CN202998650U - PCB internal layer thin substrate copper layer structure - Google Patents
PCB internal layer thin substrate copper layer structure Download PDFInfo
- Publication number
- CN202998650U CN202998650U CN 201220739658 CN201220739658U CN202998650U CN 202998650 U CN202998650 U CN 202998650U CN 201220739658 CN201220739658 CN 201220739658 CN 201220739658 U CN201220739658 U CN 201220739658U CN 202998650 U CN202998650 U CN 202998650U
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- China
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- internal layer
- thin substrate
- copper
- pcb
- pcb internal
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- Expired - Fee Related
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Abstract
The utility model relates to a PCB internal layer thin substrate copper layer structure, comprising copper leather laid at each corner of the PCB internal layer thin substrate and copper grids or a plurality of block-shaped copper sheets laid at each side of the PCB internal layer thin substrate. The copper leather is in the shape of an equilateral right angled triangle. The plurality of block-shaped copper sheets are distributed on each side of the PCB internal layer thin substrate at equal intervals. The PCB internal layer thin substrate copper layer structure is used on the PCB internal layer thin substrate, thereby effectively enhancing corner support force of the PCB internal layer thin substrate, preventing warp, ensuring parallel flow of a PCB in a production device, and preventing worthless declaration of the PCB due to board clamping and damage upon devices.
Description
Technical field
The utility model relates to the circuit board making technical field, particularly relates to the thin substrate copper of a kind of PCB internal layer layer structure.
Background technology
The copper layer of traditional PCB internal layer edges of boards adopts the mode of paving copper sheet to form more, appearance along with the high frequency plate, thickness and uniformity requirement to PCB inner plating dielectric layer are more and more higher, adopt that oneself can't satisfy the demand that thickness and the uniformity of dielectric layer are accurately controlled in the mode of internal layer edges of boards paving copper sheet.For obtaining the dielectric layer of stable and uniform more, in to gummosis and the strict part pcb board of dielectric layer, adopt the mode of lapping lattice/copper pad to form the copper layer at the internal layer edges of boards in industry.The flow direction of gummosis when this mode is controlled the pcb board pressing is effectively avoided causing the pcb board became uneven because gummosis is obstructed, thereby effectively promotes thickness and the uniformity of PCB inner plating dielectric layer.But this mode has been brought new technical problem, when the internal layer edges of boards form the copper layer, often causes thin substrate the clamp phenomenon often to occur in process of production when the mode that thin substrate is adopted lapping lattice/copper pad, and causing in batches, the PCB of property scraps.Cause the reason of above-mentioned technical problem to be, grid or the copper pad support force at thin substrate plate angle after etching are not strong, are vulnerable to the External Force Acting perk in production equipment, encounter space in production equipment and whole strip is risen block.Be pipelining because PCB produces, when clamp occured for the streamline downstream, the streamline upstream still kept running, and this will cause in batches the useless and damage equipment of integrated circuit board blackboard newspaper.
Summary of the invention
In view of this, the technical problems to be solved in the utility model is to provide the thin substrate copper of a kind of PCB internal layer layer structure, adopt the thin substrate copper of this PCB internal layer layer structure on the thin substrate of PCB internal layer, can effectively strengthen the thin substrate plate of PCB internal layer angle support force, prevent warpage, guarantee pcb board PARALLEL FLOW in production equipment, prevent that the pcb board clamp from scrapping and damage equipment.
In order to solve the problems of the technologies described above, this technical problem adopts following solution:
The thin substrate copper of a kind of PCB internal layer layer structure comprises the copper sheet that is layed in each plate of the thin substrate of PCB internal layer angle and copper grid or a plurality of block copper sheet that is layed in thin each edges of boards of substrate of PCB internal layer.
Structure of the present utility model, fully utilized the advantage of copper sheet and grid or block copper sheet, laying grid or block copper sheet except the edges of boards the plate angle, the flow direction of gummosis when effectively controlling the pcb board pressing, avoid causing the pcb board became uneven because gummosis is obstructed, prevent after thin substrate etch copper that copper sheet does not possess that continuity, support force are poor, plate angle easy perk clamp phenomenon, significantly reduces bad.And lay copper sheet at Ban Jiaochu, and can improve plate angular flux glue excessive, avoid causing the thick globality of plate gusset partially thin, can effectively protect plate angle internal layer luminous point simultaneously.
As preferably, the copper grid of two adjacent edges of boards or a plurality of block copper sheet are separated by the copper sheet at the plate angle between these two edges of boards.
Above-mentioned copper sheet preferably is equilateral right-angled triangle.
Above-mentioned a plurality of block copper sheet is equally distributed on each edges of boards of the thin substrate of PCB internal layer.
Above-mentioned block copper sheet is also copper PAD.
the utility model has following beneficial effect with respect to prior art: because the utility model comprises the copper sheet that is layed in each plate of the thin substrate of PCB internal layer angle and copper grid or a plurality of block copper sheet that is layed in thin each edges of boards of substrate of PCB internal layer, utilization is layed in copper grid or a plurality of block copper sheet of thin each edges of boards of substrate of PCB internal layer, can avoid causing the pcb board became uneven because gummosis is obstructed, thereby effectively promote thickness and the uniformity of PCB inner plating dielectric layer, pass through simultaneously at plate angle laying copper sheet, can effectively strengthen the thin substrate plate of PCB internal layer angle support force, prevent warpage, guarantee pcb board PARALLEL FLOW in production equipment, prevent that the pcb board clamp from scrapping and damage equipment.
Description of drawings
Fig. 1 is the utility model example structure schematic diagram.
Embodiment
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and embodiment, the utility model is explained in further detail.
As shown in Figure 1, the present embodiment discloses the thin substrate copper of a kind of PCB internal layer layer structure, comprises the copper sheet 1 that is layed in each plate of the thin substrate of PCB internal layer angle and a plurality of block copper sheet 2 that is layed in thin each edges of boards of substrate of PCB internal layer.
A plurality of block copper sheet of two adjacent edges of boards is separated by the copper sheet at the plate angle between these two edges of boards.Above-mentioned copper sheet is equilateral right-angled triangle.A plurality of block copper sheets are equally distributed on each edges of boards of the thin substrate of PCB internal layer.
Block copper sheet is also copper PAD.
The thin substrate copper of this PCB internal layer layer structure, fully utilized the advantage of copper sheet and grid or block copper sheet, laying grid or block copper sheet except the edges of boards the plate angle, the flow direction of gummosis when effectively controlling the pcb board pressing, avoid causing the pcb board became uneven because gummosis is obstructed, prevent after thin substrate etch copper that copper sheet does not possess that continuity, support force are poor, plate angle easy perk clamp phenomenon, significantly reduces bad.And lay copper sheet at Ban Jiaochu, and can improve plate angular flux glue excessive, avoid causing the thick globality of plate gusset partially thin, can effectively protect plate angle internal layer luminous point simultaneously.
Be more than wherein specific implementation of the present utility model, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these apparent replacement forms all belong to protection range of the present utility model.
Claims (3)
1. the thin substrate copper of PCB internal layer layer structure is characterized in that: it comprises the copper sheet that is layed in each plate of the thin substrate of PCB internal layer angle and copper grid or a plurality of block copper sheet that is layed in thin each edges of boards of substrate of PCB internal layer.
2. the thin substrate copper of PCB internal layer according to claim 1 layer structure, it is characterized in that: described copper sheet is equilateral right-angled triangle.
3. the thin substrate copper of PCB internal layer according to claim 1 layer structure, it is characterized in that: described a plurality of block copper sheets are equally distributed on each edges of boards of the thin substrate of PCB internal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220739658 CN202998650U (en) | 2012-12-30 | 2012-12-30 | PCB internal layer thin substrate copper layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220739658 CN202998650U (en) | 2012-12-30 | 2012-12-30 | PCB internal layer thin substrate copper layer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998650U true CN202998650U (en) | 2013-06-12 |
Family
ID=48569771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220739658 Expired - Fee Related CN202998650U (en) | 2012-12-30 | 2012-12-30 | PCB internal layer thin substrate copper layer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998650U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363696A (en) * | 2014-12-02 | 2015-02-18 | 高德（无锡）电子有限公司 | Multi-layer PCB (printed circuit board) |
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
-
2012
- 2012-12-30 CN CN 201220739658 patent/CN202998650U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363696A (en) * | 2014-12-02 | 2015-02-18 | 高德（无锡）电子有限公司 | Multi-layer PCB (printed circuit board) |
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
| CN104582285B (en) * | 2014-12-31 | 2018-01-30 | 广州兴森快捷电路科技有限公司 | The preparation method of the printed circuit board (PCB) of low warpage high-flatness |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20211230 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |