CN203013689U - Device carrying out dismounting and welding according to size of BGA chip - Google Patents
Device carrying out dismounting and welding according to size of BGA chip Download PDFInfo
- Publication number
- CN203013689U CN203013689U CN 201220676892 CN201220676892U CN203013689U CN 203013689 U CN203013689 U CN 203013689U CN 201220676892 CN201220676892 CN 201220676892 CN 201220676892 U CN201220676892 U CN 201220676892U CN 203013689 U CN203013689 U CN 203013689U
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- China
- Prior art keywords
- size
- nozzle
- bga chip
- bga
- lower nozzle
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a device carrying out dismounting and welding according to a size of a BGA (Ball Grid Array) chip. The device comprises a first temperature control part, a second temperature control part, an upper nozzle, a lower nozzle, a bottom infrared heating part and a vernier caliper, wherein the upper nozzle and the lower nozzle are arranged with an interval, the bottom infrared heating part is arranged below the lower nozzle, the first temperature control part and the second temperature control part are respectively connected with the upper nozzle and the lower nozzle, preferably, the device further comprises a vacuum suction pen, a tin suction belt and a welding-aid agent. The size of the BGA chip is 35mm * 35mm, sizes of the upper nozzle and the lower nozzle are 38mm *38mm. The size of the BGA chip is 28mm * 28mm, the sizes of the upper nozzle and the lower nozzle are 31mm *31mm. The size of the BGA chip is 40mm * 40mm, the sizes of the upper nozzle and the lower nozzle are 41mm *41mm. The device has novel design; a proper part is selected to carry out dismounting and welding according to the size of the BGA chip; various BGA chips can be completely dismounted and mounted, and main board welding points can be completely maintained; explosion of the chip because of heating does not occur; and the device is applicable to large scale application.
Description
Technical field
The utility model relates to the relieving attachment technical field, and particularly band epoxy sealing bga chip dismounting and welder technical field, specifically refer to a kind of device of dismantling and welding according to the bga chip size.
Background technology
PCB(Printed Circuit Board, printed circuit board) the BGA(Ball Grid Array on mainboard, ball grid array structure, a kind of package method that integrated circuit adopts organic support plate) structure of chip is as shown in fig. 1, the upper strata is that bga chip 10, lower floor are mainboard 20, is tin ball 30 and epoxy sealing 40 between the upper and lower.
When directly bga chip being dismantled with the BGA Rework station, have plumbous and unleaded two class heating-up temperatures except being divided into, the size of chip divides in addition, the size of tin ball point, welding middle-sized bga chip with one group of temperature curve commonly used is fine, but when running into size chip bigger than normal or less than normal, will suitably adjust temperature curve.Otherwise run into large chip, when temperature curve was completed, the tin ball is not fusing fully also, easily solder joint on wiring board is taken up; It is overheated that little chip can cause, and causes explosion (this is catastrophic).The density height of tin ball also will suitably improve temperature, and the low words of temperature in winter also will improve temperature.The temperature of little chip will be fit to, should not be too high, also to suitably shorten the time of melting welding, and this is to consider that copper conductor is fused to the factor in scolding tin admittedly.Design in sum suitable heating temperature curve extremely important.
Therefore, a kind of device of dismantling and welding according to the bga chip size need to be provided, can select suitable parts to dismantle and weld according to the bga chip size, can pull down and install various bga chips are complete, and keep PCB mainboard solder joint complete, chip can because adding thermal spalling, not be suitable for large-scale promotion application.
The utility model content
The purpose of this utility model is to have overcome above-mentioned shortcoming of the prior art, a kind of device of dismantling and welding according to the bga chip size is provided, this device design of dismantling and welding according to the bga chip size is ingenious, can select suitable parts to dismantle and weld according to the bga chip size, can pull down and install various bga chips are complete, and keep PCB mainboard solder joint complete, chip can because adding thermal spalling, not be suitable for large-scale promotion application.
To achieve these goals, the device of dismantling and welding according to the bga chip size of the present utility model, be characterized in, comprise the first temperature control parts, the second temperature control parts, upper nozzle, lower nozzle, bottom infrared heating parts and vernier caliper, described upper nozzle and described lower nozzle are between the upper and lower every setting, described bottom infrared heating parts are positioned at described lower nozzle below, described the first temperature control parts be connected the second temperature control parts respectively circuit connect described upper nozzle and described lower nozzle.
Preferably, the described device of dismantling and welding according to the bga chip size also comprises vacuum WAND.
Preferably, the described device of dismantling and welding according to the bga chip size also comprises suction tin band and scaling powder.
Preferably, the size of described bga chip is 35mm * 35mm, and the size of described upper nozzle and described lower nozzle is 38mm * 38mm.
Preferably, the size of described bga chip is 28mm * 28mm, and the size of described upper nozzle and described lower nozzle is 31mm * 31mm.
Preferably, the size of described bga chip is 40mm * 40mm, and the size of described upper nozzle and described lower nozzle is 41mm * 41mm.
the beneficial effects of the utility model specifically are: the device of dismantling and welding according to the bga chip size of the present utility model, comprise the first temperature control parts, the second temperature control parts, upper nozzle, lower nozzle, bottom infrared heating parts and vernier caliper, described upper nozzle and described lower nozzle are between the upper and lower every setting, described bottom infrared heating parts are positioned at below described lower nozzle, described the first temperature control parts be connected the second temperature control parts respectively circuit connect described upper nozzle and described lower nozzle, thereby determine the size of bga chip by vernier caliper, choose upper nozzle and the lower nozzle of appropriate size, upper nozzle, lower nozzle and bottom infrared heating parts form the three-temperature-zone treatment bench, and control respectively the temperature of described upper nozzle and described lower nozzle by described the first temperature control parts and described the second temperature control parts, design ingenious, can select suitable parts to dismantle and weld according to the bga chip size, can pull down and install various bga chips are complete, and keep PCB mainboard solder joint complete, chip can be because not adding thermal spalling, be suitable for large-scale promotion application.
Description of drawings
Structural representation when Fig. 1 is a specific embodiment use of the present utility model.
Fig. 2 is that chip temperature setting schematic diagram is unloaded in the first assembling and dismantling.
Embodiment
In order more clearly to understand technology contents of the present utility model, describe in detail especially exemplified by following examples.Should be understood that embodiment is only for explanation the utility model, rather than to restriction of the present utility model.
Shown in Figure 1, the device of dismantling and welding according to the bga chip size of the present utility model comprises the first temperature control parts 1, the second temperature control parts 2, upper nozzle 3, lower nozzle 4, bottom infrared heating parts 5 and vernier caliper 6, described upper nozzle 3 and described lower nozzle 4 are between the upper and lower every setting, described bottom infrared heating parts 5 are positioned at described lower nozzle 4 belows, described the first temperature control parts 1 be connected the second temperature control parts 2 respectively circuit connect described upper nozzle 3 and described lower nozzle 4.
For the ease of mentioning bga chip 10, in specific embodiment of the utility model, the described device of dismantling and welding according to the bga chip size also comprises the vacuum WAND (not shown).
In order to remove residual tin, in specific embodiment of the utility model, the described device of dismantling and welding according to the bga chip size also comprises inhales tin band (not shown) and scaling powder (not shown).
Determine the size of bga chip 10 by vernier caliper 6, choose upper nozzle 3 and the lower nozzle 4 of appropriate size, preferably, the size of described bga chip 10 is 35mm * 35mm, and the size of described upper nozzle 3 and described lower nozzle 4 is 38mm * 38mm.Preferably, the size of described bga chip 10 is 28mm * 28mm, and the size of described upper nozzle 3 and described lower nozzle 4 is 31mm * 31mm.Preferably, the size of described bga chip 10 is 40mm * 40mm, and the size of described upper nozzle 3 and described lower nozzle 4 is 41mm * 41mm.
When the utility model used, (1) therefore will check before dismounting whether device makes moist due to 10 pairs of moisture sensitivities of bga chip, and the device that makes moist is carried out dehumidify.The bga chip 10 that has damaged is placed between upper nozzle 3 and lower nozzle 4; (2) Temperature Setting of bottom infrared heating parts 5 is 160 ℃ (lead is arranged), controls by the first temperature control parts 1 and the second temperature control parts 2, the detachable general size of plumbous Temperature Setting (table 1 and shown in Figure 2) is arranged at the bga chip 10 of 35 * 35mm with first group; (3) the detachable general size of plumbous Temperature Setting (shown in table 2) is arranged at the bga chip 10 of 28 * 28mm with second group; (4) the detachable general size of plumbous Temperature Setting (shown in table 3) is arranged at the bga chip 10 of 40 * 40mm with the 3rd group; Unload chip temperature with the first assembling and dismantling and set (table 1 and shown in Figure 2) when beginning to dismantle, reach 183 ℃ of reflow temperature after one minute at observed temperature, beginning holds bga chip 10 with vacuum WAND gently it is mentioned; (5) coordinate scaling powder to remove residual tin with inhaling the tin band.Arrange pad in order to welding again.First group has plumbous Temperature Setting to coordinate upper nozzle 3 and lower nozzle 4 specification 38mm * 38mm, temperature is applicable to the bga chip 10 of 35mm * 35mm size, as standard, 2.5 ℃ of the every increase and decrease of the edge length of bga chip 10 1mm temperature increases and decreases, 200～245 ℃ of melting welding temperature extremess.Run into unleaded bga chip 10, the dismounting Temperature Setting generally adds 30 ℃.The density height of tin ball 30 also will suitably improve temperature, and the low words of temperature in winter also will improve temperature, are limited with 5 ℃.The temperature of little chip will be fit to, should not be too high, also to suitably shorten the time of melting welding, and in melting welding time 60S, this is to consider that copper conductor is fused to the factor in scolding tin admittedly; But the melting welding time proper extension of large chip, this is to make up the irregular deficiency of being heated.Use according to the size of bga chip 10 upper nozzle 3 and the lower nozzle 4 that is fit to its specification.This device can be pulled down and install various bga chips 10 are complete, and keeps PCB mainboard solder joint complete, and chip can because adding thermal spalling, not be suitable for large-scale promotion application.
First group, table 1 has plumbous Temperature Setting, nozzle specification 38mm * 38mm, applicable 35mm * 35mm chip
| ? | Preheating/1 | Heat up/2 | Constant temperature/3 | Melting welding/4 | Reflow/5 |
| The upper nozzle temperature (℃) | 55 | 185 | 160 | 193 | ? |
| The top time (second) | 45 | 70 | 35 | 75 | ? |
| The lower nozzle temperature (℃) | 55 | 185 | 160 | 230 | 235 |
| The bottom time (second) | 45 | 70 | 35 | 15 | 65 |
Second group, table 2 has plumbous Temperature Setting, nozzle specification 31mm * 31mm, applicable 28mm * 28mm chip
| ? | Preheating/1 | Heat up/2 | Constant temperature/3 | Melting welding/4 | Reflow/5 |
| The upper nozzle temperature (℃) | 55 | 185 | 160 | 193 | ? |
| The top time (second) | 45 | 70 | 35 | 75 | ? |
| The lower nozzle temperature (℃) | 55 | 185 | 160 | 210 | 215 |
| The bottom time (second) | 45 | 70 | 35 | 15 | 65 |
The 3rd group, table 3 has plumbous Temperature Setting, nozzle specification 41mm * 41mm, applicable 40mm * 40mm chip
| The upper nozzle temperature (℃) | 55 | 185 | 160 | 193 | ? |
| Time (second) | 45 | 70 | 35 | 120 | ? |
| The lower nozzle temperature (℃) | 55 | 185 | 160 | 240 | 245 |
| Time (second) | 45 | 70 | 35 | 15 | 105 |
To sum up, the device of dismantling and welding according to the bga chip size of the present utility model designs ingenious, can select suitable parts to dismantle and weld according to the bga chip size, can pull down and install various bga chips are complete, and keep PCB mainboard solder joint complete, chip can because adding thermal spalling, not be suitable for large-scale promotion application.
In this specification, the utility model is described with reference to its specific embodiment.But, still can make various modifications and conversion obviously and not deviate from spirit and scope of the present utility model.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (6)
1. device of dismantling and welding according to the bga chip size, it is characterized in that, comprise the first temperature control parts, the second temperature control parts, upper nozzle, lower nozzle, bottom infrared heating parts and vernier caliper, described upper nozzle and described lower nozzle are between the upper and lower every setting, described bottom infrared heating parts are positioned at described lower nozzle below, described the first temperature control parts be connected the second temperature control parts respectively circuit connect described upper nozzle and described lower nozzle.
2. the device of dismantling and welding according to the bga chip size according to claim 1, is characterized in that, the described device of dismantling and welding according to the bga chip size also comprises vacuum WAND.
3. the device of dismantling and welding according to the bga chip size according to claim 1, is characterized in that, the described device of dismantling and welding according to the bga chip size also comprises inhales tin band and scaling powder.
4. the device of dismantling and welding according to the bga chip size according to claim 1, is characterized in that, the size of described bga chip is 35mm * 35mm, and the size of described upper nozzle and described lower nozzle is 38mm * 38mm.
5. the device of dismantling and welding according to the bga chip size according to claim 1, is characterized in that, the size of described bga chip is 28mm * 28mm, and the size of described upper nozzle and described lower nozzle is 31mm * 31mm.
6. the device of dismantling and welding according to the bga chip size according to claim 1, is characterized in that, the size of described bga chip is 40mm * 40mm, and the size of described upper nozzle and described lower nozzle is 41mm * 41mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220676892 CN203013689U (en) | 2012-12-10 | 2012-12-10 | Device carrying out dismounting and welding according to size of BGA chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220676892 CN203013689U (en) | 2012-12-10 | 2012-12-10 | Device carrying out dismounting and welding according to size of BGA chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203013689U true CN203013689U (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220676892 Expired - Lifetime CN203013689U (en) | 2012-12-10 | 2012-12-10 | Device carrying out dismounting and welding according to size of BGA chip |
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| CN (1) | CN203013689U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
-
2012
- 2012-12-10 CN CN 201220676892 patent/CN203013689U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107624000A (en) * | 2017-09-06 | 2018-01-23 | 国营芜湖机械厂 | A kind of more pin placing components method for dismounting for the maintenance of aircraft electrical plate |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130619 |