver slurry 37,47, the effect of described silver slurry 37,47 is to make on it to set firmly better a quartz crystal 38,48, described quartz crystal 38,48 be arranged on by ceramic substrate 32,42 and the formed enclosure space of cover plate in, ceramic substrate 32,42 and cover plate rely on this low temperature glass ring 35,45 to combine.
Specifically as shown in Figure 2, described ceramic substrate 22 adopts the aluminium oxide ceramics array substrate, can be ceramic chips, can be also the ripe ceramics after burning till, and is conducive to precise silk screen typography and mass industrialized production, and production efficiency is high, can effectively reduce cost of manufacture.
As shown in Figure 3, described cover plate is the metal pipe cap 39 of intermediate projections, the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described ceramic substrate 32 and metal pipe cap 39 relies on this low temperature glass ring 35 to combine.Described metal pipe cap 39 adopts the iron-nickel alloy mechanical stamping of mating with the alumina ceramic substrate coefficient of expansion to form, and plating nickel on surface is to prevent corrosion.
Perhaps, as shown in Figure 4, described cover plate is middle recessed ceramic pipe cap 49, and the recessed surrounding in described centre is the sealing-in limit, recessed sealing-in limit with surrounding, described centre is relative vertical, and the sealing-in limit of described ceramic substrate 42 and ceramic pipe cap 49 relies on this low temperature glass ring 45 to combine.Described aluminium oxide ceramics pipe cap 49 can be used the multi-layer ceramics technological forming, also can adopt die casting sinter molding method to make.
Described ceramic substrate 32,42 and low temperature glass ring 35,45 between also be provided with insulation support layer 33,43 and high-temperature insulation ring 34,44.Specifically as shown in Figure 5, insulation support layer 33 adopts thick film high temperature dielectric paste silk screen printing and sintering process to make, material can be high temp glass or other high-temperature insulation media, insulation support layer 33,43 is used for padded quartz crystal 38,48 height, effectively make quartz crystal 38,48 and ceramic substrate 32,42 maintain a certain distance (greater than 50 μ m), are connected with external electrode for interior electrode 36,46 simultaneously, 41 connection reserves a path.
Described interior electrode 36,46 exits are arranged on high- temperature insulation ring 34,44 times, high- temperature insulation ring 34,44 adopts thick film high temperature dielectric paste silk screen printing and sintering process to make, material can be high temp glass and other high-temperature insulation dielectric materials, it covers interior electrode 36,46 exit effectively, plays the effect of insulation.
Low temperature glass solder ring 35,45 adopts low temperature glass slurry silk screen printing and sintering process to make, purpose be used for ceramic substrate and metal pipe cap 39(shown in Figure 3) or ceramic pipe cap 49(shown in Figure 4) (lower than 400 ° of C) sealing-in under lower temperature conditions.Pass through to melt the low temperature glass ring during encapsulation directly with metal pipe cap 39 or ceramic pipe cap and high-temperature insulation ring 34 bondings, this low temperature glass ring 35 directly printing-sintering on ceramic substrate 32, but also direct sintering 49(is as shown in Figure 4 on ceramic sealing cap), simplify the quartz oscillator packaging technology, can utilize sealed in unit to realize producing in enormous quantities.
As Fig. 6 a and Fig. 6 b and shown in Figure 7, described external electrode be shaped as square on four jiaos that are separately positioned on ceramic substrate.Described interior electrode be shaped as strip-like-shaped.External electrode and interior electrode adopt thick film conductor paste silk screen printing and sintering process to make metal layer at the ceramic substrate outer surface, can be the metals such as W, Mo/Mn, Cu, Ni, nickel plating or gold on metal layer.Interior electrode and external electrode are electrically connected to reliably by Ceramic Array via metal realization in flakes.
This package casing can be widely used in the level Hermetic Package of surface attaching quartz crystal element and other electronic devices and components.When for example making of the quartz-crystal resonator of low temperature glass-ceramic packaging shell encapsulation; specifically as shown in Figure 3; quartz wafer 39 is starched 37 by silver and is connected with interior electrode 36; low temperature glass solder ring 34 is shown in Figure 4 with metal pipe cap 34 or ceramic pipe cap 49(with ceramic substrate 32) weld together under lower temperature (lower than 400 ° of C), form and hold the airtight space of protecting quartz wafer.Surface mount pottery-the low temperature glass packaging shell structure is simple, volume is little for this, lightweight, be convenient to mass industrialized production, meet electronic devices and components miniaturization and surface-pasted development trend.
The utility model surface label low temperature glass-dress ceramic packaging shell has following features:
1. compare the surface mount ceramic packaging shell of multi-layer ceramics co-sintering structure, volume is little, lightweight, simple in structure.Adopt mono-layer oxidized aluminium array ceramics and traditional thick-film technique, equipment is simple, and technical maturity is fit to industrialized mass.
2. adopt thick-film material to make insulation support layer 23, effectively solve the problem of quartz wafer 38 and ceramic substrate 32 maintenance certain distances (greater than 50 μ m) with simple method.Reserve and the interconnective path of external electrode 21 for interior electrode 26 simultaneously.
3. adopt to cover interior electrode 26 exit high-temperature insulation glass rings 25, cause the problem of interior electric pole short circuit in the time of can avoiding sealing-in metal nut cap 39.
4. adopt low temperature glass solder ring 25 direct printing-sinterings on ceramic substrate 22, also in advance sintering on ceramic sealing cap 49.Carry out sealing-in with traditional low-temperature sintering stove, be conducive to simplify the quartz oscillator packaging technology, realize producing in enormous quantities.
The utility model still has numerous embodiments, and all employing equivalents or equivalent transformation and all technical schemes of forming are within all dropping on protection range of the present utility model.
Claims (9)
1. low temperature glass-ceramic packaging shell, it is characterized in that: comprise the base of ceramic and the cover plate that interfix, described base of ceramic comprises ceramic substrate (32) and the low temperature glass ring (35) that easily melts at least, and the interior electrode (36) and the external electrode (31) that are separately positioned on the outside in described ceramic substrate (32), described interior electrode (36) and external electrode (31) electrically conduct mutually, and described ceramic substrate (32) and cover plate rely on this low temperature glass ring (35) to combine.
2. low temperature glass according to claim 1-ceramic packaging shell, it is characterized in that: described cover plate is the metal pipe cap (39) of intermediate projections, the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described ceramic substrate (32) and metal pipe cap (39) relies on this low temperature glass ring (35) to combine.
3. low temperature glass according to claim 1-ceramic packaging shell, it is characterized in that: described cover plate is middle recessed ceramic pipe cap (49), the recessed surrounding in described centre is the sealing-in limit, recessed sealing-in limit with surrounding, described centre is relative vertical, and the sealing-in limit of described ceramic substrate (32) and ceramic pipe cap (49) relies on this low temperature glass ring (35) to combine.
4. low temperature glass according to claim 1-ceramic packaging shell, is characterized in that: also be provided with insulation support layer (33) and high-temperature insulation ring (34) between described ceramic substrate (32) and low temperature glass ring (35).
5. low temperature glass according to claim 1-ceramic packaging shell is characterized in that: described external electrode be shaped as square on four jiaos that are separately positioned on ceramic substrate (32).
6. low temperature glass according to claim 1-ceramic packaging shell is characterized in that: described interior electrode be shaped as strip-like-shaped.
7. crystal oscillator that uses low temperature glass-ceramic packaging shell, comprise the ceramic substrate (32) and the cover plate that interfix, be separately positioned on interior electrode (36) and the external electrode (31) in the outside in described ceramic substrate (32), described interior electrode (36) and external electrode (31) electrically conduct mutually, the top of described interior electrode (36) is installed with a quartz crystal (38), described quartz crystal (38) is arranged on by in ceramic substrate (32) and the formed enclosure space of cover plate, it is characterized in that: the low temperature glass ring (35) that is provided with easy fusing between described ceramic substrate (32) and cover plate, described ceramic substrate (32) and cover plate rely on this low temperature glass ring (35) to combine.
8. crystal oscillator according to claim 7, it is characterized in that: described cover plate is the metal pipe cap (39) of intermediate projections, the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described ceramic substrate (32) and metal pipe cap (39) relies on this low temperature glass ring (35) to combine.
9. crystal oscillator according to claim 7, it is characterized in that: described cover plate is middle recessed ceramic pipe cap (49), the recessed surrounding in described centre is the sealing-in limit, recessed sealing-in limit with surrounding, described centre is relative vertical, and the sealing-in limit of described ceramic substrate (32) and ceramic pipe cap (49) relies on this low temperature glass ring (35) to combine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628333 CN203014755U (en) | 2012-11-26 | 2012-11-26 | Low-temperature glass-ceramic sealed housing and crystal oscillator employing same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628333 CN203014755U (en) | 2012-11-26 | 2012-11-26 | Low-temperature glass-ceramic sealed housing and crystal oscillator employing same |
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| CN203014755U true CN203014755U (en) | 2013-06-19 |
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| CN 201220628333 Expired - Fee Related CN203014755U (en) | 2012-11-26 | 2012-11-26 | Low-temperature glass-ceramic sealed housing and crystal oscillator employing same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
-
2012
- 2012-11-26 CN CN 201220628333 patent/CN203014755U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20151126 |